EP0802028A3 - Vorrichtung zum Abtrennen von Wafern des Halbleiterbarrensupports und zum Lagern der individualisierten Wafer - Google Patents

Vorrichtung zum Abtrennen von Wafern des Halbleiterbarrensupports und zum Lagern der individualisierten Wafer Download PDF

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Publication number
EP0802028A3
EP0802028A3 EP97105331A EP97105331A EP0802028A3 EP 0802028 A3 EP0802028 A3 EP 0802028A3 EP 97105331 A EP97105331 A EP 97105331A EP 97105331 A EP97105331 A EP 97105331A EP 0802028 A3 EP0802028 A3 EP 0802028A3
Authority
EP
European Patent Office
Prior art keywords
wafers
stocking
storage element
slices
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97105331A
Other languages
English (en)
French (fr)
Other versions
EP0802028B1 (de
EP0802028A2 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Hauser Charles
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauser Charles filed Critical Hauser Charles
Publication of EP0802028A2 publication Critical patent/EP0802028A2/de
Publication of EP0802028A3 publication Critical patent/EP0802028A3/de
Application granted granted Critical
Publication of EP0802028B1 publication Critical patent/EP0802028B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP19970105331 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente Expired - Lifetime EP0802028B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH95696A CH691169A5 (fr) 1996-04-16 1996-04-16 Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
CH95696 1996-04-16
CH956/96 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802028A2 EP0802028A2 (de) 1997-10-22
EP0802028A3 true EP0802028A3 (de) 1998-04-08
EP0802028B1 EP0802028B1 (de) 2003-05-21

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970105331 Expired - Lifetime EP0802028B1 (de) 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente

Country Status (4)

Country Link
EP (1) EP0802028B1 (de)
JP (1) JPH1070095A (de)
CH (1) CH691169A5 (de)
DE (1) DE69722071T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102005053410B4 (de) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102009060575B9 (de) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
CN111452237A (zh) * 2020-05-13 2020-07-28 张家港市超声电气有限公司 晶拖脱胶装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (fr) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Procédé et appareil pour le découpage des baguettes en bois utilisées comme trame dans les nattes et analogues
JPS61125767A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPH0639831A (ja) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd スライシングマシンにおけるウエハーの収納装置
JPH07205140A (ja) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd ワイヤーソーのウェーハ取出方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (fr) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Procédé et appareil pour le découpage des baguettes en bois utilisées comme trame dans les nattes et analogues
JPS61125767A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPH0639831A (ja) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd スライシングマシンにおけるウエハーの収納装置
JPH07205140A (ja) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd ワイヤーソーのウェーハ取出方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 258 (M - 1606) 17 May 1994 (1994-05-17) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 011 26 December 1995 (1995-12-26) *

Also Published As

Publication number Publication date
JPH1070095A (ja) 1998-03-10
EP0802028B1 (de) 2003-05-21
DE69722071D1 (de) 2003-06-26
CH691169A5 (fr) 2001-05-15
EP0802028A2 (de) 1997-10-22
DE69722071T2 (de) 2004-03-18

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