EP1076831A2 - Controle d'un ensemble plaquette de circuit - Google Patents

Controle d'un ensemble plaquette de circuit

Info

Publication number
EP1076831A2
EP1076831A2 EP99904998A EP99904998A EP1076831A2 EP 1076831 A2 EP1076831 A2 EP 1076831A2 EP 99904998 A EP99904998 A EP 99904998A EP 99904998 A EP99904998 A EP 99904998A EP 1076831 A2 EP1076831 A2 EP 1076831A2
Authority
EP
European Patent Office
Prior art keywords
scanner
circuit board
image data
test
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99904998A
Other languages
German (de)
English (en)
Inventor
David John Barrott
Duncan Edward Willis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scientific Generics Ltd
Original Assignee
Scientific Generics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9803179.2A external-priority patent/GB9803179D0/en
Application filed by Scientific Generics Ltd filed Critical Scientific Generics Ltd
Publication of EP1076831A2 publication Critical patent/EP1076831A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Definitions

  • CIRCUIT BOARD ASSEMBLY INSPECTION This invention relates to circuit board assembly inspection and in particular but not exclusively to inspection in production facilities for producing circuit board assemblies comprising printed circuit boards to which surface mounted components are assembled.
  • Such known systems generally require a first electronic camera to be positioned so as to obtain an image of a reference circuit board assembly and a second camera is then used to image successive subject circuit board assemblies , respective reference and test images then being displayed for comparison.
  • Known comparison techniques include simply displaying the images side by side, alternately displaying the images in registration with one another so as to "flip" from one image to another, or partially superimposing the images to an extent variably determined by a movable scroll line in a "split-scroll" method. It is also known from EP-A-0247308 to provide inspection of (unpopulated) printed circuit boards by automatic analysis of image data obtained by means of an optical scanner. This technique is suitable for checking circuit connectivity prior to assembly with surface mounted components .
  • a method of inspecting a subject circuit board assembly comprising a circuit board having surface mounted components on a major face thereof, the method comprising the steps of; optically scanning the subject circuit board assembly to obtain test image data representative of a plan view of the major face of the circuit board including the surface mounted components ; and performing a test procedure on the test image data for detecting defects in the subject circuit board assembly; wherein the optical scanning step comprises positioning the subject circuit board assembly relative to an optical scanner such that the surface mounted components and the major face of the circuit board are maintained within an imaging region for which the scanner is operable to provide substantially focused imaging and operating the scanner to obtain the test image data.
  • a method of inspecting a subject circuit board including the step of optically scanning a reference circuit board assembly using corresponding method steps to those used in optically scanning the subject circuit board to obtain reference image data; and wherein the test procedure comprises comparing the test and reference image data to detect differences therebetween .
  • Commercially available scanners such as for example those used for document scanning in conjunction with a personal computer, are found to exhibit an exceptional degree of depth of focus, typically of the order of 10mm, which is exploited in the method and apparatus of the present invention as a means of acquiring image information for circuit board assemblies .
  • fiducial features of the circuit board assemblies are identified in the scanned images and used to process image data for successive images using a common frame of reference defined relative to the fiducial features.
  • This alignment facility avoids the need for each assembly to be accurately aligned relative to the scanner during image acquisition. This provides a significant advantage over the prior art arrangements described above which typically require precise alignment of each assembly during imaging.
  • the present invention thereby has the advantage of providing simplified image acquisition without requiring high tolerance alignment jigs.
  • Figure 1 is a schematic diagram of a scanning system used to form an image of a circuit board assembly
  • Figure 2 is a schematic diagram of an alternative scanning system used to form an image of a circuit board assembly
  • Figure 3 is a schematic diagram of a further alternative scanning system used to form an image of a circuit board assembly
  • Figure 4 is a schematic sectional elevation of a scanning system of the type illustrated in Figure 1;
  • Figure 5 is a schematic sectional elevation of a scanner for use in a scanning system of the type illustrated in Figure 3;
  • Figure 6 is a schematic diagram of a testing system for use in testing circuit board assemblies
  • Figure 7 is a schematic view of a display of reference image data
  • Figure 8 is a schematic view of a display of partially superimposed test image data and reference image data
  • Figure 9 is a flowchart illustrating reference image acquisition
  • Figure 10 is a flowchart illustrating a test sequence
  • Figure 11 is an illustration of a difference image formed from a reference image and a test image
  • Figure 12 is a schematic view of an alternative testing system
  • Figure 13 is a sectional elevation of part of the testing system of Figure 12.
  • Figure 1 illustrates a scanning system 1 comprising a flatbed scanner 2 having a transparent platen 3 which is uppermost relative to the scanner.
  • the flatbed scanner 2 is provided with a lid 4 attached to the scanner by hinges 5 allowing the lid to be closed into the position shown in Figure 1 or opened to allow access to the space above the platen 3 , a handle 5 being provided for this purpose.
  • a circuit board assembly 6 consisting of a printed circuit board 7 and surface mounted components 8 mounted on a major face 9 thereof is positioned face down (i.e. with the major face of the circuit board assembly facing downwards ) so as to rest upon the platen 3 with the surface mounted components 8 making contact with an outer surface 43 of the platen.
  • the lid 4 is configured to be recessed to a sufficient depth to allow adequate clearance of the circuit board assembly 6 when in the closed position as shown in Figure 1.
  • Operation of the flatbed scanner 2 produces an electronic output representative of an image of the circuit board assembly 6 in plan view (from below) relative to the major face of the circuit board assembly, revealing detail of the surface mounted components and their relative position on the printed circuit board 7.
  • the scanning system 20 consists of a flatbed scanner
  • Figure 1 having a platen with an outer surface through which an image is acquired of a circuit board assembly 6.
  • a cover 21 overlays the scanner 2 and has a side opening 22 allowing a cradle 23 supporting the circuit board assembly 6 to be slidably moved between a withdrawn position as shown in Figure 2 in which the circuit board assembly is accessible and an inserted position (not shown) in which the position of the circuit board assembly corresponds to that shown in Figure 1 relative to the platen 3 with the exception that a clearance is provided between the outer surface of the platen and the components , thereby avoiding damage to both platen and circuit board assembly.
  • the cradle 23 is provided with a handle 5 and, internally, with an adjustable jig 24 allowing the shape of the cradle 23 to be adapted to the circuit board assembly 6 as required.
  • the cradle 23 When moved to the inserted position, the cradle 23 cooperates with the fixed cover 21 to form a light-tight enclosure of the platen 3 and the scanner 2 is then operable to provide an electronic signal representative of an image of the circuit board assembly 6 in plan view (from below) to show the surface mounted components 8 against the major face of the printed circuit board 7.
  • a further alternative scanning system 30 is shown in Figure 3 and will be described using corresponding reference numerals to those of preceding figures where appropriate for corresponding elements .
  • the flatbed scanner 2 is supported in an inverted position above a heavy base 31 and is movable between a lowered position as shown in Figure 3 and a raised position (not shown) in which the scanner is pivoted about hinges 15. In the lowered position, a light-tight enclosure is formed between the base and the scanner 2.
  • a platen (not shown in Figure 3) of the scanner 2 is maintained in spaced relationship from the circuit board assembly 6 , the outer surface of the platen being located slightly above the maximum height of the surface mounted components 8.
  • a handle 5 is attached to the scanner 2 allowing the scanner to be raised and lowered, the enclosure being accessible in the raised position of the scanner to allow insertion and removal of each circuit board assembly.
  • a spacer 32 interposed between the base 31 and the scanner 2 determines the height of the enclosure formed therebetween. Spacers 32 of different height may be used according to the required dimensions of the circuit board assembly 6.
  • FIG 4 illustrates schematically the manner in which the flatbed scanner 2 operates in the scanning system 1 of Figure 1 to form an image of the circuit board assembly 6.
  • the scanner 2 comprises a housing 40 within which an imaging device 41 is mounted for reciprocating movement on a transport mechanism 42.
  • the imaging device consists of a light source, focusing element and light receptor in the form of a linear imaging element such as a charged coupled device (CCD) configured to image a linear array of pixels at each one of a succession of positions in the direction of transport provided by mechanism 42.
  • CCD charged coupled device
  • the imaging device 41 is movable beneath a transparent platen 3 as described above, the imaging device being arranged to have a focal plane 46 at or immediately above the outer surface 43 of the platen and defined by the locus of points of focus for which imaging occurs during translation of the imaging device.
  • the outer surface of the platen is defined herein as being that surface of the platen which is outermost relative to the internal workings of the scanner such as the imaging device; for an upright scanner the outer surface is uppermost and for an inverted scanner the outer surface is lowermost.
  • the imaging device 41 has a depth of field of about 10mm extending from the focal plane 46 to an imaginary surface 47 defined by the locus of points of maximum focal depth for which imaging is possible when the imaging device is translated, thereby defining an imaging region 44 immediately above the platen within which substantially focused imaging is available.
  • the circuit board assembly 6 is supported in contact with the platen 3 such that those features which are to be imaged, i.e. the surface mounted components 8 and the printed circuit board 7 , lie within the imaging region
  • the scanner 2 used in the system of Figure 2 differs from the arrangement of Figure 4 in that a small clearance is maintained between the components of the circuit board assembly 6 and the outer surface 43 of the platen 3 by virtue of the assembly 6 being supported clear of the outer surface by the cradle 23.
  • Figure 5 illustrates similarly the structure of the flatbed scanner 2 when inverted as for example in the case of the scanning system 30 of Figure 3.
  • An imaging region 44 is similarly defined, this time beneath the outer surface 43 of the platen 3, and the circuit board assembly 6 is supported related to the platen at a location such that both the surface mounted components 8 and the major face 45 of the printed circuit board 7 are within the imaging region 44.
  • a clearance 50 is maintained between the outer surface 43 of the platen 3 and the components 8 of the circuit board assembly 6, the clearance being determined by choice of spacer 32 between the lid 4 and scanner housing 40.
  • Figure 6 illustrates schematically the overall circuit board assembly testing system 60 which may include any one of the scanning systems 1, 20 or 30 described above, represented in Figure 6 by a scanning system 61.
  • An image signal 62 from the scanning system 61 is input to a processor 63 typically comprising a PC (personal computer) and having a VDU (Visual Display Unit) 64 with a display screen 65.
  • a processor 63 typically comprising a PC (personal computer) and having a VDU (Visual Display Unit) 64 with a display screen 65.
  • the processor 63 is provided with a keyboard 66, mouse 67 and joystick 68 for the input of operator controls and is further connected to a data storage device 69 for the mass storage of image data, the data storage device typically being in the form of a compact disc writer.
  • a reader 70 for reading machine readable codes such as bar codes is also provided and connected to the processor 63 for the input of data associated with circuit board assemblies 6.
  • the circuit board assembly testing system of Figure 6 may alternatively be configured as illustrated in Figure 12 where an alternative testing system 120 is illustrated using corresponding references to previous figures where appropriate for corresponding elements.
  • the system 120 achieves the same functions as the system 60 but is more conveniently constructed in that a housing 121 contains the scanning system 61 in addition to the processor 63 and data storage device 69.
  • the visual display unit 64 rests conveniently upon the housing 121 in use.
  • the scanning 61 of the testing system 120 includes an inverted flat bed scanner 122 as illustrated in Figure 13 in which the operative components of the scanner correspond generally to those described above with reference to the scanner 2 of Figure 5.
  • the scanner 122 however does not include a platen.
  • the scanner 122 includes a cradle 23 similar to that described above with reference to Figure 2 in that the cradle is horizontally slidable between a withdrawn position (shown in dotted lines in Figure 13) and an inserted position in which the position of the circuit board assembly is correctly aligned for scanning by the inverted flat bed scanner.
  • the testing system 120 is provided with a motorised actuating system for automatically moving the cradle 23 between its withdrawn and inserted positions for ease of use.
  • the housing 121 constitutes a light excluding exclosure during scanning.
  • the adjustable jig of the cradle 23 ensures that successive assemblies can be accurately positioned in a repeatable manner when inserted for scanning.
  • Figure 7 illustrates a typical view of a display available on the display screen 65 of VDU 64, showing a reference image 71 of a circuit board assembly 6.
  • Fiducial mark images 72 and 73 corresponding to fiducial marks applied to the printed circuit board 7 appear at spaced apart locations of the image 71 and are used as a basis for alignment of subsequently displayed images , an alignment routine implemented in software by the processor being used to align each image such that the fiducial mark images are located at the same display screen coordinates as images 72 and 73.
  • FIG. 7 Also visible in Figure 7 is a machine readable code 74 uniquely identifying the circuit board assembly to which the image 71 relates.
  • the code 74 may also include human readable indicia which can be read on screen.
  • Figure 8 provides a view corresponding to that of Figure 7 when a "split-scroll" method of image comparison is used to compare a test image 80 with the reference image 81 upon which it is partially overlaid, the positions of each of the test and reference images being superposed in alignment with fiducial mark images 72 and 73 and a movable scroll line 82 delineating between the extent of the test and reference images .
  • the position of the scroll line 82 is variable by movement of the joystick 68 and a user is thereby able to scan the scroll line up and down the images to reveal differences in the test and reference images which become most noticeable in the vicinity of the scroll line when the scroll line passes over a point of dissimilarity.
  • the split-scroll method may alternatively provide relative movement between the scroll line and the images by retaining the scroll line at a fixed position on the display screen 65 and providing operator controlled movement of both test image 80 and reference image 81 in registration with one another.
  • the operator may select one or other modes of split-scroll operation as required.
  • Other options for image comparison are selectively available.
  • the "image flipping" method provides comparison by sequentially displaying the reference image and test image in alternating manner.
  • a further option is to simply display the test image continuously.
  • a further option provides recognition software to automatically highlight areas of difference for operator assessment.
  • the processor 63 may selectively develop a difference image formed by comparing pixel data for the reference image and test image so that a difference image can be displayed in which any differences are highlighted.
  • the above techniques of split-scroll comparison, image flipping or single image display may additionally make use of the difference image so that for example the image flipping method may sequentially display in alternating manner any combination of two images selected from the reference image, test image and difference image.
  • the split-scroll method may similarly be used to split-scroll between the difference image and reference image or the difference image and test image.
  • variable magnification of the images may usefully be used in order to provide closer scrutiny of localised image areas.
  • Figure 11 illustrates the generation of a difference image shown in Figure 11C from a reference image shown in Figure 11A and test image shown in Figure 11B.
  • the reference image includes a component 110 which is absent from the subject circuit board and therefore does not show up on the test image of Figure
  • the difference image generated from a digital comparison of the reference and test images shows only the component 110.
  • the image flipping method rapidly allows the omission of the component 110 from the test image to be located by sequentially displaying the reference image and difference image or the test image and the difference image.
  • a text display of assembly type and serial number data is provided on the screen 65 to identify the image being viewed.
  • Figure 9 illustrates the sequence of steps carried out when acquiring an image of a reference circuit board assembly.
  • step 90 type data characterising the reference circuit board assembly is input to the PC using the keyboard 66 and the files necessary to store information relevant to the reference circuit board assembly are created.
  • This process is simplified using an appropriate software tool or "wizard" which leads the user through a series of steps using software to interface with the user via the display screen 65.
  • the reference circuit board assembly is mounted in the scanner and the settings of the scanner are adjusted by the user via the PC which generates control signals 75 as illustrated in Figure 6.
  • Optimum scanner settings including brightness, contrast, resolution, sharpness and colour settings are determined by inspecting the image appearing on the screen 65 and the optimum scannings are stored in the data file created for the reference circuit board assembly. Different settings required for specific options of image comparison may be separately stored for retrieval according to which option is later selected.
  • the fiducial mark images 72 and 73 are identified in the image appearing on the display screen 65 and the co-ordinates of the marks are measured and recorded.
  • a software routine provided for this purpose automatically logs the co-ordinates of the images of the fiducial marks when the mark images are identified by the user aligning a cursor using the mouse 67 and clicking the mouse when alignment is achieved.
  • a template is created for future alignment of test images based on the fiducial mark co- ordinates obtained from the reference image, the template establishing a common frame of reference for image comparison.
  • the reference image is stored in the hard drive of the processor 63 and, if required, may also be stored in a mass storage medium such as a CD ROM by writing using the data storage device 69.
  • Figure 10 illustrates the steps required in acquiring a test image of a test circuit board assembly and comparing the test image with the reference image.
  • step 100 type data is input to the PC to identify the generic type of the test circuit board assembly and appropriate file records are created using a software tool or wizard for this purpose.
  • the PC displays a menu of assembly types for which reference data exists, allowing the user to select the appropriate assembly type, and appropriate files are opened for the current test assembly.
  • part number data uniquely identifying the test circuit board assembly is input to the PC.
  • this data is acquired by means of a bar code reader 70 which scans a bar code previously applied to the test circuit board assembly during manufacture. Input manually via the keyboard of part number data is available as an option.
  • the test circuit board assembly is positioned in the scanning system 61 which for example in the case of the system in Figure 2 requires alignment of the assembly using jig 24 and moving the cradle 23 into a position such that the assembly is within a light- tight enclosure and within the imaging region 44 of the scanner 2.
  • the PC sets the scanner operating parameters according to the stored optimum settings which were acquired in step 91 and the operator then actuates the scanner so that image information is required and received by the processor 63.
  • images of fiducial marks in the scanned test image are identified by displaying the image on the display screen 65 and by alignment of a cursor using the mouse 67. Co-ordinate information for the fiducial marks is then made available to software in the processor 63 which is used at step 104 to align the test image with the template.
  • the reference image corresponding to the type of circuit board assembly being tested is retrieved from temporary or permanent memory and at step 105.
  • test image is compared with the reference image using any one of the techniques described above.
  • test results may simply be a pass or fail indicator or may comprise details of points of difference identified in the comparison step, including for example the coordinates of defects or identifiers corresponding to missing components .
  • Points of difference identified in the comparison step may be logged by generating tags which appear on the displayed test image at the co-ordinates of the point of difference. These tags may be of different categories allowing differences to be categorised appropriately, such as for example missing component, incorrectly oriented component, wrong component, or defect in component connection.
  • the test image is stored in the hard drive of the processor 63 and, if required, may be stored in mass storage medium by writing using data storage device 69.
  • a hierarchical file storage is used to organise the stored images according to type and serial number.
  • step 109 if more boards are to be tested, control is returned to step 101 or otherwise the procedure ends .
  • Operation of the processor 63 is effected in accordance with program instructions which may be input to the processor from a storage medium such as a CD ROM, optical disc or floppy disc.
  • the program instructions may alternatively be input via a network connection or by downloading a file from the Internet. Any such instructions for executing the above described processes, when stored in a storage medium or transmitted as an encoded signal, constitute an embodiment of the present invention .
  • the scanner 2 used in the preferred embodiments is a Hewlett-Packard ScanJet 6100C (trademark) which provides a linear resolution of 600 dots per inch allowing fine detail such a component leads of thickness 0.02 inches to be resolved.
  • the above scanner requires modification according to the selected form of scanning system for printed circuit board assembly, as for example in the embodiments of Figures 1 , 2 and 3.
  • the platen is retained in the form typically provided by manufacturers of document scanners where the document to be scanned is placed in contact with the platen during scanning. It is envisaged that in accordance with the present invention such scanners may be modified by removal of the platen, for example in the embodiments of Figures 2 , 3 and 5 where no contact is made in use between the circuit board assembly 6 and the scanner.
  • Removal of the platen 3 may for example allow the printed circuit board assembly 6 to be located closer to the focal plane 46 of the imaging device 41, or for the focal plane to be positioned at any desired position relative to the major face 45 of the circuit board 7. Positioning the scanner in an inverted position is advantageous when no platen is present since debris from the circuit board assembly cannot then fall into the scanner.
  • the above described methods of visual comparison may be partially or fully automated using recognition software, for example to identify and locate the images of fiducial marks 72,73 during the alignment sequence.
  • the above described embodiments make use of a joystick 68 during the split-scroll method of comparison.
  • the mouse 67 or keyboard 66 may be used instead of providing a joystick for this purpose .
  • the present invention thereby allows the use of a personal computer 63 with a commercially available flatbed scanner 61 in a low volume printed circuit board assembly inspection system. It is envisaged that such a system could be realisable at substantially lower cost than currently available systems.
  • means for alignment of the subject assembly relative to the scanner are described. Since however the PC is provided with software for alignment of images using fiduciary marks, the exact position of the assembly relative to the scanner is not critical and such jigs or alignment means for achieving accurate alignment may be dispensed with .
  • a mouse 67 is described for use as a pointing device in relation to scroll line motion control.
  • Alternative pointing devices such as a tracker ball may equivalently be used.
  • a principal advantage of the present invention is to dispense with the need for conventional camera optics and related mechanics such as stands, accurately adjusted board mountings etc, and instead using cheaply available components such as scanners and PCs .

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Image Input (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

L'invention concerne des ensembles plaquettes de circuit (6) comprenant des plaquettes à circuit imprimé (7) sur lesquelles des composants montés en surface (8) sont visuellement contrôlés par rapport à un ensemble plaquette de circuit de référence. Une image de référence (81) est comparée visuellement avec une image d'essai (80) par l'écran (64) d'un ordinateur personnel (63). Des données d'image sont acquises dans chaque cas au moyen d'un numériseur optique (2) se présentant sous la forme d'un scanner à plat. Pendant la numérisation, ces ensembles plaquettes de circuit sont placés de manière à localiser à l'intérieur d'une zone d'image (44) du numériseur une surface importante de la plaquette à circuit imprimé et des composants montés en surface. L'alignement des images est automatiquement effectué par l'ordinateur qui les affiche en utilisant un système de coordonnées commun défini par rapport à des éléments fiduciels des ensembles plaquettes de circuit. Pendant la numérisation, les plaquettes peuvent être maintenues dans une position verticale faciale ou inversée à l'intérieur d'une enceinte abritée de la lumière. Le procédé trouve une application dans de petites ou moyennes installations de production d'ensembles plaquettes à circuit imprimé.
EP99904998A 1998-02-13 1999-02-10 Controle d'un ensemble plaquette de circuit Withdrawn EP1076831A2 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB9803179 1998-02-13
GBGB9803179.2A GB9803179D0 (en) 1998-02-13 1998-02-13 PCB Inspection system
GB9818768A GB2334330A (en) 1998-02-13 1998-08-27 Circuit board assembly inspection
GB9818768 1998-08-27
PCT/GB1999/000409 WO1999041621A2 (fr) 1998-02-13 1999-02-10 Controle d'un ensemble plaquette de circuit

Publications (1)

Publication Number Publication Date
EP1076831A2 true EP1076831A2 (fr) 2001-02-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP99904998A Withdrawn EP1076831A2 (fr) 1998-02-13 1999-02-10 Controle d'un ensemble plaquette de circuit

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Country Link
EP (1) EP1076831A2 (fr)
AU (1) AU2531199A (fr)
WO (1) WO1999041621A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127499A (ja) 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd 検査方法および検査装置
JPWO2002067039A1 (ja) 2001-02-19 2004-06-24 オリンパス株式会社 画像比較装置、画像比較方法及び画像比較をコンピュータに実行させるプログラム
US9996766B2 (en) 2015-05-01 2018-06-12 Corning Incorporated Imaging-based methods for detecting and measuring defects in extruded cellular ceramic articles
US10769772B2 (en) 2015-05-21 2020-09-08 Corning Incorporated Methods for inspecting cellular articles
CN110940787B (zh) * 2019-12-29 2022-12-13 圣达电气有限公司 一种移动式铜箔针孔检验装置
CN112393710A (zh) * 2020-11-30 2021-02-23 徐州尚飞网络科技有限公司 一种性能稳定的电路板形变度测量装置和测量方法

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DE3425568A1 (de) * 1984-07-11 1986-01-16 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum pruefen elektronischer flachbaugruppen
IL78943A (en) * 1986-05-27 1990-09-17 Ibm Israel Method and apparatus for automated optical inspection of printed circuits
US5131755A (en) * 1988-02-19 1992-07-21 Chadwick Curt H Automatic high speed optical inspection system
FR2647574B1 (fr) * 1989-05-12 1991-09-06 Automatisme Robotique Applique Procedes et dispositifs pour effectuer des controles de fabrication visuels d'une serie de pieces identiques
US5550583A (en) * 1994-10-03 1996-08-27 Lucent Technologies Inc. Inspection apparatus and method

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Also Published As

Publication number Publication date
WO1999041621A2 (fr) 1999-08-19
WO1999041621A3 (fr) 1999-11-11
AU2531199A (en) 1999-08-30

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