Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09372—Pads and lands
  • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10439—Position of a single component
  • H05K2201/10477—Inverted
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10719—Land grid array [LGA]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Definitions

• the present invention relates to an integrated circuit module and a mixed connection card comprising such a module.
• Such cards can be connected to a reader either by a contact link via the external connection pads of the card, or by a contactless link by magnetic, radio or optical coupling.
• An integrated circuit module generally comprises a support film having a first face carrying the integrated circuit and internal connection pads, and a second face carrying external connection pads extending up to the periphery of the second face, the pads of internal and external connection being connected to the integrated circuit.
• This module is intended to be fixed in a card with mixed connection comprising a card body in which an antenna is embedded.
• the integrated circuit module is glued into a cavity of the card body so that the internal connection pads extend 1 perpendicular to the antenna terminals.
• the internal connection pads are connected to the terminals of the antenna by a conductive adhesive received in holes extending in the card body directly above the terminals of the antenna and opening into the cavity.
• the module is placed in the cavity of the card body by pressing it into the cavity after the conductive adhesive has been deposited in the holes in the card body. So that the contact between the conductive adhesive and each internal connection area is sufficient to allow an efficient electrical connection between the internal connection pads and the antenna terminals, there is generally deposited a quantity of glue such that glue overflows from the bore. As a result, during gluing, the excess glue is expelled from the cavity due to the pressure exerted on the module and rises between the edges of the cavity and the edge of the support film. The adhesive may then come to establish a short-circuit connection between an internal connection pad and an external connection pad, thus rendering the card unusable.
• An object of the invention is to provide a means for preventing the formation of such short-circuit connections during bonding of the module.
• an integrated circuit module comprising a support film having a first face carrying the integrated circuit and internal connection pads and a second face carrying external connection pads, the internal connection pads and the external connection pads being connected to the integrated circuit, the second face of the support film comprising at least one peripheral zone electrically isolated from the integrated circuit and extending opposite at least one of the internal connection pads .
• the peripheral zone comprises a metal layer of the same thickness as the external connection pads.
• External connection ranges are generally produced by depositing a conductive sheet on the second face of the support film and acid attack of this sheet to delimit the different areas of external connection.
• the peripheral zone is cut from the initial conductive sheet. The manufacture of the module is therefore simple and the arrangement of peripheral zones electrically isolated from the integrated circuit is inexpensive.
• At least one of the internal connection pads comprises a cavity.
• the cavity can then receive the excess of conductive adhesive.
• the cavity is in the form of a spiral.
• the cavity will preferably be positioned so that it surrounds the area of the internal connection area intended to be in contact with the adhesive. This ensures both good contact with the antenna terminals and the production of a reserve volume sufficient to receive the excess adhesive.
• the invention also relates to a mixed connection card comprising an integrated circuit module having at least one of the aforementioned characteristics.
• FIG. 1 is a top view of the integrated circuit module according to the invention, from the side of the external connection pads,
• FIG. 2 is a bottom view of this integrated circuit module
• the integrated circuit module according to the invention comprises a support film 2.
• the support film 2 has a first face 2.1 carrying an integrated circuit 3 and two internal connection pads 4, and a second face 2.2, opposite the first face 2.1, carrying a plurality of external connection pads 5.
• the integrated circuit 3 is connected in a manner known per se to the internal connection pads 4 and to the external connection pads 5 by conductors 6, and is embedded in a drop of resin 7 also surrounding the conductors 6.
• each strip 8 extends opposite an internal connection pad 4.
• the strips 8 are spaced from the external connection pads 5 and electrically isolated from the integrated circuit.
• Each internal connection pad 4 comprises a cavity 9 in the form of a spiral.
• the card with mixed connection comprises a card body in which an antenna 11 is embedded.
• the card body 10 comprises a cavity 12 for receiving the module 1 described above.
• Holes 13 extend vertically above the terminals of the antenna 11 to open into the cavity 12.
• the holes 13 contain conductive adhesive 14.
• the module 1 is fixed with glue 15 of cyanoacrylate type in the cavity 12 so that the cavity 9 of each internal connection area 4 of the module 1 extends opposite the opening of a bore 13.
• the conductive adhesive 14 contained in the holes 13 ensures the electrical connection between the terminals of the antenna 11 and the internal connection pads 4.
• the strips 8 form an isolated area between the external connection pads 5 and the periphery of the support film so that the risk of a glue rise sufficiently large to reach an external connection pad is practically eliminated.
• the excess conductive adhesive 14 is received in the cavities 9 of the internal connection pads 4.
• the cavities 9 therefore make it possible to limit the flow of conductive adhesive and thus prevent an excessive amount of adhesive from rising by capillarity. between the edges of the cavity 12 and the edge of the support film 2 and risks reaching external connection areas.
• the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention as defined by the claims.
• peripheral zone electrically isolated from the integrated circuit has been represented by a metal strip 8
• this electrically isolated zone can be produced by leaving the second face of the support film bare in this zone.
• the peripheral zone is formed of a bare strip extending substantially over the entire periphery of the second face.
• the cavity 9 has been shown in the form of a spiral, it is possible to produce a cavity 9 in an arc extending in the vicinity of the external periphery of the connection pad 4, or in any other suitable form.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Credit Cards Or The Like (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=9527729

Family Applications (1)

Country Status (6)

Families Citing this family (2)

Family Cites Families (4)

• 1998
  • 1998-06-23 FR FR9807912A patent/FR2780201B1/fr not_active Expired - Fee Related
• 1999
  • 1999-06-16 CN CN 99809474 patent/CN1312957A/zh active Pending
  • 1999-06-16 EP EP99957214A patent/EP1099254A1/de not_active Withdrawn
  • 1999-06-16 WO PCT/FR1999/001437 patent/WO1999067822A1/fr not_active Application Discontinuation
  • 1999-06-16 JP JP2000556399A patent/JP2002519849A/ja active Pending
  • 1999-06-16 AU AU42689/99A patent/AU4268999A/en not_active Abandoned

Non-Patent Citations (1)

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