EP0924811A1 - Systemträger, und Verfahren zum Herstellen eines Systemträgers - Google Patents

Systemträger, und Verfahren zum Herstellen eines Systemträgers Download PDF

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Publication number
EP0924811A1
EP0924811A1 EP98124134A EP98124134A EP0924811A1 EP 0924811 A1 EP0924811 A1 EP 0924811A1 EP 98124134 A EP98124134 A EP 98124134A EP 98124134 A EP98124134 A EP 98124134A EP 0924811 A1 EP0924811 A1 EP 0924811A1
Authority
EP
European Patent Office
Prior art keywords
segment
circuit trace
lead
segments
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98124134A
Other languages
English (en)
French (fr)
Inventor
Timothy J. Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Publication of EP0924811A1 publication Critical patent/EP0924811A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Definitions

  • the present invention relates to a lead-frame for use in an electrical connector. More particularly, the present invention relates to such a lead-frame which is useful, without limitation, with an insert molded insulative housing to provide a lead-frame assembly which serves as an electrical connector. A method of forming such a lead-frame and lead-frame assembly is also disclosed.
  • One known technique to provide more flexibility in the routing of the connection points in insert molded housings is to use multiple stampings.
  • two or more lead-frames are provided to route the connection points of each insert molded housing.
  • this increases the complexity by increasing the number of components which must be loaded into the injection mold.
  • the complexity of the loading tooling and the cycle time of the process may be adversely affected.
  • additional stamping dies are required. All of the foregoing increases the cost of manufacturing the product.
  • Another object of the present invention is to provide an improved lead-frame having improved flexibility in the routing of lead-frame connection points.
  • a further object of the present invention is to provide an improved lead-frame having improved flexibility in the routing of lead-frame connection points, and a lead-frame assembly which contains such an improved lead-frame, which is less costly than those manufactured heretofore.
  • Yet another object of the present invention is to provide an improved lead-frame assembly having flexibility in the routing of connection points using contacts provided by a single stamping.
  • a further object of the present invention is to provide an improved method of fabricating a lead-frame.
  • Another object of the present invention is to provide an improved method of fabricating a lead-frame assembly.
  • a lead-frame comprising a base segment and a plurality of circuit trace segments extending from the base segment.
  • Each circuit trace segment extends from a first end adjacent the base segment to an opposite distal contact segment.
  • the distal contact segments are parallel.
  • At least one circuit trace segment includes a section which bridges over at least an adjacent circuit trace segment.
  • the distal contact segment of the bridging circuit trace segment is located on one side of the adjacent circuit trace segment, and the first end of the bridging circuit trace segment is located on an opposite side of the adjacent circuit trace segment.
  • a lead-frame assembly which comprises the foregoing lead-frame is also disclosed. Methods of fabricating the foregoing lead-frame, and lead-frame assembly, are also disclosed.
  • Lead-frame 10 includes a base segment and a plurality of circuit trace segments.
  • lead-frame 10 includes a base segment 12 and a plurality of circuit trace segments 14, 16, 18, 20 and 22 extending from the base segment. More or less circuit trace segments may be provided as desired.
  • Each circuit trace segment extends from a first end adjacent the base segment 12 to an opposite end which includes a distal contact segment.
  • circuit trace segment 14 extends from a first end 24 to an opposite end which includes a distal contact segment 26.
  • the distal contact segments are parallel to each other as illustrated in FIG. 1.
  • At least one circuit trace segment includes a section which bridges over at least an adjacent circuit trace segment.
  • the circuit trace segment 16 includes a section 28 which bridges over an adjacent circuit trace segment 18.
  • bridges over is meant that a section of a circuit trace segment is raised above, is out of contact with and crosses over one or more other circuit trace segments.
  • section 28 bridges over the circuit trace segments 18, 20 and 22.
  • the distal end segment 30 of the circuit trace segment 16 is located on one side 32 of the circuit trace segment 18 and the first end 34 of the circuit trace segment 16 is located on an opposite side 36 of the circuit trace segment 18.
  • the distal contact segments such as segments 26 and 30, and the first ends, such as ends 24 and 34, extend in a first plane.
  • all of the circuit trace segments illustrated in FIG. 1 extend substantially continuously in such first plane from respective first ends to respective distal contact segments.
  • circuit trace segment 14 extends substantially continuously in such first plane from the first end 24 to the distal contact segment 26.
  • the section 28 of the circuit trace segment 16 extends in a second plane which is parallel to such first plane as is evident from FIG. 1.
  • each circuit trace segment includes a length which extends in a direction 38 which is substantially perpendicular to the base segment 12.
  • all of the first ends such as first ends 24 and 34, extend in direction 38.
  • Section 28 of the circuit trace segment 16 extends in a direction 40 which is substantially parallel to base segment 12.
  • all of the distal contact segments are equally spaced, and all of the first ends are parallel to each other but not equally spaced.
  • all of the distal contact segments are equally spaced, each distance 42 between adjacent distal contact segments being substantially equal.
  • the distances 44 and 46 being substantially equal to each other but different from the distances 48 and 50 which are different from each other, as illustrated in FIG. 1.
  • At least one of the circuit trace segments includes more than one distal contact segment.
  • circuit trace segment 20 is forked at 52 to provide two distal contact segments 54 and 56.
  • FIG. 2 depicts a lead-frame assembly 58 which comprises a lead-frame 10 of the type illustrated in FIG. 1, and a plastic lead-frame insulative housing 60 which may be electrically and mechanically mated with a harness connector 62 in a conventional manner.
  • a portion of the lead-frame is embedded within a region of the plastic lead-frame insulative housing.
  • such portion is outlined by the phantom lines 64 and such region is the region 66 within phantom lines 64.
  • a section of each circuit trace segment 14-22 is embedded in region 66 of the plastic lead-frame insulative housing 60.
  • the section 28 of the circuit trace segment 16 is also embedded in the region 66.
  • Each circuit trace segment includes an exposed distal contact segment such as distal contact segments 26, 54, 56 and 30 which extend in a first direction 68 out of and away from the region 66, the distal contact segments being parallel to one another as illustrated in FIG. 3.
  • Each circuit trace segment 14-22 also includes an exposed end segment 70, 72, 74, 76 and 78 which extends in an opposite second direction 80 out of and away from the region 66 of the plastic lead-frame insulative housing 60.
  • a sheet of conductive material such as a sheet of copper is cut into the desired configuration.
  • a sheet of conductive material may be cut into the configuration depicted in FIG. 4.
  • the cutting is effected such that the base segment 12 and plurality of circuit trace segments 14-22 are provided.
  • Each circuit trace segment is cut so as to extend from a first end adjacent the base segment 12, such as first end 24, to a distal end segment, such as distal end segment 26, of circuit trace segment 14, all but one of the distal end segments being parallel to each other as illustrated in FIG. 4.
  • the section 28 of the circuit trace segment 16 is substantially perpendicular to the base segment 12.
  • Distal end segment 30 of circuit trace segment 16 will extend in a direction 82 which is substantially perpendicular to the section 28 of circuit trace segment 16 and substantially parallel to the base segment 12.
  • the sheet of conductive material may be cut such that at least one circuit trace segment, such as circuit trace segment 20, includes more than one distal contact segment, such as distal contact segments 54 and 56.
  • such cutting step may be effected in a conventional stamping operation.
  • At least one circuit trace segment is bent or folded until at least a section thereof bridges over at least one adjacent circuit trace segment. For example, as illustrated in FIG. 5, circuit trace segment 16 is bent until the section 28 bridges over the adjacent circuit trace segment 18 and circuit trace segments 20 and 22.
  • each circuit trace segment includes a length which extends in a direction substantially perpendicular to the base segment 12, and bending may be effected such that the section 28 is substantially parallel to the base segment.
  • the distal end segment 30 and the first end 34 of the circuit trace segment 16 will be on opposite sides of the circuit trace segment 18. Subsequent to cutting, the cut sheet will extend in a first plane. Subsequent to bending, the section 28 will extend in a second plane parallel to the first plane so that the lead-frame so formed will have the configuration of lead-frame 10 of FIG. 1.
  • the lead-frame may be plated in a conventional manner.
  • the lead-frame 10 depicted in FIG. 5 may be plated to provide an aluminum inlay upon each circuit trace segment 14-22 at a respective length 86.
  • FIG. 6 schematically represents a plurality of lead-frames 10 which were formed from a conductive material in a progressive stamping die and are being carried by a strip forming the base segment 12, the lead-frames travelling from the die (not shown) to rolls 88 and 90 from which the lead-frames progress to a plating operation (not shown).
  • the lead-frames of the present invention are useful in the fabrication of the lead-frame assembly of the present invention.
  • the lead-frame insulative housing 60 of FIGS. 2 and 3 may be fabricated in a conventional extrusion molding process.
  • a lead-frame 10 may be embedded within the plastic lead-frame insulative housing 60 during the extrusion thereof such that the portion of the lead-frame outlined by the phantom lines 64 is embedded in the lead-frame insulative housing at the region 66 within phantom lines 64.
  • each circuit trace segment 14-22 within the phantom lines 64 may be embedded within region 66 such that a length of each distal contact segment, such as distal contact segment 26 of circuit trace segment 14, extends from the region 66 in the first direction 68, and at least a length of each first end, such as length 70 extends from region 66 in the second direction 80.
  • a conventional insert injection molding operation may be used to embed the lead-frame in the insulative housing as described herein.
  • the lead-frame 10 may be trimmed at each circuit trace segment 14-22 to remove the excess material, including the base segment, identified by phantom line 92, so that only the distal contact segments, such as distal contact segment 26, and the lengths of end segments, such as length 70, are exposed.
  • the distal contact segments are prong like male members which are constructed and arranged for insertion into female connectors 94 of the harness connector 62, and the lengths 70 are constructed and arranged for electrical and mechanical connection to some other component(s), as desired, as for example, by welding conductors thereto.
  • the folding of the section 28 of the circuit trace segment 16 so that the section 28 bridges over an adjacent circuit trace segment provides multiple routing planes in a single stamping.
  • a flat pattern or blank is formed such that the circuit traces can be formed and folded over each other in multiple planes thereby increasing routing flexibility in one stamping operation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
EP98124134A 1997-12-19 1998-12-18 Systemträger, und Verfahren zum Herstellen eines Systemträgers Withdrawn EP0924811A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99473197A 1997-12-19 1997-12-19
US994731 1997-12-19

Publications (1)

Publication Number Publication Date
EP0924811A1 true EP0924811A1 (de) 1999-06-23

Family

ID=25540985

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98124134A Withdrawn EP0924811A1 (de) 1997-12-19 1998-12-18 Systemträger, und Verfahren zum Herstellen eines Systemträgers

Country Status (2)

Country Link
EP (1) EP0924811A1 (de)
JP (1) JPH11251006A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10015993A1 (de) * 2000-03-31 2001-10-11 Heraeus Gmbh W C Verfahren zur Herstellung eines Hybridsteckergehäuses
FR2913538A1 (fr) * 2007-03-05 2008-09-12 Peugeot Citroen Automobiles Sa Gel d'isolation en plaque pour isolation renforcee.
WO2011128401A1 (de) * 2010-04-14 2011-10-20 Phoenix Contact Gmbh & Co. Kg Leadframe und anschlussdose mit einem leadframe
JP5677541B1 (ja) * 2013-09-25 2015-02-25 株式会社東海理化電機製作所 インシュレータおよびインシュレータの製造方法
LU501814B1 (de) * 2022-04-07 2023-10-09 Phoenix Contact Gmbh & Co Verfahren zur Herstellung eines Stanzgitterteils und Sockelklemme umfassend Stanzgitterteil

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4481909B2 (ja) * 2005-09-21 2010-06-16 日立オートモティブシステムズ株式会社 コネクタに用いる接続端子の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927558A (ja) * 1982-08-03 1984-02-14 Toshiba Corp 半導体装置用リ−ドフレ−ム
US5274918A (en) * 1993-04-15 1994-01-04 The Whitaker Corporation Method for producing contact shorting bar insert for modular jack assembly
EP0590986A1 (de) * 1992-09-30 1994-04-06 Texas Instruments Incorporated Leiterrahmen für die Innendrahtverbindung von Überchipanschlüssen, Bondierungsmethode und Apparat
US5645455A (en) * 1994-02-02 1997-07-08 Yazaki Corporation Joint connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927558A (ja) * 1982-08-03 1984-02-14 Toshiba Corp 半導体装置用リ−ドフレ−ム
EP0590986A1 (de) * 1992-09-30 1994-04-06 Texas Instruments Incorporated Leiterrahmen für die Innendrahtverbindung von Überchipanschlüssen, Bondierungsmethode und Apparat
US5274918A (en) * 1993-04-15 1994-01-04 The Whitaker Corporation Method for producing contact shorting bar insert for modular jack assembly
US5645455A (en) * 1994-02-02 1997-07-08 Yazaki Corporation Joint connector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 111 (E - 246) 24 May 1984 (1984-05-24) *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10015993A1 (de) * 2000-03-31 2001-10-11 Heraeus Gmbh W C Verfahren zur Herstellung eines Hybridsteckergehäuses
DE10015993C2 (de) * 2000-03-31 2002-01-31 Heraeus Gmbh W C Verfahren zur Herstellung eines Hybridsteckergehäuses
FR2913538A1 (fr) * 2007-03-05 2008-09-12 Peugeot Citroen Automobiles Sa Gel d'isolation en plaque pour isolation renforcee.
WO2011128401A1 (de) * 2010-04-14 2011-10-20 Phoenix Contact Gmbh & Co. Kg Leadframe und anschlussdose mit einem leadframe
CN102859808A (zh) * 2010-04-14 2013-01-02 菲尼克斯控特有限公司 引线框以及具备引线框的连接插座
US8979597B2 (en) 2010-04-14 2015-03-17 Phoenix Contact Gmbh & Co. Kg Leadframe having selectively removable bridges between terminals and contacts
TWI487457B (zh) * 2010-04-14 2015-06-01 Phoenix Contact Gmbh & Co 引線框以及具有引線框的接線盒
CN102859808B (zh) * 2010-04-14 2015-12-09 菲尼克斯控特有限公司 引线框以及具备引线框的连接插座
JP5677541B1 (ja) * 2013-09-25 2015-02-25 株式会社東海理化電機製作所 インシュレータおよびインシュレータの製造方法
LU501814B1 (de) * 2022-04-07 2023-10-09 Phoenix Contact Gmbh & Co Verfahren zur Herstellung eines Stanzgitterteils und Sockelklemme umfassend Stanzgitterteil
WO2023194250A1 (de) * 2022-04-07 2023-10-12 Phoenix Contact Gmbh & Co.Kg Verfahren zur herstellung eines stanzgitterteils und sockelklemme umfassend stanzgitterteil

Also Published As

Publication number Publication date
JPH11251006A (ja) 1999-09-17

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