EP0855722B1 - Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren - Google Patents

Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren Download PDF

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Publication number
EP0855722B1
EP0855722B1 EP97403046A EP97403046A EP0855722B1 EP 0855722 B1 EP0855722 B1 EP 0855722B1 EP 97403046 A EP97403046 A EP 97403046A EP 97403046 A EP97403046 A EP 97403046A EP 0855722 B1 EP0855722 B1 EP 0855722B1
Authority
EP
European Patent Office
Prior art keywords
layer
steel
bedplate
multilayer structure
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97403046A
Other languages
English (en)
French (fr)
Other versions
EP0855722A1 (de
Inventor
Stéphane Serpolet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay SA
Original Assignee
Vishay SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay SA filed Critical Vishay SA
Publication of EP0855722A1 publication Critical patent/EP0855722A1/de
Application granted granted Critical
Publication of EP0855722B1 publication Critical patent/EP0855722B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks

Definitions

  • the present invention relates to resistance to strong dissipation of power and / or energy with integrated radiator as well as its manufacturing process.
  • this type of resistance has a substrate and a multilayer structure applied to the substrate and comprising a layer of resistive material and a layer of conductive material.
  • the substrate 12 receives a multilayer structure comprising a layer of resistive material 24 and a layer of conductive material 6.
  • the structure includes an aluminum sole 10 on which is deposited a layer of glue 11 to fix a substrate in alumina 12 intended to receive the multilayer structure.
  • the substrate includes a steel soleplate covered by a layer ceramic insulator applied by screen printing.
  • the object of the present invention is to provide a high power resistance simplified manufacturing and having improved thermal performance.
  • this resistance is characterized in that the multilayer structure comprises furthermore an assembly forming a thermal reservoir comprising a block of thermal conductive material with high heat capacity and an alumina plate.
  • resistance thermal performance are including the thermal resistance between the resistive layer and a possible auxiliary radiator, on which the resistance is fixed, is reduced.
  • Resistor assembly is simplified by makes continuous use of screen printing for apply one or more insulating layers of material dielectric, as well as the layers of resistive material and driver.
  • the insulating layer in contact with the sole of the substrate made of a material dielectric having a coefficient of expansion thermal substantially equal to the coefficient of expansion thermal of the steel of the sole.
  • the adequacy of the expansion coefficients steel constituting the sole and the layer insulation in contact with the sole prevents cracks or separation of the insulating layers screen printed on the sole.
  • the steel of the sole comprises at least 17% by weight of titanium.
  • the titanium content of the steel allows improve the adhesion of the dielectric material screen printed on the sole.
  • the present invention also provides a method manufacturing a resistance to far power dissipation, and / or of energy, the steps of which are defined by claim 7.
  • a high resistance dissipation comprises an insulating housing 1, fixed on a sole 10, 20, fixing lugs not shown being provided for fixing the resistance, by example by screwing, on an auxiliary radiator.
  • Connection pads 2 two in number allow the resistance to be linked to a source of Electric power.
  • Electric current is transmitted by a rod conductive 4, fixed for example by means of solder 5, on a conductive element 6, generally made of an alloy silver and palladium.
  • This conductive element 6 is in contact with the layer of resistive material 24 and makes it possible to supply the latter in electric current.
  • the multilayer structure of the resistance successively comprises this layer of material resistive 24, in contact with the substrate, a layer of glue 25, an alumina plate 26, a second layer glue 27 and a block of conductive material 28 such as copper.
  • the alumina plate 26 on which is stuck the block of thermal conductive material 28, with high heat capacity constitutes a whole forming thermal tank.
  • the substrate comprises a sole made of steel 20 and at least one insulating layer 21, 22, 23 dielectric material applied by screen printing on the steel sole 20 and disposed between the sole 20 and the previously described multilayer structure.
  • the substrate comprises at least two insulating layers 21, 22, 23 superimposed in dielectric material.
  • the substrate comprises three insulating layers 21, 22, 23.
  • the insulating layer 21 in contact with the sole 20 of the substrate is made of a dielectric material having a coefficient of thermal expansion substantially equal to the coefficient of thermal expansion steel of sole 20 in order to avoid any detachment or crack of this insulating layer 21.
  • the characteristics of the dielectric material used to make this first layer 21 are mainly determined to allow hanging of this insulating layer 21 on the steel of the sole 20.
  • the second and third layers 22 and 23 allow to realize strictly speaking a layer insulating between the steel sole 20 and the layer in resistive material 24.
  • the different superimposed insulating layers 21, 22, 23 are applied by screen printing and baked separately, before each new application silkscreen.
  • a continuous insulating coating is thus obtained on one face of the sole 20.
  • the different layers 21, 22, 23 can be made of an identical dielectric material, such as that marketed by the company ESL ® under the ESL reference D - 4914, having a coefficient of expansion accorded to ferritic stainless steel.
  • the last layer 23 can also be made of a dielectric material different from previous, such as that marketed under the reference ESL D - 4913.
  • a high resistance is thus obtained dissipation, able to hold in tension until about 7000 Volt, and having an ohmic value which does not vary practically not throughout the life of the resistance.
  • the sole is made of steel ferritic stainless, comprising at least 17% by weight titanium.
  • This steel sole has an equal or greater than about 1 mm, so as to present a sufficient mechanical rigidity and good dissipation heat.
  • a steel suitable for realize the sole is marketed by the company UGINE ® under the reference UGINOX F 17 T, corresponding to the European designation X 3 Cr Ti 17.
  • Standard steels X 2 Cr Ti 12, X 2 Cr Ti Nb 18 or X 2 Cr Mo Ti 18 - 2 may also be suitable.
  • the number of insulating layers in dielectric material can be adjusted according to the thickness of each of the screen-printed layers and the insulating power of the material used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Tires In General (AREA)
  • Secondary Cells (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Claims (8)

  1. Widerstand mit starker Dissipation von Leistung und/oder Energie, umfassend:
    ein Substrat mit einer Fußplatte aus Stahl (20) und wenigstens einer Isolierschicht (21, 22, 23) aus dielektrischem Material, welche durch Siebdrucken auf die Fußplatte aus Stahl (20) aufgebracht ist,
    eine mehrschichtige Struktur, die auf das Substrat aufgebracht ist und eine Schicht aus Widerstandmaterial (24) und eine Schicht aus elektrisch leitfähigem Material (6) aufweist,
    dadurch gekennzeichnet, dass die mehrschichtige Struktur außerdem eine ein thermisches Reservoir formende Anordnung umfasst, die einen Block (28) aus thermisch leitfähigem Material mit großer Wärmekapazität und eine Platte aus Aluminiumoxid (26) aufweist.
  2. Widerstand nach Anspruch 1,
    dadurch gekennzeichnet, dass die mehrschichtige Struktur eine erste Klebstoffschicht (25), die auf die Schicht aus Widerstandsmaterial (24) aufgebracht ist, die Platte aus Aluminiumoxid (26), eine zweite Klebstoffschicht (27) und den Block aus leitfähigem Material (28) in dieser Folge aufweist.
  3. Widerstand nach einem der Ansprüche 1 oder 2,
    dadurch gekennzeichnet, dass die Isolierschicht (21) in Kontakt mit der Fußplatte (20) des Substrats aus einem dielektrischen Material gebildet ist, welches einen Wärmeausdehnungskoeffizienten hat, der dem Wärmeausdehnungskoeffizienten des Stahls der Fußplatte (20) im wesentlichen gleich ist.
  4. Widerstand nach einem der Ansprüche 1 bis 3,
    dadurch gekennzeichnet, dass die Schicht(en) aus dielektrischem Material (21, 22, 23), welche zwischen der Fußplatte (20) und der mehrschichtigen Struktur angeordnet sind, eine Gesamtdicke haben, die ungefähr 80 m erreichen kann.
  5. Widerstand nach einem der Ansprüche 1 bis 4,
    dadurch gekennzeichnet, dass die Fußplatte aus Stahl (20) eine Dicke von größer oder gleich 1 mm hat.
  6. Widerstand nach einem der Ansprüche 1 bis 5,
    dadurch gekennzeichnet, dass die Fußplatte (20) rostfreien ferritischen Stahl mit wenigstens 17 Gew.-% Titan enthält.
  7. Verfahren zur Herstellung eines Widerstands mit starker Dissipation von Leistung und/oder Energie, welches die aufeinander folgenden Schritte umfasst:
    Aufbringen durch Siebdrucken wenigstens einer Isolierschicht (21, 22, 23) aus dielektrischem Material auf eine Fußplatte aus Stahl (20),
    Aufbringen durch Siebdrucken auf die Isolierschicht (21, 22, 23) einer Schicht aus Widerstandsmaterial (24), anschließend einer Schicht aus elektrisch leitfähigem Material (6),
    dadurch gekennzeichnet, dass es ferner die Schritte umfasst, die darin bestehen, auf die Schicht aus Widerstandsmaterial (24) eine Platte aus Aluminiumoxid (26) zu kleben, und auf die Platte aus Aluminiumoxid (26) einen Block (28) aus thermisch leitfähigem Material mit großer Wärmekapazität zu kleben.
  8. Herstellungsverfahren nach Anspruch 7,
    dadurch gekennzeichnet, dass es das Aufbringen von wenigstens zwei Isolierschichten (21, 22, 23), die getrennt gehärtet werden, auf die Fußplatte aus Stahl (20) umfasst.
EP97403046A 1997-01-10 1997-12-15 Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren Expired - Lifetime EP0855722B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9700207A FR2758409B1 (fr) 1997-01-10 1997-01-10 Resistance a forte dissipation de puissance et/ou d'energie
FR9700207 1997-01-10

Publications (2)

Publication Number Publication Date
EP0855722A1 EP0855722A1 (de) 1998-07-29
EP0855722B1 true EP0855722B1 (de) 2002-10-16

Family

ID=9502508

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97403046A Expired - Lifetime EP0855722B1 (de) 1997-01-10 1997-12-15 Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren

Country Status (4)

Country Link
EP (1) EP0855722B1 (de)
AT (1) ATE226355T1 (de)
DE (1) DE69716398T2 (de)
FR (1) FR2758409B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632779B (zh) * 2013-12-05 2016-04-06 蚌埠市德瑞特电阻技术有限公司 功率厚膜电阻器
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
GB2123316B (en) * 1982-07-14 1985-10-23 Atomic Energy Authority Uk Substrates for electronic devices
US4689270A (en) * 1984-07-20 1987-08-25 W. C. Heraeus Gmbh Composite substrate for printed circuits and printed circuit-substrate combination
FR2708782B1 (fr) * 1993-08-05 1995-10-06 Mcb Ind Composant résistif de puissance, avec dispositif d'application sous pression sur un dissipateur thermique.

Also Published As

Publication number Publication date
DE69716398T2 (de) 2003-03-06
ATE226355T1 (de) 2002-11-15
EP0855722A1 (de) 1998-07-29
FR2758409B1 (fr) 1999-04-02
DE69716398D1 (de) 2002-11-21
FR2758409A1 (fr) 1998-07-17

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