EP0757378A1 - Process of polishing silicon wafers - Google Patents
Process of polishing silicon wafers Download PDFInfo
- Publication number
- EP0757378A1 EP0757378A1 EP96112357A EP96112357A EP0757378A1 EP 0757378 A1 EP0757378 A1 EP 0757378A1 EP 96112357 A EP96112357 A EP 96112357A EP 96112357 A EP96112357 A EP 96112357A EP 0757378 A1 EP0757378 A1 EP 0757378A1
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- European Patent Office
- Prior art keywords
- polishing
- relative speed
- wafer
- final
- pressure
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- 238000005498 polishing Methods 0.000 title claims abstract description 273
- 235000012431 wafers Nutrition 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 9
- 239000010703 silicon Substances 0.000 title claims abstract description 9
- 238000007517 polishing process Methods 0.000 claims abstract description 23
- 239000003082 abrasive agent Substances 0.000 claims abstract description 22
- 230000009467 reduction Effects 0.000 claims abstract description 20
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 230000003746 surface roughness Effects 0.000 claims description 24
- 239000006061 abrasive grain Substances 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 20
- 230000000694 effects Effects 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 230000009471 action Effects 0.000 claims description 14
- 239000008119 colloidal silica Substances 0.000 claims description 9
- 230000001965 increasing effect Effects 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 229910052729 chemical element Inorganic materials 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 230000006872 improvement Effects 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004540 process dynamic Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
Definitions
- This invention relates to a process of polishing semiconductor wafers and, more particularly, to a process of mechanochemical polishing of silicon wafers with effective control of the relative speeds of work wafer and polishing pad and the polishing pressure.
- wafers Mechanochemical polishing process which is adopted for polishing silicon wafers (hereinafter being referred to as wafers), is principally brought about by the following polishing mechanism.
- the process is brought about by using an abrasive material, which is prepared by colloidally suspending superfine particles of SiO 2 with average grain size of 100 nm or below as abrasive grain in an aqueous alkali solution having a chemical action on the wafers, and also using a soft polyester cloth, a polyurethane cloth or a non-woven fiber cloth as polishing pad.
- the process is free from rubbing of the wafer surface, and dissolution products accumulated on the wafer surface are removed with friction of the superfine particles noted above, while also chemically removing working damage on the wafer surface. In this way, mirror finished surface free from working defects can be obtained.
- the abrasive grain in the abrasive material between the wafer surface and polishing pad generates strain energy accompanying elastic deformations and also heat of friction. This has an effect of making the wafer surface to be chemically active and thus promoting dissolution based on the alkali solution. Dissolution products are thus accumulated in the vicinity of the wafer surface, and viscous solution is generated in the wafer surface vicinity.
- the superfine particles of SiO 2 as abrasive grain remove the dissolution products to maintain dissolution based on the chemically active state noted above. Described so far is the summary of the mechanism of mechanochemical polishing.
- silicon wafers are required to be greater in diameter and higher in accuracy and quality in spite of an opposite demand for increasing their production efficiency.
- the wafer surface should have less working damage and less polished surface roughness while being highly flat.
- the wafer surface is mirror finished in a polishing process comprising a plurality of steps.
- the mirror finishing of wafers is done by using the mechanochemical polishing process noted above (mechanical chemical composite polishing process).
- mechanical chemical composite polishing process As described before, in this process dynamic action of mechanical polishing and chemical action of chemical etching are combined to provide a composite effect for obtaining a high efficiency, high accuracy mirror finished surface.
- the polishing properties of the process are influenced by apportionment of mechanical and chemical elements during the polishing process.
- the action of the mechanical element is provided greatly to provide high flatness in high efficiency, and in the final stage it is reduced the action of the mechanical element to improve the surface roughness. In this way, highly accurate mirror finishing free form working damage is obtained.
- Fig. 1(A) shows a polishing apparatus for carrying out the above mechanochemical polishing.
- the apparatus comprises a rotatable polishing surface plate 13 with a polishing pad 14 applied thereto and a rotatable wafer support plate 11 for supporting a wafer 12 mounted thereon.
- the wafer 12 and the polishing pad 14 are moved at a certain relative speed with abrasive material 15 interposed between them, and the wafer 12 is thus polished by mechanochemical polishing process based on frictional motion between it on one hand and the abrasive grain 17 and polishing pad 14 under it on the other hand.
- Liquid coolant 21 is supplied to the polishing surface plate 13 and wafer support plate 11 to adjust the working temperature rise due to heat generated by the above frictional movement, thus preventing thermal deformation of the polishing surface plate 13 and the wafer support plate 11.
- a cooling air source 25 is further provided, which includes an air compressor 251, a pressure regulator 252 and a cooler 253. Compressed cooling air is supplied from the cooling air source 25 to be blown through a nozzle 201 against the polishing surface plate 13 (the blowing position being hereinafter referred to as air cooling station 20).
- Fig. 1(B) is a top view showing the polishing surface plate 13.
- a polishing station 30, in which the wafer 12 is held, and the cooling station 20 for removing working heat generated during polishing of the wafer are formed symmetrically with respect to the axis of rotation of the polishing surface plate 13, thus providing for uniform surface temperature distribution of the abrasive cloth 14 and permitting high flatness polishing.
- Fig. 4 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness, surface roughness and haze level in the prior art polishing process using the above apparatus. As shown, the process is a three-step process comprising a primary polishing step, a secondary polishing step and a final polishing step.
- the primary and secondary polishing steps are performed by using colloidal silica as the abrasive grain and non-woven fiber cloth as the polishing pad.
- the relative speed is set to 100 m/min. as reference relative speed, and the polishing pressure is set to 500 g/cm 2 .
- the flattening is substantially ended to secure a flatness of about 0.3 ⁇ m.
- the surface roughness at this time is about 1 nm.
- the secondary polishing step is performed by changing the grain size of the colloidal silica. Toward the end of the secondary polishing step, a flatness of about 0.3 ⁇ m and a surface roughness of about 0.5 nm are obtained.
- the final polishing step is performed by using the same colloidal silica abrasive material and polishing pad of suede type and by setting a reference polishing pressure of 340 g/cm 2 and a low relative speed of 40 m/min. In this step, a flatness of about 0.3 ⁇ m, a surface roughness of about 0.35 ⁇ m, and a haze level of 40 bits are obtained.
- An object of the invention is to provide a wafer polishing process comprised two polishing steps, in which it can ensure comparable quality with that of wafers finished in the prior art three-step wafer polishing process.
- the above object of the invention is attained by a process of polishing wafers, in which a silicon wafer held by a wafer surface rotated under a predetermined applied pressure is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed, the plurality of polishing steps are composed not three-step wafer polishing process but two-steps being a primary polishing step and a final polishing step, increase of the relative speed of the polishing pad and wafer and reduction of the polishing pressure being brought about at the same time or step-wise in a final stage of primary polishing step.
- the relative speed is the speed of the polishing pad relative to the wafer surface when polishing the wafer by causing relative movement of the wafer and the polishing pad each other, and it is usually represented by the distance covered in unit time.
- the primary polishing step is performed with a high polishing pressure of 300 to 700 g/cm 2 and a reference relative speed of 50 to 150 m/min., and a quick increase of the relative speed to 2 to 4 times and a quick reduction of the polishing pressure to 1/2 to 1/10 are done in the final stage of the primary polishing step.
- the final polishing step is performed with a reference polishing pressure of 100 to 400 g/cm 2 and at a reference relative speed of 50 to 150 m/min., and in a final stage of the final polishing step the relative speed is quickly reduced to 1/2 to 1/5.
- polishing mainly based on a mechanical file effect on the reference relative speed and high polishing pressure is done, and subsequently mechanical polishing and chemical polishing are suitably combined at the process after final stage.
- the ambient temperature around the wafer surface and the clearance between the abrasive material and polishing pad should be in the best situation.
- the relative speed is switched over to a higher one for enhancing chemical polishing owing to temperature rise, and also the polishing pressure is switched over to a lower one for weakening mechanical polishing.
- the higher relative speed and the lower polishing pressure are set for the purpose of generating a hydroplane phenomenon.
- the reference relative speed is reduced to provide for polishing mainly based on mechanical polishing only for a short period of time in a final stage of the step, thus preventing (or reducing) generation of haze during this period.
- the plurality of polishing steps being a primary polishing step and a final polishing step, in a final stage of flattening mainly based on a mechanical file effect provided by reference relative speed and high polishing pressure in the primary polishing step, quick increase of the relative speed for quickly providing chemical action and quick reduction of the polishing pressure for reducing mechanical effects on the wafer surface when removing dissolution products formed by the chemical action in the vicinity of the wafer surface, are done at the same time to effectively realize quick surface roughness reduction and polishing efficiency improvement and also permit reduction of the polishing process.
- the final polishing step is done by using a polishing pad of suede type having a high porosity with high abrasive grain holding property, is initially performed to effect chemical polishing for most part of it to secure a predetermined surface roughness, and in its final stage a reduced reference relative speed is set for a short period of time for mainly mechanical polishing therein to prevent (or reduce) generation of haze.
- the primary polishing step is performed by using an abrasive material containing colloidal silica as abrasive grain and a non-woven polishing pad, its most part is done with a high polishing pressure of about 500 g/cm 2 and a reference relative speed of about 100 m/min., and in its final stage quick increase of high the relative speed and quick reduction of the low polishing pressure are caused to obtain quick reduction of the surface roughness, improvement of the polishing efficiency and consequent reduction of the polishing step.
- the final polishing step is performed by using the same abrasive material containing colloidal silica as abrasive grain and a polishing pad of suede type having a high porosity with high abrasive grain holding property, and for its most part a reference polishing pressure of about 340 g/cm 2 and a reference relative speed of about 100 m/min. are set to secure the final surface roughness.
- a reduced relative speed is set for a short period of time for obtaining a balance between the mechanical action and chemical action and permitting haze-free working.
- Figs. 1(A) and 1(B) briefly show the polishing apparatus for polishing wafers in the two-step polishing process according to the invention.
- the apparatus itself is a conventional one.
- Fig. 2 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness level, surface roughness and haze level in polishing of wafer in the embodiment of the two-step polishing process according to the invention.
- a polishing pad 14 is applied to the polishing surface plate 13, and a wafer 12 is mounted on the wafer support plate 11.
- the wafer 12 and the polishing pad 14 are moved relatively at a relative speed with abrasive material 15 provided between them.
- the wafer 12 is polished by mechanical-chemical polishing with frictional movement between it and the abrasive grain 17 in the abrasive material 15 and the polishing pad 14 under it.
- Liquid coolant 21 is supplied to the polishing surface plate 13 and the wafer support plate 11 to control working temperature increase due to heat of friction generated by the above frictional movement, thus preventing thermal deformation of the polishing surface plate 13 and the wafer support plate 11.
- a cooling air source 25 is further provided.
- a polishing station 30, in which the wafer 12 is supported, and a cooling station 20 for removing working heat generated during polishing of wafer are formed on the polishing surface plate 13 in symmetrical positions with respect to the axis of rotation of the polishing surface plate 13. The surface temperature distribution over the polishing pad 14 is thus made uniform, thus permitting polishing to provide high flatness.
- the cooling air source 25 includes an air compressor 251 for supplying compressed air, a pressure regulator 252 and a cooler 253.
- the wafer polishing process according to the embodiment of the invention comprises a primary polishing step and a final polishing step.
- the primary polishing step is performed by using a non-woven polishing pad as the polishing pad 14 and also using as the abrasive material 15 a suspension of colloidal silicas in an aqueous alkali solution having chemical action on wafer for initially providing for flattening mainly based on mechanical file effect with a reference relative speed of 100 m/min. and a high polishing pressure of 500 g/cm 2 .
- the relative speed is quickly increased to 270 m/min. to provide for quick activation as composite chemical action obtained with suitable combination of mechanical polishing and chemical polishing.
- a hydroplane phenomenon produced in the wafer by the dynamic pressure effect of fluid has an effect of reducing the effects the surface roughness due to the file effect of the polishing pad 14 on.
- the final polishing step is performed by using as the polishing pad 14 one of suede type polishing pad having a high porosity with high abrasive grain holding property and as the abrasive material 15 the same one as noted above obtained by suspending colloidal silica in a weak aqueous alkali solution.
- a reference relative speed of 100 m/min. and a reference polishing pressure of 340 g/cm 2 are set, and preference is given to chemical polishing.
- the above polishing is adapted to be mirror finishing making use of chemical reaction induced by mechanical energy at the point of contact between the fine particles of SiO 2 and the wafer.
- a reduced relative speed of 40 m/min. is set for a short period of time to cause polishing based on mechanical polishing.
- generation of haze is prevented, and at the end of the final polishing step a wafer is obtained, which has a flatness about of 0.3 ⁇ m, a surface roughness of about 0.35 nm, and a haze level of about 40 bits.
- the use of the polishing pad 14 which is of suede type having a high porosity, permits flow of the abrasive material 15 containing the abrasive grain 17 in correspondence to the relative speed. Fine particles under the wafer 12 thus bring about the hydroplane phenomenon, thus holding a large clearance between the wafer and the polishing pad 14 without causing mechanical damage to the wafer as shown in Fig. 3. The clearance is not reduced but is maintained by the setting of the reduced relative speed for the short period of time noted above, thus preventing generation of haze by the abrasive grain 17.
- the high porosity suede type polishing pad used according to the invention has a porosity of 400 to 600 forms/mm 2 , which is about double the porosity of the usual suede type polishing pad, i.e., 200 to 300 forms/mm 2 .
- it is considered to have excellent capacity of holding abrasive grain, which is effective for polishing efficiency improvement.
- the average grain size of the colloidal silica grain in the abrasive materials used for the primary and final polishing steps is set to 10 to 50 nm.
- the grain size is set to be greater for the primary polishing step than for the final polishing step.
- the haze is a measure of fine surface roughness such as to cause scattering of light under a focal beam lamp, the surface roughness being measured by Particle Counter Model “LS-6030” (manufactured by Hitachi DECO) using a measurement mode called “Haze Mode”, and represented by a value obtained by proportionally converting the intensity of the scattered light to a corresponding voltage.
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Abstract
The invention concerns a process of polishing wafers, in which a silicon wafer held on a wafer support plate rotatable under a predetermined applied pressure, is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad cloth applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed. Quality comparable to that of wafers obtainable by a prior art three-step polishing process can be obtained with a two-step wafer polishing step comprising a primary polishing step and a final polishing step. The primary polishing step is performed by setting a high polishing pressure of 300 to 700 g/cm2 and a reference relative speed of 50 to 150 m/min., and quick increase of the relative speed to 2 to 4 times and quick reduction of the polishing pressure down to 1/2 to 1/10 are caused in a final stage of the primary polishing step. The final polishing step is performed by setting a reference polishing pressure of 100 to 400 g/cm2 and a reference relative speed of 50 to 150 m/min., and in its final stage the relative speed is quickly reduced to 1/2 to 1/5.
Description
- This invention relates to a process of polishing semiconductor wafers and, more particularly, to a process of mechanochemical polishing of silicon wafers with effective control of the relative speeds of work wafer and polishing pad and the polishing pressure.
- Mechanochemical polishing process which is adopted for polishing silicon wafers (hereinafter being referred to as wafers), is principally brought about by the following polishing mechanism.
- The process is brought about by using an abrasive material, which is prepared by colloidally suspending superfine particles of SiO2 with average grain size of 100 nm or below as abrasive grain in an aqueous alkali solution having a chemical action on the wafers, and also using a soft polyester cloth, a polyurethane cloth or a non-woven fiber cloth as polishing pad. The process is free from rubbing of the wafer surface, and dissolution products accumulated on the wafer surface are removed with friction of the superfine particles noted above, while also chemically removing working damage on the wafer surface. In this way, mirror finished surface free from working defects can be obtained.
- During polishing, the abrasive grain in the abrasive material between the wafer surface and polishing pad, generates strain energy accompanying elastic deformations and also heat of friction. This has an effect of making the wafer surface to be chemically active and thus promoting dissolution based on the alkali solution. Dissolution products are thus accumulated in the vicinity of the wafer surface, and viscous solution is generated in the wafer surface vicinity. The superfine particles of SiO2 as abrasive grain remove the dissolution products to maintain dissolution based on the chemically active state noted above. Described so far is the summary of the mechanism of mechanochemical polishing.
- In order to increase the efficiency of polishing by the mechanochemical polishing process, therefore, it is necessary to maintain the chemically active state, which is provided by temperature rise due to mechanical action between the wafer surface on one and the abrasive grain and polishing pad on the other hand, and also remove the dissolution products generated by the chemical activation from the wafer surface. In order to obtain a high accuracy, high quality wafer surface, on the other hand, it is necessary to remove the dissolution products from the vicinity of the wafer without having mechanically adverse effects thereon.
- Up to date, silicon wafers are required to be greater in diameter and higher in accuracy and quality in spite of an opposite demand for increasing their production efficiency. Particularly, for higher accuracy and higher quality the wafer surface should have less working damage and less polished surface roughness while being highly flat. To meet this end, the wafer surface is mirror finished in a polishing process comprising a plurality of steps.
- The mirror finishing of wafers is done by using the mechanochemical polishing process noted above (mechanical chemical composite polishing process). As described before, in this process dynamic action of mechanical polishing and chemical action of chemical etching are combined to provide a composite effect for obtaining a high efficiency, high accuracy mirror finished surface. The polishing properties of the process are influenced by apportionment of mechanical and chemical elements during the polishing process.
- Specifically, in an initial stage of the polishing process the action of the mechanical element is provided greatly to provide high flatness in high efficiency, and in the final stage it is reduced the action of the mechanical element to improve the surface roughness. In this way, highly accurate mirror finishing free form working damage is obtained.
- Fig. 1(A) shows a polishing apparatus for carrying out the above mechanochemical polishing. The apparatus comprises a rotatable
polishing surface plate 13 with apolishing pad 14 applied thereto and a rotatable wafer support plate 11 for supporting awafer 12 mounted thereon. Thewafer 12 and thepolishing pad 14 are moved at a certain relative speed withabrasive material 15 interposed between them, and thewafer 12 is thus polished by mechanochemical polishing process based on frictional motion between it on one hand and theabrasive grain 17 andpolishing pad 14 under it on the other hand. -
Liquid coolant 21 is supplied to thepolishing surface plate 13 and wafer support plate 11 to adjust the working temperature rise due to heat generated by the above frictional movement, thus preventing thermal deformation of thepolishing surface plate 13 and the wafer support plate 11. Acooling air source 25 is further provided, which includes anair compressor 251, apressure regulator 252 and acooler 253. Compressed cooling air is supplied from thecooling air source 25 to be blown through anozzle 201 against the polishing surface plate 13 (the blowing position being hereinafter referred to as air cooling station 20). - Fig. 1(B) is a top view showing the
polishing surface plate 13. As shown, apolishing station 30, in which thewafer 12 is held, and thecooling station 20 for removing working heat generated during polishing of the wafer, are formed symmetrically with respect to the axis of rotation of thepolishing surface plate 13, thus providing for uniform surface temperature distribution of theabrasive cloth 14 and permitting high flatness polishing. - Fig. 4 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness, surface roughness and haze level in the prior art polishing process using the above apparatus. As shown, the process is a three-step process comprising a primary polishing step, a secondary polishing step and a final polishing step.
- The primary and secondary polishing steps are performed by using colloidal silica as the abrasive grain and non-woven fiber cloth as the polishing pad. The relative speed is set to 100 m/min. as reference relative speed, and the polishing pressure is set to 500 g/cm2. Toward the end of the primary polishing step, the flattening is substantially ended to secure a flatness of about 0.3 µm. The surface roughness at this time, is about 1 nm. The secondary polishing step is performed by changing the grain size of the colloidal silica. Toward the end of the secondary polishing step, a flatness of about 0.3 µm and a surface roughness of about 0.5 nm are obtained.
- The final polishing step is performed by using the same colloidal silica abrasive material and polishing pad of suede type and by setting a reference polishing pressure of 340 g/cm2 and a low relative speed of 40 m/min. In this step, a flatness of about 0.3 µm, a surface roughness of about 0.35 µm, and a haze level of 40 bits are obtained.
- As noted before, as a recent trend of semiconductor wafers it is strongly desired to study a polishing process, which is expected to provide for high production efficiency while maintaining high accuracy and high quality.
- An object of the invention is to provide a wafer polishing process comprised two polishing steps, in which it can ensure comparable quality with that of wafers finished in the prior art three-step wafer polishing process.
- The above object of the invention is attained by a process of polishing wafers, in which a silicon wafer held by a wafer surface rotated under a predetermined applied pressure is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed, the plurality of polishing steps are composed not three-step wafer polishing process but two-steps being a primary polishing step and a final polishing step, increase of the relative speed of the polishing pad and wafer and reduction of the polishing pressure being brought about at the same time or step-wise in a final stage of primary polishing step.
- The relative speed is the speed of the polishing pad relative to the wafer surface when polishing the wafer by causing relative movement of the wafer and the polishing pad each other, and it is usually represented by the distance covered in unit time.
- Suitably, the primary polishing step is performed with a high polishing pressure of 300 to 700 g/cm2 and a reference relative speed of 50 to 150 m/min., and a quick increase of the relative speed to 2 to 4 times and a quick reduction of the polishing pressure to 1/2 to 1/10 are done in the final stage of the primary polishing step.
- Suitably, the final polishing step is performed with a reference polishing pressure of 100 to 400 g/cm2 and at a reference relative speed of 50 to 150 m/min., and in a final stage of the final polishing step the relative speed is quickly reduced to 1/2 to 1/5.
- According to the invention, with quick increase of the relative speed and accompanying quick reduction of the polishing pressure, done in the final stage of primary polishing step, it is possible to improve the polishing efficiency without adverse effects on the quality and omit the secondary polishing step in the prior art.
- In addition, by adopting mechanochemical polishing using a suede type polishing pad having a high porosity in the final polishing step, it is possible to obtain mirror final polishing with high polishing efficiency and high quality (with an aim of reducing the haze level), while permitting prevention of haze generation with a reduced relative speed set for a short period of time in the final stage of the final polishing step. That is, it is possible to obtain wafers comparable in quality to those obtainable by the prior art process with a two-step polishing process, thus permitting improvement of the polishing efficiency and reduction of the manufacturing cost.
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- Fig. 1(A) is a schematic side view showing a polishing apparatus used for carrying out an embodiment of the invention;
- Fig. 1(B) is a schematic top view showing a polishing surface plate in the same apparatus;
- Fig. 2 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness level, surface roughness and haze level in a two-step polishing process according to the invention;
- Fig. 3 is a graphic representation of the relation between haze and relative speed in a final polishing step shown in Fig. 2 and also of the clearance between wafer and polishing pad; and
- Fig. 4 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness level, surface roughness and haze level in a prior art three-step polishing process.
- Reference numerals: 11: wafer support plate , 12: wafer, 13: polishing surface plate, 14: polishing pad, 15: abrasive material, 17: abrasive grain, 20: cooling station, 21: liquid coolant, 31: polishing station
- The invention will now be described in detail with reference to the drawings.
- From the time chart in Fig. 4 for the prior art mechanochemical polishing, the flattening of the wafer is mostly ended in the primary polishing step, and subsequently a flatness of about 0.3 µm is secured. Specifically, it will be seen that in the primary polishing step flattening mainly based on mechanical file effect is done, and subsequently the emphasis is switched over to polishing, which is a suitable combination of mechanical polishing and chemical polishing and has an aim of reducing the surface roughness and haze level.
- More specifically, as shown in Fig. 2, according to the invention in most of the primary polishing step polishing mainly based on a mechanical file effect on the reference relative speed and high polishing pressure is done, and subsequently mechanical polishing and chemical polishing are suitably combined at the process after final stage. In order to establish and maintain a chemically active state and reduce the surface roughness of the wafer, the ambient temperature around the wafer surface and the clearance between the abrasive material and polishing pad should be in the best situation.
- In a final stage in the primary polishing step, the relative speed is switched over to a higher one for enhancing chemical polishing owing to temperature rise, and also the polishing pressure is switched over to a lower one for weakening mechanical polishing.
- The higher relative speed and the lower polishing pressure are set for the purpose of generating a hydroplane phenomenon.
- In the subsequent final polishing step, in order to prevent polishing efficiency reduction due to chemical polishing, which was overwhelmingly seen in the prior art final polishing step, the reference relative speed is reduced to provide for polishing mainly based on mechanical polishing only for a short period of time in a final stage of the step, thus preventing (or reducing) generation of haze during this period.
- In the process for polishing wafers according to the invention, in which a wafer held by a wafer support plate rotated under an adequate polishing pressure is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad applied in a polishing surface plate moved relative to the wafer support plate at a adequate relative speed, the plurality of polishing steps being a primary polishing step and a final polishing step, in a final stage of flattening mainly based on a mechanical file effect provided by reference relative speed and high polishing pressure in the primary polishing step, quick increase of the relative speed for quickly providing chemical action and quick reduction of the polishing pressure for reducing mechanical effects on the wafer surface when removing dissolution products formed by the chemical action in the vicinity of the wafer surface, are done at the same time to effectively realize quick surface roughness reduction and polishing efficiency improvement and also permit reduction of the polishing process.
- The final polishing step is done by using a polishing pad of suede type having a high porosity with high abrasive grain holding property, is initially performed to effect chemical polishing for most part of it to secure a predetermined surface roughness, and in its final stage a reduced reference relative speed is set for a short period of time for mainly mechanical polishing therein to prevent (or reduce) generation of haze.
- In a typical embodiment, the primary polishing step is performed by using an abrasive material containing colloidal silica as abrasive grain and a non-woven polishing pad, its most part is done with a high polishing pressure of about 500 g/cm2 and a reference relative speed of about 100 m/min., and in its final stage quick increase of high the relative speed and quick reduction of the low polishing pressure are caused to obtain quick reduction of the surface roughness, improvement of the polishing efficiency and consequent reduction of the polishing step.
- The final polishing step is performed by using the same abrasive material containing colloidal silica as abrasive grain and a polishing pad of suede type having a high porosity with high abrasive grain holding property, and for its most part a reference polishing pressure of about 340 g/cm2 and a reference relative speed of about 100 m/min. are set to secure the final surface roughness. In a final stage of this step, a reduced relative speed is set for a short period of time for obtaining a balance between the mechanical action and chemical action and permitting haze-free working.
- With the technical constitution as described above, the following effects can be obtained.
- (1) With quick increase of the relative speed caused in the final stage of the primary polishing step, a hydroplane phenomenon is brought about by quick polishing pressure reduction caused subsequently after a time delay, for preventing quality deterioration and permitting polishing process reduction.
- (2) With the final polishing step performed by using the suede type polishing pad having high porosity and with chemical polishing proceeded initially for most part of the step, increased polishing efficiency can be maintained in addition to abrasive grain holding efficiency improvement. In addition, with a reduced relative speed set for a short period of the final stage in the step, the polishing is brought to one mainly based on mechanical polishing, thus preventing generation of haze.
- A suitable embodiment of the invention will be described in detail with reference to the drawings. Unless particularly specified, however, the sizes, shapes, relative positions, etc. of parts described in the embodiment are given without any sense of limiting the invention but are merely exemplary.
- Figs. 1(A) and 1(B) briefly show the polishing apparatus for polishing wafers in the two-step polishing process according to the invention. The apparatus itself is a conventional one. Fig. 2 is a time chart showing the summary variation on the relative speed, polishing pressure, flatness level, surface roughness and haze level in polishing of wafer in the embodiment of the two-step polishing process according to the invention.
- In the polishing apparatus as shown in Fig. 1(A), comprising a wafer support plate 11 and a polishing
surface plate 13 both rotatable in the respective directions of arrows, apolishing pad 14 is applied to the polishingsurface plate 13, and awafer 12 is mounted on the wafer support plate 11. Thewafer 12 and thepolishing pad 14 are moved relatively at a relative speed withabrasive material 15 provided between them. - The
wafer 12 is polished by mechanical-chemical polishing with frictional movement between it and theabrasive grain 17 in theabrasive material 15 and thepolishing pad 14 under it.Liquid coolant 21 is supplied to the polishingsurface plate 13 and the wafer support plate 11 to control working temperature increase due to heat of friction generated by the above frictional movement, thus preventing thermal deformation of the polishingsurface plate 13 and the wafer support plate 11. A coolingair source 25 is further provided. As shown schematically in Fig. 1(B), a polishingstation 30, in which thewafer 12 is supported, and acooling station 20 for removing working heat generated during polishing of wafer, are formed on the polishingsurface plate 13 in symmetrical positions with respect to the axis of rotation of the polishingsurface plate 13. The surface temperature distribution over thepolishing pad 14 is thus made uniform, thus permitting polishing to provide high flatness. - The cooling
air source 25 includes anair compressor 251 for supplying compressed air, apressure regulator 252 and a cooler 253. - The wafer polishing process according to the embodiment of the invention, as shown in Fig. 2, comprises a primary polishing step and a final polishing step.
- The primary polishing step is performed by using a non-woven polishing pad as the
polishing pad 14 and also using as the abrasive material 15 a suspension of colloidal silicas in an aqueous alkali solution having chemical action on wafer for initially providing for flattening mainly based on mechanical file effect with a reference relative speed of 100 m/min. and a high polishing pressure of 500 g/cm2. When the flattening is ended in a final stage, the relative speed is quickly increased to 270 m/min. to provide for quick activation as composite chemical action obtained with suitable combination of mechanical polishing and chemical polishing. - It is intended to generate a hydroplane phenomenon with composite action of the relative speed increase and low polishing pressure reduction. It is considered that with the hydroplane phenomenon the polishing pad and the wafer are slightly separated from each other, so that the surface roughness of the former is not transferred as surface roughness (ripples) to the latter side but is reduced.
- Subsequent quick reduction of low the polishing pressure to 100 g/cm2 caused after slight delay time, has an effect of removing the dissolution products without causing damage to the wafer surface, thus maintaining the chemical activity. The dissolution products can be removed without substantial possibility of direct rubbing of the wafer surface because the
abrasive grain 17 of SiO2 in the abrasive material are fine particles and also because thenon-woven polishing pad 14 is soft. It is thus possible to obtain a surface roughness of about 0.75 nm. - At this time, a hydroplane phenomenon produced in the wafer by the dynamic pressure effect of fluid has an effect of reducing the effects the surface roughness due to the file effect of the
polishing pad 14 on. - The final polishing step is performed by using as the
polishing pad 14 one of suede type polishing pad having a high porosity with high abrasive grain holding property and as theabrasive material 15 the same one as noted above obtained by suspending colloidal silica in a weak aqueous alkali solution. For this step, a reference relative speed of 100 m/min. and a reference polishing pressure of 340 g/cm2 are set, and preference is given to chemical polishing. - The above polishing is adapted to be mirror finishing making use of chemical reaction induced by mechanical energy at the point of contact between the fine particles of SiO2 and the wafer. In the final stage of the step, a reduced relative speed of 40 m/min. is set for a short period of time to cause polishing based on mechanical polishing. Thus, as shown in Fig. 3, generation of haze is prevented, and at the end of the final polishing step a wafer is obtained, which has a flatness about of 0.3 µm, a surface roughness of about 0.35 nm, and a haze level of about 40 bits.
- The use of the
polishing pad 14 which is of suede type having a high porosity, permits flow of theabrasive material 15 containing theabrasive grain 17 in correspondence to the relative speed. Fine particles under thewafer 12 thus bring about the hydroplane phenomenon, thus holding a large clearance between the wafer and thepolishing pad 14 without causing mechanical damage to the wafer as shown in Fig. 3. The clearance is not reduced but is maintained by the setting of the reduced relative speed for the short period of time noted above, thus preventing generation of haze by theabrasive grain 17. - The high porosity suede type polishing pad used according to the invention has a porosity of 400 to 600 forms/mm2, which is about double the porosity of the usual suede type polishing pad, i.e., 200 to 300 forms/mm2. Thus, it is considered to have excellent capacity of holding abrasive grain, which is effective for polishing efficiency improvement.
- The average grain size of the colloidal silica grain in the abrasive materials used for the primary and final polishing steps, is set to 10 to 50 nm. Of course the grain size is set to be greater for the primary polishing step than for the final polishing step.
- The haze is a measure of fine surface roughness such as to cause scattering of light under a focal beam lamp, the surface roughness being measured by Particle Counter Model "LS-6030" (manufactured by Hitachi DECO) using a measurement mode called "Haze Mode", and represented by a value obtained by proportionally converting the intensity of the scattered light to a corresponding voltage.
Claims (10)
- A process of polishing wafers, in which a silicon wafer held by a wafer support plate rotated under a predetermined applied pressure is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed,
the plurality of polishing steps being a primary polishing step and a final polishing step, increase of the relative speed of the polishing pad and wafer and reduction of the polishing pressure being brought about at the same time or step-wise in a final stage of the primary polishing step. - The process of polishing wafers according to claim 1, wherein in the final stage of the primary polishing step the relative speed between the polishing pad and the wafer is increased quickly to 2 to 4 times of the reference relative speed in the preceding stage, while the polishing pressure is reduced quickly to 1/2 to 1/10 of a high polishing pressure in the preceding stage.
- The process of polishing wafers according to claim 1, wherein the primary polishing step is performed with a high polishing pressure of 300 to 700 g/cm2 and a reference relative speed of 50 to 150 m/min., and a quick increase of the relative speed to 2 to 4 times and a quick reduction of the low polishing pressure to 1/2 to 1/10 are done in the final stage of the primary polishing step.
- The process of polishing wafers according to claim 1, wherein in a final stage of the final polishing step the relative speed is quickly reduced to 1/2 to 1/5 of the reference relative speed at the final polishing step in the preceding stage.
- The process of polishing wafers according to claim 1, wherein the final polishing step is performed with a reference polishing pressure of 100 to 400 g/cm2 and at a reference relative speed of 50 to 150 m/min., and in a final stage of the final polishing step the relative speed is quickly reduced to 1/2 to 1/5.
- A process of polishing wafers, in which a silicon wafer held by a wafer support plate rotated under a predetermined applied pressure is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed,
the plurality of polishing steps being a primary polishing step and a final polishing step, the primary polishing step being performed such that quick increase of the relative speed between the polishing pad and the wafer for quickly bringing about chemical action and quick reduction of the polishing pressure for reducing mechanical effects on the wafer surface are done at the same time in a final stage of flattening of the wafer mainly based on a mechanical file effect. - The process for polishing wafers, wherein the primary polishing step being performed by using an abrasive material containing colloidal silica as abrasive grain and also a polishing pad of non-woven fiber cloth type and by setting, for most part of it, a high polishing pressure of about 500 g/cm2 and a reference relative speed of about 100 m/min. while causing quick increase of the high relative speed and quick reduction of the low polishing pressure at the same time in a final stage of it.
- A process of polishing wafers according to claim 7, wherein a silicon wafer held by a wafer support plate rotated under a predetermined applied pressure is polished by mechanochemical polishing in a polishing process at a plurality of polishing steps with an abrasive interposed between the wafer and a polishing pad applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed,
the plurality of polishing steps being a primary polishing step and a final polishing step, the reference relative speed between the polishing pad and the wafer being reduced to cause polishing mainly based on mechanical polishing for a short period of time in a final stage of the final polishing step. - The process of polishing wafers according to claim 8, wherein the final polishing step is performed by using as the polishing pad one of suede type having a high porosity with a high abrasive grain holding property to cause polishing based on chemical element at a final polishing step to be performed initially so as to secure a predetermined surface roughness, the reference relative speed being reduced to cause polishing mainly based on mechanical polishing for a short period of time in the final stage of the final polishing step.
- The process of polishing wafers according to claim 8, wherein the final polishing step is performed by using an abrasive material containing colloidal silica as abrasive grain and as the polishing pad one of suede type having a high porosity with a high abrasive grain holding property and by setting, for most part of it, a reference polishing pressure of about 340 g/cm2 and a reference relative speed of about 100 m/min. to secure a final surface roughness, a reduced relative speed being set for a short period of time in the final stage of the final polishing step.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP21524295A JP2850803B2 (en) | 1995-08-01 | 1995-08-01 | Wafer polishing method |
JP215242/95 | 1995-08-01 |
Publications (1)
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EP0757378A1 true EP0757378A1 (en) | 1997-02-05 |
Family
ID=16669080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP96112357A Withdrawn EP0757378A1 (en) | 1995-08-01 | 1996-07-31 | Process of polishing silicon wafers |
Country Status (6)
Country | Link |
---|---|
US (1) | US5733177A (en) |
EP (1) | EP0757378A1 (en) |
JP (1) | JP2850803B2 (en) |
KR (1) | KR100209443B1 (en) |
MY (1) | MY132155A (en) |
TW (1) | TW314485B (en) |
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WO1999066544A1 (en) * | 1998-06-13 | 1999-12-23 | Applied Materials, Inc. | A technique for chemical mechanical polishing silicon |
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US6113465A (en) * | 1998-06-16 | 2000-09-05 | Speedfam-Ipec Corporation | Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
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DE19726307B4 (en) * | 1996-06-21 | 2005-07-28 | Hynix Semiconductor Inc., Ichon | Method for smoothing the insulating layer of a semiconductor device |
WO1999059201A1 (en) * | 1998-05-11 | 1999-11-18 | Applied Materials Inc | Polished ceramic chuck for low backside particles in semiconductor plasma processing |
WO1999066544A1 (en) * | 1998-06-13 | 1999-12-23 | Applied Materials, Inc. | A technique for chemical mechanical polishing silicon |
US6162368A (en) * | 1998-06-13 | 2000-12-19 | Applied Materials, Inc. | Technique for chemical mechanical polishing silicon |
US6113465A (en) * | 1998-06-16 | 2000-09-05 | Speedfam-Ipec Corporation | Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
US7201636B2 (en) | 1998-11-02 | 2007-04-10 | Applied Materials, Inc. | Chemical mechanical polishing a substrate having a filler layer and a stop layer |
EP0999012A2 (en) * | 1998-11-06 | 2000-05-10 | Ebara Corporation | Method and apparatus for polishing substrate |
EP0999012A3 (en) * | 1998-11-06 | 2003-01-29 | Ebara Corporation | Method and apparatus for polishing substrate |
EP1600258A1 (en) * | 1998-11-06 | 2005-11-30 | Ebara Corporation | Method and apparatus for polishing substrate |
US6555466B1 (en) | 1999-03-29 | 2003-04-29 | Speedfam Corporation | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers |
DE102004011994A1 (en) * | 2004-03-11 | 2005-09-29 | Siltronic Ag | Semiconductor wafer manufacturing method for fabricating electronic components, involves polishing front and rear sides of wafer in two phases, where wafer material is removed up to five micrometer during one phase in short time |
EP2128896A3 (en) * | 2008-05-28 | 2010-10-06 | Sumco Corporation | Method of polishing silicon wafer |
US8147295B2 (en) | 2008-05-28 | 2012-04-03 | Sumco Corporation | Method of polishing silicon wafer |
DE102013205448A1 (en) | 2013-03-27 | 2014-10-16 | Siltronic Ag | A method of polishing a substrate of semiconductor material |
DE102013213838A1 (en) | 2013-07-15 | 2014-09-25 | Siltronic Ag | A method of polishing a substrate of semiconductor material |
CN114102427A (en) * | 2021-12-02 | 2022-03-01 | 中国电子科技集团公司第四十六研究所 | Photoelectrochemical double-side polishing method of 2-inch CdS single crystal wafer |
Also Published As
Publication number | Publication date |
---|---|
KR970013086A (en) | 1997-03-29 |
TW314485B (en) | 1997-09-01 |
JP2850803B2 (en) | 1999-01-27 |
KR100209443B1 (en) | 1999-07-15 |
US5733177A (en) | 1998-03-31 |
JPH0938849A (en) | 1997-02-10 |
MY132155A (en) | 2007-09-28 |
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