EP1127385B9 - Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions - Google Patents
Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions Download PDFInfo
- Publication number
- EP1127385B9 EP1127385B9 EP99950839A EP99950839A EP1127385B9 EP 1127385 B9 EP1127385 B9 EP 1127385B9 EP 99950839 A EP99950839 A EP 99950839A EP 99950839 A EP99950839 A EP 99950839A EP 1127385 B9 EP1127385 B9 EP 1127385B9
- Authority
- EP
- European Patent Office
- Prior art keywords
- wafers
- antenna
- receiver
- etching
- frequency wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
Definitions
- the present invention relates to a method for producing radio wave receivers by circuit interconnection integrated in three dimensions.
- GPS Global Positioning System
- the GPS it is possible to receive, at every moment and anywhere on the earth, by means of a receiver and a antenna, radio signals emitted by at least 6 satellites that allow the user to know his exact position in latitude, longitude and altitude.
- an on-board GPS allows thanks a transponder to transmit trajectory correction commands to from a ground station, or directly control a system of onboard trajectory correction from the position of the shell and coordinates of an objective.
- the electronic circuits must be able to operate with very severe acceleration constraints of 15 to 20,000 g for several milliseconds and, on the other hand, the volume occupied by the assembly must be very small for certain types of ammunition. , of the order of a few tens of cm 3 for example.
- 3D technology of the type of described in the patent FR 2 670 323 and filed in the name of Thomson-CSF, may be considered.
- the described method consists in carrying out the interconnection of stacked semiconductor pellets each having a circuit integrated.
- connection pads are each connected to any one of the faces of the stack except one, so-called base which is intended to be in contact with a circuit substrate printed.
- the formation of the connections of the pellets between them is carried out on the faces of the stack by laser etching.
- the object of the invention is to overcome the aforementioned drawbacks.
- the subject of the invention is a production method of a radio wave receiver coupled to a radio antenna stack receipt of semiconductor pellets containing each at least one integrated circuit and having pads of connection for connecting the pellets to one another, characterized in that metallizing the outer surface of the stacked pellets to create a ground plane of the receiver antenna, to cover the plane of mass by a dielectric material, to metallize the surface of the material dielectric and to etch the receiver antenna on the metallized surface obtained.
- the subject of the invention is also a use of the method of the implementation of a GPS receiver embedded in a munition.
- the main advantage of the invention is that it allows a implementation of onboard radio wave receivers on board of ammunition that gives them sufficient reliability to withstand the accelerations to which ammunition is subjected.For this fact it allows to ensure greater effectiveness in long-range firing as it is known that in the absence of trajectory correction device, this efficiency decreases very quickly with ammunition range due to errors of accuracy and dispersion.
- the implementation according to the invention of a wave receiver radioelectric device by stacking semiconductor chips comprising an antenna engraved on the outer surface of the pellets constitutes a good means to constitute an on-board navigation aid system able to locate the ammunition on its trajectory and perform a course correction so that the ammunition can reach its goal.
- Step 1 consists of producing in a known manner in the form of ASIC chips, English abbreviation for "Application Specific Integrated Circuit” the specific components of the GPS receiver.
- the wiring of the chips or discrete components is carried out at Step 2 on flexible printed circuits type polyamide, epoxy or still on film according to the method known by the abbreviation Anglo Saxon TAB of "Automated Bonding Tape".
- these movies can be four, a movie 7 feed, two movies 8 and 9 containing the signal processing electronics and a film 10 for microwave circuits.
- step 3 The films 7 to 10 are coated in step 3 in a resin epoxy to form pellets.
- step 3 is also realized the cutting pellets following the shape of the windows of TAB films and stacking them one above the other to form a module
- the interconnections between each film level can be carried out according to the process described in patent FR 2,670,323 already cited. After metallization of the faces of the pellets, the interconnections between pellets are performed by laser etching and conduction tracks are protected by an insulating deposit. Stacking of the pellets is shown in Figure 3, where the elements homologous to those of the figure 2 are represented with the same references.
- Plots 11 of connection of the module to an external printed circuit not shown are carried out according to the process known by the abbreviation BGA of "Ball Grid Array. "Outputs 12a, 12b connecting the hyper film to the antenna are also realized.
- Step 4 consists in carrying out a metallization represented in FIG. 4 of the outer faces of the module composed of pellets stacked according to step 3 to create the ground plane of the antenna.
- step 5 a deposit shown in FIG. 5 of a high dielectric constant dielectric material is carried out on the faces of the module, this deposit is followed in step 6 by metallization and etching of the antennas 13 a , 13 b as shown in Figure 6.
- the antennas are preferably etched all around the module so that there is always an active antenna, that is to say capable of receiving data from the GPS satellite network when the ammunition rotate on itself.
- the 3D technology used allows to consider all types of shapes, and to use compliant antennas or micro-ribbon antennas still known as Anglo-Saxon "patch" whose engraving is performed on the surface of the modules.
- Figures 6 a to 6c shows different integration solutions capable of satisfying certain volume constraints.
- FIG. 6 a corresponds to a cubic module embodiment with "patch" antennas arranged on four faces of the cube.
- Figure 6b corresponds to an embodiment of a cylindrical module with a ribbon antenna arranged in turn.
- Figure 6C is that of a cylindrical module with conical stranded antenna.
- FIG. 7 represents a GPS module implemented according to the method of the invention, within an artillery rocket. Following this embodiment the GPS module 14 is placed in the nose of the rocket.It can be seen that its dimension is very small compared to the longitudinal dimension of the rocket which in this example is of the order of 145 mm, its maximum diameter being of the order of 50 mm.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Position Fixing By Use Of Radio Waves (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
Claims (9)
- Procédé de réalisation d'un récepteur d'ondes radioélectriques couplé à une antenne de réception, par empilement (3) de pastilles semiconductrices contenant chacune au moins un circuit intégré et comportant des plots de connexion pour raccorder les pastilles entre elles, caractérisé en ce qu'il consiste à métalliser (4) la surface extérieure des pastilles empilées pour créer un plan de masse de l'antenne du récepteur, à recouvrir (5) le plan de masse par un matériau diélectrique, à métalliser (6) la surface du matériau diélectrique et à graver l'antenne du récepteur sur la surface métallisée obtenue.
- Procédé selon la revendication 1, caractérisé en ce que les pastilles semiconductrices sont obtenues par câblage de puces électronique sur film TAB suivi d'un enrobage dans une résine époxy.
- Procédé selon les revendications 1 et 2, caractérisé en ce qu'il consiste à empiler les pastilles en les conformant pour former un cube.
- Procédé selon la revendication 3, caractérisé en ce qu'il consiste à graver des antennes patch sur les faces du cube.
- Procédé selon l'une quelconque des revendications 1 et 2,
caractérisé en ce qu'il consiste à conformer les pastilles selon un cylindre. - Procédé selon la revendication 5, caractérisé en ce qu'il consiste à graver une antenne ruban tout au tour du cylindre.
- Procédé selon l'une quelconque des revendications 1 et 2, caractérisé en ce qu'il consiste à empiler les pastilles en les conformant pour former un cône.
- Procédé selon la revendication 7, caractérisé en ce qu'il consiste à graver les antennes à la surface du cône.
- Utilisation du procédé selon l'une quelconque des revendications 1 à 8 à la mise en oeuvre d'un récepteur GPS embarqué dans une munition ou des récepteurs d'ondes radioélectriques.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9813814A FR2785452B1 (fr) | 1998-11-03 | 1998-11-03 | Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions |
FR9813814 | 1998-11-03 | ||
PCT/FR1999/002606 WO2000026992A1 (fr) | 1998-11-03 | 1999-10-26 | Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1127385A1 EP1127385A1 (fr) | 2001-08-29 |
EP1127385B1 EP1127385B1 (fr) | 2003-09-03 |
EP1127385B9 true EP1127385B9 (fr) | 2004-03-03 |
Family
ID=9532311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99950839A Expired - Lifetime EP1127385B9 (fr) | 1998-11-03 | 1999-10-26 | Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1127385B9 (fr) |
DE (1) | DE69911047T2 (fr) |
FR (1) | FR2785452B1 (fr) |
WO (1) | WO2000026992A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004013643A1 (de) * | 2004-03-19 | 2005-10-13 | Infineon Technologies Ag | Antennenanordnung und Verfahren zum Herstellen derselben |
WO2010026527A2 (fr) | 2008-09-08 | 2010-03-11 | Koninklijke Philips Electronics N.V. | Détecteur de rayonnement comportant un empilement de plaques de conversion et de couches d'interconnexion |
FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2670323B1 (fr) * | 1990-12-11 | 1997-12-12 | Thomson Csf | Procede et dispositif d'interconnexion de circuits integres en trois dimensions. |
US5219377A (en) * | 1992-01-17 | 1993-06-15 | Texas Instruments Incorporated | High temperature co-fired ceramic integrated phased array package |
US5367308A (en) * | 1992-05-29 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Thin film resonating device |
US5493305A (en) * | 1993-04-15 | 1996-02-20 | Hughes Aircraft Company | Small manufacturable array lattice layers |
DE19535962C1 (de) * | 1995-09-27 | 1997-02-13 | Siemens Ag | Dopplerradarmodul |
-
1998
- 1998-11-03 FR FR9813814A patent/FR2785452B1/fr not_active Expired - Fee Related
-
1999
- 1999-10-26 DE DE69911047T patent/DE69911047T2/de not_active Expired - Lifetime
- 1999-10-26 EP EP99950839A patent/EP1127385B9/fr not_active Expired - Lifetime
- 1999-10-26 WO PCT/FR1999/002606 patent/WO2000026992A1/fr active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1127385B1 (fr) | 2003-09-03 |
FR2785452A1 (fr) | 2000-05-05 |
DE69911047D1 (de) | 2003-10-09 |
WO2000026992A1 (fr) | 2000-05-11 |
FR2785452B1 (fr) | 2003-06-13 |
EP1127385A1 (fr) | 2001-08-29 |
DE69911047T2 (de) | 2004-04-29 |
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