EP1156886A4 - Dispositif et procede permettant d'appliquer du flux a un substrat - Google Patents

Dispositif et procede permettant d'appliquer du flux a un substrat

Info

Publication number
EP1156886A4
EP1156886A4 EP00902365A EP00902365A EP1156886A4 EP 1156886 A4 EP1156886 A4 EP 1156886A4 EP 00902365 A EP00902365 A EP 00902365A EP 00902365 A EP00902365 A EP 00902365A EP 1156886 A4 EP1156886 A4 EP 1156886A4
Authority
EP
European Patent Office
Prior art keywords
substrate
applying flux
flux
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00902365A
Other languages
German (de)
English (en)
Other versions
EP1156886A1 (fr
Inventor
Vision Systems Inc Robotic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acuity CiMatrix Inc
Original Assignee
Robotic Vision Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robotic Vision Systems Inc filed Critical Robotic Vision Systems Inc
Publication of EP1156886A1 publication Critical patent/EP1156886A1/fr
Publication of EP1156886A4 publication Critical patent/EP1156886A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP00902365A 1999-01-07 2000-01-07 Dispositif et procede permettant d'appliquer du flux a un substrat Withdrawn EP1156886A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US227243 1988-08-02
US22724399A 1999-01-07 1999-01-07
PCT/US2000/000427 WO2000040343A1 (fr) 1999-01-07 2000-01-07 Dispositif et procede permettant d'appliquer du flux a un substrat

Publications (2)

Publication Number Publication Date
EP1156886A1 EP1156886A1 (fr) 2001-11-28
EP1156886A4 true EP1156886A4 (fr) 2002-08-28

Family

ID=22852350

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00902365A Withdrawn EP1156886A4 (fr) 1999-01-07 2000-01-07 Dispositif et procede permettant d'appliquer du flux a un substrat

Country Status (3)

Country Link
EP (1) EP1156886A4 (fr)
AU (1) AU2409500A (fr)
WO (1) WO2000040343A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
JPH0313393A (ja) * 1989-06-12 1991-01-22 Sony Corp クリームはんだ印刷用マスクスクリーン及びその製造方法
JPH03256396A (ja) * 1990-03-07 1991-11-15 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法
JPH04230095A (ja) * 1990-12-27 1992-08-19 Fuji Photo Film Co Ltd 基板実装方法
JPH06260748A (ja) * 1993-03-03 1994-09-16 Kiyoshi Saitou プリント基板のフラックス部分塗布装置
US5356658A (en) * 1993-07-19 1994-10-18 Motorola, Inc. Flexible high speed liquid dispenser
US5373786A (en) * 1992-06-10 1994-12-20 Dainippon Screen Mfg. Co., Ltd. Metal mask plate for screen printing
GB2320462A (en) * 1996-12-18 1998-06-24 Micro Metallic Ltd Improved stencil and method of producing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0244496B1 (fr) * 1986-05-06 1991-01-16 Ibm Deutschland Gmbh Masque pour lithographie avec des ions, des électrons ou avec des rayons X et procédé de fabrication
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
KR0138278B1 (ko) * 1995-01-24 1998-04-27 김광호 엑스레이 리소그래피용 마스크 및 그의 제조방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
JPH0313393A (ja) * 1989-06-12 1991-01-22 Sony Corp クリームはんだ印刷用マスクスクリーン及びその製造方法
JPH03256396A (ja) * 1990-03-07 1991-11-15 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法
JPH04230095A (ja) * 1990-12-27 1992-08-19 Fuji Photo Film Co Ltd 基板実装方法
US5373786A (en) * 1992-06-10 1994-12-20 Dainippon Screen Mfg. Co., Ltd. Metal mask plate for screen printing
JPH06260748A (ja) * 1993-03-03 1994-09-16 Kiyoshi Saitou プリント基板のフラックス部分塗布装置
US5356658A (en) * 1993-07-19 1994-10-18 Motorola, Inc. Flexible high speed liquid dispenser
GB2320462A (en) * 1996-12-18 1998-06-24 Micro Metallic Ltd Improved stencil and method of producing same

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 124 (M - 1097) 26 March 1991 (1991-03-26) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 059 (E - 1166) 14 February 1992 (1992-02-14) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 579 (E - 1299) 18 December 1992 (1992-12-18) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 661 (E - 1644) 14 December 1994 (1994-12-14) *
See also references of WO0040343A1 *

Also Published As

Publication number Publication date
WO2000040343A1 (fr) 2000-07-13
EP1156886A1 (fr) 2001-11-28
AU2409500A (en) 2000-07-24

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