EP0855722A1 - Hoher energie- und/oder leistungsauflösender Widerstand - Google Patents
Hoher energie- und/oder leistungsauflösender Widerstand Download PDFInfo
- Publication number
- EP0855722A1 EP0855722A1 EP97403046A EP97403046A EP0855722A1 EP 0855722 A1 EP0855722 A1 EP 0855722A1 EP 97403046 A EP97403046 A EP 97403046A EP 97403046 A EP97403046 A EP 97403046A EP 0855722 A1 EP0855722 A1 EP 0855722A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sole
- layer
- steel
- resistance
- resistance according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
Definitions
- the present invention relates to resistance to strong dissipation of power and / or energy with integrated radiator.
- this type of resistance has a substrate and a multilayer structure applied to the substrate and comprising a layer of resistive material and a layer of conductive material.
- the substrate 12 receives a multilayer structure comprising a layer of resistive material 24 and a layer of conductive material 6.
- the structure includes an aluminum sole 10 on which is deposited a layer of glue 11 to fix a substrate in alumina 12 intended to receive the multilayer structure.
- the object of the present invention is to provide a high power resistance simplified manufacturing and having improved thermal performance.
- High power dissipation resistance targeted by the invention comprises a substrate comprising a steel sole and a multilayer structure applied to said substrate and comprising a layer of resistive material and a layer of conductive material.
- this resistance is characterized in that at least one insulating layer in dielectric material is applied by screen printing on the steel soleplate and is disposed between said soleplate and said multilayer structure.
- the resistance thermal performance are including the thermal resistance between the resistive layer and a possible auxiliary radiator, on which the resistance is fixed, is reduced.
- the steel sole increases the heat dissipation and improve mechanical strength resistance.
- the resistance assembly is simplified due to the continuous use of the screen printing to apply one or more coats insulating materials made of dielectric material as well as the layers in resistive and conductive material.
- the insulating layer in contact with the sole of the substrate made of a material dielectric having a coefficient of expansion thermal substantially equal to the coefficient of expansion thermal of the steel of the sole.
- the adequacy of the expansion coefficients steel constituting the sole and the layer insulation in contact with the sole prevents cracks or separation of the insulating layers screen printed on the sole.
- the steel of the sole comprises at least 17% by weight of titanium.
- the titanium content of the steel allows improve the adhesion of the dielectric material screen printed on the sole.
- a high resistance dissipation comprises an insulating housing 1, fixed on a sole 10, 20, fixing lugs not shown being provided for fixing the resistance, by example by screwing, on an auxiliary radiator.
- Connection pads 2 two in number allow the resistance to be linked to a source of Electric power.
- Electric current is transmitted by a rod conductive 4, fixed for example by means of solder 5, on a conductive element 6, generally made of an alloy silver and palladium.
- This conductive element 6 is in contact with the layer of resistive material 24 and makes it possible to supply the latter in electric current.
- the multilayer structure of the resistance successively comprises this layer of material resistive 24, in contact with the substrate, a layer of glue 25, an alumina plate 26, a second layer glue 27 and a block of conductive material 28 such as copper.
- the alumina plate 26 on which is stuck the block of thermal conductive material 28, with high heat capacity constitutes a whole forming thermal tank.
- the substrate comprises a sole made of steel 20 and at least one insulating layer 21, 22, 23 dielectric material applied by screen printing on the steel sole 20 and disposed between the sole 20 and the previously described multilayer structure.
- the substrate comprises at least two insulating layers 21, 22, 23 superimposed in dielectric material.
- the substrate comprises three insulating layers 21, 22, 23.
- the insulating layer 21 in contact with the sole 20 of the substrate is made of a dielectric material having a coefficient of thermal expansion substantially equal to the coefficient of thermal expansion steel of sole 20 in order to avoid any detachment or crack of this insulating layer 21.
- the characteristics of the dielectric material used to make this first layer 21 are mainly determined to allow hanging of this insulating layer 21 on the steel of the sole 20.
- the second and third layers 22 and 23 allow to realize strictly speaking a layer insulating between the steel sole 20 and the layer in resistive material 24.
- the different superimposed insulating layers 21, 22, 23 are applied by screen printing and baked separately, before each new application screen printing.
- a continuous insulating coating is thus obtained on one face of the sole 20.
- the different layers 21, 22, 23 can be made of an identical dielectric material, such as that marketed by the company ESL ® under the ESL reference D - 4914, having a coefficient of expansion accorded to ferritic stainless steel.
- the last layer 23 can also be made of a dielectric material different from previous, such as that marketed under the reference ESL D - 4913.
- a high resistance is thus obtained dissipation, able to hold in tension until about 7000 Volt, and having an ohmic value which does not vary practically not throughout the life of the resistance.
- the sole is made of steel ferritic stainless, comprising at least 17% by weight titanium.
- the presence of titanium improves the attachment of the dielectric coating applied by screen printing.
- This steel sole has an equal or greater than about 1 mm, so as to present a sufficient mechanical rigidity and good dissipation heat.
- a steel suitable for realize the sole is marketed by the company UGINE ® under the reference UGINOX F 17 T, corresponding to the European designation X 3 Cr Ti 17.
- Standard steels X 2 Cr Ti 12, X 2 Cr Ti Nb 18 or X 2 Cr Mo Ti 18 - 2 may also be suitable.
- the number of insulating layers in dielectric material can be adjusted according to the thickness of each of the screen-printed layers and the insulating power of the material used.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Tires In General (AREA)
- Secondary Cells (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9700207A FR2758409B1 (fr) | 1997-01-10 | 1997-01-10 | Resistance a forte dissipation de puissance et/ou d'energie |
FR9700207 | 1997-01-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0855722A1 true EP0855722A1 (de) | 1998-07-29 |
EP0855722B1 EP0855722B1 (de) | 2002-10-16 |
Family
ID=9502508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97403046A Expired - Lifetime EP0855722B1 (de) | 1997-01-10 | 1997-12-15 | Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0855722B1 (de) |
AT (1) | ATE226355T1 (de) |
DE (1) | DE69716398T2 (de) |
FR (1) | FR2758409B1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103632779A (zh) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | 功率厚膜电阻器 |
US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4313262A (en) * | 1979-12-17 | 1982-02-02 | General Electric Company | Molybdenum substrate thick film circuit |
US4689270A (en) * | 1984-07-20 | 1987-08-25 | W. C. Heraeus Gmbh | Composite substrate for printed circuits and printed circuit-substrate combination |
US4720419A (en) * | 1982-07-14 | 1988-01-19 | United Kingdom Atomic Energy Authority | Substrates for electronic devices |
EP0637826A1 (de) * | 1993-08-05 | 1995-02-08 | Mcb Industrie | Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke |
-
1997
- 1997-01-10 FR FR9700207A patent/FR2758409B1/fr not_active Expired - Fee Related
- 1997-12-15 AT AT97403046T patent/ATE226355T1/de not_active IP Right Cessation
- 1997-12-15 DE DE69716398T patent/DE69716398T2/de not_active Expired - Fee Related
- 1997-12-15 EP EP97403046A patent/EP0855722B1/de not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4313262A (en) * | 1979-12-17 | 1982-02-02 | General Electric Company | Molybdenum substrate thick film circuit |
US4720419A (en) * | 1982-07-14 | 1988-01-19 | United Kingdom Atomic Energy Authority | Substrates for electronic devices |
US4689270A (en) * | 1984-07-20 | 1987-08-25 | W. C. Heraeus Gmbh | Composite substrate for printed circuits and printed circuit-substrate combination |
EP0637826A1 (de) * | 1993-08-05 | 1995-02-08 | Mcb Industrie | Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103632779A (zh) * | 2013-12-05 | 2014-03-12 | 蚌埠市德瑞特电阻技术有限公司 | 功率厚膜电阻器 |
CN103632779B (zh) * | 2013-12-05 | 2016-04-06 | 蚌埠市德瑞特电阻技术有限公司 | 功率厚膜电阻器 |
US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
Also Published As
Publication number | Publication date |
---|---|
EP0855722B1 (de) | 2002-10-16 |
DE69716398T2 (de) | 2003-03-06 |
ATE226355T1 (de) | 2002-11-15 |
FR2758409B1 (fr) | 1999-04-02 |
DE69716398D1 (de) | 2002-11-21 |
FR2758409A1 (fr) | 1998-07-17 |
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