EP1173008A2 - Vorrichtung und Verfahren zur Defekterkennung in einem Multikanalabtasttreiber - Google Patents

Vorrichtung und Verfahren zur Defekterkennung in einem Multikanalabtasttreiber Download PDF

Info

Publication number
EP1173008A2
EP1173008A2 EP01306062A EP01306062A EP1173008A2 EP 1173008 A2 EP1173008 A2 EP 1173008A2 EP 01306062 A EP01306062 A EP 01306062A EP 01306062 A EP01306062 A EP 01306062A EP 1173008 A2 EP1173008 A2 EP 1173008A2
Authority
EP
European Patent Office
Prior art keywords
test
row
coupled
detector
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01306062A
Other languages
English (en)
French (fr)
Other versions
EP1173008A3 (de
Inventor
Scott A. Bielski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Medical Systems Global Technology Co LLC
Original Assignee
GE Medical Systems Global Technology Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Medical Systems Global Technology Co LLC filed Critical GE Medical Systems Global Technology Co LLC
Publication of EP1173008A2 publication Critical patent/EP1173008A2/de
Publication of EP1173008A3 publication Critical patent/EP1173008A3/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2829—Testing of circuits in sensor or actuator systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras

Definitions

  • the present invention relates generally to the field of digital imaging devices, such as digital x-ray imaging systems. More particularly, the invention relates to a technique for testing portions of driver circuitry in digital detector arrays of the type used in direct digital x-ray systems.
  • x-ray systems for example, techniques are being developed for detecting intensities of radiation striking a digital detector surface during examinations.
  • an x-ray source emits radiation which traverses a subject, such as a human patient.
  • the x-ray intensity is, however, affected by the various tissues and structures within the subject, resulting in intensity variations at the detector, which is placed behind the subject with respect to the source.
  • the detector By identifying intensities of resulting radiation at a large number of locations arranged in a matrix, the detector allows a data set to be acquired which can be used to reconstruct a useful image of the subject.
  • each element consists of a photodiode and a thin film transistor.
  • the cathode of the diode is connected to the source of the transistor, and the anodes of all diodes are connected to a negative bias voltage.
  • the gates of the transistors in a row are connected together and the row electrode is connected to scanning electronics.
  • the drains of the transistors in each column are connected together and each column electrode is connected to additional readout electronics. Sequential scanning of the rows and columns permits the system to acquire the entire array or matrix of signals for subsequent signal processing and display.
  • the signals generated at the pixel locations of the detector are sampled and digitized.
  • the digital values are transmitted to processing circuitry where they are filtered, scaled, and further processed to produce the image data set.
  • the data set may then be used to store the resulting image, to display the image, such as on a computer monitor, to transfer the image to conventional photographic film, and so forth.
  • images are used by attending physicians and radiologists in evaluating the physical conditions of a patient and diagnosing disease and trauma.
  • the present invention provides a technique for identifying potential short circuits and other defects in scan driver circuitry designed to respond to these needs.
  • the technique is particularly well suited for implementation in circuitry associated with digital detectors comprising an array of rows and columns, and capable of producing signals representative of radiation impacting a plurality of pixels defined by the rows and columns.
  • the structure employed in the technique is designed to facilitate its implementation in one or more row driver integrated circuits.
  • the technique advantageously employs an arrangement of transistors which are dedicated to testing for shorts in row output drivers, thereby reducing or eliminating the need to externally probe outputs simultaneously while individually enabling each row of the detector.
  • open-test outputs may be electrically linked in the structure, such as via wired-NOR functional groups. This further minimizes the number of inputs to be monitored by subsystem control electronics.
  • Fig. 1 represents an imaging system in the form of a digital x-ray system 10.
  • Imaging system 10 includes a source of x-ray radiation 12 positioned adjacent to a collimator 14.
  • Collimator 14 permits a stream 16 of radiation to pass into a region in which a subject, such as a human patient 18 is positioned.
  • a portion of the radiation 20 passes through or around the subject and impacts a digital x-ray detector represented generally at reference numeral 22.
  • detector 22 converts the x-ray photons received on its surface to lower energy photons, and subsequently to electrical signals which are acquired and processed to reconstruct an image of the features within the subject.
  • Source 12 is controlled by a power supply/control circuit 24 which furnishes both power and control signals for examination sequences.
  • detector 22 is coupled to a detector controller 26 which commands acquisition of the signals generated in the detector.
  • Detector controller 26 may also execute various signal processing and filtration functions, such as for adjustment of dynamic ranges, interleaving of digital image data, and so forth.
  • Both power supply/control circuit 24 and detector controller 26 are responsive to signals from a system controller 28.
  • system controller 28 commands operation of the imaging system to execute examination protocols and to process acquired image data.
  • system controller 28 will typically include a general purpose or application-specific computer, associated memory circuitry, interface circuits, and so forth. In the embodiment illustrated in Fig.
  • system controller 28 is linked to a display/printer 30 and to an operator work station 32.
  • display/printer 30 will permit reconstructed images to be output for use by an attending physician or radiologist.
  • Operator work station 32 allows examinations to be commanded by a clinician or radiologist, permits system configurations to be reviewed, and so forth.
  • Fig. 2 is a diagrammatical representation of functional components of the digital detector 22.
  • Fig. 2 also represents an imaging detector controller or IDC 34 which will typically be configured within detector controller 26.
  • IDC 34 includes a CPU or digital signal processor, as well as memory circuits for commanding acquisition of sensed signals from the detector.
  • IDC 34 is coupled via two-way fiber optic conductors to detector control circuitry 36 within detector 22. IDC 34 thereby exchanges command signals for image data with the detector during operation.
  • Detector control circuitry 36 receives DC power from a power source, represented generally at reference numeral 38. Detector controller circuitry 36 is configured to originate timing and control commands for row and column drivers used to transmit sensed signals during a data acquisition phase of operation. Circuitry 36 therefore transmits power and control signals to reference/regulator circuitry 40, and receives digital image pixel data from circuitry 40.
  • Detector 22 consists of a scintillator that converts the x-ray photons received on a detector surface during examinations to lower energy (light) photons.
  • An array of photo detectors then converts the light photons to electrical signals which are representative of the number of photons or intensity of the radiation impacting individual pixel regions of the detector surface.
  • readout electronics convert the resulting analog signals to digital values that can be processed, stored, and displayed using well known image processing techniques.
  • the array of photo detectors is formed of a single base of amorphous silicon. The array elements are organized in rows and columns, with each element consisting of a photo diode and a thin film transistor.
  • each diode is connected to the source of the transistor and the anodes of all diodes are connected to a negative bias voltage.
  • the gates of the transistors in each row are connected together and the row electrodes are connected to the scanning electronics described below.
  • the drains of the transistors in a column are connected together and an electrode for each column is connected to readout electronics. The technique described below permits testing of the detector and the row (or column) driver electronics for malfunctions, such as short circuits.
  • a row bus 42 includes a plurality of conductors for enabling readout from the various columns of the detector as well as for disabling rows and applying a charge compensation voltage to selected rows.
  • a column bus 44 includes additional conductors for commanding readout from the columns while the rows are sequentially enabled.
  • Row bus 42 is coupled to a series of row drivers 46, each of which commands enabling of a series of rows in the detector.
  • readout electronics 48 are coupled to column bus 44 for commanding readout of all of columns of the detector.
  • row drivers 46 and readout electronics 48 are coupled to a detector panel 50 which may be subdivided into a plurality of sections 52. Each section 52 is coupled to one of the row drivers 46, and includes a number of rows. Similarly, each column driver 48 is coupled to a series of columns.
  • the photo diode and thin film transistor arrangement mentioned above thereby defines a series of pixels or discrete picture elements 54 which are arranged in rows 56 and columns 58.
  • the rows and columns define an image matrix 60 having a height 62 and a width 64.
  • the particular configuration of the detector panel 50, and the subdivision of the panel into rows and columns driven by row and column drivers is subject to various alternate configurations.
  • more or fewer row and column drivers may be used, and detector panels having various matrix dimensions may be thereby defined.
  • the detector panel may be further subdivided into regions of multiple sections, such as along a vertical or horizontal center line.
  • Fig. 3 represents in somewhat greater detail a pair of the row drivers 46 shown in Fig. 2 coupled to the detector panel 50.
  • row drivers 46 receive various command signals from reference/regulator circuitry 40 for enabling of rows in the detector panel.
  • each row driver 46 includes a pair of row driver chips or RDCs 66 and 68.
  • Each RDC is configured to command enabling of a plurality of rows of the detector.
  • Reference/regulator circuitry 40 receives various control and command signals for operation of the RDCs, such as scan mode command signals, charge compensation command signals, enable strobe signals, and so forth.
  • circuitry 40 includes control logic configured for command of the RDCs.
  • Circuitry 40 outputs the commands on a plurality of conductors within the row bus 42 (see Fig. 2).
  • three such conductors are illustrated, including a V on conductor 70, a V off conductor 72, and a V COMP conductor 74.
  • Each of the conductors is coupled to each RDC.
  • Other conductors may be provided, for commanding output of the RDCs for enabling, disabling and charge compensating the individual rows of the detector.
  • each row driver is coupled to a plurality of row electrodes, such as row electrode 76 illustrated in Fig. 3.
  • Each row electrode traverses a series of column electrodes, of which a single column electrode 78 is represented in Fig. 3.
  • photo diodes and thin film transistors are provided and coupled to each row and column electrode to form the detector panel array.
  • Each column electrode is coupled to an ARC (analog readout chip) amplifier 80 which reads out the signal produced at the photo diode of each row and column crossing during readout sequences.
  • Readout of sensed signals from the detector proceeds as follows. Multiple scan modes may be selected for reading data from the detector, or for testing operability of the detector. In a presently preferred embodiment four such readout or scan modes are provided. In a first or high resolution mode, a single row is enabled at a time. While each row of the panel is thus sequentially enabled for readout, the columns in the detector are read, thereby progressively reading out all signals from the array. Other scan modes may provide for different numbers of rows to be simultaneously enabled in groups, with the groups being sequentially scanned.
  • defects or anomalies may occur in the panel and drive circuitry described above.
  • potentially serious defects may include open circuits or short circuits, such as between row electrodes, between row electrodes and bias potential sources, and between row electrodes and ground . Such defects may be detected though the techniques set forth below.
  • test circuitry is provided, preferably directly in the RDCs.
  • similar circuitry may be provided in associated chips or modules.
  • Fig. 4 represents a portion of a solid state control circuit 84 employed in the row drivers discussed above.
  • output from the circuit may have a value V ON or V DD corresponding to the enabling voltage, a value V OFF corresponding to the "off' state, or a value V COMP corresponding to the compensation voltage state.
  • the transistors of circuit 84 are coupled to corresponding voltage sources, such as through conductors 70, 72 and 74 (see Fig. 3), as shown by reference numerals 86, 88 and 90.
  • three transistors 92, 94 and 96 are coupled to one another as illustrated.
  • transistor 92 is a p-channel MOSFET, the gate of which is coupled to a control line 98, the source of which is coupled to the voltage V ON (as illustrated at reference numeral 86), and the drain of which is coupled to an output line 108.
  • Transistor 94 is an n-channel MOSFET the gate of which is coupled to a control line 100, the source of which is coupled to the voltage V OFF (at reference numeral 88), and the drain of which is coupled to output line 108.
  • transistor 96 is also an n-channel MOSFET, the gate of which is coupled to a third control line 102, the source of which is coupled to the voltage Vcomp (at reference numeral 90), and the drain of which is coupled to outline line 108.
  • Control lines 98, 100 and 102 are coupled to upstream control logic devices and transmit control signals to the transistors for selecting the voltage on output line 108 which is transmitted to the particular row electrode.
  • a plurality of such circuits are included on each RDC for driving corresponding rows of the detector.
  • transistor 98 when a logical "low" signal is transmitted on control line 98, transistor 98 is placed in a conductive state, applying the enabling voltage V ON to the outline line 108 and thus to a row electrode 76.
  • the control logic turns off transistors 94 and 96.
  • a logical "high" signal on control line 100 switches transistor 94 to a conductive state to apply the logical low or off voltage V OFF to the row electrode 76.
  • a logical "high” signal at control line 102 places transistor 96 in a conductive state to apply the compensating voltage V COMP to the row electrode 76.
  • Output line 108 is coupled to the gate of the transistors to provide the desired enabling signals or charge compensation signals.
  • Fig. 5 represents circuitry for detecting anomalies in the row driver circuitry, such as short circuits between rows, between rows and ground, and between rows and negative bias supplies.
  • the technique entails resetting internal devices of the RDC, and shifting a single bit through a shift register of the device, while enabling the associated output to an "on" state between each data shift, that is, enabling a single row at a time while other rows are “off.” Assuming there are no shorts to the other outputs (which remain at the "off' bias state), or to the bias supplies (other than the "on” bias), the active output will swing towards the positive "on” bias since the sense circuits are positive logic circuits.
  • each row driver output stage Internal to the RDC, associated with each row driver output stage, is a three transistor voltage sense circuit, three such circuits being illustrated in Fig. 5. If the driven row output positive swing is within a gate-to-source (turn-off) threshold of an associated p-channel MOSFET, a change in state of a wired-OR test output takes place. If any short exists, the active output would not swing sufficiently to turn the MOSFET off, resulting in the test output failing to change state, and providing an indication of the short condition. In effect, in the illustrated embodiment, the test circuitry functions as a voltage comparator with offset. If the transitions tested are correct, the state of the comparators (p-channel MOSFETs) changes in an expected manner.
  • test circuitry 120 is provided on the RDC associated with the groups of rows.
  • Test circuitry 120 includes row sense circuitry for each row of the associated portion of the detector, as indicated by reference numerals 122, 124, and 126.
  • Each row sense circuit includes a group of three solid state devices for detecting short circuits of the associated row.
  • the row sense circuitry is coupled between high and low potentials (V DD and V COMP , respectively), as indicated at reference numerals 128 and 129, respectively.
  • the row sense circuits comprise a pair of p-channel MOSFETs 132 and 134, and an n-channel MOSFET 136.
  • the first device 132 has its gate, denoted 138 in Fig. 5, coupled to an output line for an associated row.
  • gate 138 of circuit 132 would be coupled to an output line ROW-n such as line 108 of Fig. 4.
  • the source 140 of the device is coupled to the high potential bus 128.
  • the drain 142 of device 132 is coupled to the gate 144 of the second device 134.
  • the source 146 of this device is also coupled to the high potential bus line 128.
  • the drain of device 134 is coupled to a "wired-OR" bus line 130.
  • the gate of the third device 136 is coupled to a bias source, which serves as a test enable TESTN.
  • Line 150 will, therefore, be associated with test drive electronics for providing a test enable bias signal TESTN to device 136 when row testing is desired, such as during manufacture or troubleshooting of the detector circuitry.
  • the drain 152 of device 136 is coupled to drain 142 of device 132 and commonly to gate 144 of device 134.
  • the source 154 of device 136 is coupled to a desired potential, such as the most negative power supply available, here V COMP .
  • high potential bus line 128 is coupled to a row enable potential V DD , such as +12 volts.
  • the negative bias voltage V COMP applied to source 154 of device 136 may be any suitable negative voltage, such as -12 volts.
  • bus line 130 functions as a "wired-OR" logic signal.
  • the series of rows sense circuits is coupled to a test enable device 156 which essentially acts as a weak current source during operation.
  • device 156 is an n-channel MOSFET having a gate 158 coupled to test enable circuitry for receiving a test bias signal TESTN at the same time as gate 150 of device 136.
  • the drain 160 of device 156 is coupled to the "wired-OR" signal line 130.
  • the source 162 of device 156 is coupled to a low potential source, preferably the same potential as source 154 of device 136. It should be noted that through the foregoing structure, a single device 156 is capable of serving all row sense circuits for a row driver chip. In the illustrated embodiment, 128 row sense circuits are provided in parallel to one another and are coupled to a single test enable device 156.
  • Output of the resulting signals during tests of the circuitry of Fig. 5 is provided via "wired-OR" signal line 130.
  • Two inputs are provided to a NAND gate 164, namely "wired-OR” signal line 130, and a test enabled input signal TESTENABLE as provided at input 166 in Fig. 5.
  • the output from the NAND gate 164 is directed to an RDC test output IC-PAD 168 which, in a preferred embodiment, is an open collector device permitting multiple RDCs to be tied to a common input of a CPU used to analyze the test results.
  • a pull-up resistor 170 is provided between the output of the open drain device 168 and a reference potential, such as 5 volts.
  • output 172 from device 168 is transferred to an analyzing circuit, such as the CPU used to drive the rows of the detector.
  • a test enable bias signal TESTN is applied to the circuitry of Fig. 5 to drive devices 136 of each row sense circuit via gate 150, as well as the gate 158 of device 156.
  • TESTN is a bias signal which is produced from a bias generator circuit (not shown).
  • the generator circuit is enabled by the TESTENABLE input signal and may produce a bias signal TESTN whose voltage is between V DD and V COMP .
  • each row of the RDC is sequentially enabled to a "V ON " state as described above with reference to Fig. 4. If all other rows associated with the RDC are off (at the V OFF default bias), all associated devices 132 of the circuitry of Fig.
  • the test output does not change states, a problem is considered to be detected with the particular row or row driver.
  • the present arrangement is suitable for detecting shorts between rows of the detector panel and related electronics, as well as between rows and other circuitry such as bias supplies.
  • a voltage drop from the anticipated level would be detectable greater than the gate-threshold tolerance of the device 132 of the row sense circuit.
  • Other shorts would provide a drop in response which could be similarly detected.
  • Fig. 6 illustrates graphically a series of row drivers of an RDC tested in accordance with the present technique, employing circuitry such as that illustrated in Fig. 5.
  • the test sequence indicated by reference numeral 174, consists of a series of output pulses which may be represented along a vertical axis 176.
  • the test sequence proceeds through the rows driven by the RDC being tested.
  • the test enable signal TESTN discussed above is applied and remains applied throughout the test sequence as indicated by trace 180.
  • the rows are initiliazed to the V OFF state. Rows are then sequentially enabled to the V DD state beginning with a first row as indicated at trace 182 for a row labeled P 1 .
  • test output is monitored through this sequence at output IC-PAD 168 as indicated by trace 184 in Fig. 6.
  • Each subsequent row enabling step is preceded by disabling of the previously enabled row.
  • each subsequent row enabling step produces a trace which may be represented as 186, 188, and so forth, for each subsequent row.
  • a tolerance 192 equal to the gate-to-source threshold of the row driver device is preferably lower than the detectable change in state in the event of a short circuit of the row.
  • Such short circuits will be manifested in lower than expected rises in the output level, as indicated at reference numeral 194 in Fig. 6. That is, the signal level of a shorted circuit will not reach V DD .
  • rows P 3 and P 4 are likely shorted to one another.
  • the test output as provided by trace 184 did not decline as would have been expected for a normal test.
  • a similar variation from the expected results would occur in test trace 184 in the event of shorts between a row and bias supply V COMP or shorts between a row and ground.
  • Fig. 7 represents circuitry for detecting anomalies in the row driver circuitry, such as short circuits between rows, between rows and ground, and between rows and positive bias supplies.
  • the technique entails setting all row outputs of the RDC to a positive bias level (V ON /V DD ), and shifting a single bit "0" through a shift register of the device, by driving a single row at a time to the most negative bias voltage, here V SS , while all other rows remain at the positive bias voltage, here V DD .
  • V ON /V DD the active output will be driven to V SS since the sense circuits are negative logic circuits.
  • a three-transistor voltage sense circuit Internal to the RDC, associated with each row driver output stage, is a three-transistor voltage sense circuit, three such circuits being illustrated in Fig. 7. If the driven row output negative swing is less than source threshold of an associated n-channel MOSFET, a change in the state of a wired-NOR test output takes place. If any short exists, the active output would not swing sufficiently to turn the MOSFET on, resulting in the test output failing to change state and providing an indication of the short condition. In effect, in the illustrated embodiment, the test circuitry functions as a voltage comparitor with offset. If the transitions tested are correct, the state of the comparitors (n-channel MOSFETs) changes in an expected manner.
  • test circuitry 200 may be provided on the RDC associated with the groups of rows.
  • Test circuitry 200 includes row sense circuitry for each row of the associated portion of the detector, as indicated by reference numerals 202, 204, and 206.
  • Each row sense circuit includes a group of three solid state devices for detecting short circuits of the associated row.
  • the row sense circuitry is coupled between high and low potentials (V DD and V COMP ), as indicated at reference numerals 208 and 210 respectively.
  • the row sense circuits comprise a pair of n-channel MOSFETs 214 and 216, and p-channel MOSFET 218.
  • the first device 214 has its gate 220 coupled to an output line for an associated row.
  • gate 220 of the circuit 202 would be coupled to an output line such as line 108 of Fig. 4.
  • the source 222 of the device 214 is coupled to the low potential bus 210.
  • the drain 224 of the device 214 is coupled to the gate 226 of the second device 216.
  • the source 228 of this device is also coupled to the low potential bus line 210.
  • the drain of the device 216 is coupled to a "wired-NOR" common bus line 212.
  • the gate of the third device 218 is coupled to a biased source TESTP*, which serves as an active-low test enable.
  • the device 218 will act as a weak pull-up when it is enabled in test mode.
  • Line 232 will, therefore, be associated with test drive electronics for a test enabling bias signal TESTP* to device 214 when row testing is desired.
  • the drain 234 of device 218 is coupled to the drain 224 of device 214 and commonly to gate 226 of device 216.
  • the source 236 of device 218 is coupled to a desired potential such as a positive power supply, here V DD .
  • low potential bus line 210 is coupled to a row enable potential V COMP , such as -12 volts.
  • the positive bias voltage applied to source 236 of device 218 may be any suitable positive voltage, such as +12 volts.
  • Bus line 212 functions as a "wired-NOR" logic signal.
  • the series of row sense circuits is coupled to a test enable device 238 which acts as a current source during operation.
  • device 238 is a p-channel MOSFET having a gate 240 coupled to test enable circuitry for receiving a test bias signal TESTP* at the same time as gate 232 of device 218.
  • the drain 242 of device 240 is coupled to the "wired-NOR" signal line 212.
  • the source 244 of device 238 is coupled to a high potential source, preferably the same potential as source 236 of device 218.
  • the device 238 acts as a weak pull-up. It should be noted that through the foregoing structure, a single device 238 is capable of serving all row sense circuits as a row driver chip. In the illustrated embodiment, 128 row sense circuits are provided in parallel to one another and are coupled to a single test enable device 238.
  • Output of the resulting signals during tests of the circuitry illustrated in Fig. 7 is provided via "wired-NOR" signal line 212 after the signal line 212 has been inverted by inverter 245.
  • Two inputs are provided to a NAND gate 246, namely the inversion of the "wired-NOR" signal line 212, and a TESTENABLE signal as provided at input 248.
  • the output from the NAND gate 246 is directed to an RDC test output IC-PAD 250 which, in a preferred embodiment, is an open collector device permitting multiple RDCs to be tied to a common input of a CPU used to analyze the test results.
  • a pull-up resistor 252 is provided between the output of the device 168 and a 5V supply voltage.
  • output 254 from device 250 is transferred to an analyzing circuit, such as the CPU used to drive the rows of the detector.
  • a test enable bias signal TESTP* is applied to the circuitry of Fig. 7 to drive P-Channel devices 218 of each row sense circuit via gate 232 as well as the gate 240 of device 238.
  • TESTP* is a bias signal which is produced from a bias generator circuit (not shown).
  • the bias generator circuit is enabled by the TESTENABLE signal and may produce a bias signal TESTP* whose voltage is between V DD and ground. Devices 218 and 238 therefore, act as "weak" pull-ups.
  • all rows of the RDC are enabled to an "on" state as described above with reference to Fig. 4.
  • both the inversion of signal line 212 and the TESTENABLE signal (provided at input 248) are delivered to the NAND gate 246, and an appropriate test output signal is provided to open collector device 250 which can be read by the downstream circuitry. If, through the foregoing test sequence, the test output does not change states, a problem with a particular row or row driver has been assumed by external logic.
  • Fig. 8 illustrates graphically a series of row drivers of an RDC tested in accordance with the present technique, employing circuitry such as that illustrated in Fig. 7.
  • the test sequence indicated by reference numeral 256, consists of a series of output pulses which may be represented along vertical axis 258.
  • the test sequence proceeds through the rows driven by the RDC being tested.
  • the test enable signal TESTP* discussed above, is applied and remains applied throughout the test sequence as indicated by trace 262.
  • the rows are initialized to V DD . Rows are then sequentially driven low, to V SS beginning with a first row as indicated at (trace 264 for a row labeled Q 1 .
  • test output is monitored through this sequence at output IC-PAD 250 as indicated by trace 266.
  • Each row is driven low for a time interval 260 and then returned to its initial on state (V DD ).
  • V DD initial on state
  • each subsequent row driving step produces a trace which may be represented as 268, 270, and so forth, for each subsequent row.
  • a tolerance 274 equal to the gate-to-source threshold of the row driver device test circuit is preferably lower than the detectable change in state in the event of a short circuit of the row. Such short circuits will be manifested in lower than expected drops in output level, as indicated at reference numeral 276.
  • rows Q 3 and Q 4 are likely shorted to one another. As a result, upon enabling these rows, the test output as provided by trace 266 will not go low as would have been expected for normal test. A similar variation from the expected results would occur in test trace 266 in the event of a short between a row and the positive bias supply V DD or a short between a row and ground.
  • the circuitry described above may be implemented along with driver circuitry in an economical and compact manner, with the test circuitry itself occupying only minimal real estate in the overall design. Moreover, the test circuitry, permitting verification of each row driver individually in a very straightforward process, includes a minimal number of small individual components for the tasks performed. Through the test sequence, row test circuits add very little to the cost of the row drivers, with minimal likelihood of test circuitry-induced failures. It should also be appreciated that the circuits discussed in Figs. 5 and 7 may be used in conjuction to provide a means of testing for shorts between rows, shorts between rows and ground, shorts between rows and positive bias supplies, and shorts between rows and negative bias supplies.
  • a single test circuit may be provided using a triple-input NAND gate.
  • the first input would be the TESTENABLE signal.
  • the second input would be from the wired-OR line 130 provided in Fig. 5.
  • the third input would be the inverted wired-NOR line 212 provided in Fig. 7.
  • test circuitry may be incorporated for selectively testing driver circuitry for defects such as shorts to high voltage bias lines or other supplies in a multi-level driver.
  • the circuitry may be employed various devices other than digital detectors to test for shorts and other defects. Such devices might include any application wherein rows, columns, lines, or similar series of circuits are driven, such as solid state displays, thermal facsimile machines, and so forth.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Biomedical Technology (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
EP01306062A 2000-07-14 2001-07-13 Vorrichtung und Verfahren zur Defekterkennung in einem Multikanalabtasttreiber Withdrawn EP1173008A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US616869 1984-06-04
US09/616,869 US6492802B1 (en) 2000-07-14 2000-07-14 Apparatus and method for detecting defects in a multi-channel scan driver

Publications (2)

Publication Number Publication Date
EP1173008A2 true EP1173008A2 (de) 2002-01-16
EP1173008A3 EP1173008A3 (de) 2002-08-07

Family

ID=24471305

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01306062A Withdrawn EP1173008A3 (de) 2000-07-14 2001-07-13 Vorrichtung und Verfahren zur Defekterkennung in einem Multikanalabtasttreiber

Country Status (4)

Country Link
US (1) US6492802B1 (de)
EP (1) EP1173008A3 (de)
JP (1) JP2002165233A (de)
TW (1) TWI248327B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1883252A1 (de) * 2005-05-19 2008-01-30 Matsushita Electric Industrial Co., Ltd. Vorrichtung zur detektion von anomalien
CN101118267B (zh) * 2006-08-03 2011-04-27 国际商业机器公司 确定阈值电压变化的阵列表征电路、系统和方法

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836804B2 (en) 2003-08-20 2010-11-23 Sd3, Llc Woodworking machines with overmolded arbors
US8459157B2 (en) 2003-12-31 2013-06-11 Sd3, Llc Brake cartridges and mounting systems for brake cartridges
US7024975B2 (en) 2000-08-14 2006-04-11 Sd3, Llc Brake mechanism for power equipment
US8061245B2 (en) 2000-09-29 2011-11-22 Sd3, Llc Safety methods for use in power equipment
US7077039B2 (en) 2001-11-13 2006-07-18 Sd3, Llc Detection system for power equipment
US9724840B2 (en) 1999-10-01 2017-08-08 Sd3, Llc Safety systems for power equipment
US8065943B2 (en) 2000-09-18 2011-11-29 Sd3, Llc Translation stop for use in power equipment
US7098800B2 (en) * 2003-03-05 2006-08-29 Sd3, Llc Retraction system and motor position for use with safety systems for power equipment
US7712403B2 (en) 2001-07-03 2010-05-11 Sd3, Llc Actuators for use in fast-acting safety systems
US7600455B2 (en) 2000-08-14 2009-10-13 Sd3, Llc Logic control for fast-acting safety system
US7350444B2 (en) * 2000-08-14 2008-04-01 Sd3, Llc Table saw with improved safety system
US7284467B2 (en) 2000-08-14 2007-10-23 Sd3, Llc Apparatus and method for detecting dangerous conditions in power equipment
US20030056853A1 (en) 2001-09-21 2003-03-27 Gass Stephen F. Router with improved safety system
US7225712B2 (en) 2000-08-14 2007-06-05 Sd3, Llc Motion detecting system for use in a safety system for power equipment
US7827890B2 (en) 2004-01-29 2010-11-09 Sd3, Llc Table saws with safety systems and systems to mount and index attachments
US6857345B2 (en) 2000-08-14 2005-02-22 Sd3, Llc Brake positioning system
US20020017179A1 (en) 2000-08-14 2002-02-14 Gass Stephen F. Miter saw with improved safety system
US7210383B2 (en) 2000-08-14 2007-05-01 Sd3, Llc Detection system for power equipment
US7377199B2 (en) * 2000-09-29 2008-05-27 Sd3, Llc Contact detection system for power equipment
US7640835B2 (en) * 2000-08-14 2010-01-05 Sd3, Llc Apparatus and method for detecting dangerous conditions in power equipment
US7707920B2 (en) 2003-12-31 2010-05-04 Sd3, Llc Table saws with safety systems
US7536238B2 (en) 2003-12-31 2009-05-19 Sd3, Llc Detection systems for power equipment
US9927796B2 (en) 2001-05-17 2018-03-27 Sawstop Holding Llc Band saw with improved safety system
US7277812B1 (en) * 2005-02-18 2007-10-02 Xilinx, Inc. Data generator
JP4277055B2 (ja) * 2007-05-29 2009-06-10 シャープ株式会社 駆動回路、表示装置、およびテレビジョンシステム
US8587573B2 (en) * 2008-02-28 2013-11-19 Sharp Kabushiki Kaisha Drive circuit and display device
US9851459B2 (en) * 2014-12-18 2017-12-26 Carestream Health, Inc. Threshold voltage calibration and compensation circuit for a digital radiographic detector
JP6763185B2 (ja) * 2016-04-08 2020-09-30 コニカミノルタ株式会社 放射線画像撮影装置および放射線画像撮影システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5451768A (en) * 1994-11-14 1995-09-19 Xerox Corporation On-chip test circuit and method for an image sensor array
US5654537A (en) * 1995-06-30 1997-08-05 Symbios Logic Inc. Image sensor array with picture element sensor testability

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL292956A (de) 1962-05-18
GB9020048D0 (en) 1990-09-13 1990-10-24 Hoskins Ltd Supporting appliance
US5331179A (en) * 1993-04-07 1994-07-19 E. I. Du Pont De Nemours And Company Method and apparatus for acquiring an X-ray image using a thin film transistor array
DE4423402C2 (de) 1994-07-04 1999-12-30 Maquet Ag Stützsäule zur Halterung einer Patientenlagerfläche
US5654970A (en) * 1995-12-22 1997-08-05 Xerox Corporation Array with redundant integrated self-testing scan drivers
EP0847740A1 (de) 1996-11-13 1998-06-17 Jean Roger Batifouyé Sagitalkippbares Bett oder Untersuchungstisch
US5877501A (en) 1996-11-26 1999-03-02 Picker International, Inc. Digital panel for x-ray image acquisition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5451768A (en) * 1994-11-14 1995-09-19 Xerox Corporation On-chip test circuit and method for an image sensor array
US5654537A (en) * 1995-06-30 1997-08-05 Symbios Logic Inc. Image sensor array with picture element sensor testability

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1883252A1 (de) * 2005-05-19 2008-01-30 Matsushita Electric Industrial Co., Ltd. Vorrichtung zur detektion von anomalien
EP1883252B1 (de) * 2005-05-19 2015-11-18 Panasonic Intellectual Property Management Co., Ltd. Vorrichtung zur detektion von anomalien
CN101118267B (zh) * 2006-08-03 2011-04-27 国际商业机器公司 确定阈值电压变化的阵列表征电路、系统和方法

Also Published As

Publication number Publication date
JP2002165233A (ja) 2002-06-07
US6492802B1 (en) 2002-12-10
EP1173008A3 (de) 2002-08-07
TWI248327B (en) 2006-01-21

Similar Documents

Publication Publication Date Title
US6492802B1 (en) Apparatus and method for detecting defects in a multi-channel scan driver
JP4325974B2 (ja) Ｘ線検出器モニタリング
US6489798B1 (en) Method and apparatus for testing image sensing circuit arrays
EP0627722B1 (de) Lichtventilvorrichtung mit Fehlererkennungsschaltung
KR100289938B1 (ko) 반도체 검사회로 및 반도체 회로의 검사방법
US6535576B2 (en) Enhanced digital detector and system and method incorporating same
EP2387021A1 (de) Verbindungstest für OLED-Modul auf Grundlage eines Treiberchips
US11050952B2 (en) Reading circuit for infrared detectors and method for inspecting same
EP1088516B1 (de) Verfahren und Vorrichtung zur Fehlererkennung in einem diskreten Bildelementdetektor
US7122802B2 (en) Method and apparatus for increasing the data acquisition rate in a digital detector
JP3614792B2 (ja) アクティブマトリックス型ディスプレイの画素検査装置および画素検査方法
US20200359978A1 (en) Radiation image capturing apparatus and radiation image capturing system
US6359967B1 (en) Method and apparatus for scan charge compensation in a digital detector
US20230419872A1 (en) Display detection device, detection method, and detection system
US20040240724A1 (en) Tester and testing method
KR100428795B1 (ko) 빠른 초기화를 수행하는 엑스선 검출기
JP3131585B2 (ja) 半導体検査回路および半導体回路の検査方法
US7120230B2 (en) System and method for eliminating the effects of saturated pixels in solid state x-ray detectors
US20040234121A1 (en) Circuit wiring inspetion instrument and circuit wiring inspecting method
US20040243345A1 (en) Tester and testing method
JP2020182667A (ja) 放射線撮像装置及びその制御方法
JP2003503965A (ja) 画像検出器
JP4646997B2 (ja) 光電変換装置の駆動方法
JPH08313396A (ja) 液晶パネルの検査方法
CN114464117A (zh) 显示面板、显示器及显示面板检测方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RIC1 Information provided on ipc code assigned before grant

Free format text: 7H 04N 5/217 A, 7H 04N 17/00 B, 7H 04N 5/335 B

17P Request for examination filed

Effective date: 20030207

AKX Designation fees paid

Designated state(s): DE FR

17Q First examination report despatched

Effective date: 20060829

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20091107