EP0745656A1 - Particules abrasives, méthode de production et utilisation - Google Patents

Particules abrasives, méthode de production et utilisation Download PDF

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Publication number
EP0745656A1
EP0745656A1 EP96303652A EP96303652A EP0745656A1 EP 0745656 A1 EP0745656 A1 EP 0745656A1 EP 96303652 A EP96303652 A EP 96303652A EP 96303652 A EP96303652 A EP 96303652A EP 0745656 A1 EP0745656 A1 EP 0745656A1
Authority
EP
European Patent Office
Prior art keywords
cerium
oxide
aluminum
parts
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96303652A
Other languages
German (de)
English (en)
Inventor
Kazumasa Ueda
Yoshiaki Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of EP0745656A1 publication Critical patent/EP0745656A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C04B35/1115—Minute sintered entities, e.g. sintered abrasive grains or shaped particles such as platelets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C09K3/1418—Abrasive particles per se obtained by division of a mass agglomerated by sintering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
EP96303652A 1995-05-22 1996-05-22 Particules abrasives, méthode de production et utilisation Withdrawn EP0745656A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP12231495 1995-05-22
JP122314/95 1995-05-22
JP4372496 1996-02-29
JP43724/96 1996-02-29

Publications (1)

Publication Number Publication Date
EP0745656A1 true EP0745656A1 (fr) 1996-12-04

Family

ID=26383546

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96303652A Withdrawn EP0745656A1 (fr) 1995-05-22 1996-05-22 Particules abrasives, méthode de production et utilisation

Country Status (6)

Country Link
US (1) US5697992A (fr)
EP (1) EP0745656A1 (fr)
KR (1) KR960041316A (fr)
CN (1) CN1141326A (fr)
SG (1) SG63647A1 (fr)
TW (1) TW301024B (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use
EP0826757A1 (fr) * 1996-08-29 1998-03-04 Sumitomo Chemical Company, Limited Composition abrasive et son utilisation
FR2761629A1 (fr) * 1997-04-07 1998-10-09 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
WO1999005232A1 (fr) * 1997-07-25 1999-02-04 Infineon Technologies Ag Produit de polissage pour substrats semi-conducteurs
WO1999042537A1 (fr) * 1998-02-18 1999-08-26 Saint-Gobain Industrial Ceramics, Inc. Formulation de polissage de surfaces optiques

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69611653T2 (de) * 1995-11-10 2001-05-03 Tokuyama Corp Poliersuspensionen und Verfahren zu ihrer Herstellung
US6152976A (en) * 1996-08-30 2000-11-28 Showa Denko Kabushiki Kaisha Abrasive composition for disc substrate, and process for polishing disc substrate
CA2263241C (fr) * 1996-09-30 2004-11-16 Masato Yoshida Abrasif a l'oxyde de cerium et procede d'abrasion de substrats
JPH10166258A (ja) * 1996-12-06 1998-06-23 Tadahiro Omi 研磨剤組成物
US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6602439B1 (en) 1997-02-24 2003-08-05 Superior Micropowders, Llc Chemical-mechanical planarization slurries and powders and methods for using same
SG72802A1 (en) * 1997-04-28 2000-05-23 Seimi Chem Kk Polishing agent for semiconductor and method for its production
US20090255189A1 (en) * 1998-08-19 2009-10-15 Nanogram Corporation Aluminum oxide particles
US6190237B1 (en) * 1997-11-06 2001-02-20 International Business Machines Corporation pH-buffered slurry and use thereof for polishing
JPH11181403A (ja) * 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
US6360562B1 (en) 1998-02-24 2002-03-26 Superior Micropowders Llc Methods for producing glass powders
US6124207A (en) * 1998-08-31 2000-09-26 Micron Technology, Inc. Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries
US6783434B1 (en) * 1998-12-25 2004-08-31 Hitachi Chemical Company, Ltd. CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6478837B1 (en) * 1999-06-28 2002-11-12 Showa Denko K.K. Abrasive composition substrate for magnetic recording disks and process for producing substrates for magnetic recording disk
US6630433B2 (en) * 1999-07-19 2003-10-07 Honeywell International Inc. Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
JP4251750B2 (ja) 2000-03-13 2009-04-08 Ｏｋｉセミコンダクタ株式会社 絶縁膜中のスクラッチ検出方法
MY118582A (en) * 2000-05-12 2004-12-31 Kao Corp Polishing composition
WO2002006418A1 (fr) * 2000-07-19 2002-01-24 Kao Corporation Composition de fluide de polissage
KR100382541B1 (ko) * 2000-09-21 2003-05-01 주식회사 하이닉스반도체 반도체 소자의 플러그 형성 방법
JP3719971B2 (ja) * 2001-11-06 2005-11-24 株式会社椿本チエイン 耐摩耗性被覆物を被覆したサイレントチェーン
US20030118824A1 (en) * 2001-12-20 2003-06-26 Tokarz Bozena Stanislawa Coated silica particles and method for production thereof
US6645265B1 (en) * 2002-07-19 2003-11-11 Saint-Gobain Ceramics And Plastics, Inc. Polishing formulations for SiO2-based substrates
US20050129849A1 (en) * 2003-12-12 2005-06-16 General Electric Company Article protected by a thermal barrier coating having a cerium oxide-enriched surface produced by precursor infiltration
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
US8685123B2 (en) * 2005-10-14 2014-04-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material
CN100368484C (zh) * 2006-05-26 2008-02-13 上海大学 氧化铝/氧化硅复合磨粒的制备方法
US8491682B2 (en) * 2007-12-31 2013-07-23 K.C. Tech Co., Ltd. Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry
TWI593791B (zh) * 2011-01-25 2017-08-01 日立化成股份有限公司 Ｃｍｐ研磨液及其製造方法、複合粒子的製造方法以及基體的研磨方法
CN102504705B (zh) * 2011-10-17 2014-07-09 河南省化工研究所有限责任公司 光通讯Zr02陶瓷插芯精密加工用抛光液及其制备方法
KR102367577B1 (ko) * 2013-12-16 2022-02-25 로디아 오퍼레이션스 세륨 옥사이드 입자의 액체 현탁액

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1519396A1 (de) * 1964-01-09 1969-05-08 Treibacher Chemische Werke Ag Verfahren zur Herstellung von Glaspolier- und Schleifmitteln
DE2737358A1 (de) * 1976-08-26 1978-03-02 Treibacher Chemische Werke Ag Poliermittel
US5114437A (en) * 1990-08-28 1992-05-19 Sumitomo Chemical Co., Ltd. Polishing composition for metallic material
JPH059463A (ja) * 1990-08-28 1993-01-19 Sumitomo Chem Co Ltd 金属材料の研磨用組成物
WO1993022103A1 (fr) * 1992-04-27 1993-11-11 Rodel, Inc. Compositions et procedes pour polir et aplanir des surfaces
WO1994007970A1 (fr) * 1992-09-25 1994-04-14 Minnesota Mining And Manufacturing Company Procede de fabrication de grains abrasifs contenant de l'oxyde d'aluminium et de l'oxyde cerique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626547A (en) * 1979-08-11 1981-03-14 Toyota Motor Corp Manufacture of catalyst support
US4331565A (en) * 1980-11-28 1982-05-25 General Motors Corporation Method for forming high surface area catalyst carrier and catalyst using same
JPS6283315A (ja) * 1985-10-04 1987-04-16 Nippon Engeruharudo Kk 熱安定性にすぐれたγアルミナの製造方法
JPH05220394A (ja) * 1992-02-07 1993-08-31 Sumitomo Metal Mining Co Ltd 酸化セリウムとアルミナからなる触媒担体の製造方法
US5445996A (en) * 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1519396A1 (de) * 1964-01-09 1969-05-08 Treibacher Chemische Werke Ag Verfahren zur Herstellung von Glaspolier- und Schleifmitteln
DE2737358A1 (de) * 1976-08-26 1978-03-02 Treibacher Chemische Werke Ag Poliermittel
US5114437A (en) * 1990-08-28 1992-05-19 Sumitomo Chemical Co., Ltd. Polishing composition for metallic material
JPH059463A (ja) * 1990-08-28 1993-01-19 Sumitomo Chem Co Ltd 金属材料の研磨用組成物
WO1993022103A1 (fr) * 1992-04-27 1993-11-11 Rodel, Inc. Compositions et procedes pour polir et aplanir des surfaces
WO1994007970A1 (fr) * 1992-09-25 1994-04-14 Minnesota Mining And Manufacturing Company Procede de fabrication de grains abrasifs contenant de l'oxyde d'aluminium et de l'oxyde cerique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 274 (C - 1064) *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use
EP0826757A1 (fr) * 1996-08-29 1998-03-04 Sumitomo Chemical Company, Limited Composition abrasive et son utilisation
US5804513A (en) * 1996-08-29 1998-09-08 Sumitomo Chemical Company, Ltd. Abrasive composition and use of the same
FR2761629A1 (fr) * 1997-04-07 1998-10-09 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
US6126518A (en) * 1997-04-07 2000-10-03 Clariant (France) S.A. Chemical mechanical polishing process for layers of semiconductor or isolating materials
WO1999005232A1 (fr) * 1997-07-25 1999-02-04 Infineon Technologies Ag Produit de polissage pour substrats semi-conducteurs
US6447372B1 (en) 1997-07-25 2002-09-10 Infineon Technologies Ag Polishing agent for semiconductor substrates
WO1999042537A1 (fr) * 1998-02-18 1999-08-26 Saint-Gobain Industrial Ceramics, Inc. Formulation de polissage de surfaces optiques
AU729245B2 (en) * 1998-02-18 2001-01-25 Saint-Gobain Ceramics And Plastics, Inc. Optical polishing formulation
US6258136B1 (en) 1998-02-18 2001-07-10 Norton Company Fixed abrasives for optical polishing

Also Published As

Publication number Publication date
KR960041316A (ko) 1996-12-19
TW301024B (fr) 1997-03-21
US5697992A (en) 1997-12-16
SG63647A1 (en) 1999-03-30
CN1141326A (zh) 1997-01-29

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