AU5150100A - High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants - Google Patents

High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Info

Publication number
AU5150100A
AU5150100A AU51501/00A AU5150100A AU5150100A AU 5150100 A AU5150100 A AU 5150100A AU 51501/00 A AU51501/00 A AU 51501/00A AU 5150100 A AU5150100 A AU 5150100A AU 5150100 A AU5150100 A AU 5150100A
Authority
AU
Australia
Prior art keywords
encapsulants
bismaleimide
epoxy resin
high performance
resin compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU51501/00A
Inventor
Miguel Albert Capote
Edward Smiley Harrison
Yong-Joon Lee
Howard Arthur Lenos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority claimed from PCT/US2000/013943 external-priority patent/WO2000071614A1/en
Publication of AU5150100A publication Critical patent/AU5150100A/en
Abandoned legal-status Critical Current

Links

AU51501/00A 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants Abandoned AU5150100A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13535699P 1999-05-21 1999-05-21
US60135356 1999-05-21
US34600199A 1999-06-30 1999-06-30
US09346001 1999-06-30
PCT/US2000/013943 WO2000071614A1 (en) 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Publications (1)

Publication Number Publication Date
AU5150100A true AU5150100A (en) 2000-12-12

Family

ID=26833235

Family Applications (1)

Application Number Title Priority Date Filing Date
AU51501/00A Abandoned AU5150100A (en) 1999-05-21 2000-05-22 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

Country Status (3)

Country Link
EP (1) EP1196485A4 (en)
JP (1) JP2003500509A (en)
AU (1) AU5150100A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG172201A1 (en) * 2008-12-16 2011-07-28 Dow Global Technologies Llc Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
JP6761572B2 (en) * 2015-11-11 2020-09-30 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
JP6618036B2 (en) * 2015-11-25 2019-12-11 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
CN117690902B (en) * 2024-02-03 2024-04-12 江门市和美精艺电子有限公司 Packaging substrate containing modified adhesive film

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH621811A5 (en) * 1976-06-17 1981-02-27 Ciba Geigy Ag
JPS55145766A (en) * 1979-04-30 1980-11-13 Toshiba Chem Corp Solventless type varnish for electric insulation
JPS6354419A (en) * 1986-08-26 1988-03-08 Mitsubishi Gas Chem Co Inc Thermosetting resin composition
JPS63230726A (en) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd Molding resin composition
JPH0637613B2 (en) * 1989-07-12 1994-05-18 東レ株式会社 Conductive adhesive
JP3069364B2 (en) * 1990-08-01 2000-07-24 旭化成工業株式会社 Curable resin composition and curable composite material
JP3346495B2 (en) * 1992-08-07 2002-11-18 日立化成工業株式会社 Method of manufacturing photosensitive element for forming photovia and multilayer wiring board
JPH0770317A (en) * 1993-09-03 1995-03-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition for semiconductor sealing
JPH10139981A (en) * 1996-11-11 1998-05-26 Nissan Motor Co Ltd Epoxy resin composition for reinforcing car body, car body reinforcement structure, and method for reinforcing car body
JPH11100432A (en) * 1997-09-29 1999-04-13 Daicel Chem Ind Ltd Active energy ray-polymerizable unsaturated resin composition
JPH11124487A (en) * 1997-10-22 1999-05-11 Mitsubishi Gas Chem Co Inc Cyanic acid ester-maleimide liquid resin composition and sealed semiconductor device

Also Published As

Publication number Publication date
JP2003500509A (en) 2003-01-07
EP1196485A1 (en) 2002-04-17
EP1196485A4 (en) 2002-10-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase