EP0802028A2 - Vorrichtung zum Abtrennen von Wafern des Halbleiterbarrensupports und zum Lagern der individualisierten Wafer - Google Patents

Vorrichtung zum Abtrennen von Wafern des Halbleiterbarrensupports und zum Lagern der individualisierten Wafer Download PDF

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Publication number
EP0802028A2
EP0802028A2 EP97105331A EP97105331A EP0802028A2 EP 0802028 A2 EP0802028 A2 EP 0802028A2 EP 97105331 A EP97105331 A EP 97105331A EP 97105331 A EP97105331 A EP 97105331A EP 0802028 A2 EP0802028 A2 EP 0802028A2
Authority
EP
European Patent Office
Prior art keywords
slices
heel
cutting
cutting tool
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97105331A
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English (en)
French (fr)
Other versions
EP0802028B1 (de
EP0802028A3 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0802028A2 publication Critical patent/EP0802028A2/de
Publication of EP0802028A3 publication Critical patent/EP0802028A3/de
Application granted granted Critical
Publication of EP0802028B1 publication Critical patent/EP0802028B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the present invention relates to a device for the storage element of slices of a sawn block attached by a heel to a cutting support.
  • the block to be cut is generally mounted glued on a plate intended for a single use, if possible a material having similar characteristics of the material to be cut.
  • This plate is mechanically mounted on a second cutting support which serves as a link with the cutting machine.
  • the block of material will be cut completely and the cutting tool will open into the single use plate.
  • the block will be in the form of a set of parallel slices separated from each other by the saw cut, but attached to their base by a partially cut heel and forming part of the single use plate always mounted on a cutting support. It will then be necessary to separate the slices from the single use plate.
  • the object of the present invention is to remedy the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged so as to cut said heel and a displacement member capable of producing a relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a mechanism for recovery arranged to take each detached slice and place it in an empty box of the storage element.
  • the storage element operation is facilitated and made faster, reliable and streamlined.
  • Slices even of very small thickness, can be processed easily and without risk of being damaged.
  • the operating device slice by slice is better suited and offers better performance, increased productivity and higher reliability.
  • the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged so as to cut said heel or the plate. single use in a direction substantially perpendicular to the edges to separate them one by one from the heel.
  • the recovery mechanism comprises a conveyor belt intended to transfer the separated slices from the heel to the storage element.
  • the device comprises an installation having one or more nozzles intended to inject a pressurized fluid to facilitate detachment of the released wafer.
  • the device for placing cassettes in slices attached by a heel to a cutting support therefore comprises a table on which the cutting support is fixed with its cut block and glued to the single-use plate, of a mechanism cutting allowing the cutting of the slice heel by slice constituted by a cutting tool, of a relative displacement element of the set of slices allowing to present them one by one to the cutting tool, of a recovery element slices and a conveyor system for subsequent storage.
  • Slice by slice cutting can be done either by moving the block, the cutting tool being fixed, or by advancing the tool, the block then being fixed. However, it may happen that both movements are necessary.
  • Figure 1 is a side view of this embodiment.
  • Figure 2 is a partial perspective view of a variant.
  • FIG. 3 is a partial enlarged view of part of FIG. 1.
  • FIG. 1 schematically illustrates the principle of application of the present invention.
  • the section 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water.
  • the storage element 11 will receive the wafer in one of its empty boxes 12, then moves along the column 13 thanks to the motor 14 in a direction substantially perpendicular to the plane of the ramp 10.
  • the single-use plate 4 is advantageously made of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is moreover partially sawn off by the wires or the blades during slice formation. The separation of the edges 2 of the heel 3 by the cutting tool 7 therefore takes place at the level of the single-use plate 4 in a direction perpendicular to the edges 2.
  • FIG. 2 more particularly illustrates a cutting solution by a band saw 15 driven by the wheels 16.
  • the cut edge 2 is separated here by a jet of liquid coming from the nozzle 17.
  • FIG. 3 shows more particularly the block 1 with its edges 2 supported by their heel 3 partially sawn in the single use plate 4 fixed on the cutting support 5.
  • the cutting tool 7 could for example be constituted by a mechanical cutting tool, such as a milling cutter, a disc saw, a wire, a band or a band saw, or any other cutting system, for example thermal such as laser, plasma, blowtorch, etc., or even an attack or dissolution liquid pressure system chemical.
  • a mechanical cutting tool such as a milling cutter, a disc saw, a wire, a band or a band saw, or any other cutting system, for example thermal such as laser, plasma, blowtorch, etc., or even an attack or dissolution liquid pressure system chemical.
  • the device according to the invention is advantageously used in the case of a block of axial symmetry such as, for example, single crystals of silicon or of semiconductor materials of large production. Any block of material cut by wire saws or multi-blades can however be treated by the device object of the present invention.
  • the embodiments described above are in no way limiting and that they can receive any desirable modifications inside the frame as defined by claim 1.
  • the cutting tool 7 could be arranged to move perpendicularly to the slices 2 relative to the block 1 which would be stationary.
  • the nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a pressurized fluid to facilitate the detachment of the last released section.
  • the device could have a tank containing a liquid, for example water, in which all or part of the device is immersed to prevent drying of the wafers 2 during the procedure.
  • the conveyor belt 9 could be replaced by any other means of transport.
  • the ramp 10 could be devoid of a water cushion or even be eliminated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP19970105331 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente Expired - Lifetime EP0802028B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH95696A CH691169A5 (fr) 1996-04-16 1996-04-16 Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
CH95696 1996-04-16
CH956/96 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802028A2 true EP0802028A2 (de) 1997-10-22
EP0802028A3 EP0802028A3 (de) 1998-04-08
EP0802028B1 EP0802028B1 (de) 2003-05-21

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970105331 Expired - Lifetime EP0802028B1 (de) 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente

Country Status (4)

Country Link
EP (1) EP0802028B1 (de)
JP (1) JPH1070095A (de)
CH (1) CH691169A5 (de)
DE (1) DE69722071T2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671A1 (de) * 1999-01-11 2000-07-20 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
WO2007054525A1 (de) 2005-11-09 2007-05-18 Wolfgang Coenen Verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften
DE102005053410B4 (de) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
CN111452237A (zh) * 2020-05-13 2020-07-28 张家港市超声电气有限公司 晶拖脱胶装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102009060575B9 (de) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (fr) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Procédé et appareil pour le découpage des baguettes en bois utilisées comme trame dans les nattes et analogues
JPS61125767A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPH0639831A (ja) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd スライシングマシンにおけるウエハーの収納装置
JPH07205140A (ja) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd ワイヤーソーのウェーハ取出方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671A1 (de) * 1999-01-11 2000-07-20 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
WO2007054525A1 (de) 2005-11-09 2007-05-18 Wolfgang Coenen Verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften
DE102005053410B4 (de) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE202006020827U1 (de) 2005-11-09 2010-08-26 Coenen, Wolfgang, Dipl.-Ing. Vorrichtung zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
CN111452237A (zh) * 2020-05-13 2020-07-28 张家港市超声电气有限公司 晶拖脱胶装置

Also Published As

Publication number Publication date
JPH1070095A (ja) 1998-03-10
EP0802028B1 (de) 2003-05-21
DE69722071D1 (de) 2003-06-26
CH691169A5 (fr) 2001-05-15
DE69722071T2 (de) 2004-03-18
EP0802028A3 (de) 1998-04-08

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