EP1114450A1 - A system and a method for plating of a conductive pattern - Google Patents
A system and a method for plating of a conductive patternInfo
- Publication number
- EP1114450A1 EP1114450A1 EP99936188A EP99936188A EP1114450A1 EP 1114450 A1 EP1114450 A1 EP 1114450A1 EP 99936188 A EP99936188 A EP 99936188A EP 99936188 A EP99936188 A EP 99936188A EP 1114450 A1 EP1114450 A1 EP 1114450A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- contact
- conductive pattern
- plating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93974 | 1987-09-08 | ||
US9397498P | 1998-07-24 | 1998-07-24 | |
PCT/BE1999/000090 WO2000007229A1 (en) | 1998-07-24 | 1999-07-14 | A system and a method for plating of a conductive pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1114450A1 true EP1114450A1 (en) | 2001-07-11 |
Family
ID=22242015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99936188A Withdrawn EP1114450A1 (en) | 1998-07-24 | 1999-07-14 | A system and a method for plating of a conductive pattern |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1114450A1 (en) |
JP (1) | JP2002521575A (en) |
AU (1) | AU5141999A (en) |
WO (1) | WO2000007229A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6782116B2 (en) * | 2016-08-02 | 2020-11-11 | 古河電気工業株式会社 | Silver coating material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6701136A (en) * | 1967-01-25 | 1968-07-26 | ||
DE2830761A1 (en) * | 1978-07-13 | 1980-01-24 | Bosch Gmbh Robert | Thickened anode contact Schottky diode production - involves electroplating by passing current in forward direction through diode to plating anode |
JPS57153431A (en) * | 1981-03-17 | 1982-09-22 | Mitsubishi Electric Corp | Electroplating method for semiconductor wafer |
JPS60128615A (en) * | 1983-12-15 | 1985-07-09 | Sumitomo Electric Ind Ltd | Electrolyte plating method for semiconductor wafer |
KR900008647B1 (en) * | 1986-03-20 | 1990-11-26 | 후지쓰 가부시끼가이샤 | A method for manufacturing three demensional i.c. |
FR2742452B1 (en) * | 1995-12-18 | 1998-01-16 | Commissariat Energie Atomique | SUPPORT FOR ELECTROCHEMICAL DEPOSIT |
-
1999
- 1999-07-14 WO PCT/BE1999/000090 patent/WO2000007229A1/en active Application Filing
- 1999-07-14 JP JP2000562941A patent/JP2002521575A/en active Pending
- 1999-07-14 EP EP99936188A patent/EP1114450A1/en not_active Withdrawn
- 1999-07-14 AU AU51419/99A patent/AU5141999A/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO0007229A1 * |
Also Published As
Publication number | Publication date |
---|---|
AU5141999A (en) | 2000-02-21 |
JP2002521575A (en) | 2002-07-16 |
WO2000007229A1 (en) | 2000-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20001130 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM |
|
17Q | First examination report despatched |
Effective date: 20080414 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: IMEC |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/58 20060101AFI20150304BHEP Ipc: H01L 21/288 20060101ALI20150304BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
DAX | Request for extension of the european patent (deleted) | ||
INTG | Intention to grant announced |
Effective date: 20150428 |
|
RBV | Designated contracting states (corrected) |
Designated state(s): BE DE FR GB IT |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150909 |