EP1137500B9 - Bindemittelsystem zur herstellung von kernen und giessformen auf polyurethanbasis - Google Patents
Bindemittelsystem zur herstellung von kernen und giessformen auf polyurethanbasis Download PDFInfo
- Publication number
- EP1137500B9 EP1137500B9 EP99957988A EP99957988A EP1137500B9 EP 1137500 B9 EP1137500 B9 EP 1137500B9 EP 99957988 A EP99957988 A EP 99957988A EP 99957988 A EP99957988 A EP 99957988A EP 1137500 B9 EP1137500 B9 EP 1137500B9
- Authority
- EP
- European Patent Office
- Prior art keywords
- binder system
- casting
- phenol resin
- component
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011230 binding agent Substances 0.000 title claims abstract description 44
- 239000004814 polyurethane Substances 0.000 title description 4
- 229920002635 polyurethane Polymers 0.000 title description 4
- 239000005011 phenolic resin Substances 0.000 claims abstract description 40
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 24
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 24
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 21
- -1 fatty acid ester Chemical class 0.000 claims description 33
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 28
- 239000000194 fatty acid Substances 0.000 claims description 28
- 229930195729 fatty acid Natural products 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 27
- 238000005266 casting Methods 0.000 claims description 18
- 150000002989 phenols Chemical class 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 150000005676 cyclic carbonates Chemical class 0.000 claims description 4
- 150000003997 cyclic ketones Chemical class 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 238000005058 metal casting Methods 0.000 claims 1
- 239000000206 moulding compound Substances 0.000 claims 1
- 239000003495 polar organic solvent Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 abstract description 30
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 23
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 22
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
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- 150000004665 fatty acids Chemical class 0.000 description 10
- 239000004576 sand Substances 0.000 description 10
- 239000003849 aromatic solvent Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 239000000779 smoke Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
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- 239000002245 particle Substances 0.000 description 3
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- 125000001424 substituent group Chemical group 0.000 description 3
- 239000003784 tall oil Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- VTCDZPUMZAZMSB-UHFFFAOYSA-N 3,4,5-trimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1OC VTCDZPUMZAZMSB-UHFFFAOYSA-N 0.000 description 2
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 description 2
- XQDNFAMOIPNVES-UHFFFAOYSA-N 3,5-Dimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1 XQDNFAMOIPNVES-UHFFFAOYSA-N 0.000 description 2
- LPCJHUPMQKSPDC-UHFFFAOYSA-N 3,5-diethylphenol Chemical compound CCC1=CC(O)=CC(CC)=C1 LPCJHUPMQKSPDC-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- MBGGFXOXUIDRJD-UHFFFAOYSA-N 4-Butoxyphenol Chemical compound CCCCOC1=CC=C(O)C=C1 MBGGFXOXUIDRJD-UHFFFAOYSA-N 0.000 description 2
- ZSBDGXGICLIJGD-UHFFFAOYSA-N 4-phenoxyphenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC=C1 ZSBDGXGICLIJGD-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 235000019387 fatty acid methyl ester Nutrition 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HRUHVKFKXJGKBQ-UHFFFAOYSA-N 3,5-dibutylphenol Chemical compound CCCCC1=CC(O)=CC(CCCC)=C1 HRUHVKFKXJGKBQ-UHFFFAOYSA-N 0.000 description 1
- PEZSSBYAUDZEMO-UHFFFAOYSA-N 3,5-dicyclohexylphenol Chemical compound C=1C(O)=CC(C2CCCCC2)=CC=1C1CCCCC1 PEZSSBYAUDZEMO-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 description 1
- CHQPRDVSUIJJNP-NSCUHMNNSA-N 4-[(e)-but-2-enyl]phenol Chemical compound C\C=C\CC1=CC=C(O)C=C1 CHQPRDVSUIJJNP-NSCUHMNNSA-N 0.000 description 1
- ILASIIGKRFKNQC-UHFFFAOYSA-N 4-methoxy-3-methylphenol Chemical compound COC1=CC=C(O)C=C1C ILASIIGKRFKNQC-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- ZNPSUQQXTRRSBM-UHFFFAOYSA-N 4-n-Pentylphenol Chemical compound CCCCCC1=CC=C(O)C=C1 ZNPSUQQXTRRSBM-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
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- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
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- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
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- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
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- 229910052788 barium Inorganic materials 0.000 description 1
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- 238000004821 distillation Methods 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
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- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
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- 150000003839 salts Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
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- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- YZYKBQUWMPUVEN-UHFFFAOYSA-N zafuleptine Chemical compound OC(=O)CCCCCC(C(C)C)NCC1=CC=C(F)C=C1 YZYKBQUWMPUVEN-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/2273—Polyurethanes; Polyisocyanates
Definitions
- the present invention relates to a binder system for the production of Cores and molds based on polyurethane.
- the named "cold box method” or "Ashland method” has become known in the foundry industry a top position conquered.
- the Component 1 consists of the solution of a polyol that at least contains two OH groups per molecule.
- Component 2 is the solution of a Polyisocyanate with at least two NCO groups per molecule.
- the Curing of the binder system is carried out using basic Catalysts. Liquid bases can be added to the binder system before Shaping be added to the two components for the reaction to bring (US-A-3,676,392). Another possibility is according to US-A-3,409,579 therein, gaseous tertiary amines after shaping by the To pass molding material / binder system mixture.
- phenolic resins are used as polyols used by condensation of phenol with aldehydes, preferably Formaldehyde, in the liquid phase at temperatures up to approx. 130 ° C in Presence of catalytic amounts of metal ions can be obtained.
- aldehydes preferably Formaldehyde
- the Binder systems have increased thermal stability.
- Solvents for the phenolic component are predominantly mixtures from high boiling point polar solvents (e.g., esters and ketones) and high-boiling aromatic hydrocarbons used.
- polyisocyanates are preferred in high-boiling aromatic Hydrocarbons dissolved.
- European Patent Application EP-A-0 771 599 formulations are described in which by use of fatty acid methyl esters wholly or at least largely aromatic Solvent is omitted.
- the fatty acid methyl esters are included either as a sole solvent or with the addition of polarity increasing Solvents (phenol component) or aromatic solvents (Isocyanate component) used.
- the with these binder systems made cores can be particularly easily from the molds remove.
- Binder systems that have little or no aromatic Contain hydrocarbons.
- a binder system comprising a Phenolic resin component and a polyisocyanate component in that the phenolic resin component and / or the polyisocyanate component comprises a fatty acid ester and the phenolic resin component comprises an alkoxy-modified phenolic resin wherein less than 25 mol% of the hydroxymethyl groups in the phenolic resin a primary or secondary aliphatic alcohol of 1 to 10 Are etherified carbon atoms and wherein the solvent content of the Phenolic resin component is at most 40 wt .-%.
- the invention relates to molding compositions, the aggregates and up to 15 Wt .-% based on the weight of the aggregates of an inventive Binder system include.
- the casting molding thus obtained can according to the invention for casting metal be used.
- Essential to the invention is the choice of the alkoxy-modified phenolic resin, the has a low viscosity and favorable polarity. According to the invention allows the alkoxy-modified phenolic resin that needed Total solvent amount in both the phenolic resin component as also reduce in the isocyanate component. Furthermore, on the Use of aromatic hydrocarbons in one or both Binder components are dispensed with. By combining the alkoxy-modified phenolic resin with oxygen-rich, polar, organic Solvents are improved with reduced smoke formation Achieved instant strength. The addition of fatty acid ester has a positive effect the release effect and the moisture resistance.
- Phenolic resins are made by condensation of phenols and aldehydes (Ullmann's Encyclopedia of Industrial Chemistry, Vol. A19, page 371 ff, 5th edition, VCH Verlag, Weinheim).
- substituted phenols and mixtures thereof may also be used be used. Suitable are all conventionally used substituted phenols.
- the phenolic compounds are either in both ortho positions or unsubstituted in an ortho and in the para position, to allow the polymerization. The remaining ring carbons may be substituted.
- the choice of the substituent is not particular if the substituent limited the polymerization of the phenol and the Aldehyds are not adversely affected.
- substituted phenols are alkyl-substituted phenols, aryl-substituted phenols, cycloalkyl-substituted Phenols, alkenyl-substituted phenols, alkoxy-substituted phenols, aryloxy-substituted Phenols and halogen-substituted phenols.
- the abovementioned substituents have 1 to 26, preferably 1 to 12, carbon atoms.
- suitable phenols besides the most preferred unsubstituted phenols are o-cresol, m-cresol, p-cresol, 3,5-xylene, 3,4-xylene, 3,4,5-trimethylphenol, 3-ethylphenol, 3,5 Diethylphenol, p-butylphenol, 3,5-dibutylphenol, p-amylphenol, cyclohexylphenol, p-octylphenol, 3,5-dicyclohexylphenol, p-crotylphenol, p-phenylphenol, 3,5-dimethoxyphenol, 3,4,5-trimethoxyphenol , p-ethoxyphenol, p-butoxyphenol, 3-methyl-4-methoxyphenol and p-phenoxyphenol.
- Particularly preferred is phenol itself.
- the phenols can also be described by the general formula: where A, B and C may be hydrogen, alky
- Formaldehyde used as aldehyde according to the invention
- formaldehyde either in its aqueous form or as paraformaldehyde.
- an at least equivalent number of moles of formaldehyde based on the number of moles of Phenol component, can be used.
- the molar ratio is preferably Formaldehyde: Phenol, therefore, at least 1: 1.0, more preferably at least 1: 0.58.
- primary and secondary aliphatic alcohols having one OH group and from 1 to 10 Carbon atoms used.
- Suitable primary or secondary alcohols include e.g. Methanol, ethanol, n-propanol, iso-propanol, n-butanol and Hexanol.
- the phenol component in the one-step process, the phenol component, the formaldehyde and the alcohol in the presence of a suitable catalyst for the reaction brought.
- a suitable catalyst for the reaction brought.
- a non-modified Resin prepared, which is then treated with alcohol.
- Suitable catalysts are salts of divalent ions of Mn, Zn, Cd, Mg, Co, Ni, Fe, Pb, Ca and Ba.
- zinc acetate is used.
- the alkoxylation leads to resins with a low viscosity.
- the resins have mainly ortho-ortho Benzylethermaschinen and also have ortho and para to the phenolic OH group alkoxymethylene groups of the general formula - (CH 2 O) n R on.
- R is the alkyl group of the alcohol and n is a small integer in the range of 1 to 5.
- solvents which are conventionally used in binder systems for foundry technology can be used in the systems according to the invention. It is even possible to use aromatic hydrocarbons as a solvent component in larger proportions, but this does not avoid the above-mentioned, potentially environmentally and health-endangering solvents.
- aromatic hydrocarbons As solvents for the phenolic resin component therefore oxygen-rich, polar, organic solvents are preferably used.
- Particularly suitable are dicarboxylic acid esters, glycol ether esters, glycol diesters, glycol diethers, cyclic ketones, cyclic esters (lactones) or cyclic carbonates. Dicarboxylic acid esters, cyclic ketones and cyclic carbonates are preferably used.
- Dicarboxylic acid esters have the formula R 1 OOC-R 2 -COOR 1 , wherein each R 1 independently represents an alkyl group having 1-12 (preferably 1-6) carbon atoms and R 2 is an alkylene group having 1-4 carbon atoms.
- R 1 independently represents an alkyl group having 1-12 (preferably 1-6) carbon atoms
- R 2 is an alkylene group having 1-4 carbon atoms.
- dimethyl esters of carboxylic acids having 4 to 6 carbon atoms which are obtainable, for example, under the name Dibasic Ester from DuPont.
- Glycol ether esters are compounds of the formula R 3 -OR 4 -OOCR 5 where R 3 is an alkyl group of 1-4 carbon atoms, R 4 is an alkylene group of 2-4 carbon atoms and R 5 is an alkyl group of 1-3 carbon atoms (eg butyl glycol acetate ), preferred are glycol ether acetates.
- Glycol diesters correspondingly have the general formula R 5 COO-R 4 -OOCR 5 , wherein R 4 and R 5 are as defined above and the radicals R 5 are each independently selected (eg propylene glycol diacetate), glycol diacetates are preferred.
- Glycol diethers can be characterized by the formula R 3 -OR 4 -OR 3 in which R 3 and R 4 are as defined above and the radicals R 3 are each independently selected (eg dipropylene glycol dimethyl ether). Cyclic ketones, cyclic esters and cyclic carbonates of 4-5 carbon atoms are also suitable (eg, propylene carbonate).
- the alkyl and alkylene groups may each be branched or unbranched.
- These organic polar solvents are preferably used either as a sole solvent for the phenolic resin or in combination with fatty acid esters, wherein the content of the oxygen-rich solvents in the solvent mixture should predominate.
- the content of oxygen-rich solvents should thus be more than 50% by weight, preferably more than 55% by weight.
- the measure had a positive effect on the development of quality, the To reduce the total content of solvents in the binder system. While conventional phenolic resins predominantly about 45 wt .-% and partially up to 55 wt .-% solvent to a Processing-compatible viscosity (up to about 400 mPa ⁇ s) can be achieved by Use of a low-viscosity phenolic resin of the invention Solvent content in the phenol component to at most 40 wt .-%, preferably even limited to at most 35 wt .-%.
- the dynamic Viscosity is e.g. determined by the Brookfield rotary spindle method.
- Suitable binder systems have an instantaneous strength of at least 150 N / cm 2 at a used amount of each 0.8 parts by weight of phenolic resin component and isocyanate component, based on 100 parts by weight of aggregate, such as quartz sand H 32 (see EP-A-0 771 599 or DE -A-4 327 292).
- fatty acid ester to the solvent of the phenolic component leads to particularly good release properties.
- Suitable fatty acids are e.g. with 8 to 22 carbons esterified with an aliphatic alcohol.
- fatty acids of natural origin e.g. from tall oil, Rapeseed oil, sunflower oil, germ oil and coconut oil.
- the natural oils which are mostly mixtures of different fatty acids,
- single fatty acids e.g. palmitic or myristic fatty acid.
- Aliphatic monoalcohols with 1 to 12 carbons are suitable for Esterification of fatty acids. Preference is given to alcohols having 1 to 10 Carbon atoms, particularly preferred are alcohols having 4 to 10 Carbon atoms. Due to the lower polarity of the fatty acid esters, whose alcohol component has 4 to 10 carbon atoms, it is possible to reduce the fatty acid ester content and reduce the formation of smoke. A number of fatty acid esters are commercially available.
- fatty acid esters whose Alcohol component contains 4 to 10 carbon atoms particularly advantageous because they are excellent for the binder system Impart release properties when their content in the solvent of the Phenol component is less than 50 wt .-% is.
- Fatty acid esters with longer alcohol components are the butyl esters of Oleic acid and tall oil fatty acid and the mixed octyl / decyl ester of Called tall oil fatty acid.
- the alkoxy-modified Phenolic resins can be aromatic hydrocarbons as a solvent avoid the phenol component. This is due to the balanced polarity of the Due to the use of oxygenated, organic, polar solvents e.g. as a sole solvent.
- By the use of the alkoxy-modified Phenolic resins can reduce the amount of solvent needed to less than 35 wt .-% of phenol component are limited. This is done by the low viscosity of the resin allows.
- aromatic Hydrocarbons can also be avoided.
- binder system according to the invention with at least 50 wt .-% of above-mentioned oxygen-rich, polar, organic solvent as Part of the solvent of the phenol component also leads to a significantly reduced smoke development compared to conventional Systems with a high proportion of fatty acid esters in the solvent.
- the second component of the binder system comprises an aliphatic, cycloaliphatic or aromatic polyisocyanate, preferably with 2 to 5 Isocyanate groups. Depending on the desired properties can also Mixtures of organic isocyanates are used.
- suitable Polyisocyanates include aliphatic polyisocyanates, e.g. Hexamethylene diisocyanate, alicyclic polyisocyanates such as e.g. 4,4'-dicyclohexylmethane and dimethyl derivatives thereof.
- aromatic polyisocyanates examples include toluene-2,4-diisocyanate, toluene-2,6-diisocyanate, 1,5-naphthalene diisocyanate, triphenylmethane triisocyanate, Xylylene diisocyanate and methyl derivatives thereof, Polymethylene polyphenylisocyanate and chlorophenylene-2,4-diisocyanate.
- Preferred polyisocyanates are aromatic polyisocyanates, especially preferred are polymethylene polyphenyl polyisocyanates, e.g. Diisocyanate.
- polyisocyanate is by weight used the phenolic resin.
- Liquid polyisocyanates can be undiluted Form while solid or viscous polyisocyanates in be dissolved organic solvents. Up to 80% by weight of the isocyanate component may consist of solvents.
- a solvent for the Polyisocyanate will be either the above-mentioned fatty acid esters or a Mixture of fatty acid esters and up to 50% by weight of aromatic solvents used. Suitable aromatic solvents are naphthalene, alkyl-substituted Naphthalenes, alkyl-substituted benzenes and mixtures thereof.
- aromatic solvents consisting of mixtures of consist of above-mentioned aromatic solvents and a Boiling point range between 140 ° C and 230 ° C have.
- no aromatic solvent used Preferably no aromatic solvent used.
- the binder systems conventional additives, such. B. silanes (US 4,540,724), drying oils (US 4,268,425) or complexing agents (WO 95/03903).
- the Binder systems are preferred as two-component systems offered, wherein the solution of the phenolic resin is a component and the polyisocyanate, optionally in solution, is the other component.
- the two components are combined and then sand or a similar aggregate mixed to produce a molding material.
- the Molding composition contains an effective binding amount of up to 15 wt .-% of binder system according to the invention, based on the weight of Aggregates. It is also possible to use the components first with each Mixing of the sand or aggregate and then this to unite both mixtures. Method to a uniform mixture to achieve the components and the aggregate are those skilled in the art known.
- the mixture may optionally contain other conventional Ingredients, such as iron oxide, ground flax fibers, wood pieces, and pitch refractory flours, included.
- the aggregate should have enough have large particle size.
- the mold part has a Sufficient porosity and volatile compounds may occur during the Casting escape.
- at least 80% by weight and preferably 90% by weight of the aggregate an average Particle size ⁇ 290 microns on.
- the average particle size of the Aggregates should be between 100 and 300 ⁇ m.
- sand is preferred as aggregate material used, wherein at least 70 wt .-% and preferably more than 80 wt .-% of the sand are silica.
- Zircon, olefin, aluminosilicate sand and Chromite sand are also suitable as aggregate materials.
- the aggregate material is the main ingredient in molded parts.
- In Molded sand moldings for standard applications account for the share of Binder generally up to 10 wt .-%, often between 0.5 and 7 Wt .-%, based on the weight of the aggregate. Especially preferred are 0.6 to 5 wt .-% of binder, based on the weight of Aggregates, used.
- the aggregate is preferably dried, up to 0.1 wt .-%, based on the weight of the aggregate, tolerated by moisture become.
- the mold part is hardened so that it conforms to its external shape the removal of the mold retains.
- Conventional liquid or gaseous Hardening systems can be used to cure the invention
- Binder system can be used.
- a volatile one tertiary amine e.g. Triethylamine or dimethylethylamine as described in US-A-3,409,579 described, are passed through the mold part. It is furthermore possible to add a liquid amine to the molding compound for curing. After removal from the mold is in a conventional manner the Molded part converted by further hardening in the final state.
- silanes of the general formula (R'O) 3 Si are added to the molding compound before curing.
- R ' is a hydrocarbon radical, preferably an alkyl radical of 1-6 carbon atoms
- R is an alkyl radical, an alkoxy-substituted alkyl radical or an alkylamine-substituted amine radical having alkyl groups having 1-6 carbon atoms.
- silanes examples include Dow Corning Z6040 and Union Carbide A-187 ( ⁇ -glycidoxypropyltrimethoxysilane), Union Carbide A-1100 ( ⁇ -aminopropyltriethoxysilane), Union Carbide A-1120 (N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane) and Union Carbide A-1160 (ureidosilane).
- additives including wetting agents and the use of the sand mixture extending additives (engl. Benchlife additives), as described in US 4,683,252 or US 4,540,724, be used.
- Additional mold release agents such as e.g. fatty acids, Fatty alcohols and their derivatives can be used, but are used in usually not needed.
- example 1 not according to the invention inventively phenol 2130.7 g 1770.6 g Paraformaldehyde 91% 865.3 g 984.3 g n-butanol - 279.6 g Zinc acetate dihydrate 1.0 g 1.5 g
- the phenol resin solution 1A separates after cooling to room temperature in two phases and is therefore not used for further tests.
- the viscosity of the phenol resin solutions 1B-1D is far outside the application-favorable range (up to approx. 400 mPa ⁇ s)
- the flexural strengths of the specimens are determined by the GF method. The bending strength of the specimens immediately after their Production (immediate strength) as well as tested after 1, 2 and 24 hours.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mold Materials And Core Materials (AREA)
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19850833 | 1998-11-04 | ||
| DE19850833A DE19850833C2 (de) | 1998-11-04 | 1998-11-04 | Bindemittelsystem zur Herstellung von Kernen und Gießformen auf Polyurethanbasis, deren Verwendung und Verfahren zur Herstellung eines Gießformteils auf Polyurethanbasis |
| PCT/EP1999/008419 WO2000025957A1 (de) | 1998-11-04 | 1999-11-04 | Bindemittelsystem zur herstellung von kernen und giessformen auf polyurethanbasis |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1137500A1 EP1137500A1 (de) | 2001-10-04 |
| EP1137500B1 EP1137500B1 (de) | 2004-03-24 |
| EP1137500B9 true EP1137500B9 (de) | 2005-12-14 |
Family
ID=7886667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP99957988A Expired - Lifetime EP1137500B9 (de) | 1998-11-04 | 1999-11-04 | Bindemittelsystem zur herstellung von kernen und giessformen auf polyurethanbasis |
Country Status (16)
| Country | Link |
|---|---|
| EP (1) | EP1137500B9 (cs) |
| KR (1) | KR100871534B1 (cs) |
| AT (1) | ATE262387T1 (cs) |
| AU (1) | AU757432B2 (cs) |
| BG (1) | BG64942B1 (cs) |
| BR (1) | BR9915076A (cs) |
| CA (1) | CA2349878C (cs) |
| CZ (1) | CZ296809B6 (cs) |
| DE (2) | DE19850833C2 (cs) |
| DK (1) | DK1137500T3 (cs) |
| ES (1) | ES2217841T3 (cs) |
| HU (1) | HU223611B1 (cs) |
| NO (1) | NO20012166L (cs) |
| PL (1) | PL191929B1 (cs) |
| TR (1) | TR200101240T2 (cs) |
| WO (1) | WO2000025957A1 (cs) |
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| DE102013004663B4 (de) | 2013-03-18 | 2024-05-02 | Ask Chemicals Gmbh | Bindemittelsystem, Formstoffmischung enthaltend dasselbe, Verfahren zur Herstellung der Formstoffmischung, Verfahren zur Herstellung eines Gießformteils oder Gießkerns, Gießformteil oder Gießkern sowie Verwendung des so erhältlichen Gießformteils oder Gießkerns für den Metallguss |
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| GB2267524B (en) * | 1992-06-04 | 1995-07-12 | Chas Braithwaite | Cycle parking fixture |
| DE4327292C2 (de) * | 1993-08-13 | 1996-04-25 | Ashland Suedchemie Kernfest | Bindemittel zur Herstellung von Gießereikernen und -formen und ihre Verwendung |
| WO1998002473A1 (en) * | 1996-07-17 | 1998-01-22 | Ashland Inc. | Benzylic ether phenolic resole resins, their preparation, and uses |
-
1998
- 1998-11-04 DE DE19850833A patent/DE19850833C2/de not_active Expired - Fee Related
-
1999
- 1999-11-04 WO PCT/EP1999/008419 patent/WO2000025957A1/de not_active Ceased
- 1999-11-04 CA CA002349878A patent/CA2349878C/en not_active Expired - Fee Related
- 1999-11-04 KR KR1020017005623A patent/KR100871534B1/ko not_active Expired - Fee Related
- 1999-11-04 DK DK99957988T patent/DK1137500T3/da active
- 1999-11-04 EP EP99957988A patent/EP1137500B9/de not_active Expired - Lifetime
- 1999-11-04 HU HU0104315A patent/HU223611B1/hu not_active IP Right Cessation
- 1999-11-04 ES ES99957988T patent/ES2217841T3/es not_active Expired - Lifetime
- 1999-11-04 AT AT99957988T patent/ATE262387T1/de active
- 1999-11-04 DE DE59908972T patent/DE59908972D1/de not_active Expired - Lifetime
- 1999-11-04 AU AU15509/00A patent/AU757432B2/en not_active Ceased
- 1999-11-04 TR TR2001/01240T patent/TR200101240T2/xx unknown
- 1999-11-04 BR BR9915076-0A patent/BR9915076A/pt not_active Application Discontinuation
- 1999-11-04 CZ CZ20011334A patent/CZ296809B6/cs not_active IP Right Cessation
- 1999-11-04 PL PL348642A patent/PL191929B1/pl unknown
-
2001
- 2001-05-02 NO NO20012166A patent/NO20012166L/no not_active Application Discontinuation
- 2001-06-01 BG BG105554A patent/BG64942B1/bg unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013004663B4 (de) | 2013-03-18 | 2024-05-02 | Ask Chemicals Gmbh | Bindemittelsystem, Formstoffmischung enthaltend dasselbe, Verfahren zur Herstellung der Formstoffmischung, Verfahren zur Herstellung eines Gießformteils oder Gießkerns, Gießformteil oder Gießkern sowie Verwendung des so erhältlichen Gießformteils oder Gießkerns für den Metallguss |
Also Published As
| Publication number | Publication date |
|---|---|
| CZ20011334A3 (cs) | 2002-05-15 |
| HUP0104315A2 (hu) | 2002-03-28 |
| KR20010113634A (ko) | 2001-12-28 |
| CA2349878C (en) | 2009-06-09 |
| WO2000025957A1 (de) | 2000-05-11 |
| HU223611B1 (hu) | 2004-10-28 |
| AU1550900A (en) | 2000-05-22 |
| NO20012166D0 (no) | 2001-05-02 |
| PL191929B1 (pl) | 2006-07-31 |
| DE19850833C2 (de) | 2001-06-13 |
| ATE262387T1 (de) | 2004-04-15 |
| PL348642A1 (en) | 2002-06-03 |
| NO20012166L (no) | 2001-06-11 |
| KR100871534B1 (ko) | 2008-12-05 |
| EP1137500B1 (de) | 2004-03-24 |
| BR9915076A (pt) | 2001-10-23 |
| DK1137500T3 (da) | 2004-05-10 |
| TR200101240T2 (tr) | 2001-10-22 |
| BG64942B1 (bg) | 2006-10-31 |
| DE19850833A1 (de) | 2000-05-11 |
| HUP0104315A3 (en) | 2002-05-28 |
| AU757432B2 (en) | 2003-02-20 |
| DE59908972D1 (de) | 2004-04-29 |
| ES2217841T3 (es) | 2004-11-01 |
| CZ296809B6 (cs) | 2006-06-14 |
| EP1137500A1 (de) | 2001-10-04 |
| CA2349878A1 (en) | 2000-05-11 |
| BG105554A (en) | 2001-12-29 |
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