EP0855722A1 - Hoher energie- und/oder leistungsauflösender Widerstand - Google Patents

Hoher energie- und/oder leistungsauflösender Widerstand Download PDF

Info

Publication number
EP0855722A1
EP0855722A1 EP97403046A EP97403046A EP0855722A1 EP 0855722 A1 EP0855722 A1 EP 0855722A1 EP 97403046 A EP97403046 A EP 97403046A EP 97403046 A EP97403046 A EP 97403046A EP 0855722 A1 EP0855722 A1 EP 0855722A1
Authority
EP
European Patent Office
Prior art keywords
sole
layer
steel
resistance
resistance according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97403046A
Other languages
English (en)
French (fr)
Other versions
EP0855722B1 (de
Inventor
Stéphane Serpolet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay SA
Original Assignee
Vishay SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay SA filed Critical Vishay SA
Publication of EP0855722A1 publication Critical patent/EP0855722A1/de
Application granted granted Critical
Publication of EP0855722B1 publication Critical patent/EP0855722B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks

Definitions

  • the present invention relates to resistance to strong dissipation of power and / or energy with integrated radiator.
  • this type of resistance has a substrate and a multilayer structure applied to the substrate and comprising a layer of resistive material and a layer of conductive material.
  • the substrate 12 receives a multilayer structure comprising a layer of resistive material 24 and a layer of conductive material 6.
  • the structure includes an aluminum sole 10 on which is deposited a layer of glue 11 to fix a substrate in alumina 12 intended to receive the multilayer structure.
  • the object of the present invention is to provide a high power resistance simplified manufacturing and having improved thermal performance.
  • High power dissipation resistance targeted by the invention comprises a substrate comprising a steel sole and a multilayer structure applied to said substrate and comprising a layer of resistive material and a layer of conductive material.
  • this resistance is characterized in that at least one insulating layer in dielectric material is applied by screen printing on the steel soleplate and is disposed between said soleplate and said multilayer structure.
  • the resistance thermal performance are including the thermal resistance between the resistive layer and a possible auxiliary radiator, on which the resistance is fixed, is reduced.
  • the steel sole increases the heat dissipation and improve mechanical strength resistance.
  • the resistance assembly is simplified due to the continuous use of the screen printing to apply one or more coats insulating materials made of dielectric material as well as the layers in resistive and conductive material.
  • the insulating layer in contact with the sole of the substrate made of a material dielectric having a coefficient of expansion thermal substantially equal to the coefficient of expansion thermal of the steel of the sole.
  • the adequacy of the expansion coefficients steel constituting the sole and the layer insulation in contact with the sole prevents cracks or separation of the insulating layers screen printed on the sole.
  • the steel of the sole comprises at least 17% by weight of titanium.
  • the titanium content of the steel allows improve the adhesion of the dielectric material screen printed on the sole.
  • a high resistance dissipation comprises an insulating housing 1, fixed on a sole 10, 20, fixing lugs not shown being provided for fixing the resistance, by example by screwing, on an auxiliary radiator.
  • Connection pads 2 two in number allow the resistance to be linked to a source of Electric power.
  • Electric current is transmitted by a rod conductive 4, fixed for example by means of solder 5, on a conductive element 6, generally made of an alloy silver and palladium.
  • This conductive element 6 is in contact with the layer of resistive material 24 and makes it possible to supply the latter in electric current.
  • the multilayer structure of the resistance successively comprises this layer of material resistive 24, in contact with the substrate, a layer of glue 25, an alumina plate 26, a second layer glue 27 and a block of conductive material 28 such as copper.
  • the alumina plate 26 on which is stuck the block of thermal conductive material 28, with high heat capacity constitutes a whole forming thermal tank.
  • the substrate comprises a sole made of steel 20 and at least one insulating layer 21, 22, 23 dielectric material applied by screen printing on the steel sole 20 and disposed between the sole 20 and the previously described multilayer structure.
  • the substrate comprises at least two insulating layers 21, 22, 23 superimposed in dielectric material.
  • the substrate comprises three insulating layers 21, 22, 23.
  • the insulating layer 21 in contact with the sole 20 of the substrate is made of a dielectric material having a coefficient of thermal expansion substantially equal to the coefficient of thermal expansion steel of sole 20 in order to avoid any detachment or crack of this insulating layer 21.
  • the characteristics of the dielectric material used to make this first layer 21 are mainly determined to allow hanging of this insulating layer 21 on the steel of the sole 20.
  • the second and third layers 22 and 23 allow to realize strictly speaking a layer insulating between the steel sole 20 and the layer in resistive material 24.
  • the different superimposed insulating layers 21, 22, 23 are applied by screen printing and baked separately, before each new application screen printing.
  • a continuous insulating coating is thus obtained on one face of the sole 20.
  • the different layers 21, 22, 23 can be made of an identical dielectric material, such as that marketed by the company ESL ® under the ESL reference D - 4914, having a coefficient of expansion accorded to ferritic stainless steel.
  • the last layer 23 can also be made of a dielectric material different from previous, such as that marketed under the reference ESL D - 4913.
  • a high resistance is thus obtained dissipation, able to hold in tension until about 7000 Volt, and having an ohmic value which does not vary practically not throughout the life of the resistance.
  • the sole is made of steel ferritic stainless, comprising at least 17% by weight titanium.
  • the presence of titanium improves the attachment of the dielectric coating applied by screen printing.
  • This steel sole has an equal or greater than about 1 mm, so as to present a sufficient mechanical rigidity and good dissipation heat.
  • a steel suitable for realize the sole is marketed by the company UGINE ® under the reference UGINOX F 17 T, corresponding to the European designation X 3 Cr Ti 17.
  • Standard steels X 2 Cr Ti 12, X 2 Cr Ti Nb 18 or X 2 Cr Mo Ti 18 - 2 may also be suitable.
  • the number of insulating layers in dielectric material can be adjusted according to the thickness of each of the screen-printed layers and the insulating power of the material used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Secondary Cells (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Tires In General (AREA)
EP97403046A 1997-01-10 1997-12-15 Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren Expired - Lifetime EP0855722B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9700207 1997-01-10
FR9700207A FR2758409B1 (fr) 1997-01-10 1997-01-10 Resistance a forte dissipation de puissance et/ou d'energie

Publications (2)

Publication Number Publication Date
EP0855722A1 true EP0855722A1 (de) 1998-07-29
EP0855722B1 EP0855722B1 (de) 2002-10-16

Family

ID=9502508

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97403046A Expired - Lifetime EP0855722B1 (de) 1997-01-10 1997-12-15 Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren

Country Status (4)

Country Link
EP (1) EP0855722B1 (de)
AT (1) ATE226355T1 (de)
DE (1) DE69716398T2 (de)
FR (1) FR2758409B1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632779A (zh) * 2013-12-05 2014-03-12 蚌埠市德瑞特电阻技术有限公司 功率厚膜电阻器
US10418157B2 (en) 2015-10-30 2019-09-17 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4689270A (en) * 1984-07-20 1987-08-25 W. C. Heraeus Gmbh Composite substrate for printed circuits and printed circuit-substrate combination
US4720419A (en) * 1982-07-14 1988-01-19 United Kingdom Atomic Energy Authority Substrates for electronic devices
EP0637826A1 (de) * 1993-08-05 1995-02-08 Mcb Industrie Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4720419A (en) * 1982-07-14 1988-01-19 United Kingdom Atomic Energy Authority Substrates for electronic devices
US4689270A (en) * 1984-07-20 1987-08-25 W. C. Heraeus Gmbh Composite substrate for printed circuits and printed circuit-substrate combination
EP0637826A1 (de) * 1993-08-05 1995-02-08 Mcb Industrie Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632779A (zh) * 2013-12-05 2014-03-12 蚌埠市德瑞特电阻技术有限公司 功率厚膜电阻器
CN103632779B (zh) * 2013-12-05 2016-04-06 蚌埠市德瑞特电阻技术有限公司 功率厚膜电阻器
US10418157B2 (en) 2015-10-30 2019-09-17 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation

Also Published As

Publication number Publication date
DE69716398T2 (de) 2003-03-06
FR2758409B1 (fr) 1999-04-02
DE69716398D1 (de) 2002-11-21
EP0855722B1 (de) 2002-10-16
FR2758409A1 (fr) 1998-07-17
ATE226355T1 (de) 2002-11-15

Similar Documents

Publication Publication Date Title
JP4085536B2 (ja) 電気機器およびその製造方法並びに圧接型半導体装置
EP0424254B1 (de) Elektrischer Widerstand in Chip-Bauweise für Oberflächenbestückung und Verfahren zu seiner Herstellung
EP2217933B1 (de) Luftfahrtsonde mit integriertem heizelement
EP1757168A1 (de) Heizelement, sein herstellsverfahren, gut versehen mit so einem element, und das herstellsverfahren desgleichen
WO2010031915A1 (fr) Resonateur pour detecteur de parametre angulaire
FR2692426A1 (fr) Plaque chauffante pour récipient chauffant, notamment pour bouilloire.
EP0796499B1 (de) Anschlussklemme auf sammelschienen für lastschalter oder mehrpolige trennbare systeme
FR2573565A1 (fr) Resitance de puissance de precision ayant un coefficient thermique de resistance tres faible
FR2671428A1 (fr) Element fusible realise a partir d'une mince pellicule de fusion deposee sur un substrat.
EP2196393A1 (de) Enteisungssystem, Erstellungsverfahren und Flugzeugstruktur mit einem solchen System
FR2489066A1 (fr) Bougies incandescentes pour moteurs diesel
EP0855722B1 (de) Hoher energie- und/oder leistungsauflösender Widerstand und Herstellungsverfahren
FR2785463A1 (fr) Appareil de protection de circuit electrique a monter en surface comportant plusieurs elements ctp
FR2657196A1 (fr) Monture intermediaire de dispositif laser a semi-conducteur.
FR2718317A1 (fr) Combinaison d'éléments de construction.
FR2497434A1 (fr) Bougie de rechauffage en ceramique
CA2809401C (fr) Circuit imprime comportant au moins un composant ceramique
FR2689452A1 (fr) Tête d'impression thermique.
FR2779268A1 (fr) Bobinage electrique, transformateur et moteur electrique comportant un tel bobinage
EP0204636B1 (de) Starkstromkondensator und Verfahren zur Herstellung eines solchen Kondensators
EP0637826B1 (de) Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke
FR2696870A1 (fr) Circuit à couches comprenant au moins une résistance de puissance.
FR2631154A1 (fr) Resistance de puissance electrique
JP2963671B2 (ja) チップ抵抗器
EP0269775A1 (de) Blitzschutzanordnung mit einem durch Siebdruckverfahren hergestellten schmelzbaren Widerstand, Herstellungsverfahren und Anwendung für Bordkalkulatoren in Flugzeugen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 19981020

AKX Designation fees paid

Free format text: AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

RBV Designated contracting states (corrected)

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

17Q First examination report despatched

Effective date: 20010615

RTI1 Title (correction)

Free format text: HIGH ENERGY AND/OR POWER DISSIPATION RESISTOR AND ITS METHOD OF MANUFACTURING

RTI1 Title (correction)

Free format text: HIGH ENERGY AND/OR POWER DISSIPATION RESISTOR AND ITS METHOD OF MANUFACTURING

RTI1 Title (correction)

Free format text: HIGH ENERGY AND/OR POWER DISSIPATION RESISTOR AND ITS METHOD OF MANUFACTURING

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20021016

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20021016

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20021016

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20021016

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20021016

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20021016

REF Corresponds to:

Ref document number: 226355

Country of ref document: AT

Date of ref document: 20021115

Kind code of ref document: T

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: WILLIAM BLANC & CIE CONSEILS EN PROPRIETE INDUSTRI

Ref country code: CH

Ref legal event code: EP

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20021016

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: FRENCH

REF Corresponds to:

Ref document number: 69716398

Country of ref document: DE

Date of ref document: 20021121

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030116

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030116

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030116

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030429

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

Ref document number: 0855722E

Country of ref document: IE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20030717

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20061115

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20061207

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: LU

Payment date: 20061211

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: MC

Payment date: 20061212

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20061213

Year of fee payment: 10

Ref country code: CH

Payment date: 20061213

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20061218

Year of fee payment: 10

BERE Be: lapsed

Owner name: S.A. *VISHAY

Effective date: 20071231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071231

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20071215

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071231

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080701

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071231

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20081020

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071215

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071215