EP1018627B1 - Heat pump - Google Patents

Heat pump Download PDF

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Publication number
EP1018627B1
EP1018627B1 EP00200011A EP00200011A EP1018627B1 EP 1018627 B1 EP1018627 B1 EP 1018627B1 EP 00200011 A EP00200011 A EP 00200011A EP 00200011 A EP00200011 A EP 00200011A EP 1018627 B1 EP1018627 B1 EP 1018627B1
Authority
EP
European Patent Office
Prior art keywords
heat pump
heat
compressor
circuit
heat source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00200011A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1018627A3 (en
EP1018627A2 (en
Inventor
Robert Luimers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INVENTUM HOLDING B.V.
Original Assignee
Inventum Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventum Holding BV filed Critical Inventum Holding BV
Publication of EP1018627A2 publication Critical patent/EP1018627A2/en
Publication of EP1018627A3 publication Critical patent/EP1018627A3/en
Application granted granted Critical
Publication of EP1018627B1 publication Critical patent/EP1018627B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/40—Fluid line arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F25B49/025—Motor control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/13—Vibrations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/06—Heat pumps characterised by the source of low potential heat

Definitions

  • the invention relates to a heat pump according to the preamble of claim 1.
  • a heat pump of this kind is known from US-A-4,305,260.
  • a drawback of all prior art heat pumps is the fact that they occupy a great deal of space, whilst in addition they produce a considerable amount of noise. Because of this it is not possible to install the prior art heat pump in a room of a house or the like building which is also used for other purposes, such as a scullery, an attic or a kitchen, for example. In the first place, such rooms are often much too small for accommodating the heat pumps that we have known so far, and in the second place it will not be possible to use the room for other activities because of the large amount of noise that is produced by the prior art heat pump.
  • the object of the invention is to provide a heat pump by means of which the above-described problems are overcome.
  • the invention provides a heat pump according to claim 1.
  • An aspect which is relevant for the heat pump as defined in claim 1 is the fact that the compressor is connected with a subframe, which is connected, via first damping elements, with a mounting frame which is provided with means for fixedly connecting it to a wall.
  • the presence of the subframe and the first damping elements provides vibration isolation between the subframe and the mounting frame, which results in a considerable noise and vibration reduction.
  • second damping elements are incorporated in the connection between the compressor and the subframe, which second damping elements provide vibration isolation between the compressor and the subframe.
  • This mounting arrangement comprising double damping provides a very good noise and vibration reduction. This makes it possible to mount or install the heat pump according to the invention in a room which is also used for other purposes, such as a kitchen, a bathroom or an attic, for example.
  • the evaporator and the condenser form an integral part of the subframe.
  • US-A-5,070,708 discloses a mounting system for a compressor of a refrigerator wherein the compressor and the condensor are connected with a subframe, which subframe is connected via damping elements, with a mounting frame, and wherein second damping elements are incorporated between the compressor and the subframe.
  • the heat pump comprises flexible, vibration isolating pipe portions which, when the heat pump is connected, connect the evaporator to the heat source pipe system and the condenser to the CH pipe system.
  • the heat pump with a double-walled encasing comprising an inner casing and an outer casing.
  • the inner casing contains the components of the compressor circuit, whilst the outer casing contains all the components of the heat pump.
  • the inner casing can be filled with a sound insulating material, such as acoustic cellulose fibres, for example.
  • the water-carrying pipe portions and the heat source circuit pump, as well as the CH circuit pump can be packed in moulded plastic foam members, such as EPS, for example.
  • EPS moulded plastic foam members
  • the heat pump In order to enable simple maintenance of the heat pump, which maintenance can be carried out by a regular CH engineer, it is very advantageous for the heat pump to have a modular structure, wherein a compressor module comprises the compressor, the expansion valve, the condenser and the evaporator, wherein a first transport module comprises the heat source circuit pump and a heat source venting unit, wherein the first transport module is attached and connected to the evaporator by means of fittings, wherein a second transport module comprises the CH circuit pump, a CH venting unit and an electrical heating coil, wherein the second transport module is attached and connected to the condenser by means of fittings.
  • a compressor module comprises the compressor, the expansion valve, the condenser and the evaporator
  • a first transport module comprises the heat source circuit pump and a heat source venting unit, wherein the first transport module is attached and connected to the evaporator by means of fittings
  • a second transport module comprises the CH circuit pump, a CH venting unit and an electrical heating coil, wherein
  • the engineer can simply unscrew the fittings so as to remove the first transport module and subsequently place a substitute transport module.
  • the compressor circuit is not touched by the engineer thereby, so that these operations can be carried out by a regular CH engineer.
  • the engineer must replace the complete compressor module. The broken compressor module can then be repaired at the workshop by a specially trained engineer.
  • the heat pump can be fitted with a sanitary water heating unit, wherein the sanitary water heating unit also comprises a water transport unit, which carries the CH water that has been heated in the condenser either to the sanitary water heating unit or to the CH pipe system.
  • a water transport arrangement may for example be in the form of a three-way valve.
  • the sanitary water heating unit will be supplied as a separate module, wherein the connections between the sanitary water heating unit and the water pump can simply be made by a regular CH engineer, for example by means of clamp fittings, wherein the making of an electric and/or electronic connection can take place by plugging in one or more plugs. Since the sanitary water heating unit is a separate module, it is easily to handle.
  • sanitary water heating units having different capacities will become available.
  • the sanitary water heating unit will be in the form of a boiler, through which a coil extends, through which coil hot water from the heat pump can be passed.
  • a family will use a 150 litre boiler, for example, whilst a boiler capacity of 100 litres is more than enough for a single person household.
  • a sanitary water heating unit is already present, so that it is not necessary to connect a sanitary water heating unit to the heat pump.
  • different heat pumps having different capacities will become commercially available.
  • the compressor and the sanitary water heating unit include identification means which are connected to the control unit, wherein the control unit is of a universal type which is suitable for controlling heat pump comprising compressors having different output values and sanitary water heating units having different capacities, wherein the control unit automatically selects the desired control programme on the basis of information from the identification means.
  • the identification means may for example be electric resistors.
  • the heat pump is preferably so compact and light in weight that it can be mounted on a wall. This makes it very easy to install the heat pump in a room which can also be used for other purposes.
  • the heat pump can also comprise a cooling medium inlet stub and a cooling medium return stub for connection to a cooling pipe system, wherein the heat pump is used for withdrawing heat from a medium which circulates in a cooling circuit which comprises at least the cooling pipe system and the heat source pipe system.
  • the heat pump includes identification means which, when a cooling pipe system is connected to the cooling medium inlet stub and a cooling medium return stub, communicate the existence of this connection to the control unit.
  • identification means which, when a cooling pipe system is connected to the cooling medium inlet stub and a cooling medium return stub, communicate the existence of this connection to the control unit.
  • the control unit can arrange for the house to be heated in the winter and cooled in the summer.
  • the control unit is capable of providing a heating effect or a cooling effect on its own accord, without the user having to take any action in this regard.
  • Figs. 1 - 5 in particular show the components of the compressor circuit
  • Figs. 6 - 18 in particular relate to components that form part of a heat source circuit and a CH circuit.
  • the present heat pump comprises a compressor 1.
  • the compressor 1 is a so-called scroll compressor.
  • An outgoing pipe 2 of the compressor is connected to the inlet 3 of a primary part of a first heat exchanger, hereinafter referred to as condenser 4.
  • the outlet 5 of the primary part of the condenser is connected to an expansion valve 8 via a pipe 6 and a filter 7.
  • a pipe 9 extends to the inlet 10 of a primary part of a second heat exchanger, hereinafter referred to as evaporator 11.
  • Outlet 12 of the primary part of evaporator 11 is connected, via a pipe 13, to an intake opening 14 of compressor 1.
  • Present in the compressor circuit is a medium which transports heat.
  • an environment-friendly medium is used.
  • the operation of the heat pump is as follows: a very cold coolant is introduced into the primary part of the evaporator as a result of the expansion that takes place in the expansion valve 8. This very cold coolant absorbs heat in the evaporator 11. This heat is supplied by a heat source, whose medium flows through the secondary part of the evaporator 11. When the coolant exits the evaporator at outlet 12, it has absorbed heat, but the temperature of the coolant is still relatively low. Strong compression of the coolant by means of compressor 1 will cause the temperature of the medium to rise considerably, so that it can be used for heating water which flows through the secondary part of condenser 4.
  • the secondary part of condenser 4 forms part of a CH circuit when the heat pump is connected.
  • the coolant gives off part of its heat to the water that flows through the secondary part of the condenser 4, so that the temperature of the coolant will have been reduced again at outlet 5.
  • the coolant is purified in filter 7, and any oil particles that may be present therein are removed.
  • the coolant is passed through the expansion valve 8, in which a large pressure drop occurs, which results in a considerable temperature decrease. This process takes place continuously.
  • the energy input is supplied by the current which is used to drive compressor 1 and by the heat which is supplied by the heat source via the secondary part of the evaporator 11.
  • the heat source may for example be the ground water, which is present at a certain depth under the ground.
  • the ground water will have a temperature which is higher, both in the winter and in the summer, than the temperature of the expanded medium which enters the primary part of the evaporator at inlet 10.
  • a conversion efficiency of about 350% is achieved. This means that, starting from 100% electric energy input, about 3.5 times as much energy is transmitted to the CH water. Basically, it boils down to this that about 70% of the energy which is transmitted to the CH water comes from the heat source and about 30% comes from the electricity grid.
  • the compressor 1 is mounted on a subframe.
  • the subframe comprises a base 15, a condenser 4 and an evaporator 11 and a number of mounting parts 16, 17, which are connected to the baseplate 15 and/or the condenser 4 and/or the evaporator 11.
  • the mounting parts 16, 17 are connected, via first damping elements 18, 19, with a mounting frame 20, 21, which is intended for being fixedly connected to a fixed structure. Due to the damped mounting arrangement of subframe 4, 11, 15, 16, 17, the compressor vibrations are hardly transmitted, if at all, to the wall on which the heat pump is mounted.
  • the compressor 1 itself is also mounted on the baseplate 15 of the subframe via two damping elements 22.
  • Figs. 6 - 10 shows the so-called water-carrying parts of the heat pump, whilst the pipes of the compressor circuit have been left out.
  • said water-carrying parts consist of two transport modules, in which several functions are integrated.
  • the left-hand part forms the first transport module.
  • This transport module includes a heat source circuit pump 23. From the heat source circuit pump 23 the heat source medium flows to a heat source venting unit 24, which is provided with a vent valve 25. Via the heat source vent valve 24 the heat source medium flows to the inlet 27 of the secondary part of evaporator 11 via pipe 26.
  • the heat source medium flows through the secondary part of evaporator 11 to the outlet 28 of the secondary part of evaporator 11, after which it is carried to the heat source inlet stub 32 through a pipe 29, via a bend 30 which is connected to pipe portion 29 by means of a clamp fitting 31.
  • the heat source medium flows through the heat source pipe system (not shown) to the heat source, where it undergoes a temperature increase, and subsequently it flows back to the heat source return stub 33.
  • Said heat source return stub 33 is connected to pump 23 via a bend 34 and a clamp fitting 37. All these parts together constitute the heat source circuit.
  • the heat source circuit pump 23, the heat source venting unit 34, the connecting piece 36 and the bends 30, 34 are all connected to the damped subframe (4, 11, 15 - 17).
  • the heat source inlet stub and the heat source return stub 32, 33 are connected to the fixed structure.
  • a flexible, vibration isolating pipe portion 38 is mounted between the bend 30 and the heat source inlet stub 32.
  • a similar vibration isolating, flexible pipe portion is mounted between bend 34 and heat source return stub 33.
  • the right-hand side of Fig. 6 shows the second transport module for the CH circuit.
  • the second transport module includes a CH circuit pump 39. From said CH circuit pump 39, the CH water is pumped into the CH pipe system via connecting piece 40, clamp fitting 41, bend 42 and CH inlet stub 43. In the CH pipe system, which comprises room heating elements, the heat of the CH water is given off. The cooled-down CH water enters the heat pump again via the CH return stub 44, and in the heat pump it is carried to the inlet 48 of the secondary part of the condenser 4 via bend 45, clamp fitting 46 and pipe portion 47. Inside condenser 4, the CH water absorbs heat which is supplied by the hot coolant of the compressor circuit, which hot coolant is present in the primary part of condenser 4.
  • the CH water flows, via a pipe portion 50, via a clamp fitting 51, to a CH water venting unit 52, which includes a vent valve 53. From the CH water venting unit 52 the CH water flows to pump 39 again.
  • the main components of the second transport module that is, CH circuit pump 39, CH water venting unit 52 and connecting piece 40, are mounted on subframe 4, 11, 15 - 17. As a result of this arrangement, the vibrations caused by the CH circuit pump 39 are not transmitted to the wall on which the heat pump is mounted.
  • a flexible, vibration isolating pipe portion is mounted between bend 42 and CH inlet stub 43.
  • a similar flexible, vibration isolating pipe portion 54 is mounted between bend 45 and CH return stub 44. This prevents the transmission of movements of the subframe 4, 11, 15 - 17 to the CH inlet stub 43 and the CH return stub 44.
  • Figs. 11 - 14 furthermore show in various elevational and sectional views the CH water venting unit 52.
  • the stub 55 onto which the clamp fitting 51 is screwed is clearly shown.
  • the water enters a first chamber 56 via stub 55 and flows via an opening 57 into a second chamber 58, in which a partition is present, which causes a the CH water to change its flow direction, which makes it possible for air bubbles that are present in the CH water to find their way into a third chamber 60 via an opening 59, from which chamber they are withdrawn from the CH water via vent valve 53.
  • the CH water then exits the CH water venting unit via the lower outlet opening 61.
  • the construction of the heat source venting unit 24 is entirely identical thereto. It is noted that the vent valve 53 is commercially available as standard.
  • Figs. 15 - 18 shows the connecting piece 40 of the second transport module.
  • Said connecting piece 40 comprises a stub 62 for connecting the clamp fitting 41. Furthermore a stub 63 is provided with a clamp fitting 64 which is intended for fitting pump 39.
  • Connecting piece 40 is further provided with an opening 65, through which the pipe 47 extends on which the clamp fitting 46 is mounted.
  • a similar connecting piece 36 is provided in the first transport module for the heat source circuit.
  • Connecting piece 40 on the CH water transport module furthermore includes a heating coil 66, which can be turned on when a very quick heating of the CH water is desired. Such a situation may for example occur when a large amount of hot sanitary water is tapped within a short period of time. Under those exceptional circumstances the heating coil 66 is capable of providing the required additional heat capacity.
  • the ends 67, 68 of the heating coil 66 are also clearly shown in Fig. 8, and they are connected to a power source.
  • the control unit 73 of the heat pump is clearly shown in Fig. 6, wherein it is shown to be connected to the mounting frame 20, 21 which is fixedly connected to the wall, so that it is free from vibrations. Temperature sensors 69, 70, 71, 72 are mounted in bends 31, 35, 41, 46. Said temperature sensors 69 - 72 are in communication with the control unit 73. The control unit 73 regulates the rotational speeds of heat source circuit pump 23 and/or CH water circuit pump 39 on the basis of the temperature detected by temperature sensors 69 - 72. Possibly, the speed of compressor 1 can also be adjusted.
  • control unit 73 With regard to the other functions of the control unit 73 reference is made to that which is stated in claims 14 - 21, 24 and 29, as well as to that which has been stated in the above in the introduction to the description. As already stated in the introduction, the control unit 73 is arranged for periodic verification and calibration of the temperature sensors 69 - 72. In addition, the control unit 73 functions as a protective device, since it verifies the direction of rotation of the compressor as well as the operation of the heat source circuit pump 23 and the CH circuit pump 39.
  • a sanitary water heating unit can be connected to the illustrated heat pump via a three-way valve.
  • the control unit 73 thereby controls the three-way valve in such a manner that the CH water that has been heated in condenser 4 is carried to the sanitary water heating unit when hot sanitary water is requested, whilst the CH water that has been heated in the condenser 4 is carried to the CH pipe system in order to turn over the three-way valve when a room heating is requested.
  • the various parts of the heat pump, such as the compressor 1 and the sanitary water heating unit that are possibly connected thereto may be provided with electronic identification means, so that the control unit 73 will automatically use the programme that is associated with that specific type of assembly of heat pump and sanitary water heating unit.
  • the electronic identification means may for example be resistors which are automatically read when compressor 1 and/or the sanitary water heating unit are connected to the control unit 73.
  • An encasing 74 is provided, which functions to damp the sound of the heat pump even further.
  • the figure clearly shows that the compressor module is still disposed in a separate encasing 75, which is shown is sectional view in Fig. 10.
  • said second encasing 75 cannot be opened by the installer of the heat pump, so that he is prevented from fiddling with the compressor circuit. The installer only has access to the water-carrying part of the heat pump.
  • the empty spaces in the encasing 75 are filled with a sound-damping material, such as acoustic cellulose fibres, for example.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Central Heating Systems (AREA)
  • Control Of The Air-Fuel Ratio Of Carburetors (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
EP00200011A 1999-01-07 2000-01-05 Heat pump Expired - Lifetime EP1018627B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1010979A NL1010979C2 (nl) 1999-01-07 1999-01-07 Warmtepomp.
NL1010979 1999-01-07

Publications (3)

Publication Number Publication Date
EP1018627A2 EP1018627A2 (en) 2000-07-12
EP1018627A3 EP1018627A3 (en) 2000-12-06
EP1018627B1 true EP1018627B1 (en) 2006-07-26

Family

ID=19768435

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00200011A Expired - Lifetime EP1018627B1 (en) 1999-01-07 2000-01-05 Heat pump

Country Status (4)

Country Link
EP (1) EP1018627B1 (nl)
AT (1) ATE334359T1 (nl)
DE (1) DE60029497T2 (nl)
NL (1) NL1010979C2 (nl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT412911B (de) * 2002-03-07 2005-08-25 Thermo System Kaelte Klima Und Vorrichtung zum erwärmen eines wärmeträgers
US20060080988A1 (en) * 2004-10-20 2006-04-20 Carrier Corporation Gas cooler configuration integrated into heat pump chassis
DE102007010139B4 (de) * 2007-02-28 2021-02-11 Stiebel Eltron Gmbh & Co. Kg Wärmepumpenvorrichtung
WO2008132244A2 (en) * 2007-05-01 2008-11-06 Arcelik Anonim Sirketi A cooling device
NL2003397C2 (nl) * 2009-08-26 2011-03-01 Inventum Holding B V Warmtetransportinrichting en warmtetransportsysteem.
EP2442203A1 (de) * 2010-10-12 2012-04-18 IMMOSOLAR Active Building Verfahren zur Regelung für thermodynamische Anlage
EP2442052A1 (de) * 2010-10-12 2012-04-18 Immosolar Active Building Technologies, S.L. Verfahren zur regelung, welches in einer Heizungsanlage ausgeführt wird
CA2845520C (en) 2014-03-04 2019-02-26 Johnson Controls Technology Company Method and apparatus for noise attenuation for hvac&r system
DE202020003281U1 (de) * 2020-07-30 2021-11-03 Zweicom-Hauff Gmbh Leitungsinstallationsgehäuse mit Kühlung
DE102021103063A1 (de) * 2021-02-10 2022-08-11 Viessmann Climate Solutions Se Wärmepumpe
DE102022213574A1 (de) 2022-10-10 2024-04-11 Vertiv Srl Wärmepumpe mit schwingungsbeeinflussungseinrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1753944A (en) * 1926-10-26 1930-04-08 Kelvinator Corp Air-cooled refrigeration apparatus
SE432477B (sv) * 1979-07-20 1984-04-02 Anders Daniel Backlund Kompakt vermepumpenhet
FR2532729A1 (fr) * 1982-09-06 1984-03-09 Rossignol Sa Pompe a chaleur a structure cellulaire et son procede de fabrication
DE3302081A1 (de) * 1983-01-22 1984-07-26 Stiebel Eltron Gmbh & Co Kg, 3450 Holzminden Waermepumpengehaeuse
US4449376A (en) * 1983-02-18 1984-05-22 Westinghouse Electric Corp. Indoor unit for electric heat pump
US5070708A (en) * 1987-12-29 1991-12-10 Whirlpool Corporation Floating frame mounting system and method for a refrigerator
US5274200A (en) * 1992-12-22 1993-12-28 Carrier Corporation Sound attenuating enclosure for compressors

Also Published As

Publication number Publication date
DE60029497T2 (de) 2007-05-03
EP1018627A3 (en) 2000-12-06
NL1010979C2 (nl) 2000-07-11
DE60029497D1 (de) 2006-09-07
EP1018627A2 (en) 2000-07-12
ATE334359T1 (de) 2006-08-15

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