EP1108544B1 - Tête d'impression pour une imprimante à jet de liquide - Google Patents

Tête d'impression pour une imprimante à jet de liquide Download PDF

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Publication number
EP1108544B1
EP1108544B1 EP00310133A EP00310133A EP1108544B1 EP 1108544 B1 EP1108544 B1 EP 1108544B1 EP 00310133 A EP00310133 A EP 00310133A EP 00310133 A EP00310133 A EP 00310133A EP 1108544 B1 EP1108544 B1 EP 1108544B1
Authority
EP
European Patent Office
Prior art keywords
printhead
layer
substrate
heat sink
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00310133A
Other languages
German (de)
English (en)
Other versions
EP1108544A1 (fr
Inventor
David A. Shade
John B. Rauscn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP1108544A1 publication Critical patent/EP1108544A1/fr
Application granted granted Critical
Publication of EP1108544B1 publication Critical patent/EP1108544B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
    • B41J2/235—Print head assemblies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/1408—Structure dealing with thermal variations, e.g. cooling device, thermal coefficients of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering

Definitions

  • This invention relates generally to thermal inkjet printing.
  • the preferred embodiment provides an inkjet printhead apparatus having a dual-function heat sink and a method for manufacturing such an inkjet printhead.
  • the dual-function heat sink is used during operation of the inkjet printhead to cool a resistor, or other energy-dissipation device.
  • a resistor or other energy-dissipation device is used to eject fluid from the fully integrated fluid-jet printhead.
  • the dual-function heat sink is used as a barrier preventing a chemical element or compound which is present in a substrate of the printhead from migrating by diffusion or other transport mechanism to another structure of the printhead.
  • Inkjet printers or plotters typically have a printhead mounted on a carriage. This carriage traverses back and forth across the width of a print medium (i.e., usually paper or a plastic plotting film, for example) as the medium is fed through the printer or plotter. Orifices on the printhead are fed ink (or other printing fluid) by one or more channels communicating from a reservoir. Energy applied individually to addressable resistors (or other energy-dissipating elements, for example, to piezoelectric actuators), transfers energy to ink which is within or associated with selected orifices, causing a portion of the ink to momentarily convert to vapor phase and to form a vapor bubble.
  • a print medium i.e., usually paper or a plastic plotting film, for example
  • Orifices on the printhead are fed ink (or other printing fluid) by one or more channels communicating from a reservoir.
  • Energy applied individually to addressable resistors or other energy-dissipating elements, for example,
  • this type of printer is also sometimes referred to as a "bubble jet printer.”
  • some of the ink is ejected out of the respective orifice toward the print medium (i.e., forming an "ink jet”).
  • the bubble collapses almost simultaneously, allowing more ink from the reservoir to fill the channel.
  • This quick ejection of an ink jet from an orifice, and almost simultaneous collapse of the bubble which caused this ejection allows for the ink jet printing cycle to have a high repetition rate.
  • misfiring may cause the printhead to quit functioning at a particular print orifice because it is possible for the electrical resistor to open-circuit.
  • This open circuiting of a printing resistor is similar to blowing a fuse, and can result from excessive temperature buildup at the printing resistors.
  • This type of failure creates a permanent loss of printing ability at that orifice location of the printhead.
  • Such a loss of printhead function is a serious inconvenience to the user as the ink jet printing cartridge must be replaced, even though it may be nearly full of ink. Therefore, it is very important to more efficiently remove heat generated by the resistors or other energy dissipating elements of an ink jet printhead.
  • EP 0445688 discloses a plastic substrate for a thermal ink jet printer.
  • a substrate for a printhead includes a plastic base with a metallization layer overlying the plastic base and a dielectric structure overlying the metallization layer.
  • a thin film resistor is deposited over the substrate.
  • the metallization layer aids in bonding the overlying structure to the base and to some extent acts as a heat sink.
  • US 5,751,316 discloses a heat sink for an ink jet printhead which has improved resistance to the corrosive effects of ink by forming a chromate film on a copper plated metal substrate.
  • the present invention seeks to provide improved inkjet printing.
  • this invention provides a method of making an integrated thermal fluid jet print head, this method comprising steps of: forming a substrate having a plan-view shape; forming a thin-film structure on the substrate; including in the thin-film structure adjacent to the substrate a metallic heat sink layer; and forming the metallic heat sink layer to have a plan-view shape substantially the same as and congruent with the plan-view shape of the substrate, whereby the heat sink layer covers substantially the entire plan-view shape of the substrate.
  • Still another aspect of the present invention provides a printhead for ejecting printing liquid, the printhead comprising an amorphous substrate, a thin-film structure carried on the substrate; and a thin-film radio-frequency shield layer interposed between the substrate and the thin-film structure, whereby the radio-frequency shield layer substantially prevents sodium, another chemical element, or chemical compound from transporting from the substrate to the thin-film structure during exposure of the substrate and thin film structure to radio frequency energy.
  • FIG 1 shows an exemplary inkjet printer 10.
  • This printer 10 includes a base 12 carrying a housing 14. Within the housing 14 is a feed mechanism 16 for controllably moving a print medium (i.e., paper) through the printer 10.
  • the feed mechanism 16 controllably moves a sheet of paper 18 from a paper magazine 20 along a print path 22 within the printer 10.
  • the printer 10 includes a traverse mechanism 24 carrying an inkjet print cartridge 26.
  • the traverse mechanism moves the inkjet printing cartridge 26 perpendicularly to the direction of movement of the paper 18 (i.e., the cartridge 26 is moved perpendicularly to the plane of Figure 2).
  • the printer uses the inkjet printing cartridge 26 to controllably place small droplets of printing fluid (i.e., ink, for example) from the inkjet printing cartridge 26 on the paper 18.
  • printing fluid i.e., ink, for example
  • characters or images may be controllably formed by ejection of the small droplets of ink from the cartridge 26.
  • These small droplets of ink are ejected in the form of ink jets impinging on the paper 18 in controlled locations to form characters and images, as will be well known to those ordinarily skilled in the pertinent arts.
  • the electrical contacts 40 individually make electrical contact with matching contacts (not seen in the drawing Figures) on the traverse mechanism 24, and provide for electrical interface of the printhead 32 with electrical driving circuitry (also not illustrated in the drawing Figures) of the printer 10.
  • Individual fine-dimension orifices 42 of the printhead 32 eject printing fluid when appropriate control signals are applied to contacts 40.
  • the fine-dimension orifices 42 are formed in a metallic plate member 44 adhesively attached to underlying structure (generally referenced with the numeral 46, and seen in Figure 4) of the printhead 32.
  • the underlying structure 46 of the printhead 32 defines a through hole 48 communicating printing fluid from the chamber 36 to a cavity 50 (best seen in Figure 5) formed between the structure 46 and a portion of the plate member 44.
  • the structure of the printhead 32 is shown in Figures 3-6 viewed in conjunction with one another.
  • the thermal ink jet printhead 32 of Figures 3-6 includes a substrate 52 (best seen in Figures 5 and 6), which is most preferably formed as a plate of glass (i.e., an amorphous, generally non-conductive material).
  • the substrate 52 is generally rectangular in plan view, although the invention is not so limited.
  • this glass substrate is an inexpensive type of soda/lime glass (i.e., like ordinary window glass), which makes the printhead 32 very economical to manufacture,
  • the printhead 32 is especially economical and inexpensive to manufacture when considered in comparison to printheads using the conventional technologies requiring a substrate of silicon or other crystalline semiconductor materials.
  • a thin-film structure 54 of plural layers On the glass substrate 52 is formed a thin-film structure 54 of plural layers. As will be further explained, during manufacturing of the printhead 32 this thin-film structure 54 is formed substantially of plural thin-film layers applied one after the other and atop of one another, and each of which entirely covers and is congruent with the plan-view shape of the substrate. Again, this plan-view shape of the substrate 52 is seen in Figures 3 and 4. Once selected ones of these thin-film layers are formed on the substrate 52, subsequent patterning and etching operations are used to define the contacts 40 and print circuit 38, for example, as is further explained below.
  • the thin-film structure 54 includes a metallic multi-function heat sink, radio frequency shield, and diffusion barrier thin-film layer 56 (best seen in Figures 5 and 6) which is applied upon the substrate 52.
  • the layer 56 covers the entire plan-view shape of the substrate 52, and is preferably formed of chrome about 1 to 2 microns thick.
  • the layer 52 may be formed of other metals and alloys.
  • the thin-film heat sink, RF shield, and diffusion barrier layer 56 may be formed of aluminum, chrome, copper, gold, iron, molybdenum, nickel, palladium, platinum, tantalum, titanium, tungsten, a refractory metal, or of alloys of these or other metals.
  • the insulator layer 58 is preferably formed of silicon oxide, and is about 1 to 2 microns thick. Again, this insulator layer 58 covers and is congruent with the entire plan-view shape of the substrate 52.
  • a resistor thin-film layer 60 is formed on the substrate 52 and on the insulator layer 56.
  • the thin-film resistor layer is preferably formed of tantalum, aluminum alloy, and is preferably about 600 Angstroms thick.
  • This resistor thin-film layer 60 is formed to cover and be congruent with the entire plan-view shape of the substrate 52, but does not remain this extensive. That is, the resistor layer 60 is later patterned and etched back until it covers only an area congruent with the traces 38a of the print circuit 38, with each of the contacts 40, and with each one of plural print resistor areas 62 (best seen in Figure 5, and generally indicated with the arrowed numeral 62 on Figure 4).
  • This metallic conductor thin-film layer 64 is formed preferably of an aluminum based alloy, and is about 0.5 micron thick. Again, this metallic conductor layer 64 is initially formed to cover and be congruent with the entire plan-view shape of the substrate 52. However, this conductor layer 64 is also later patterned and etched back to cover only the area defining the traces 38a of print circuit 38, and defining the contacts 40. More particularly, the conductor layer 64 is first etched away at the location of the print resistors 62 so that a portion of the thin-film resistor layer 60 spanning between traces 38a of the print circuit 38 provides the only conduction path between these traces.
  • the etching operation is carried further, removing both the conductive layer 64 and the underlying resistive layer 60 over the entire plan-view shape of the substrate 52, except at the locations of the traces 38 and contact pads 40.
  • This etching operation leaves the traces 38a and contact pads 40 standing in relief on the insulative layer 58, as can be appreciated from a study of Figure 5.
  • the printhead 32 when a current is applied between two of the contacts 40 leading via traces 38a to opposite sides of one of the print resistors 62, the current to and from the respective print resistor 62 is carried in the traces of the print circuit 38 by a combination of the conductor thin-film layer 64 and the underlying resistor thin-film layer 60. Because the conductive layer 64 has a much lower resistance than the resistive layer 60, most of this current will flow in the layer 64. However, at the print resistor 62 itself only the underlying resistor layer 64 is available to carry the current (the overlying conductive layer 64 having been locally etched away). The print resistors 62 are fine-dimension areas of the resistive layer 60.
  • these print resistors 62 can be caused to quickly dissipate energy, and to liberate heat.
  • the metallic heat sink layer 56 covers substantially the entire plan-view shape of the substrate 52, it will be understood that this heat sink layer both underlies the resistors 62 to absorb heat from these resistors, and has a large area (i.e., essentially the entire plan-view area of the printhead 32) from which to dissipate excess heat.
  • the printhead 32 during operation maintains a desirably low temperature, and can operate at firing repetition rates not possible with conventional printheads using a glass substrate.
  • a first manufacturing intermediate article 66 results from the above described manufacturing steps prior to the patterning and etching steps described above, and prior to the formation of the through hole 48.
  • This first manufacturing intermediate article includes the substrate 52, and the thin-film layers 56, 58, 60, and 64, each of which substantially covers and is congruent with the entire plan-view shape of the substrate 52.
  • This first manufacturing intermediate article 66 is subjected to the patterning and etching processes described above to produce a second manufacturing intermediate article 68, substantially as is seen in Figures 4 and 5.
  • On this second manufacturing intermediate article 68 is formed a pair of passivating thin-film layers 70, as is best seen in Figure 5, and which are indicated on Figure 6 with dashed lines.
  • This passivating thin-film layer 70 includes a first sub-layer 70a of silicon nitride, followed by a second sub-layer 70b of silicon carbide. As Figure 5 illustrates fragmentarily, the completion of the printhead 32 requires only the adhesive attachment of the metallic plate member 44, with the print orifices 42 in alignment with the print resistors 62.
  • the thin-film structure 54 may be formed on the substrate 52 using a variety of techniques. These techniques including, but are not limited to, sputtering, and plasma enhanced chemical vapor deposition (PECVD) (i.e., physical vapor deposition. See, Thin-film Processes II, J.L. Vossen & W. Kern, editors, Academic Press, New York, 1991, ch. 2-4), During one or more of these deposition processes, the workpiece that will become the first and second manufacturing intermediate articles, and which will become a completed printhead 32, may be subjected to radio frequency energy.
  • PECVD plasma enhanced chemical vapor deposition
  • the second manufacturing intermediate article 68 is exposed to elevated temperatures and to radio frequency energy to assist in the deposition of these layers.
  • the metallic heat sink layer 56 serves as a radio-frequency shield, possibly preventing the localized heating of areas of the substrate that have comparatively higher conductivity, and preventing sodium or another chemical element or compound that is present in the soda/lime glass substrate 52 from being transported into the other thin-layer structures of the printhead.
  • the sodium or other chemical element or compound could cause a lesion in the passivation layer at which this layer would not long withstand the cavitatiun occurring in the printing fluid each time a bubble collapses after an ink jet ejection.
  • the heat sink layer 56 covers the entire plan-view shape of the printhead 32, there is no place where sodium, another chemical element, or compound, from the glass substrate 52 can be transported (perhaps by diffusion, for example) into the thin-film structures above this metallic heat sink layer 56. Thus, contamination of the thin-film structure 54 with sodium, with another chemical element, or with a chemical compound from the glass substrate 52 is prevented.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)

Claims (8)

  1. Tête d'impression (32) pour éjecter un fluide d'impression, ladite tête d'impression comprenant :
    un substrat (52) formé de verre ayant une forme de vue plane ; et
    une structure de film mince (54) portée sur ledit substrat (52), ladite structure de film mince (54) comprenant :
    une couche métallique dissipatrice de chaleur (56) adjacente audit substrat (52), ladite couche métallique dissipatrice de chaleur (56) ayant une forme de vue plane sensiblement identique à et congruente avec la forme de vue plane dudit substrat (52), ladite couche dissipatrice de chaleur (56) couvrant ainsi sensiblement la totalité de la forme de vue plane du substrat (52) ; et
    une couche de passivation (70) sensiblement dépourvue de sodium migrant à partir dudit substrat en verre (52),
    caractérisée en ce que :
    ladite couche métallique dissipatrice de chaleur (56) agit comme barrière à la diffusion empêchant sensiblement la migration de sodium à partir dudit substrat en verre (52) dans ladite couche de passivation (70).
  2. Tête d'impression selon la revendication 1, dans laquelle ladite couche métallique dissipatrice de chaleur (56) est formée à partir d'un métal choisi dans le groupe constitué par :
    le chrome, l'or, le palladium, le platine et les alliages de ceux-ci.
  3. Tête d'impression selon la revendication 1 ou la revendication 2, dans laquelle ladite couche métallique dissipatrice de chaleur (56) fait interface avec ledit substrat (52) ; ladite structure de film mince (54) comprenant une couche isolante (58) faisant interface avec ladite couche métallique dissipatrice de chaleur (56) ; une couche résistive (60) faisant interface avec ladite couche isolante (58) ; une couche conductrice (64) faisant interface avec ladite couche résistive (60) ; et ladite couche de passivation (70).
  4. Tête d'impression selon la revendication 3, dans laquelle ladite couche isolante (58) comprend de l'oxyde de silicium.
  5. Tête d'impression selon la revendication 3 ou la revendication 4, dans laquelle ladite couche résistive (60) comprend un alliage de tantale et d'aluminium.
  6. Tête d'impression selon l'une quelconque des revendications 3 à 5, dans laquelle ladite couche conductrice (64) comprend de l'aluminium.
  7. Tête d'impression selon l'une des revendications précédentes, dans laquelle ladite tête d'impression (32) est portée par une cartouche d'impression de fluide (26) pour éjecter un fluide d'impression sur un support d'impression, ladite cartouche d'impression (26) comprenant :
    un corps de cartouche (28) fournissant une chambre de fluide d'impression (36) et un ensemble de délivrance de fluide d'impression (3.0) ;
    ladite tête d'impression (32) recevant un fluide d'impression à partir de ladite chambre de fluide d'impression (36) via ledit ensemble de délivrance de fluide d'impression (30) et éjectant de manière commandable ce fluide d'impression sur le support d'impression.
  8. Tête d'impression selon l'une des revendications précédentes, dans laquelle ladite couche dissipatrice de chaleur (56) fournit une portion de film mince de protection contre la radiofréquence interposée entre ledit substrat (52) et le reste de ladite structure de film mince (54) ;
    ladite portion de protection contre la radiofréquence empêchant ainsi sensiblement le sodium, un autre élément chimique, ou un composé chimique de se transporter à partir dudit substrat (52) vers le reste de la structure de film mince (54) pendant l'exposition dudit substrat et de la structure de film mince à une énergie de radiofréquence.
EP00310133A 1999-12-13 2000-11-15 Tête d'impression pour une imprimante à jet de liquide Expired - Lifetime EP1108544B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/459,999 US6341848B1 (en) 1999-12-13 1999-12-13 Fluid-jet printer having printhead with integrated heat-sink
US459999 1999-12-13

Publications (2)

Publication Number Publication Date
EP1108544A1 EP1108544A1 (fr) 2001-06-20
EP1108544B1 true EP1108544B1 (fr) 2006-06-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP00310133A Expired - Lifetime EP1108544B1 (fr) 1999-12-13 2000-11-15 Tête d'impression pour une imprimante à jet de liquide

Country Status (6)

Country Link
US (1) US6341848B1 (fr)
EP (1) EP1108544B1 (fr)
JP (1) JP2001191529A (fr)
KR (1) KR100722095B1 (fr)
DE (1) DE60029077T2 (fr)
TW (1) TW558507B (fr)

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JP4604608B2 (ja) * 2004-08-24 2011-01-05 ブラザー工業株式会社 複合基板及びインクジェットプリンタ
US7195343B2 (en) * 2004-08-27 2007-03-27 Lexmark International, Inc. Low ejection energy micro-fluid ejection heads
US7416980B2 (en) * 2005-03-11 2008-08-26 Intel Corporation Forming a barrier layer in interconnect joints and structures formed thereby
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DE60029077D1 (de) 2006-08-10
DE60029077T2 (de) 2007-02-08
KR20010062345A (ko) 2001-07-07
KR100722095B1 (ko) 2007-05-25
TW558507B (en) 2003-10-21
EP1108544A1 (fr) 2001-06-20
US6341848B1 (en) 2002-01-29

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