EP1196485A4 - High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants - Google Patents
High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulantsInfo
- Publication number
- EP1196485A4 EP1196485A4 EP00936140A EP00936140A EP1196485A4 EP 1196485 A4 EP1196485 A4 EP 1196485A4 EP 00936140 A EP00936140 A EP 00936140A EP 00936140 A EP00936140 A EP 00936140A EP 1196485 A4 EP1196485 A4 EP 1196485A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- encapsulants
- bismaleimide
- epoxy resin
- high performance
- resin compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US346001 | 1982-02-08 | ||
US13535699P | 1999-05-21 | 1999-05-21 | |
US135356P | 1999-05-21 | ||
US34600199A | 1999-06-30 | 1999-06-30 | |
PCT/US2000/013943 WO2000071614A1 (en) | 1999-05-21 | 2000-05-22 | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1196485A1 EP1196485A1 (en) | 2002-04-17 |
EP1196485A4 true EP1196485A4 (en) | 2002-10-30 |
Family
ID=26833235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00936140A Withdrawn EP1196485A4 (en) | 1999-05-21 | 2000-05-22 | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1196485A4 (en) |
JP (1) | JP2003500509A (en) |
AU (1) | AU5150100A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG172201A1 (en) * | 2008-12-16 | 2011-07-28 | Dow Global Technologies Llc | Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
JP6761572B2 (en) * | 2015-11-11 | 2020-09-30 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
JP6618036B2 (en) * | 2015-11-25 | 2019-12-11 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
CN117690902B (en) * | 2024-02-03 | 2024-04-12 | 江门市和美精艺电子有限公司 | Packaging substrate containing modified adhesive film |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH621811A5 (en) * | 1976-06-17 | 1981-02-27 | Ciba Geigy Ag | |
JPS55145766A (en) * | 1979-04-30 | 1980-11-13 | Toshiba Chem Corp | Solventless type varnish for electric insulation |
JPS6354419A (en) * | 1986-08-26 | 1988-03-08 | Mitsubishi Gas Chem Co Inc | Thermosetting resin composition |
JPS63230726A (en) * | 1987-03-20 | 1988-09-27 | Sumitomo Chem Co Ltd | Molding resin composition |
JPH0637613B2 (en) * | 1989-07-12 | 1994-05-18 | 東レ株式会社 | Conductive adhesive |
JP3069364B2 (en) * | 1990-08-01 | 2000-07-24 | 旭化成工業株式会社 | Curable resin composition and curable composite material |
JP3346495B2 (en) * | 1992-08-07 | 2002-11-18 | 日立化成工業株式会社 | Method of manufacturing photosensitive element for forming photovia and multilayer wiring board |
JPH0770317A (en) * | 1993-09-03 | 1995-03-14 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition for semiconductor sealing |
JPH10139981A (en) * | 1996-11-11 | 1998-05-26 | Nissan Motor Co Ltd | Epoxy resin composition for reinforcing car body, car body reinforcement structure, and method for reinforcing car body |
JPH11100432A (en) * | 1997-09-29 | 1999-04-13 | Daicel Chem Ind Ltd | Active energy ray-polymerizable unsaturated resin composition |
JPH11124487A (en) * | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | Cyanic acid ester-maleimide liquid resin composition and sealed semiconductor device |
-
2000
- 2000-05-22 AU AU51501/00A patent/AU5150100A/en not_active Abandoned
- 2000-05-22 EP EP00936140A patent/EP1196485A4/en not_active Withdrawn
- 2000-05-22 JP JP2000620000A patent/JP2003500509A/en active Pending
Non-Patent Citations (2)
Title |
---|
No further relevant documents disclosed * |
See also references of WO0071614A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2003500509A (en) | 2003-01-07 |
AU5150100A (en) | 2000-12-12 |
EP1196485A1 (en) | 2002-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20011218 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20020918 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
RIC1 | Information provided on ipc code assigned before grant |
Free format text: 7C 08J 7/06 A, 7C 08L 63/00 B, 7C 08L 63/02 B, 7C 08L 63/04 B, 7C 08L 79/08 B, 7C 08L 87/00 B, 7C 08G 59/40 B |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20021206 |