EP0985218A1 - Vorrichtung und verfahren zum kühlen einer planarinduktivität - Google Patents
Vorrichtung und verfahren zum kühlen einer planarinduktivitätInfo
- Publication number
- EP0985218A1 EP0985218A1 EP98932086A EP98932086A EP0985218A1 EP 0985218 A1 EP0985218 A1 EP 0985218A1 EP 98932086 A EP98932086 A EP 98932086A EP 98932086 A EP98932086 A EP 98932086A EP 0985218 A1 EP0985218 A1 EP 0985218A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- cooling
- planar
- cooling element
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
Definitions
- the present invention relates to a device and a method for cooling a planar inductance, in particular a planar transformer, on a plate-shaped carrier having a plurality of conductor layers, at least one conductor layer of the carrier representing the planar inductance in cooperation with a core element designed to conduct a magnetic flux .
- multilayer carrier boards (“multilayers”) are increasingly being used here. which have a plurality of electrically separated or point-connected conductor layers within a conventional circuit board structure.
- conventional, discrete inductances such as transformers or chokes, are realized by the planar technology, namely by the direct utilization of appropriately designed line layers of the multilayer as windings of this inductance, these usually then interacting with a transformer core, which is more suitable Is placed on the multilayer or in breakthroughs thereof.
- a transformer arrangement or choke in a multilayer 10 with line layers correspondingly designed as transformer windings has a first transformer core 12, which is E-shaped in cross section by way of example on, which extends with legs 14 through corresponding slot-shaped openings of the multilayer 10.
- a second, plate-shaped and in cross-section I-shaped transformer core 16 To close the magnetic circuit sits on the first transformer core 12 a second, plate-shaped and in cross-section I-shaped transformer core 16, so that approximately winding layers are enclosed by the transformer core 12, 16 in the intermediate multilayer sections 18.
- the core elements 12, 16 are glued to one another laterally or flatly and thus ensure the magnetic circuit.
- a spacer bolt 20 is shown in the left area of FIG. 4, which is pressed into the circuit board 10 and at the other end makes thermal contact with a plate-shaped heat sink 22.
- An alternative, also known from the prior art, is shown in the right-hand area of FIG. 4; there a cooling pin 24 is soldered directly into the board 10 and - like the distance pin 20 - connected to the cooling body 22 by means of a screw connection.
- a thermal connection of the transformer core itself to the heat sink 22 is provided, as shown in FIG. 5 of the drawing.
- This is done by means of an elastic layer 26 made of heat-conducting material, which lies in the manner shown in FIG. 5 between the transformer core 16 and the heat sink 22.
- the mechanical connection between the heat sink 22 and the multilayer 10 is realized via spacers 28 and screws 30;
- the naturally occurring dimensional tolerances of the cores and bolts require the flexibility of the material 26, which is also referred to as a large-area, flexible heat-conducting mat, also known as a "gap pad" or "soft pad".
- the arrangement according to FIG. 5 therefore causes considerable manufacturing and manufacturing outlay.
- the same disadvantages apply as in the embodiment according to FIG. 4.
- FIG. 6 a further approach from the prior art is shown in FIG. 6, in which the heat of the multilayer 10 is dissipated to the heat sink 22 by means of elastic heat-conducting mats 32; at the same time, the transformer arrangement can be held by a resilient clamp element 34. However, the core is not cooled here.
- planar transformers are used in a so-called matrix arrangement; a plurality of transformers distributed on a multilayer, each of which requires individual, local heat dissipation.
- the invention advantageously makes it possible to create a planar inductance in a multilayer, in particular a circuit arrangement of the power electronics, which is extremely simple to manufacture, is suitable for automatic assembly or implementation and, moreover, a very high level of heat dissipation - both from the heat-generating section of the multilayer and from the transformer core - permitted.
- the direct, direct connection of the cooling element having a planar contact surface to the core element permits arrangements of high power dissipation with correspondingly high heat development, without. damage to the arrangement is to be feared.
- the transformer cores are not only regarded as magnetic or electrical components, but rather as mechanical elements which - due to their relatively good heat conduction, for example in the case of ferrite - serve as thermal bridges and fix the multilayer assembly.
- the cores also realize the largest possible area for heat dissipation at the point of origin at the shortest distance.
- the adhesive layer according to the invention can advantageously compensate for tolerance problems between the various cores of a matrix arrangement and the plate-shaped cooling element.
- the thickness of the multilayer printed circuit board and the thickness of the cores no longer play a role for the mechanical fastening.
- the core elements, which are made of brittle material, such as ferrite, are also advantageously reliably fixed, as a result of which the assembly is extremely vibration-resistant.
- electrically conductive adhesives for the connections according to the invention which, since they are electrically conductive, often also have good thermal conductivity; With regard to heat dissipation, there are clear advantages over insulating plastics, such as those used for potting purposes.
- cooling element according to the invention in addition for cooling semiconductors or other heat-generating electronic components on the carrier board (multilayer), so that a complete, compact and efficient cooling and mounting system for electrical power modules is produced.
- both the core element and the electronic component to be additionally cooled can be cooled within a single operation or assembly process; suitably this can be done, for example, by appropriately dimensioned projections or profiled sections of the cooling element at points of attack and contact for a power semiconductor to be cooled.
- a cooling system is created without additional effort, especially for arrangements equipped with SMD.
- Figure 1 is a schematic plan view of a circuit board arrangement to be cooled according to the invention with a plurality of distributed transformers and chokes.
- FIG. 2 shows a side sectional view through a planar inductance to be cooled according to a first preferred embodiment of the invention
- FIG. 3 shows a side sectional view of a further embodiment of the invention with additional semiconductor power elements
- Fig. 6 Procedure for cooling planar inductors from the prior art.
- FIG. 1 shows the top view of a power semiconductor arrangement with a multilayer circuit board 10 and a plate-shaped, flat heat sink 22 made of common heat sink material, such as copper or aluminum.
- FIG. 1 shows a plurality of (SMD-equipped) electronic components 40 on the component-side of the circuit board 10, and a plurality of power semiconductor elements 42 can also be seen, which are also in contact with the heat sink 22 be cooled.
- Fig. 2 now shows a schematic side view of the basic principle of the invention.
- the first transformer core 12 and the second transformer core 16 are designed to enclose sections 18 of the circuit board 10 as a planar transformer.
- the E-shaped, first transformer element 12 is additionally connected to the downward-facing surface of the multilayer 10 between the legs 14 by means of an electrically conductive, heatable adhesive connection 44, and it is the flat surface of the transformer core 12 over the entire surface by means of a heat and electrically conductive adhesive 46 connected to the heat sink plate 22.
- the adhesive used for the adhesive connections 44 and 46 preferably has metal particles or the like. that not only create electrical conductivity between the components involved, but also ensure a significantly superior thermal conductivity. With regard to the magnetic properties of the cores cooled in this way, however, the electrical connection between the transformer core and the heat sink is practically without disadvantageous consequence.
- FIG. 3 illustrates the basic arrangement according to the invention of FIG. 2 in an environment of a heat-generating power module, such as is an electronic switching power supply.
- a power semiconductor 42 Adjacent to the transformer arrangement 12, 16 is a power semiconductor 42, for example an insulated switching transistor, which is likewise connected to the heat sink 22 via an adhesive connection 48 in the manner shown and thus not only uses the available cooling surface, but also for further mechanical stabilization of the arrangement worries.
- thermally and mechanically optimized heat dissipation for power multilayers with integrated transformers or chokes can be implemented.
- the invention enables the additional cooling of SMD power components, for example in housings such as D-Pack, D 2 -Pack, SOT 223 etc. without additional effort.
- the resulting heat loss is dissipated to the external cooler through the multilayer; this can be seen in FIG. 3 above the projection 50.
- thermally conductive material can be introduced into the multilayer, wherein the layers can be connected to one another with vias.
- the adhesive generally adapts to all unevenness, so that not only is the thermal contact resistance reduced by trapped air between all components involved; there is also an effective area compensation. After curing, the parts can also no longer be moved against each other; it not only creates a reliable, lasting one thermal, but also a correspondingly resilient and vibration-proof mechanical connection.
- the different expansion coefficients of the multilayer and the cooling plate can preferably be matched to one another. Since such a power multilayer contains a lot of copper, the thermal linear expansion of such a plate is approximately equal to that of copper (multilayer FR 4: 10 - 17 10 " 6 / K; copper: 16.5 10 " 6 / K; ferrite: 10, 5 10 "6 / K).
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
Abstract
Description
Claims
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722204 | 1997-05-27 | ||
DE19722204 | 1997-05-27 | ||
DE19740283 | 1997-09-13 | ||
DE19740283 | 1997-09-13 | ||
DE19808592 | 1998-02-28 | ||
DE19808592A DE19808592C2 (de) | 1997-05-27 | 1998-02-28 | Vorrichtung zum Kühlen einer Planarinduktivität |
PCT/EP1998/003104 WO1998054735A1 (de) | 1997-05-27 | 1998-05-27 | Vorrichtung und verfahren zum kühlen einer planarinduktivität |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0985218A1 true EP0985218A1 (de) | 2000-03-15 |
EP0985218B1 EP0985218B1 (de) | 2001-10-04 |
Family
ID=27217415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98932086A Expired - Lifetime EP0985218B1 (de) | 1997-05-27 | 1998-05-27 | Vorrichtung und verfahren zum kühlen einer planarinduktivität |
Country Status (3)
Country | Link |
---|---|
US (1) | US6222733B1 (de) |
EP (1) | EP0985218B1 (de) |
WO (1) | WO1998054735A1 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IE20000731A1 (en) * | 1999-09-13 | 2001-07-11 | Commergy Technologies Ltd | A printed circuit board assembly |
FR2798814B1 (fr) * | 1999-09-22 | 2001-11-16 | Valeo Vision | Perfectionnements aux assemblages electroniques a drain thermique, notamment pour module de commande de lampe a decharge de projecteur de vehicule automobile |
US6674355B2 (en) * | 2000-05-19 | 2004-01-06 | M-Flex Multi-Fineline Electronix, Inc. | Slot core transformers |
US6459586B1 (en) | 2000-08-15 | 2002-10-01 | Galaxy Power, Inc. | Single board power supply with thermal conductors |
US6518868B1 (en) * | 2000-08-15 | 2003-02-11 | Galaxy Power, Inc. | Thermally conducting inductors |
US6820321B2 (en) * | 2000-09-22 | 2004-11-23 | M-Flex Multi-Fineline Electronix, Inc. | Method of making electronic transformer/inductor devices |
US7135952B2 (en) * | 2002-09-16 | 2006-11-14 | Multi-Fineline Electronix, Inc. | Electronic transformer/inductor devices and methods for making same |
US20040255604A1 (en) * | 2003-01-27 | 2004-12-23 | Longardner Robert L. | Heat extraction system for cooling power transformer |
US6714414B1 (en) * | 2003-02-07 | 2004-03-30 | Morningstar Corporation | Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces |
EP1458226A3 (de) * | 2003-03-11 | 2006-06-28 | Fujitsu Hitachi Plasma Display Limited | Leiterplattenanordnung und Flachspule |
US6844802B2 (en) * | 2003-06-18 | 2005-01-18 | Advanced Energy Industries, Inc. | Parallel core electromagnetic device |
US7697300B2 (en) * | 2003-08-01 | 2010-04-13 | Siemens Aktiengesellschaft | Electronic unit and method for manufacturing an electronic unit |
JP4311243B2 (ja) * | 2004-03-15 | 2009-08-12 | 株式会社デンソー | 電子機器 |
US6963256B2 (en) * | 2004-03-29 | 2005-11-08 | Radhakrishnaiah Setty | Low cost splitter |
RU2007120247A (ru) * | 2004-12-07 | 2009-01-20 | Малти-Файнлайн Электроникс, Инк. (Us) | Миниатюрные схемы, индуктивные элементы и способы их производства |
US7436282B2 (en) * | 2004-12-07 | 2008-10-14 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
US7167074B2 (en) * | 2005-01-12 | 2007-01-23 | Medtronic, Inc. | Integrated planar flyback transformer |
DE102005008521A1 (de) * | 2005-02-24 | 2006-08-31 | OCé PRINTING SYSTEMS GMBH | Anordnung und Verfahren zum Kühlen eines Leistungshalbleiters |
US20060250205A1 (en) * | 2005-05-04 | 2006-11-09 | Honeywell International Inc. | Thermally conductive element for cooling an air gap inductor, air gap inductor including same and method of cooling an air gap inductor |
US20060261783A1 (en) * | 2005-05-23 | 2006-11-23 | Paul Gamboa | Electronic battery module (EBM) with bidirectional DC-DC converter |
US7645941B2 (en) | 2006-05-02 | 2010-01-12 | Multi-Fineline Electronix, Inc. | Shielded flexible circuits and methods for manufacturing same |
US9030822B2 (en) | 2011-08-15 | 2015-05-12 | Lear Corporation | Power module cooling system |
US9076593B2 (en) | 2011-12-29 | 2015-07-07 | Lear Corporation | Heat conductor for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
US8971041B2 (en) | 2012-03-29 | 2015-03-03 | Lear Corporation | Coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
US8902582B2 (en) * | 2012-05-22 | 2014-12-02 | Lear Corporation | Coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
US8971038B2 (en) * | 2012-05-22 | 2015-03-03 | Lear Corporation | Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
DE102012222959B4 (de) * | 2012-12-12 | 2015-04-02 | Semikron Elektronik Gmbh & Co. Kg | Leistungsbauelementeinrichtung |
WO2014206460A1 (en) * | 2013-06-26 | 2014-12-31 | Telefonaktiebolaget L M Ericsson (Publ) | Switched mode power supply module and method of manufacturing the same |
CN104684338B (zh) * | 2013-11-26 | 2018-01-30 | 台达电子企业管理(上海)有限公司 | 散热基座与电子装置 |
JP6115464B2 (ja) * | 2013-12-20 | 2017-04-19 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
US9362040B2 (en) | 2014-05-15 | 2016-06-07 | Lear Corporation | Coldplate with integrated electrical components for cooling thereof |
US9615490B2 (en) | 2014-05-15 | 2017-04-04 | Lear Corporation | Coldplate with integrated DC link capacitor for cooling thereof |
US10147531B2 (en) | 2015-02-26 | 2018-12-04 | Lear Corporation | Cooling method for planar electrical power transformer |
FR3045922B1 (fr) | 2015-12-17 | 2018-09-21 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif electronique comportant au moins une inductance comprenant des moyens de gestion thermique passifs |
US10104805B2 (en) | 2016-05-09 | 2018-10-16 | The United States Of America As Represented By The Secretary Of The Army | Self cooling stretchable electrical circuit having a conduit forming an electrical component and containing electrically conductive liquid |
EP3416467B1 (de) * | 2017-06-13 | 2022-05-04 | ABB Schweiz AG | Wärmetauscherstruktur für eine gestellanordnung |
JP2020087994A (ja) * | 2018-11-16 | 2020-06-04 | 三菱電機株式会社 | プレーナトランス |
DE202019101381U1 (de) * | 2019-03-12 | 2020-06-15 | Tridonic Gmbh & Co Kg | Spule mit einem Spulenkern mit lokaler Kühlung, Transformator mit einer solchen Spule sowie System mit einem solchen Transformator |
JP7326782B2 (ja) * | 2019-03-13 | 2023-08-16 | Tdk株式会社 | トランスおよび電源装置 |
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US4622627A (en) * | 1984-02-16 | 1986-11-11 | Theta-J Corporation | Switching electrical power supply utilizing miniature inductors integrally in a PCB |
US5598327A (en) * | 1990-11-30 | 1997-01-28 | Burr-Brown Corporation | Planar transformer assembly including non-overlapping primary and secondary windings surrounding a common magnetic flux path area |
JPH04209509A (ja) * | 1990-12-04 | 1992-07-30 | Mitsubishi Electric Corp | 金属ベース基板用トランス |
GB2252208B (en) * | 1991-01-24 | 1995-05-03 | Burr Brown Corp | Hybrid integrated circuit planar transformer |
FR2689361B1 (fr) * | 1992-03-24 | 1994-05-13 | Thomson Csf | Dispositif de refroidissement de circuit inductif. |
US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
US5652561A (en) * | 1993-06-29 | 1997-07-29 | Yokogawa Electric Corporation | Laminating type molded coil |
DE69619420T2 (de) | 1995-03-29 | 2002-10-31 | Valeo Electronique Creteil | Transformatoreinrichtung, insbesondere für eine Versorgungseinrichtung von Entladungslampen in Kraftfahrzeugen |
US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
-
1998
- 1998-05-27 EP EP98932086A patent/EP0985218B1/de not_active Expired - Lifetime
- 1998-05-27 WO PCT/EP1998/003104 patent/WO1998054735A1/de active IP Right Grant
- 1998-05-27 US US09/424,435 patent/US6222733B1/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO9854735A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1998054735A1 (de) | 1998-12-03 |
EP0985218B1 (de) | 2001-10-04 |
US6222733B1 (en) | 2001-04-24 |
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