EP0793835B1 - Carte incorporant au moins un element electronique - Google Patents

Carte incorporant au moins un element electronique Download PDF

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Publication number
EP0793835B1
EP0793835B1 EP95936569A EP95936569A EP0793835B1 EP 0793835 B1 EP0793835 B1 EP 0793835B1 EP 95936569 A EP95936569 A EP 95936569A EP 95936569 A EP95936569 A EP 95936569A EP 0793835 B1 EP0793835 B1 EP 0793835B1
Authority
EP
European Patent Office
Prior art keywords
layer
relief
binder
inner face
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95936569A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0793835A1 (fr
Inventor
François Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NID SA
Original Assignee
NID SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NID SA filed Critical NID SA
Publication of EP0793835A1 publication Critical patent/EP0793835A1/fr
Application granted granted Critical
Publication of EP0793835B1 publication Critical patent/EP0793835B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to electronic cards incorporating at least one electronic element.
  • a card according to the invention comprises an integrated circuit serving for example for the identification of persons.
  • a category of electronic cards concerned by the invention is formed by cards without external electrical contact and having a coil for electromagnetic coupling with an external device.
  • Map is understood to include any object having a substantially plane structure defining a general plane of the object and having any outline in this general plane.
  • a positioning structure having at least one main opening in which is housed the electronic element.
  • this positioning structure has on its upper and lower faces a relief ensuring a space for the binder between this structure and the outer layers, and in particular allowing a lateral flow of a surplus of binder during the formation of the map.
  • the coil and the electronic element are housed in the main opening of the positioning structure.
  • the various elements forming or associated with the electronic module incorporated in the layer solidified binder are located opposite completely flat surfaces.
  • the binder is solidified to form an intermediate layer between the outer layers.
  • a positioning structure defining at least one internal zone serving in particular for the positioning of the coil, is provided between steps I and IV of the method.
  • the binder is brought in the form of a viscous liquid. On this binder is then brought the second outer layer. Finally, using pressure means, pressure is exerted on the outer layers, and therefore on the binder, in a direction perpendicular to the working surface so as to form the binder layer in which the various expected elements.
  • the variant of the method described above is very advantageous from an economic point of view because it allows to produce large quantities of cards for a weak cost.
  • this variant is advantageous in that it does not require a heat input to melt the outer layers, thus avoiding phenomena of removal of the material and belting of the card once cooled.
  • the Applicant has observed in numerous experiments that the method described above provides satisfactory results for several particular embodiments, but that on the other hand a certain number of cards obtained by this method and having one of the structures proposed in the EP document. 0 570 784 do not have sufficiently satisfactory flatness, so that, for some embodiments, the industrial yield is relatively low.
  • the object of the present invention is to overcome the disadvantages remaining in the invention described in EP 0 570 784 by providing an electronic card having a very good flatness and no residual air in the binder layer, this card can also be obtained using an inexpensive process.
  • the Applicant has carried out a great deal of research on the cards produced according to the method described above to detect the nature of the problem causing deformations on the surface of a certain number of cards.
  • the Applicant first found that, in a number of applications, the coil occupied a relatively large area in projection in the general plane of the map.
  • the coils used in the electronic boards generally have a section of shape rectangular.
  • these coils are self-supporting, that is to say that the turns of these coils are glued to each other.
  • the coil has a specific shape and a certain rigidity.
  • the lower surface of this coil is then in abutment against the inner face of this first outer layer.
  • the binder is brought in the form of a viscous liquid and pressure is exerted on it, the binder spreads and covers the upper surface of the coil, resulting in a resulting pressure on the coil towards the surface of the coil. job.
  • the coil is thus pressed against the first outer layer and the binder does not infiltrate between the coil and this first outer layer. Therefore, the first outer layer does not adhere to the binder layer on its superimposed surface with the coil, which can cause deformations in the surface of the first outer layer after solidification of the binder and removal of the pressure exerted on this one.
  • the coil is formed of turns having a circular section.
  • the coils are formed using a winding device generally having two flanges between which the coil is formed.
  • the surfaces of the coil have a multitude of grooves, some of which may have a considerable depth.
  • This residual air can be slightly pressurized when applying a pressure on the binder used to form the binder layer, which causes deformations of the outer face of the outer layer when the application of pressure has ceased.
  • the residual air trapped between the coil and the outer layer is likely to diffuse in the card and in particular at the interface between the outer layer initially provided and the layer of binder.
  • the invention relates to a card comprising an incorporated element at least partially forming an electronic module and having a first substantially flat surface or a surface having at least one external cavity located between external projections of the electronic module, the external cavity being formed between this first surface and a geometric plane resting on these projections, a first layer of solid material and a second layer formed by a solidified binder in which is embedded said element.
  • the first layer has a first inner face to which the solidified binder adheres.
  • This map is characterized in that the first internal face has a relief provided at least within a first zone comprising the superposition surface between said first surface of said element and said first inner face, this relief defining hollow valleys. passing through said first zone.
  • the card according to the invention has at least two important advantages.
  • the relief provided on the inner face of the first layer ensures a proper evacuation of any residual air during the manufacture of the card with a viscous liquid binder provided on the various elements incorporated in this card.
  • this card allows the binder supplied as a viscous liquid to properly infiltrate between said first surface of said element incorporated in the second layer and the inner face of the first layer.
  • the entire inner face of the first layer has a relief defining hollow valleys traversing this inner face.
  • a third layer arranged so that the second layer forms an intermediate layer between the first and third layers.
  • it is intended to provide in addition to said element a positioning structure of this element inside the binder layer.
  • the card 1 essentially comprises three layers, namely a first layer 2 formed of a solid material, in particular of synthetic plastic material, a second layer 4 formed of a solidified binder 6 in which various elements are embedded, namely an electronic unit 8 housed inside a protective ring 10 and electrically connected to a coil 12 for magnetic coupling with an external communication unit not shown.
  • a positioning structure 14 for positioning the coil 12 and the electronic unit 8 inside the card.
  • the positioning structure 14 serves to define an internal zone inside the binder layer 4 for the coil 12 and the electronic unit 8.
  • the card 1 further comprises a third layer 16 formed of a solid material, for example a plastic material.
  • the binder 6 is chosen in such a way that, once solidified, it has good adhesion to the material used for the layers 2 and 16.
  • a relief 18 is provided on the internal face 20 of the first layer 2.
  • the inner face 22 of the layer 16 has a relief 24 substantially identical to the relief 18.
  • the layers 2 and 16 respectively comprise two flat outer faces 26 and 28 on which a printed pattern may be provided.
  • the positioning structure 14 has, for example, a configuration similar to any of the configurations provided in EP 0 570 784.
  • the coil 12 has a rectangular section and has a first surface 30 and a second surface 32 substantially planes and located respectively facing the internal faces 20 and 22 of the layers 2 and 16. It will be mentioned here that all of the internal faces 20 and 22 are covered respectively by the reliefs 18 and 24. Thus, in particular, the superposition area of the face 20 of the layer 2 with the surface 30 of the coil 12 has a relief.
  • the relief structure is provided in such a way that this relief has hollow valleys completely crossing said superposition zone. Two particular variants for the relief provided on the faces 20 and 22 will be described with reference to FIGS. 4 and 6.
  • step VI a pressure directed perpendicularly to the work surface 40 will be advantageously maintained.
  • the molecular structure and / or the composition of the binder 6 may vary between the liquid state in which it is supplied and the final solid state.
  • the various elements provided, in particular the coil 12 and the positioning frame 14, can not be applied against the inner face 20 so as to prevent infiltration binder 6 or to retain residual air between external projections defining external cavities, in particular on the surface 30 of the coil 12, during step V in which pressure is exerted to uniformly spread the binder 6 between the two layers 2 and 16.
  • the relief 18 having recessed valleys passing through the inner face 20, the binder can easily penetrate between the lower surfaces of the incorporated elements and the inner face 20, which thus ensures good adhesion of the various layers of the card and the evacuation of any residual air harmful for the flatness of the card.
  • the binder 6 since the binder 6 is subsequently supplied with the various elements incorporated in the layer 4, this binder 6 spreads more easily on the upper surfaces, especially the surface 32 of the coil 12, the various elements incorporated in the layer 4. This is all the more true that the amount of binder 6 provided is greater than the amount of binder finally forming the layer 4.
  • the height of one of the elements incorporated, in particular of the coil 12 is substantially equal to the predetermined height of the intermediate layer 4, and given the presence of the relief 18 on the face 20 of the layer 2 it may be that these elements rise somewhat when applying pressure and come to bear against the inner face 22 of the second outer layer 16. To avoid this, it was expected that the inner face 22 of the layer 16 also has a relief 24 similar to the relief 18.
  • the method described herein can be carried out in an environment having a certain vacuum.
  • the pressure exerted on the binder can be provided by various means, in particular a flat press, one or more rolling rolls.
  • the card 51 comprises a layer 2, identical to that of the card 1, including an inner face 20 having a relief 18.
  • the card 51 further comprises a layer 54 formed of a solidified binder 6 in which is incorporated a coil 12 connected electrically to an electronic unit 58.
  • the coil 12 and the electronic unit 58 are totally embedded in the binder 6 of the layer 54.
  • FIG. 4 shows a plan view along section line IV-IV of FIG. 3, the binder 6 not being shown to allow a partial view of the internal face 20 having the relief 18.
  • This relief 18 is formed by a set of small blocks 60 of low height.
  • the relief 18 defines hollow valleys between all of these blocks 60, these valleys crossing entirely the inner face 20 of the outer layer 2 and define multiple paths for the infiltration of the binder 6 and the evacuation of residual air during the manufacturing process of the card described above.
  • the relief 18 is a relief printed by conventional printing techniques or formed by embossing the layer 2.
  • the card 61 comprises a first outer layer 62, a second outer layer 64 and an intermediate layer 66 formed by a binder 6 solidified. Inside the layer 66 is incorporated a coil 12 and an electronic unit 8 disposed on the face 68 of a substrate 70. On this face 68 is also partially disposed the coil 12.
  • the substrate 70 serves in particular to define the position of the unit 8 relative to the coil 12 and also serves as an electrical interconnection support between this unit 8 and the coil 12.
  • the substrate 70 is located on the side of the layer 62, the plane face 72 of this substrate being located facing the inner face 74 of the layer 62 which has a relief 76 defining a set of pyramids 78 of relatively low height by ratio at the height of the layer 66. It will be mentioned that, during the manufacturing process of the card 61, the layer 62 is first brought onto the working surface. Then, the binder 6 is provided once the assembly formed by the coil 12, the unit 8 and the support 70 has been placed on the layer 62.
  • the binder 6 has not been shown so as to highlight the relief 76 and the assembly formed by the coil 12, the unit 8 and the substrate 70.
  • the relief 76 is obtained by smearing or stamping the layer 62.
  • the relief 76 defines recesses valleys traversing the inner face 74 of the layer 62. In addition, such a relief minimizes the contact surface between the incorporated elements and the inner face 74 if these incorporated elements are arranged in abutment against the relief 76 .
  • the importance of the presence of a relief is essential on the lower outer layer initially provided during the method of manufacturing a card according to the invention.
  • the presence of such a relief on the inner face of the upper layer is advantageous and ensures a perfectly flat map.
  • the many experiments carried out have shown that the relief provided on the internal face of the upper layer was not indispensable in a number of cards manufactured according to the method of the invention.
  • the embedded elements may have only a single, substantially planar surface located opposite the bottom layer.
  • the relief provided on the inner face of the lower layer plays an essential role when the elements incorporated have at least one lower surface substantially flat or having external cavities located between external projections against which a geometric plane can be pressed so as to close these cavities substantially. Then, when the incorporated elements have at least one substantially flat upper surface, it is generally advantageous to also provide a relief on the inner face of the upper outer layer. This latter relief is all the more advantageous if the element or elements having a flat upper surface have a lower height, but substantially equal to the height of the layer formed by the solidified binder in which they are incorporated.
  • the binder 6 provided in the form of a viscous liquid is preferably chosen such that it can be brought with a relatively low temperature, especially at room temperature.
  • the binder consists of a resin known to those skilled in the art. Among these resins, mention will be made of epoxy resin and two-component adhesives.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)
  • Coils Or Transformers For Communication (AREA)
EP95936569A 1994-11-25 1995-10-30 Carte incorporant au moins un element electronique Expired - Lifetime EP0793835B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9414169 1994-11-25
FR9414169A FR2727542B1 (fr) 1994-11-25 1994-11-25 Carte incorporant au moins un element electronique
PCT/EP1995/004249 WO1996017320A1 (fr) 1994-11-25 1995-10-30 Carte incorporant au moins un element electronique

Publications (2)

Publication Number Publication Date
EP0793835A1 EP0793835A1 (fr) 1997-09-10
EP0793835B1 true EP0793835B1 (fr) 2007-04-25

Family

ID=9469165

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95936569A Expired - Lifetime EP0793835B1 (fr) 1994-11-25 1995-10-30 Carte incorporant au moins un element electronique

Country Status (13)

Country Link
US (1) US6206291B1 (enrdf_load_stackoverflow)
EP (1) EP0793835B1 (enrdf_load_stackoverflow)
AT (1) ATE360861T1 (enrdf_load_stackoverflow)
AU (1) AU3845495A (enrdf_load_stackoverflow)
DE (1) DE69535481T2 (enrdf_load_stackoverflow)
DK (1) DK0793835T3 (enrdf_load_stackoverflow)
ES (1) ES2286820T3 (enrdf_load_stackoverflow)
FR (1) FR2727542B1 (enrdf_load_stackoverflow)
MY (1) MY119707A (enrdf_load_stackoverflow)
PT (1) PT793835E (enrdf_load_stackoverflow)
RU (1) RU2156499C2 (enrdf_load_stackoverflow)
TW (1) TW290668B (enrdf_load_stackoverflow)
WO (1) WO1996017320A1 (enrdf_load_stackoverflow)

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Also Published As

Publication number Publication date
MY119707A (en) 2005-07-29
EP0793835A1 (fr) 1997-09-10
PT793835E (pt) 2007-07-06
FR2727542B1 (fr) 1997-01-03
ATE360861T1 (de) 2007-05-15
ES2286820T3 (es) 2007-12-01
RU2156499C2 (ru) 2000-09-20
WO1996017320A1 (fr) 1996-06-06
US6206291B1 (en) 2001-03-27
DE69535481D1 (de) 2007-06-06
AU3845495A (en) 1996-06-19
TW290668B (enrdf_load_stackoverflow) 1996-11-11
DK0793835T3 (da) 2007-07-02
DE69535481T2 (de) 2008-01-10
FR2727542A1 (fr) 1996-05-31

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