EP0802028A2 - Device for detaching wafers from ingot support and stocking individualized wafers - Google Patents

Device for detaching wafers from ingot support and stocking individualized wafers Download PDF

Info

Publication number
EP0802028A2
EP0802028A2 EP97105331A EP97105331A EP0802028A2 EP 0802028 A2 EP0802028 A2 EP 0802028A2 EP 97105331 A EP97105331 A EP 97105331A EP 97105331 A EP97105331 A EP 97105331A EP 0802028 A2 EP0802028 A2 EP 0802028A2
Authority
EP
European Patent Office
Prior art keywords
slices
heel
cutting
cutting tool
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97105331A
Other languages
German (de)
French (fr)
Other versions
EP0802028A3 (en
EP0802028B1 (en
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HAUSER CHARLES HCT SHAPING SYSTEMS SA
Hauser Charles
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAUSER CHARLES HCT SHAPING SYSTEMS SA, Hauser Charles filed Critical HAUSER CHARLES HCT SHAPING SYSTEMS SA
Publication of EP0802028A2 publication Critical patent/EP0802028A2/en
Publication of EP0802028A3 publication Critical patent/EP0802028A3/en
Application granted granted Critical
Publication of EP0802028B1 publication Critical patent/EP0802028B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the present invention relates to a device for the storage element of slices of a sawn block attached by a heel to a cutting support.
  • the block to be cut is generally mounted glued on a plate intended for a single use, if possible a material having similar characteristics of the material to be cut.
  • This plate is mechanically mounted on a second cutting support which serves as a link with the cutting machine.
  • the block of material will be cut completely and the cutting tool will open into the single use plate.
  • the block will be in the form of a set of parallel slices separated from each other by the saw cut, but attached to their base by a partially cut heel and forming part of the single use plate always mounted on a cutting support. It will then be necessary to separate the slices from the single use plate.
  • the object of the present invention is to remedy the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged so as to cut said heel and a displacement member capable of producing a relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a mechanism for recovery arranged to take each detached slice and place it in an empty box of the storage element.
  • the storage element operation is facilitated and made faster, reliable and streamlined.
  • Slices even of very small thickness, can be processed easily and without risk of being damaged.
  • the operating device slice by slice is better suited and offers better performance, increased productivity and higher reliability.
  • the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged so as to cut said heel or the plate. single use in a direction substantially perpendicular to the edges to separate them one by one from the heel.
  • the recovery mechanism comprises a conveyor belt intended to transfer the separated slices from the heel to the storage element.
  • the device comprises an installation having one or more nozzles intended to inject a pressurized fluid to facilitate detachment of the released wafer.
  • the device for placing cassettes in slices attached by a heel to a cutting support therefore comprises a table on which the cutting support is fixed with its cut block and glued to the single-use plate, of a mechanism cutting allowing the cutting of the slice heel by slice constituted by a cutting tool, of a relative displacement element of the set of slices allowing to present them one by one to the cutting tool, of a recovery element slices and a conveyor system for subsequent storage.
  • Slice by slice cutting can be done either by moving the block, the cutting tool being fixed, or by advancing the tool, the block then being fixed. However, it may happen that both movements are necessary.
  • Figure 1 is a side view of this embodiment.
  • Figure 2 is a partial perspective view of a variant.
  • FIG. 3 is a partial enlarged view of part of FIG. 1.
  • FIG. 1 schematically illustrates the principle of application of the present invention.
  • the section 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water.
  • the storage element 11 will receive the wafer in one of its empty boxes 12, then moves along the column 13 thanks to the motor 14 in a direction substantially perpendicular to the plane of the ramp 10.
  • the single-use plate 4 is advantageously made of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is moreover partially sawn off by the wires or the blades during slice formation. The separation of the edges 2 of the heel 3 by the cutting tool 7 therefore takes place at the level of the single-use plate 4 in a direction perpendicular to the edges 2.
  • FIG. 2 more particularly illustrates a cutting solution by a band saw 15 driven by the wheels 16.
  • the cut edge 2 is separated here by a jet of liquid coming from the nozzle 17.
  • FIG. 3 shows more particularly the block 1 with its edges 2 supported by their heel 3 partially sawn in the single use plate 4 fixed on the cutting support 5.
  • the cutting tool 7 could for example be constituted by a mechanical cutting tool, such as a milling cutter, a disc saw, a wire, a band or a band saw, or any other cutting system, for example thermal such as laser, plasma, blowtorch, etc., or even an attack or dissolution liquid pressure system chemical.
  • a mechanical cutting tool such as a milling cutter, a disc saw, a wire, a band or a band saw, or any other cutting system, for example thermal such as laser, plasma, blowtorch, etc., or even an attack or dissolution liquid pressure system chemical.
  • the device according to the invention is advantageously used in the case of a block of axial symmetry such as, for example, single crystals of silicon or of semiconductor materials of large production. Any block of material cut by wire saws or multi-blades can however be treated by the device object of the present invention.
  • the embodiments described above are in no way limiting and that they can receive any desirable modifications inside the frame as defined by claim 1.
  • the cutting tool 7 could be arranged to move perpendicularly to the slices 2 relative to the block 1 which would be stationary.
  • the nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a pressurized fluid to facilitate the detachment of the last released section.
  • the device could have a tank containing a liquid, for example water, in which all or part of the device is immersed to prevent drying of the wafers 2 during the procedure.
  • the conveyor belt 9 could be replaced by any other means of transport.
  • the ramp 10 could be devoid of a water cushion or even be eliminated.

Abstract

The method involves placing the wafers (2) of a cut block (1) attached b a heel section (3) to s cutting support (4,5). A cutting station (6-8) has a cutter (7,15) to cut the heel and a drive (6) moves the wafers with respect to the cutter to present the wafers individually to a cutter to detach the wafers one by one from the heel sections. A collector (9,10) collects each detached wafer and places it in an empty case of the cassette. There can be a support plate (4) on which the cut block is placed and which is mounted on the cutter base.

Description

La présente invention concerne un dispositif pour la mise en élément de stockage de tranches d'un bloc scié attachées par un talon à un support de découpage.The present invention relates to a device for the storage element of slices of a sawn block attached by a heel to a cutting support.

Lors du sciage de matériaux sous forme de blocs par des dispositifs de sciage à outils multiples, par exemple multi-lames ou multi-fils, le bloc à découper est généralement monté collé sur une plaque destinée à une utilisation unique, si possible un matériau ayant des caractéristiques approchantes du matériau à découper. Cette plaque est montée de manière mécanique sur un deuxième support de découpage qui lui sert de liaison avec la machine de découpage. Le bloc de matériau sera découpé complètement et l'outil de découpe débouchera dans la plaque d'utilisation unique. Une fois la découpe terminée le bloc se présentera sous la forme d'un ensemble de tranches parallèles séparées les unes des autres par le trait de scie, mais attachées à leur base par un talon partiellement découpé et faisant partie de la plaque d'utilisation unique toujours montée sur un support de découpage. Il faudra alors séparer les tranches de la plaque d'utilisation unique. En général, l'utilisation des tranches ainsi obtenues nécessite de les garder séparées et de les mettre dans des éléments de stockage souvent appelés cassettes en vue de traitements subséquents tels que par exemple un lavage, un polissage ou simplement l'enlèvement des restes de colle. La mise en élément de stockage manuelle est longue et fastidieuse avec en plus des risques de casse non négligeables.When sawing materials in the form of blocks by sawing devices with multiple tools, for example multi-blade or multi-wire, the block to be cut is generally mounted glued on a plate intended for a single use, if possible a material having similar characteristics of the material to be cut. This plate is mechanically mounted on a second cutting support which serves as a link with the cutting machine. The block of material will be cut completely and the cutting tool will open into the single use plate. Once the cut is complete the block will be in the form of a set of parallel slices separated from each other by the saw cut, but attached to their base by a partially cut heel and forming part of the single use plate always mounted on a cutting support. It will then be necessary to separate the slices from the single use plate. In general, the use of the slices thus obtained requires to keep them separate and to put them in storage elements often called cassettes for subsequent treatments such as for example washing, polishing or simply removing the adhesive residues. . The setting up manual storage is long and tedious, with the added risk of breakage.

Il existe des dispositifs de mise en éléments de stockage, mais ces derniers travaillent en paquet, c'est-à-dire toutes les tranches sont d'abord détachées puis reprises par un robot et mises dans l'élément de stockage. Cette technique présente le désavantage que les tranches adhérent les unes aux autres par capillarité, ce qui dans le cas de tranches très fines est une source de déchets. De plus, cela nécessite quelques opérations supplémentaires, telles que la reprise du paquet de tranches après décollage et sa mise en position pour reprise par le robot.There are devices for putting in storage elements, but these work in a package, that is to say all the slices are first detached then taken up by a robot and put in the storage element. This technique has the disadvantage that the slices adhere to each other by capillary action, which in the case of very thin slices is a source of waste. In addition, this requires some additional operations, such as the recovery of the package of wafers after takeoff and its positioning for recovery by the robot.

Le but de la présente invention consiste à remédier aux inconvénients précités et le dispositif selon l'invention est caractérisé, a cet effet, par le fait qu'il comprend un mécanisme de découpe comportant un outil de découpe agencé de façon à découper ledit talon et un organe de déplacement susceptible de produire un déplacement relatif entre l'ensemble des tranches et l'outil de découpe pour présenter les tranches une a une à l'outil de découpe et pour détacher les tranches une à une du talon, et un mécanisme de récupération agencé de façon à reprendre chaque tranche détachée et à la placer dans une case vide de l'élément de stockage.The object of the present invention is to remedy the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged so as to cut said heel and a displacement member capable of producing a relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a mechanism for recovery arranged to take each detached slice and place it in an empty box of the storage element.

Par ces caractéristiques, l'opération de mise en élément de stockage est facilitée et rendue plus rapide, fiable et rationalisée. Les tranches, même d'épaisseur très réduite, peuvent être traitées aisément et sans risque d'être endommagées. Le dispositif à fonctionnement tranche par tranche est mieux adapté et offre un meilleur rendement, une productivité accrue et une fiabilité supérieure.By these characteristics, the storage element operation is facilitated and made faster, reliable and streamlined. Slices, even of very small thickness, can be processed easily and without risk of being damaged. The operating device slice by slice is better suited and offers better performance, increased productivity and higher reliability.

Selon un mode d'exécution préféré, le dispositif comprend une plaque d'utilisation unique sur laquelle le bloc est fixé et qui est monté sur le support de découpage et le mécanisme de découpe est agencé de façon à découper ledit talon ou la plaque d'utilisation unique suivant une direction sensiblement perpendiculaire aux tranches pour les séparer une à une du talon.According to a preferred embodiment, the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged so as to cut said heel or the plate. single use in a direction substantially perpendicular to the edges to separate them one by one from the heel.

Par ces caractéristiques, on obtient un détachement par découpe précis, rapide et fiable des tranches.By these characteristics, a detachment by precise, rapid and reliable cutting of the slices is obtained.

Avantageusement, le mécanisme de récupération comprend une bande transporteuse destinée à transférer les tranches séparées du talon vers l'élément de stockage.Advantageously, the recovery mechanism comprises a conveyor belt intended to transfer the separated slices from the heel to the storage element.

Le transport individuel et la mise en élément de stockage sont ainsi particulièrement bien adaptés et exécutés de manière continue et fiable.Individual transport and storage are thus particularly well suited and performed continuously and reliably.

Selon une variante avantageuse, le dispositif comprend une installation présentant une ou plusieurs buses destinées à injecter un fluide sous pression pour faciliter le détachement de la tranche libérée.According to an advantageous variant, the device comprises an installation having one or more nozzles intended to inject a pressurized fluid to facilitate detachment of the released wafer.

Un risque de collage de la tranche supérieure en voie de séparation est ainsi évité de façon active, contribuant à la sécurité générale du dispositif.A risk of sticking of the upper section in the process of separation is thus actively avoided, contributing to the general safety of the device.

Le dispositif pour la mise en cassette de tranches attachées par un talon à un support découpage, objet de la présente invention, comprend donc une table sur laquelle est fixé le support de découpe avec son bloc découpé et collé sur la plaque d'utilisation unique, d'un mécanisme de découpe permettant la découpe du talon tranche par tranche constitué par un outil de découpe, d'un élément de déplacement relatif de l'ensemble des tranches permettant de les présenter une à une à l'outil de découpe, d'un élément de récupération des tranches et d'un système transporteur pour la mise en élément de stockage subséquente. La découpe tranche par tranche peut se faire soit par le déplacement du bloc, l'outil de découpe étant fixe, soit par l'avance de l'outil, le bloc étant alors fixe. Il peut toutefois arriver que les deux mouvements s'avèrent nécessaires.The device for placing cassettes in slices attached by a heel to a cutting support, object of the present invention, therefore comprises a table on which the cutting support is fixed with its cut block and glued to the single-use plate, of a mechanism cutting allowing the cutting of the slice heel by slice constituted by a cutting tool, of a relative displacement element of the set of slices allowing to present them one by one to the cutting tool, of a recovery element slices and a conveyor system for subsequent storage. Slice by slice cutting can be done either by moving the block, the cutting tool being fixed, or by advancing the tool, the block then being fixed. However, it may happen that both movements are necessary.

D'autres particularités et avantages ressortent des caractéristiques exprimées dans les revendications dépendantes et de la description exposant ci-après l'invention plus en détail à l'aide de dessins qui représentent schématiquement et à titre d'exemple un mode d'exécution et une variante.Other features and advantages emerge from the characteristics expressed in the dependent claims and from the description setting out the invention below in more detail with the aid of drawings which schematically represent by way of example an embodiment and a variant.

La figure 1 est une vue latérale de ce mode d'exécution.Figure 1 is a side view of this embodiment.

La figure 2 est une vue partielle en perspective d'une variante.Figure 2 is a partial perspective view of a variant.

La figure 3 est une vue partielle agrandie d'une partie de la figure 1.FIG. 3 is a partial enlarged view of part of FIG. 1.

La figure 1 illustre schématiquement le principe d'application de la présente invention. Le bloc 1 découpé en tranches 2 retenues par leur talon 3 sur la plaque d'utilisation unique 4, elle-même fixée sur le support de découpage 5, se déplace grâce à un moteur d'avance 6 contre l'outil de découpe 7 entraîné par le moteur 8. La tranche 2 tombe sur la bande transporteuse 9 qui va la déposer dans une rampe 10 sur un coussin d'eau. L'élément de stockage 11 va recevoir la tranche dans l'une de ses cases vides 12, puis se déplace le long de la colonne 13 grâce au moteur 14 suivant une direction sensiblement perpendiculaire au plan de la rampe 10.Figure 1 schematically illustrates the principle of application of the present invention. The block 1 cut into slices 2 retained by their heel 3 on the single use plate 4, itself fixed on the cutting support 5, moves thanks to a feed motor 6 against the cutting tool 7 driven by the motor 8. The section 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water. The storage element 11 will receive the wafer in one of its empty boxes 12, then moves along the column 13 thanks to the motor 14 in a direction substantially perpendicular to the plane of the ramp 10.

Il est à noter que la plaque d'utilisation unique 4 est avantageusement constituée par un matériau dont les propriétés physiques et/ou chimiques sont proches de celles du bloc 1. Cette plaque 4 est par ailleurs partiellement sciée par les fils ou les lames lors de la formation des tranches. La séparation des tranches 2 du talon 3 par l'outil de découpe 7 s'effectue donc au niveau de la plaque d'utilisation unique 4 suivant une direction perpendiculaire aux tranches 2.It should be noted that the single-use plate 4 is advantageously made of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is moreover partially sawn off by the wires or the blades during slice formation. The separation of the edges 2 of the heel 3 by the cutting tool 7 therefore takes place at the level of the single-use plate 4 in a direction perpendicular to the edges 2.

La figure 2 illustre plus particulièrement une solution de découpe par une scie à bande 15 entraînée par les roues 16. La tranche découpée 2 est séparée ici par un jet de liquide provenant de la buse 17.FIG. 2 more particularly illustrates a cutting solution by a band saw 15 driven by the wheels 16. The cut edge 2 is separated here by a jet of liquid coming from the nozzle 17.

La figure 3 montre plus particulièrement le bloc 1 avec ses tranches 2 supportées par leur talon 3 partiellement scié dans la plaque d'utilisation unique 4 fixée sur le support de découpage 5.FIG. 3 shows more particularly the block 1 with its edges 2 supported by their heel 3 partially sawn in the single use plate 4 fixed on the cutting support 5.

Naturellement, d'autres dispositifs de découpe peuvent être envisagés. L'outil de découpe 7 pourrait par exemple être constitué par un outil de découpe mécanique, tel qu'une fraise, une scie à disque, à fil, à bande ou à ruban, ou tout autre système de découpe, par exemple thermique tel que laser, plasma, chalumeau, etc., voire un système à pression de liquide à attaque ou à dissolution chimique.Naturally, other cutting devices can be envisaged. The cutting tool 7 could for example be constituted by a mechanical cutting tool, such as a milling cutter, a disc saw, a wire, a band or a band saw, or any other cutting system, for example thermal such as laser, plasma, blowtorch, etc., or even an attack or dissolution liquid pressure system chemical.

Le dispositif selon l'invention est avantageusement utilisé dans le cas de bloc de symétrie axiale comme par exemple des monocristaux de silicium ou de matériaux semi-conducteurs de grande production. Tout bloc de matière découpé par des scies à fils ou multi-lames peut cependant être traité par le dispositif objet de la présente invention.The device according to the invention is advantageously used in the case of a block of axial symmetry such as, for example, single crystals of silicon or of semiconductor materials of large production. Any block of material cut by wire saws or multi-blades can however be treated by the device object of the present invention.

Il est bien entendu que les modes de réalisation décrits ci-dessus ne présentent aucun caractère limitatif et qu'ils peuvent recevoir toutes modifications désirables à l'intérieur du cadre tel que défini par la revendication 1. En particulier, l'outil de découpe 7 pourrait être agencé de façon à se déplacer perpendiculairement aux tranches 2 par rapport au bloc 1 qui serait stationnaire. La buse 17 pourrait être remplacée par une installation comportant plusieurs buses destinées à injecter un fluide sous pression pour faciliter le détachement de la dernière tranche libérée. Le dispositif pourrait présenter une cuve contenant un liquide, par exemple de l'eau, dans lequel tout ou partie du dispositif est immergé pour prévenir le séchage des tranches 2 en cours de procédure. La bande transporteuse 9 pourrait être remplacée par tout autre moyen de transport. La rampe 10 pourrait être dépourvue de coussin d'eau ou même être supprimée.It is understood that the embodiments described above are in no way limiting and that they can receive any desirable modifications inside the frame as defined by claim 1. In particular, the cutting tool 7 could be arranged to move perpendicularly to the slices 2 relative to the block 1 which would be stationary. The nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a pressurized fluid to facilitate the detachment of the last released section. The device could have a tank containing a liquid, for example water, in which all or part of the device is immersed to prevent drying of the wafers 2 during the procedure. The conveyor belt 9 could be replaced by any other means of transport. The ramp 10 could be devoid of a water cushion or even be eliminated.

Claims (9)

Dispositif pour la mise en élément de stockage (11) de tranches (2) d'un bloc scié (1) attachées par un talon (3) à un support de découpage (4,5), caractérisé par le fait qu'il comprend un mécanisme de découpe (6,7,8) comportant un outil de découpe (7,15) agencé de façon à découper ledit talon (3) et un organe de déplacement (6) susceptible de produire un déplacement relatif entre l'ensemble des tranches (2) et l'outil de découpe (7,15) pour présenter les tranches (2) une à une à l'outil de découpe et pour détacher les tranches une à une du talon (3), et un mécanisme de récupération (9,10) agencé de façon à reprendre chaque tranche détachée (2) et à la placer dans une case vide de l'élément de stockage (11).Device for placing in storage element (11) slices (2) of a sawn block (1) attached by a heel (3) to a cutting support (4,5), characterized in that it comprises a cutting mechanism (6,7,8) comprising a cutting tool (7,15) arranged so as to cut said heel (3) and a displacement member (6) capable of producing a relative displacement between all of the slices (2) and the cutting tool (7,15) to present the slices (2) one by one to the cutting tool and to detach the slices one by one from the heel (3), and a recovery mechanism (9,10) arranged so as to take each detached slice (2) and place it in an empty box of the storage element (11). Dispositif selon la revendication 1, caractérisé par le fait qu'il comprend une plaque d'utilisation unique (4) sur laquelle le bloc (1) est fixé et qui est montée sur le support de découpage (5) et par le fait que le mécanisme de découpe (6,7,8) est agencé de façon à découper ledit talon (3) ou la plaque d'utilisation unique (4) suivant une direction sensiblement perpendiculaire aux tranches (2) pour les séparer une à une du talon.Device according to claim 1, characterized in that it comprises a single use plate (4) on which the block (1) is fixed and which is mounted on the cutting support (5) and in that the cutting mechanism (6,7,8) is arranged to cut said heel (3) or the single use plate (4) in a direction substantially perpendicular to the edges (2) to separate them one by one from the heel. Dispositif selon la revendication 1 ou 2, caractérisé par le fait que le mécanisme de découpe est agencé de façon à déplacer le support de découpage (4,5) contre l'outil de découpe (7,15) qui est stationnaire.Device according to claim 1 or 2, characterized in that the cutting mechanism is arranged so as to move the cutting support (4,5) against the cutting tool (7,15) which is stationary. Dispositif selon la revendication 1 ou 2, caractérisé par le fait que l'outil de découpe (7) est agencé de façon à se déplacer par rapport au bloc (1) perpendiculairement aux tranches (2).Device according to claim 1 or 2, characterized in that the cutting tool (7) is arranged so as to move relative to the block (1) perpendicular to the edges (2). Dispositif selon l'une des revendications précédentes, caractérisé par le fait que le mécanisme de récupération comprend une bande transporteuse (9) destinée à transférer les tranches (2) séparées du talon vers l'élément de stockage (11).Device according to one of the preceding claims, characterized in that the recovery mechanism comprises a conveyor belt (9) intended to transfer the slices (2) separated from the heel to the storage element (11). Dispositif selon l'une des revendications précédentes, caractérisé par le fait que le mécanisme de récupération comprend une rampe (10) sur laquelle les tranches (2) séparées sont susceptibles de glisser avec ou sans coussin d'eau pour être déposées dans une case de l'élément de stockage (11) qui est monté de manière déplaçable suivant une direction sensiblement perpendiculaire au plan de la rampe (10).Device according to one of the preceding claims, characterized in that the recovery mechanism comprises a ramp (10) on which the separate slices (2) are capable of sliding with or without a cushion of water to be placed in a storage bin. the storage element (11) which is movably mounted in a direction substantially perpendicular to the plane of the ramp (10). Dispositif selon la revendication 1, caractérisé par le fait que l'outil de découpe est un disque abrasif (7), une scie à bande, ruban ou fil (15), une fraise ou un organe fonctionnant selon un procédé thermique ou de fluide sous pression.Device according to claim 1, characterized in that the cutting tool is an abrasive disc (7), a band saw, ribbon or wire (15), a milling cutter or a member operating according to a thermal or fluid process under pressure. Dispositif selon la revendication 1, caractérisé par le fait qu'il comprend une installation présentant une ou plusieurs buses (17) destinées à injecter un fluide sous pression pour faciliter le détachement de la tranche (2) libérée.Device according to claim 1, characterized in that it comprises an installation having one or more nozzles (17) intended to inject a fluid under pressure to facilitate detachment of the released edge (2). Dispositif selon l'une des revendications précédentes, caractérisé par le fait qu'il comprend une cuve contenant un liquide dans lequel tout ou partie du dispositif est immergé pour prévenir le séchage de tranches (2) en cours de procédure.Device according to one of the preceding claims, characterized in that it comprises a tank containing a liquid in which all or part of the device is immersed to prevent the drying of slices (2) during the procedure.
EP19970105331 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements Expired - Lifetime EP0802028B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH956/96 1996-04-16
CH95696A CH691169A5 (en) 1996-04-16 1996-04-16 Device for storage element slices obtained by cutting a block.
CH95696 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802028A2 true EP0802028A2 (en) 1997-10-22
EP0802028A3 EP0802028A3 (en) 1998-04-08
EP0802028B1 EP0802028B1 (en) 2003-05-21

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970105331 Expired - Lifetime EP0802028B1 (en) 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements

Country Status (4)

Country Link
EP (1) EP0802028B1 (en)
JP (1) JPH1070095A (en)
CH (1) CH691169A5 (en)
DE (1) DE69722071T2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671A1 (en) * 1999-01-11 2000-07-20 Fraunhofer Ges Forschung System for separating disc-shaped substrates for wafer prodn. etc. which are fixed together in sequence on carrier
WO2007054525A1 (en) 2005-11-09 2007-05-18 Wolfgang Coenen Method for dividing up substrates in wafer form by using adhesion forces
DE102005053410B4 (en) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19950068B4 (en) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Method and device for separating and detaching substrate disks
DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
DE102005023618B3 (en) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Device for separating silicon wafers from a stack
DE102006059809B4 (en) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Device and method for separating and transporting substrates
DE102009060575B9 (en) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Method and device for separating wafers from an ingot
DE102010045098A1 (en) 2010-09-13 2012-03-15 Rena Gmbh Device and method for separating and transporting substrates
DE102011090053A1 (en) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Separation device and method for separating a metallic or ceramic blank

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (en) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Method and apparatus for cutting wooden rods used as weft in mats and the like
JPS61125767A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of taking out wafer by wire saw
JPH0639831A (en) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd Housing equipment for wafer in slicing machine
JPH07205140A (en) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd Wafer taking-out method for wire saw

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (en) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Method and apparatus for cutting wooden rods used as weft in mats and the like
JPS61125767A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of taking out wafer by wire saw
JPH0639831A (en) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd Housing equipment for wafer in slicing machine
JPH07205140A (en) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd Wafer taking-out method for wire saw

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 258 (M-1606), 17 mai 1994 & JP 06 039831 A (NIPPON SPINDLE MFG CO LTD), 15 février 1994, *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 011, 26 décembre 1995 & JP 07 205140 A (TOKYO SEIMITSU CO LTD), 8 août 1995, *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671A1 (en) * 1999-01-11 2000-07-20 Fraunhofer Ges Forschung System for separating disc-shaped substrates for wafer prodn. etc. which are fixed together in sequence on carrier
DE19900671C2 (en) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Method and device for separating disk-shaped substrates, in particular for wafer production
WO2007054525A1 (en) 2005-11-09 2007-05-18 Wolfgang Coenen Method for dividing up substrates in wafer form by using adhesion forces
DE102005053410B4 (en) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
DE202006020827U1 (en) 2005-11-09 2010-08-26 Coenen, Wolfgang, Dipl.-Ing. Device for separating disc-shaped substrates using adhesion forces

Also Published As

Publication number Publication date
EP0802028A3 (en) 1998-04-08
DE69722071T2 (en) 2004-03-18
CH691169A5 (en) 2001-05-15
EP0802028B1 (en) 2003-05-21
JPH1070095A (en) 1998-03-10
DE69722071D1 (en) 2003-06-26

Similar Documents

Publication Publication Date Title
EP0802028B1 (en) Device for emplacing slices obtained by sawing of a block in storage elements
EP1324385B1 (en) Process for transfering semiconductor thin layers from a donor wafer.
JP2016015481A (en) Wafer washing system
JPH05217971A (en) Method for rotary-sawing brittle and hard material, especially said material having diamter exceeding 200 mm, to thin wafer by using ring-shape saw and apparatus for execution of siad method
CH691038A5 (en) Wire sawing device for cutting thin slices.
EP0028988A1 (en) Process and device for separating the edges from a glass sheet bearing a closed-contour cutting line
FR2622820A1 (en) METHOD AND DEVICE FOR MANUFACTURING PELLETS HAVING AT LEAST ONE FLAT SURFACE
EP1437209A1 (en) Wire sawing device
EP0788859B1 (en) Wire sawing device
CN101267920B (en) Method for cleaving brittle materials
CH698391B1 (en) Wire sawing device.
FR2931379A1 (en) DEVICE FOR MAINTAINING A INGOT FOR CUTTING
JP2003159642A (en) Work cutting method and multi-wire saw system
US6367467B1 (en) Holding unit for semiconductor wafer sawing
FR3068276B1 (en) BONDED ABRASIVE WIRE CUTTING SUPPORT COMPRISING AN ASSEMBLY OF DIFFERENT MATERIALS
EP2613918B1 (en) Shearer chain and shearer
US6763823B1 (en) Machining method not causing any damage to major cut surfaces of cut objects
EP0234984B1 (en) Process for making a crystalline hg1-xo cdxo te ingot
BE1006484A3 (en) Method and device for cutting the ribbon with son.
EP0938958B1 (en) Cutting segment
EP0988950A1 (en) Method of sawing stone, diamond cutting segment and saw blade equipped with such segment
JP2004082283A (en) Wire saw
WO2020225127A1 (en) Sacrificial support made of biodegradable polymer material for cutting out a part with abrasive wire
EP1103360A1 (en) Sawing installation for cutting natural stone
EP0988942A1 (en) Method and apparatus for continuous cutting of profiled plastic extrudates

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HCT SHAPING SYSTEMS SA

RIN1 Information on inventor provided before grant (corrected)

Inventor name: HAUSER, CHARLES

17P Request for examination filed

Effective date: 19980724

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

17Q First examination report despatched

Effective date: 20020307

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

RTI1 Title (correction)

Free format text: DEVICE FOR EMPLACING SLICES OBTAINED BY SAWING OF A BLOCK IN STORAGE ELEMENTS

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Designated state(s): DE FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 69722071

Country of ref document: DE

Date of ref document: 20030626

Kind code of ref document: P

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20030715

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20040224

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20110324

Year of fee payment: 15

Ref country code: FR

Payment date: 20110404

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20110321

Year of fee payment: 15

Ref country code: DE

Payment date: 20110325

Year of fee payment: 15

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20120329

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20121130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 69722071

Country of ref document: DE

Effective date: 20121002

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120329

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20121002