EP1196485A4 - High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants - Google Patents

High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Info

Publication number
EP1196485A4
EP1196485A4 EP00936140A EP00936140A EP1196485A4 EP 1196485 A4 EP1196485 A4 EP 1196485A4 EP 00936140 A EP00936140 A EP 00936140A EP 00936140 A EP00936140 A EP 00936140A EP 1196485 A4 EP1196485 A4 EP 1196485A4
Authority
EP
European Patent Office
Prior art keywords
encapsulants
bismaleimide
epoxy resin
high performance
resin compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00936140A
Other languages
German (de)
French (fr)
Other versions
EP1196485A1 (en
Inventor
Miguel Albert Capote
Edward Smiley Harrison
Yong-Joon Lee
Howard Arthur Lenos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority claimed from PCT/US2000/013943 external-priority patent/WO2000071614A1/en
Publication of EP1196485A1 publication Critical patent/EP1196485A1/en
Publication of EP1196485A4 publication Critical patent/EP1196485A4/en
Withdrawn legal-status Critical Current

Links

EP00936140A 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants Withdrawn EP1196485A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US346001 1982-02-08
US13535699P 1999-05-21 1999-05-21
US135356P 1999-05-21
US34600199A 1999-06-30 1999-06-30
PCT/US2000/013943 WO2000071614A1 (en) 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Publications (2)

Publication Number Publication Date
EP1196485A1 EP1196485A1 (en) 2002-04-17
EP1196485A4 true EP1196485A4 (en) 2002-10-30

Family

ID=26833235

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00936140A Withdrawn EP1196485A4 (en) 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Country Status (3)

Country Link
EP (1) EP1196485A4 (en)
JP (1) JP2003500509A (en)
AU (1) AU5150100A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG172201A1 (en) * 2008-12-16 2011-07-28 Dow Global Technologies Llc Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
JP6761572B2 (en) * 2015-11-11 2020-09-30 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
JP6618036B2 (en) * 2015-11-25 2019-12-11 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
CN117690902B (en) * 2024-02-03 2024-04-12 江门市和美精艺电子有限公司 Packaging substrate containing modified adhesive film

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH621811A5 (en) * 1976-06-17 1981-02-27 Ciba Geigy Ag
JPS55145766A (en) * 1979-04-30 1980-11-13 Toshiba Chem Corp Solventless type varnish for electric insulation
JPS6354419A (en) * 1986-08-26 1988-03-08 Mitsubishi Gas Chem Co Inc Thermosetting resin composition
JPS63230726A (en) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd Molding resin composition
JPH0637613B2 (en) * 1989-07-12 1994-05-18 東レ株式会社 Conductive adhesive
JP3069364B2 (en) * 1990-08-01 2000-07-24 旭化成工業株式会社 Curable resin composition and curable composite material
JP3346495B2 (en) * 1992-08-07 2002-11-18 日立化成工業株式会社 Method of manufacturing photosensitive element for forming photovia and multilayer wiring board
JPH0770317A (en) * 1993-09-03 1995-03-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition for semiconductor sealing
JPH10139981A (en) * 1996-11-11 1998-05-26 Nissan Motor Co Ltd Epoxy resin composition for reinforcing car body, car body reinforcement structure, and method for reinforcing car body
JPH11100432A (en) * 1997-09-29 1999-04-13 Daicel Chem Ind Ltd Active energy ray-polymerizable unsaturated resin composition
JPH11124487A (en) * 1997-10-22 1999-05-11 Mitsubishi Gas Chem Co Inc Cyanic acid ester-maleimide liquid resin composition and sealed semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO0071614A1 *

Also Published As

Publication number Publication date
JP2003500509A (en) 2003-01-07
AU5150100A (en) 2000-12-12
EP1196485A1 (en) 2002-04-17

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