GB2608618A - Thick film heating element - Google Patents
Thick film heating element Download PDFInfo
- Publication number
- GB2608618A GB2608618A GB2109730.8A GB202109730A GB2608618A GB 2608618 A GB2608618 A GB 2608618A GB 202109730 A GB202109730 A GB 202109730A GB 2608618 A GB2608618 A GB 2608618A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fibres
- thick film
- heating element
- film heating
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 31
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 210000003298 dental enamel Anatomy 0.000 claims abstract description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 6
- 239000011153 ceramic matrix composite Substances 0.000 claims abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 5
- 229910052582 BN Inorganic materials 0.000 abstract description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 13
- 238000010304 firing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/688—Fabrication of the plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/72—Plates of sheet metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/033—Heater including particular mechanical reinforcing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/034—Heater using resistive elements made of short fibbers of conductive material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
A thick film heating element 1 comprises a substrate 2, an insulating layer 3 formed on the substrate, one or more heater tracks 5 formed on the insulating layer and one or more connection pads 4 connected to the one or more heater tracks, wherein at least one of the insulating layer, heater track, and connection pads include glass or ceramic fibres, for example as a composite material in a matrix of glass or ceramic material, such as a ceramic matrix composite (CMC) material. The heating element may further include a cover layer or a temperature sensor track including glass or ceramic fibres. Ceramics such as boron nitride or alumina may be used as fibres to add strength to the layers. The thermal conductivity of the layers may be increased by adding fibres of a ceramic with high thermal conductivity such as silicon carbide or silicon nitride. The fibres may be introduced into an enamel which is then sprayed or screen printed onto the substrate to form the insulating layer, or the enamel and fibres may be sprayed separately onto the substrate.
Description
Thick Film Heating Element Field of the Invention
[0001] The present invention relates to thick film heating elements and methods of manufacture.
Background of the Invention
[0002] Thick film heating elements generally comprise one or more heating tracks that are screen printed as an ink or paste onto an insulating substrate and fired to form tracks of high electrical resistivity. Connecting tracks or pads may be printed in a separate layer, with a different type of ink or paste, and fired to form connecting tracks and pads of low resistivity.
[0003] The insulating substrate may be of an electrically insulating material, such as ceramic, or may be metallic with an insulating surface layer. Thick film heating elements with metal substrates are typically manufactured by applying an electrical insulating layer onto a metal substrate and subsequently forming heater tracks onto the surface of the insulating layer. The insulating layer can be a glass or ceramic material applied using a screen printing technique or a more conventional vitreous enamelling process. The metal substrate is most commonly stainless steel. The firing temperature and other characteristics of the insulating materials, heater tracks and pads have to be compatible with the characteristics of the metal. In addition, a protective ceramic or glass covering layer may added. This can also be applied by spraying or by screen printing and is subsequently fired.
[0004] Further details of thick film technology are described for example in White N. (2017) Thick Films pages 707-709 & 712 in: Kasap S., Capper P. (eds) Springer Handbook of Electronic and Photonic Materials. The thick film paste may comprise an active material, a glass frit and an organic vehicle or carrier. The glass frit remains after firing and forms part of the structure of the thick film resistor. Hence, 'thick film' refers to a specific type of resistor with a characteristic structure and properties and is not merely a comparative term or a reference to a product when manufactured by a particular process.
[0005] The heater tracks and the connection pads comprise metal particles, typically silver, platinum or palladium or a mixture of two or more of these, and glass. They are applied to the insulating layer by screen printing in the form of a paste which is then dried and fired as described above [0006] Because the thick film materials consist of glass or ceramic, they have low tensile strength and care must be taken during the design and processing and use to ensure that the materials are subjected to compressive forces rather than tensile. This is typically done by choosing materials for the substrate which have coefficients of thermal expansion greater than the coefficient of thermal expansion of the thick film materials and insulating layer. The result is that as the thick film heater cools down after the firing process the thick film materials and insulating layer are subjected to compressive stresses. Sometimes the substrate is bowed, either before or after the firing processes to put the thick film materials under compressive stress. Even so a common failure mode is cracking of the insulating layer due to thermal shock.
[0007] Another issue is the connection of the heater track to the power supply. It is common practice to provide a connection pad of low resistance material at the ends of the heater track. This consists of a material similar to the heater track but with very low resistance so there is no significant heating in the connection area. The connection pad overlaps the end of the heater track to provide a good electrical connection. The connection of the pad to a power supply can be made using sprung contacts. These are typically a copper alloy and are provided with a low resistance silver face either by electroplating or by attaching a silver contact of the type typically found in a switch.
[0008] However, a cheaper and more compact connection can be made by soldering wires directly to the connection pads. The soldering process can cause failures of the heating element, for example due to the solder shrinking volumetrically on freezing. This is especially prevalent with the lead free Sn/Ag/Cu and Sn/Cu/Ni alloys. As the solder freezes and shrinks it applies stress to the connection pad which exceeds the strength of the bond between the pad and the heater track or the strength of the pad, heater track or insulating layer in the area of the connection pad.
[0009] A thick film element with a steel substrate requires an electrically insulating layer between the substrate and the heater tracks. In common with most materials which are electrical insulators, the glass or ceramic materials are poor thermal conductors. Even though the insulating layers are relatively thin, in the order of 100p.m, there can still be a significant temperature gradient through the layer, increasing the temperature of the heater tracks. The running temperature of the tracks limits the power which can be dissipated by the heater. If the thermal conductivity of the insulating layer is increased the power density or heat flux can be increased. The result is that a heating element of a given power can be made smaller or more power can be delivered by an element of a given size.
[0010] It is also desirable to be able to measure the temperature on the surface of a thick film heater. This can be done by printing a sensor with a material which has a relatively large change of resistance with temperature. Most of these materials have a negative temperature coefficient of resistance. It is also possible to use the resistance of the heater track as a sensor. The choice of materials with suitable coefficients of resistance is limited.
Statement of the Invention
[0011] Aspects of the invention are defined by the accompanying claims.
[0012] At least some embodiments of the invention involve a solution to the above problems which increase the strength of the thick film materials and insulating layer. The mechanical failure of glass and ceramics is typically by brittle fracture initiated by cracks which propagate at faults such as scratches in the material. In at least some embodiments, certain properties of the insulating layer are improved by the use of ceramic matrix composite materials (CMC's). These composite materials have ceramic fibres embedded in a ceramic matrix. The ceramic fibres increase the stress needed to propagate the cracks through the matrix, thus increasing the energy expended during crack propagation. When through-thickness cracks begin to form across the matrix, the fibres bridge the cracks without fracturing, thus increasing the tensile strength of the material. The ceramic fibre reinforcement increases the composite material's initial resistance to crack propagation and avoids abrupt brittle failure compare to a monolithic ceramic.
Brief Description of the Drawings
[0013] Specific embodiments of the present invention will now be described with reference to the accompanying drawings, in which: Figure 1 is a perspective view of a thick film heating element in an embodiment of the invention; Figure 2 is an exploded perspective view of the thick film heating element in the embodiment; and Figure 3 is a cross-section of the thick film heating element in the embodiment.
Description of Embodiments
[0014] Figures 1-3 show a thick film heating element 1 comprising a substrate 2 with an insulating layer 3 of enamel. The substrate 2 may be made of steel, such as ferritic stainless steel. In a method of manufacture of the thick film heating element 1, the insulating layer 3 is formed on the substrate 2 and connection pads 4 and one or more heating tracks 5 are formed on the insulating layer 3 using a thick film printing and firing process, for example as described above. An overglaze layer or layers (not shown) may be formed over the heating tracks 5, leaving the connection pads 4 exposed.
[0015] In the embodiment, one or more of the insulating layer 3, connection pads 4, heater tracks 5 and overglaze layer(s) include glass or ceramic fibres, for example as a composite material in a matrix of glass or ceramic material. There are a number of conventional ways of introducing a ceramic matrix to the spaces between the fibres including sintering, deposition of the matrix from a gas mixture, chemical reaction, and pyrolysis. None of these methods are compatible with the two typical methods of applying insulating layer 3 or heater tracks 5 to the substrate 2: these are spraying, such as but not limited to, electrophoretic spraying, and flame spraying and screen printing.
[0016] In one method according to an embodiment, ceramic fibres are introduced into the enamel which is sprayed or the paste which is screen printed to form the insulating layer 3 after firing. In an alternative method according to the embodiment, the enamel and ceramic fibres are sprayed separately onto the substrate 2 and are then fired to form the insulating layer [0017] The size of the fibres and the amount of fibre in the matrix and the materials of the matrix and fibres determine the properties of the composite material. The length of fibre used in CMC materials can be up to 4 or 5 mm, and in practice the fibres are at least 0.5 mm long.
The diameter can vary from 1 i_tm to 50 However the size of fibres is limited by the application construction method and thickness of the insulating layer 3 and heater tracks 5.
The size of fibres in the heater tracks or connector pads are limited by the size of the holes in the printing screen.
[0018] In the insulating layer 3 the fibres may be long enough to break through the surface of the insulating layer 3. This can cause issues when the heater tracks 5 are subsequently screen printed but they can also provide a good bond between the heater tracks S and the insulating layer 3.
[0019] The fibres may be composed of one or more of a range of materials. The insulating layer 3 consists mainly of glass and this can be strengthened using glass and/or ceramic fibres. Ceramics such as boron nitride or alumina may be used as fibres to add strength to the insulating layer 3, heater track(s) S or connection pads 4. The thermal conductivity of the insulating layer 3, heater track(s) 5 or connection pads 4 can be increased by adding fibres of a ceramic with high thermal conductivity such as silicon carbide or silicon nitride.
[0020] In a variant of the embodiment, a temperature sensor track may be deposited using thick film technology on the insulating layer alongside and separate from the heater track(s) so as to sense the temperature of the heater track(s) S. The addition of ceramic fibres with low electrical resistance provides materials with temperature coefficients of resistance which make them suitable for such temperature sensor tracks. The addition of the fibres allows the temperature coefficient of resistance to be adjusted so that the properties of the sensor match the intended application. Fibres of silicon carbide are amongst those suitable for this application.
Alternative Embodiments [0021] Alternative embodiments which may occur to the skilled person on reading the above description may nevertheless fall within the scope of the following claims.
Claims (13)
- Claims 1. A thick film heating element comprising a substrate, an insulating layer formed on the substrate, one or more heater tracks formed on the insulating layer and one or more connection pads connected to the one or more heater tracks, wherein at least one of the insulating layer, heater track or tracks, and connection pad or pads include glass or ceramic fibres.
- 2. Thick film heating element of claim 1, further comprising a cover layer formed over the heater track or tracks, the cover layer including glass or ceramic fibres.
- 3. Thick film heating element of claim 1 or claim 2, further comprising one or more temperature sensor tracks including glass or ceramic fibres.
- 4. Thick film heating element of claim 3, wherein the temperature sensor track or tracks include fibres of silicon carbide.
- 5. Thick film heating element of any preceding claim, wherein the fibres are in a matrix of a different glass or ceramic material to that of the fibres.
- 6. Thick film heating element of any one of claims 1 to 4, wherein the fibres are in a matrix of the same glass or ceramic material as that of the fibres.
- 7. Thick film heating element consisting in part of a ceramic matrix composite material including glass or ceramic fibres.
- 8. Thick film heating element of any preceding claim, where the fibres are between 0.5mm and 5mm long.
- 9. Thick film heating element of any preceding claim, where the fibres are between 1p.m and 504m in diameter.
- 10. Thick film heating element of any preceding claim, where the fibres consist of glass.
- 11. Thick film heating element of any preceding claim, where the fibres consist of a ceramic oxide, nitride or carbide or aluminium, boron or silicon.
- 12. A method of manufacturing the thick film heating element of any preceding claim, wherein the fibres are introduced into an enamel which is then sprayed or screen printed onto the substrate to form the insulating layer.
- 13. A method of manufacturing the thick film heating element of any one of claims 1 to 11, wherein an enamel and fibres are sprayed separately onto the substrate to form the insulating layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2109730.8A GB2608618A (en) | 2021-07-06 | 2021-07-06 | Thick film heating element |
| CN202221743456.3U CN217789917U (en) | 2021-07-06 | 2022-07-06 | Thick film heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2109730.8A GB2608618A (en) | 2021-07-06 | 2021-07-06 | Thick film heating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB202109730D0 GB202109730D0 (en) | 2021-08-18 |
| GB2608618A true GB2608618A (en) | 2023-01-11 |
Family
ID=77274399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2109730.8A Pending GB2608618A (en) | 2021-07-06 | 2021-07-06 | Thick film heating element |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217789917U (en) |
| GB (1) | GB2608618A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105139916A (en) * | 2015-06-30 | 2015-12-09 | 苏州洋杰电子有限公司 | Carbon powder doped molybdenum-based thick film resistance paste and preparation method thereof |
| CN106328251A (en) * | 2016-08-18 | 2017-01-11 | 陆川县华鑫电子厂 | Thick film resistor paste and preparation method thereof |
| CN112992405A (en) * | 2021-04-27 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | High-pressure-resistant and bending-resistant stainless steel substrate insulating medium slurry |
-
2021
- 2021-07-06 GB GB2109730.8A patent/GB2608618A/en active Pending
-
2022
- 2022-07-06 CN CN202221743456.3U patent/CN217789917U/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105139916A (en) * | 2015-06-30 | 2015-12-09 | 苏州洋杰电子有限公司 | Carbon powder doped molybdenum-based thick film resistance paste and preparation method thereof |
| CN106328251A (en) * | 2016-08-18 | 2017-01-11 | 陆川县华鑫电子厂 | Thick film resistor paste and preparation method thereof |
| CN112992405A (en) * | 2021-04-27 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | High-pressure-resistant and bending-resistant stainless steel substrate insulating medium slurry |
Also Published As
| Publication number | Publication date |
|---|---|
| CN217789917U (en) | 2022-11-11 |
| GB202109730D0 (en) | 2021-08-18 |
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