EP0740846B1 - Dispositif a emission de champs muni de structures interieures permettant d'aligner les pixels de phosphore sur les emetteurs de champ correspondants - Google Patents

Dispositif a emission de champs muni de structures interieures permettant d'aligner les pixels de phosphore sur les emetteurs de champ correspondants Download PDF

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Publication number
EP0740846B1
EP0740846B1 EP95940804A EP95940804A EP0740846B1 EP 0740846 B1 EP0740846 B1 EP 0740846B1 EP 95940804 A EP95940804 A EP 95940804A EP 95940804 A EP95940804 A EP 95940804A EP 0740846 B1 EP0740846 B1 EP 0740846B1
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EP
European Patent Office
Prior art keywords
faceplate
backplate
spacer
interior side
field emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95940804A
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German (de)
English (en)
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EP0740846A1 (fr
Inventor
Christopher J. Spindt
John E. Field
Duane A. Haven
Chungdee Pong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Candescent Intellectual Property Services Inc
Original Assignee
Candescent Technologies Inc
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Filing date
Publication date
Priority claimed from US08/343,075 external-priority patent/US5578899A/en
Priority claimed from US08/343,074 external-priority patent/US5650690A/en
Priority claimed from US08/343,803 external-priority patent/US5543683A/en
Application filed by Candescent Technologies Inc filed Critical Candescent Technologies Inc
Publication of EP0740846A1 publication Critical patent/EP0740846A1/fr
Application granted granted Critical
Publication of EP0740846B1 publication Critical patent/EP0740846B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
    • H01J29/085—Anode plates, e.g. for screens of flat panel displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/467—Control electrodes for flat display tubes, e.g. of the type covered by group H01J31/123
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/86—Vessels; Containers; Vacuum locks
    • H01J29/864—Spacers between faceplate and backplate of flat panel cathode ray tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/123—Flat display tubes
    • H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
    • H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/863—Spacing members characterised by the form or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/8665—Spacer holding means

Definitions

  • This invention relates generally to field emission devices, and more particularly, to field emission devices with at least one internal structure that includes fiducials to optically align the faceplate and the backplate, and at least one internal structure that fixes and constrains the faceplate and backplate to align a plurality of phosphor pixels with corresponding field emitters.
  • Field emission devices include a faceplate, a backplate and connecting walls around the periphery of the faceplate and backplate, forming a sealed vacuum envelope.
  • the envelope is held at vacuum pressure, which in the case of CRT displays is about 1 x 10 -7 torr or less.
  • the interior surface of the faceplate is coated with light emissive elements, such as phosphor or phosphor patterns, which define an active region of the display.
  • Cathodes, (field emitters) located adjacent to the backplate are excited to release electrons which are accelerated toward the phosphor on the faceplate, striking the phosphor, and causing the phosphor to emit light seen by the viewer at the exterior of the faceplate. Emitted electrons for each of the sets of the cathodes are intended to strike only certain targeted phosphors. There is generally a one-to-one correspondence between each emitter and a phosphor.
  • Flat panel displays are used in applications where the form-factor of a flat display is required. These applications are typically where there are weight constraints and the space available for installation is limited, such as in aircraft or portable computers.
  • a certain level of color purity and contrast are needed in field emission devices. Contrast is the difference between dark and bright areas. The higher the contrast, the better.
  • the parameters of resolution, color-purity and contrast in a flat cathodeluminescent display depend on the precise communication of a selected electron emitter with its corresponding phosphor pixels. Additionally, high picture brightness (lumens), requires either high power consumption or high phosphor efficiency (lumens/watt).
  • the backplate containing the emitter array must be spatially separated from the faceplate, containing the phosphor pixels, by a distance sufficient to prevent unwanted electrical events between the two. This distance, depending on the quality of the vacuum and the topography of the substrates, is typically greater than about 2 mm.
  • the vacuum envelope is unable to withstand 1 atmosphere or greater external pressure without inclusion of the spacer walls. If the spacer walls are not included then the faceplate and backplate can collapse. In rectangular displays, having greater than approximately a 1 inch diagonal, the faceplate and backplate are particularly susceptible to this type of mechanical failure due to their high aspect ratio, which is defined as the larger dimension of the display divided by the thickness of the faceplate or backplate.
  • the use of spacer walls in the interior of the field emission device substantially eliminates this mechanical failure.
  • the faceplates and backplates for the desired flat, light portable display are typically about 1 mm thick. To avoid seeing the spacer walls at the exterior of the faceplate, the spacer walls should be hidden behind a suitable structure such as a black matrix.
  • flat panel displays to date and standard CRT's have high-temperature assembly requirements, including but not limited to plasma addressed liquid crystal (PALC), and the like, where the alignment during assembly consists of external, mechanical alignment of the faceplate and the backplate so that the correspondence of the phosphor pixels and the associated cathode emitters are initially within tolerance.
  • PLC plasma addressed liquid crystal
  • These external fixturing devices travel with the field emission display through the required high temperature bonding and sealing processes.
  • External fixturing devices have difficulties in maintaining a high precision of alignment because of differences in the coefficient of thermal expansion between the field emission display and the fixturing. Resulting misalignment gives a loss of colour purity and resolution in the field emission display.
  • Another disadvantage of external tooling is the cost of individual fixture tooling for each field emission display during the sealing and thermal processing of the displays.
  • a field emission display which does not use external fixturing devices in the high temperature bonding and sealing processes
  • a faceplate for a field emission display that includes a black matrix grid, formed on the faceplate interior side and made of column and row guard bands, with a wall locator formed in a column or row guard
  • a self aligned focus grid for field emission display and
  • a plurality of scattering shields in a high voltage display, a plurality of scattering shields, defining a subpixel volume, to reduce electron escape.
  • the invention provides a field emission display device according to claim 1 comprising:
  • the invention provides a method for forming a backplate structure according to claim 17 for a field emission device for use in the display as aforesaid, the method comprising:
  • the field emission display device includes a faceplate according to claim 20 and a backplate according to claim 38.
  • the faceplate has an interior side with an active region made of pluralities of phosphor pixel elements.
  • the backplate has an interior side with pluralities of field emitters, each plurality of field emitters defining a sweet spot.
  • Sidewalls are positioned between the faceplate and the backplate to form an enclosed sealed envelope between the sidewalls, backplate interior side and the faceplate interior side.
  • At least one spacer wall is positioned in the envelope to support the backplate and the faceplate against forces acting in a direction toward the envelope.
  • at least one internal structure is included that fixes and constrains the faceplate and the backplate relative to each other, and aligns phosphor pixels with corresponding field emitters.
  • the internal structure includes a spacer wall gripper with a receiving trench formed on the interior side of the faceplate, and a locator formed on the interior side of the backplate.
  • the spacer wall is mounted in the receiving trench and is retained in the locator.
  • the wall gripper has sufficient flexibility to receive the spacer wall in a substantially straightened geometry which is easily maintained throughout the sealing and thermal processing of the display.
  • Each receiving trench has a trapezoid geometry which is very effective in gripping the spacer wall.
  • the width of the receiving trench is the same width or smaller than a width of the spacer wall.
  • the faceplate and backplate can each include an alignment fiducial.
  • a spacer wall is positioned in the wall gripper.
  • the faceplate and backplate fiducials are then optically aligned, and brought together so that the spacer wall becomes positioned in the locator. This essentially eliminates the need for external fixturing devices during the bonding and sealing stages, and the phosphor pixels are aligned with the corresponding field emitters.
  • the spacer wall is fixably mounted in the receiving trench by the use of, for example, a frit.
  • the spacer wall can have a different coefficient of thermal expansion than the faceplate or the backplate. This results because the receiving trench is able to grip and position the spacer walls even though there is a difference in thermal expansion of the faceplate, backplate and spacer walls during the thermal and sealing processing.
  • a faceplate for a field emission display that includes a black matrix formed on an interior surface of the faceplate, and a wall locator formed in the black matrix.
  • the invention can also provide a flat panel display with a faceplate interior side that includes a plurality of scattering shields surrounding each phosphor subpixel a defining a subpixel volume.
  • a flat panel display is a display in which a faceplate and backplate are substantially parallel, and the thickness of the display is small compared to the thickness of a conventional deflected-beam CRT display.
  • the thickness of the display is measured in a direction substantially perpendicular to the faceplate and backplate.
  • the thickness of a flat panel display is substantially less than about 51 mm (2.0 inches), and in one embodiment it is about 4.5 to 7.0 mm.
  • a flat panel display 10 includes a faceplate 12, backplate 14 and side walls 16, which together form a sealed envelope 18 that is held at vacuum pressure, e.g., approximately 1.33 x 10 -5 Pa (1 x 10 -7 torr) or less.
  • One or more spacer walls 20 support faceplate 12 against backplate 14.
  • Spacer walls 20 can include electrodes positioned along their longitudinal length.
  • spacer walls 20 include walls, posts and wall segments.
  • spacer walls 20 have a sufficiently small thickness so that they provide minimal interference with the operation of flat panel display 10, particularly the cathodes (field emitters) and phosphors of the device.
  • Spacer walls 20 are made of a ceramic, glass, glass-ceramic, ceramic tape, ceramic reinforced glass, devitrified glass, amorphous glass in a flexible matrix, metal with electrically insulating coating, bulk resistivity materials such as a titanium aluminum chromium oxide, high-temperature vacuum compatible polyimides or insulators such as silicon nitride.
  • Spacer walls 20 have a thickness of about 20 to 60 ⁇ m, and a center-to-center spacing of about 8 to 10 mm. Spacer walls 20 provide internal supports for maintaining spacing between faceplate 12 and backplate 14 at a substantially uniform value across the entire active area of the display at an interior surface of faceplate 12.
  • a plurality of field emitters 22 are formed on a surface of backplate 14 within envelope 18.
  • field emitters 22 can include a plurality of field emitters or a single field emitter.
  • Row and column electrodes control the emission of electrons from field emitters 22. The electrons are accelerated toward a phosphor coated interior surface of faceplate 12.
  • Integrated circuit chips 24 include driving circuitry for controlling the voltage of the row and column electrodes so that the flow of electrons to faceplate 12 is regulated. Electrically conductive traces are used to electrically connect circuitry on chips 24 to the row and column electrodes.
  • faceplate 12 and backplate 14 consist of glass that is about 1.1 mm thick.
  • a hermetic seal 26 of solder glass including but not limited to Owens-Illinois CV 120, attaches side walls 16 to faceplate 12 and backplate 14 to create sealed envelope 18.
  • the solder glass must withstand a 450 degree C sealing temperature.
  • Within envelope 18 the pressure is typically 1.33 x 10 -6 Pa (10 -8 torr) or less. This high level of vacuum is achieved by evacuating envelope 18 through pump port 28 at high temperature to cause absorbed gasses to be removed from all internal surfaces. Envelope 18 is then hermetically sealed by a pump port patch 30.
  • Faceplate 12 includes pluralities of pixels. In order to provide good purity of color and high resolution, electrons emitted by field emitters 22 are directed to, and fall only on a corresponding plurality of pixels. An electron beam 34 from field emitters 22 is focussed and directed by a focus grid 36 to a color picture element comprised of a plurality of phosphors 32, and a black matrix 37 formed on an interior side of faceplate 12.
  • Various parameters are associated with the direction of electrons from field emitters 22 to the proper associated plurality of phosphor pixels 32. These include, but are not limited to, (i) the precision of location of the field emitter 22 relative to focus grid 36, (ii) the precision of location of the plurality of phosphor pixels 32 relative to black matrix 37, and (iii) the alignment of focus grid 36 to black matrix 37.
  • a light reflective layer including but not limited to aluminum, is deposited on black matrix 37 and phosphor pixels 32 with a thickness of about 20 to 60 nm (200-600 ⁇ ).
  • the ratio of area of the plurality of phosphor pixels 32 to black matrix 37 for a 10 inch diameter screen with color resolution of 640(x3) x 480 picture elements is about 50%.
  • the minimum width of black matrix 37 is therefore about 25.4 ⁇ m (0.001 inches). This implies a maximum misalignment of electron beam 34 to the corresponding phosphor pixels 32 (from all contributors) to be less than half the maximum black matrix width (12.7 ⁇ m or 0.0005 inches) at any location of field emission device 10.
  • Field emission display 10 includes at least one internal structure in envelope 18 that fixes and constrains faceplate 12 to backplate 14, and thus aligns a plurality of phosphor pixels 32 with a corresponding sweet spot associated with the field emitters 22 to within a predetermined tolerance of 12.7 ⁇ m (0.0005 inches) or less.
  • This internal structure is a wall gripper 42 formed on an internal side of faceplate 12, and a locator 44 formed on an interior side of backplate 14. It will be appreciated that wall gripper 42 can be formed on back plate 14, and locator 44 can be formed on faceplate 12.
  • a spacer wall 20 is mounted in wall gripper 42, and retained in locator 44.
  • the most significant parameter of the alignment issue is the precision to which faceplate 12, e.g., black matrix 37 and phosphor pixels 32, is aligned to backplate 14, e.g., focus grid 36 and field emitters 22, and thereafter held in place without movement during the thermal assembly process. This is achieved with the internal structure in envelope 18 without the use of external fixturing devices.
  • Black matrix 37 is made of a photo-patternable material including but not limited to black chromium, polyimide, black frit, and the like. Both black matrix 37 and focus grid 36 are configured by photolithography. The phototooling to create black matrix 37 is substantially the same as the phototooling used to create focus grid 36, wall gripper 42 and locator 44.
  • Spacer walls 20 are first mounted in wall gripper 42. Thereafter, faceplate 12 and backplate 14 are locked together, to within the allowed tolerances, by positioning spacer walls 20 in corresponding locators 44.
  • faceplate 12 and backplate 14 consist of glass that is about 1.1 mm thick.
  • a hermetic seal 26 of solder glass including but not limited to Owens-Illinois CV 120, attaches side walls 16 to faceplate 12 and backplate 14 to create sealed envelope 18.
  • the entire display 10 must withstand a 450 degree C sealing temperature.
  • the pressure is typically 1.33 x 10 -6 Pa (10 -7 torr) or less. This high level of vacuum is achieved by evacuating envelope 18 through pump port 28 at high temperature to cause absorbed gases to be removed from all internal surfaces. Envelope 18 is then sealed by a pump port patch 30.
  • Faceplate 12 includes a plurality of phosphor subpixels 32. Electrons defining an electron beam 34 are accelerated from a plurality of field emitters with energies in the range of 1kV to 10kV. Electron beam 34 is focused by focus grid 36 to strike a corresponding phosphor subpixel 32. There is a one-to-one correspondence between a set of field emitters 22, positioned within a section of focus grid 36, to a phosphor subpixel 32. Each phosphor subpixel 32 is surrounded by a plurality of scattering shields 38 which define a subpixel volume 40.
  • FIG. 5 illustrates the results with a black matrix but without scattering shields 38. Electrons in electron beam 34 are accelerated from a plurality of field emitters 22 to strike their corresponding phosphor subpixels 32. Some of these electrons are back scattered from a phosphor subpixel or an adjacent area to an internal support 20 as represented by ray 35. Other electrons are back scattered and strike non-corresponding phosphor subpixels, as shown with ray 39. Back scattered electrons can strike other insulating elements in envelope 18. Back scattering electrons onto resistive surfaces, such as internal supports 20, affects the ratio of brightness to power of display 10 by limiting the amount of current that can be used. Further, the back scattering onto internal supports 20 limits the height of internal supports 20 and thus the high voltage.
  • a black matrix typically has a low aspect ratio. Additionally, it is difficult to make a structure with a sufficient aspect ratio to prevent electrons escaping from their subpixel volume 40.
  • Back scattered electrons strike scattering shields 38, represented by rays 41 and 43, and do not leave their scattering shield volumes 40. They remain essentially captured in their scattering shield volumes 40.
  • scattering shields 38 capture the back scattered electrons as in the case of ray 45, preventing them from striking non-corresponding phosphor subpixels.
  • scattering shield 38 height is 12 ⁇ m, 25 ⁇ m, 25 ⁇ m, 50 ⁇ m, 75 ⁇ m, 100 ⁇ m, or greater.
  • the actual height and size will vary depending on dimensions of the display.
  • Scattering shields 38 can have heights in the range of about 20 to 200 ⁇ m, 20 to 100 ⁇ m, and 50 to 100 ⁇ m, scattering shields 38 provide a fivefold improvement in contrast.
  • Scattering shields 38 can be made of a photo pattemable material including but not limited to polyimide. At least a portion of scattering shields 38 can include a black matrix material.
  • fiducials 45 and 47 can be integral to the structure of black matrix 37 and focus grid 36 respectively. Additionally, masks for fiducials 45 and 47 are integral to the phototooling, creating a geometric relationship between fiducial 45 and black matrix 37, and fiducial 47 and focus grid 36.
  • fiducials 45 and 47 can be on each of the substrates of faceplate 12 and backplate 14 respectively and not part of black matrix 37. In any event, fiducials 45 and 47 provide optical alignment of faceplate 12 to backplate 14, and of field emitters 22 to corresponding phosphor pixels 32.
  • fiducials 45 and 47 are in optical alignment, e.g., when collimated light falls on faceplate 12 which is transparent to the light, the image of faceplate alignment fiducial 45 is projected onto and maps to backplate fiducial 47.
  • a shadow mask is provided to permit the passage of optical light through fiducials 45 and 47.
  • the mounted spacer walls 20 are physically strong and rigid enough to withstand atmospheric pressure, and maintain alignment of faceplate 12 and backplate 14 through the sealing and thermal processing of the display.
  • the shape of wall gripper 42 is designed to grip spacer wall 20 tightly and retard its movement.
  • black matrix 37 comprises column and row guard bands.
  • Wall gripper 42 is formed on black matrix 37.
  • wall gripper 42 is formed in a column or row guard band.
  • Wall gripper 42 has a height of about 25.4 ⁇ m (0.001 inches) or greater.
  • a second layer of black matrix 37(a) is formed to create wall gripper 42, which is essentially a pair of raised structures 42(a) and 42(b), creating a receiving trench 46 for spacer wall 20.
  • Wall gripper 42 is formed in a generally perpendicular direction in relation to a series of column guard bands 48. Wall gripper 42 is not visible or distinguishable from a row guard band 51 not containing a wall gripper.
  • wall gripper 42 When viewed at the exterior of faceplate 12, wall gripper 42 is not visible or distinguishable from row guard band 51, and thus has optical integrity. That is, the viewed footprint is the same for a row guard band 51 with a wall gripper 42 as that of a row guard band 51 without a wall gripper 42.
  • a first layer of black matrix 37 is formed. and then a second layer of black matrix 37(a) is created.
  • Second layer 40(a) creates wall gripper 42, with the corresponding raised structures 42(a) and 42(b) defining a receiving trench 46.
  • pluralities of phosphor pixels 32 are defined by black matrix 37 and second layer of black matrix 37(a).
  • Figure 12 illustrates the introduction of a spacer wall 20 into receiving trench 46.
  • Figure 13 illustrates spacer wall 20 positioned in receiving trench 46.
  • Figure 14 a perspective view of an interior side of faceplate 12 shows black matrix 37 and five spacer walls 20 positioned in wall grippers 42.
  • the material forming wall gripper 42 is vacuum-compatible at processing temperatures in that it does not decompose or create gas contaminants. Processing temperatures are in the range of about 300 to 450 degrees C.
  • Wall gripper 42 is sufficiently flexible (capable of local deformation) to permit spacer walls 20 to have greater thicknesses than receiving trench 46, and still be capable of insertion into receiving trench 46.
  • Wall gripper 42 also provides a straightening effect on spacer walls 20.
  • Wall gripper 42 is capable of sufficient local deformation to straighten spacer walls 20.
  • wall gripper 42 has a receiving trench 46 geometry with a narrower aperture at the point of receiving a spacer wall 20, than the bottom of receiving trench 46.
  • the depth of receiving trench 46 can be about 51 ⁇ m (0.002 inches).
  • a preferred material for wall gripper 42 is a photodefinable polyimide, such as OCG Probimide 7020, or other similar polymers from DuPont, Hitachi and the like.
  • Black matrix 37 is created from black chromium and photopattemed by conventional lithography on faceplate 12.
  • Faceplate 12 is then baked on a hot plate at 70 degrees C for 6 minutes, followed by 100 degrees C for twenty minutes, to drive off solvents.
  • the soft baked Probimide 56 is then photoexposed with an exposure dose of 250 mJ/sq cm at 405 nm through a mask 58 in proximity to Probimide layer 56.
  • Exposed Probimide layer 56 is then baked for 3 minutes at 100 degrees C, followed by a room temperature stabilization of 15 minutes.
  • Probimide layer 56 at this time has an exposure energy profile that creates the trapezoid shape, illustrated in Figure 15, that imparts the gripping function of wall gripper 42.
  • the Probimide is then developed in OCG QZ3501 by a puddle/spray cycle: [3 minutes puddle/1 minute, spray-repeat 1X] followed by a solvent rinse (OCG QZ 3512) for 1 minute.
  • the developed wall gripper 42 is then hard baked for 1 hour at 450 degrees C in a nitrogen atmosphere with a thermal ramp of 3 degrees C per minute.
  • Spacer walls 20 are then inserted into wall gripper 42 , as shown in Figure 13. As illustrated, the insertion axis is perpendicular to the plane of faceplate 12. Insertion can also be accomplished parallel to the plane of faceplate 12 (i.e. slide spacer wall 20 into receiving trench 46 from one end). Spacer wall 20 extends beyond black matrix 37 in an amount sufficient to secure one of its ends with solder glass 60 to substrate 12. Receiving trench 46 has one ore more flared ends to facilitate spacer wall 20 insertion.
  • Figure 13 shows spacer wall 20 in place with only one end secured by solder glass 60, or other high temperature adhesives.
  • suitable adhesives include but are not limited to polyimide, and the like.
  • Solder glass 60 can be, but is not limited to, OI CV 120.
  • the assembly shown in Figure 14 is then baked for one hour at 450 degrees C to devitrify solder glass 60.
  • a suitable oven ramp is 3 degrees C/minute.
  • Securing one end of spacer wall 20 provides mechanical stability of spacer wall 20 for subsequent processing. Additionally, since there is differential expansion and contraction during thermal processing, when spacer walls 20 are secured or pinned at both ends buckling of spacer wall 20 results. Securing spacer wall 20 at only one end enables the use of materials with substantially different coefficients of thermal expansion for spacer walls 20, faceplate 12 and backplate 14, because all differential movement of spacer wall 20 is along the axis of receiving trench 46.
  • spacer wall 20 is fixed and constrained by wall gripper 42 and locator 44, and then once faceplate 12 and backplate 14 are optically aligned, spacer wall 20 is fixed and constrained in locator 44.
  • Backplate 14 of display 10 is constructed to provide correspondence of features with faceplate 12 so that field emitters 22 communicate with the corresponding plurality of phosphor pixels 32, and wall gripper 42 is in optical alignment with locator 44.
  • Wall locator 44 is formed by phototooling compatible with the tooling set used to create wall gripper 42, black matrix 37 and focus grid 36. Focus grid 36 is self aligned to field emitters 22.
  • faceplate 12 with spacer walls 20 attached may be brought into proximity to backplate 14, and be manipulated in the (x,y,0) axes so as to bring spacer wall 20 into alignment with wall locator 44, and a respective plurality of phosphor pixels 32 into alignment with its corresponding sweet spot 36. Faceplate 12 may then be translated in the z axis to cause spacer wall 20 to insert into wall locator 44.
  • This assembly provides precision of alignment in the (x,y,0) axis and is held and maintained in position by the mechanically rigid structure formed by spacer walls 20, wall gripper 42 and locator 44. This structure may then be transported through a standard cycle of high temperature sealing and evacuation. Solder-glass may be used in the sealing process.
  • locator 44 on backplate 14 is illustrated beginning with backplate 14, row electrodes 50 and column electrode 49.
  • a first layer 64 of OCG Probimide 7020 polyimide is deposited on backplate 14 to a dry thickness of 45 microns by conventional spinning means for 10 seconds at a spin speed of 750 rpm.
  • First layer 64 is soft baked in a two-step process for 6 minutes at a temperature of 79 degrees C followed by 10 minutes at 100 degrees C. It is then exposed through a photomask 68 to define a column focus electrode 70.
  • the exposure parameters are: UV light at wavelength from 350 to 450 nm for an exposure dose of 250 mJ/sq cm.
  • the exposed pattern is then developed in OCG QZ 3501 developer for 3 minutes to form column focus electrode 70.
  • a second layer 72 of polyimide is deposited to a dry thickness of 20 microns and exposed through a second photomask 74 using the same exposure and development parameters as first layer 64, to form row focus electrode 76 and locator 44.
  • Locator 44 has a depth of about 10 ⁇ m.
  • the polyimide is imidized by baking at a temperature of 460 degrees C in a nitrogen atmosphere for 1 hour.
  • Backplate structure includes electrically insulating backplate, a base electrode, an electrically insulating layer, metallic gate electrodes, field emitters positioned in gate electrodes, and focusing ridges positioned adjacent to gate electrodes.
  • the gate electrode lies on the insulating layer.
  • the gate electrode is in the shape of a strip running perpendicular to the base electrode.
  • Field emitters contact the base electrode and extend through apertures in the insulating layer.
  • the tips, or upper ends, of field emitters are exposed through corresponding openings in the gate electrode.
  • Field emitters can have various shapes, including but not limited to cones, filament structures, and the like.
  • Focusing ridges generally extend to a considerably greater height above the insulating layer than the a gate electrode.
  • the average height of focusing ridges is at least ten times the average height of a gate electrode.
  • the height of focussing ridges is about 20 to 50 ⁇ m.
  • Field emitters emit electrons at off-normal emission angles when a gate electrode is provided with a suitably positive voltage relative to the field emitter voltage. Emitted electrons move towards phosphor pixels. When struck by these electrons, phosphor pixels emit light.
  • Focusing ridges influence trajectories in such a way that the one-to-one correspondence of phosphor pixels to field emitters is maintained.
  • the phosphors are struck by substantially all of the emitted electrons.
  • the height of scattering shields 38 is sufficient to reduce the number of scattered electrons which escape from a subpixel volume 40.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Claims (67)

  1. Dispositif d'affichage à émission de champ comprenant :
    une plaque faciale (12) comprenant un côté intérieur de plaque faciale avec une région active constituée d'une pluralité d'éléments d'image luminophores (32) ;
    une plaque postérieure (14) comprenant un côté intérieur de plaque postérieure avec une pluralité d'émetteurs de champ (22) ;
    des parois latérales (16) disposées entre la plaque faciale et la plaque postérieure pour former une enveloppe hermétique entre les parois latérales, le côté intérieur de la plaque postérieure et le côté intérieur de la plaque faciale ; le dispositif d'affichage à émission de champ possédant
    au moins une structure interne (42, 20, 44) pour maintenir les positions relatives de la plaque faciale et de la plaque postérieure afin d'aligner une pluralité d'éléments d'image luminophores avec des émetteurs de champ correspondants, la structure interne comprenant une entretoise allongée (20) dans l'enveloppe pour supporter la plaque supérieure et la plaque faciale à l'encontre de forces s'exerçant dans une direction dirigée vers l'enveloppe, ladite entretoise allongée étant une paroi, un segment de paroi, ou un montant, caractérisé en ce que la structure interne comprend en outre un élément de préhension d'entretoise (42).
  2. Dispositif d'affichage à émission de champ selon la revendication 1, dans lequel l'élément de préhension d'entretoise comprend une tranchée de réception (46) pratiquée sur le côté intérieur de la plaque faciale.
  3. Dispositif d'affichage à émission de champ selon la revendication 2, dans lequel la structure interne comprend un élément de positionnement (44) formé sur le côté intérieur de la plaque postérieur.
  4. Dispositif d'affichage à émission de champ selon la revendication 3, dans lequel une première partie de l'entretoise (20) est montée sur le côté intérieur de la plaque faciale dans la tranchée de réception (42, 46) et une partie opposée de la paroi est retenue dans l'élément de positionnement (44) sur le côté intérieur de la plaque postérieure.
  5. Dispositif d'affichage à émission de champ selon la revendication 1, comprenant une grille de matrice de noir (37) disposée adjacente au côté intérieur de la plaque faciale, la grille de matrice de noir comprenant la structure interne et une tranchée de réception (42, 46) qui reçoit l'entretoise (20) et la supporte vis-à-vis de la pluralité d'éléments d'image luminophores.
  6. Dispositif d'affichage à émission de champ selon la revendication 5, dans lequel la matrice de noir est constituée d'un matériau photoconfigurable.
  7. Dispositif d'affichage à émission de champ selon la revendication 6, dans lequel le matériau photoconfigurable est un polyamide.
  8. Dispositif d'affichage à émission de champ selon l'une quelconque des revendications précédentes, dans lequel une extrémité de l'entretoise (20) est fixée à demeure à la plaque faciale.
  9. Dispositif d'affichage à émission de champ selon la revendication 5 ou l'une quelconque rattachée à celle-ci, dans lequel la tranchée de réception (42, 46) est configurée pour redresser l'entretoise.
  10. Dispositif d'affichage à émission de champ selon la revendication 5 ou l'une quelconque rattachée à celle-ci, dans lequel l'entretoise (20) est pratiquement optiquement invisible pour un observateur regardant une surface extérieure de la plaque faciale.
  11. Dispositif d'affichage à émission de champ selon la revendication 5 ou l'une quelconque rattachée à celle-ci, dans lequel la tranchée de réception (42, 46) comprend des parois évasées vers l'intérieur, pour définir une région relativement étroite espacée de la base de la tranchée.
  12. Dispositif d'affichage à émission de champ selon la revendication 11, dans lequel la tranchée de réception (42, 46) présente une largeur identique ou inférieure à une largeur de l'entretoise (20).
  13. Dispositif d'affichage à émission de champ selon l'une quelconque des revendications précédentes, dans lequel l'entretoise (20) possède un coefficient de dilatation thermique différent de la plaque faciale (12).
  14. Dispositif d'affichage à émission de champ selon la revendication 1, dans lequel la structure interne comprend un élément de préhension d'entretoise formé sur le côté intérieur de la plaque postérieure et un élément de positionnement sur le côté interne de la plaque faciale.
  15. Dispositif d'affichage à émission de champ selon l'une quelconque des revendications précédentes, comprenant en outre un fiduciel d'alignement (45, 47).
  16. Dispositif d'affichage à émission de champ selon l'une quelconque des revendications précédentes, dans lequel l'entretoise allongée (20) comporte une paroi d'entretoise ou un segment de paroi.
  17. Procédé de formation d'une structure de plaque postérieure pour un dispositif à émission de champ, comprenant :
    l'apport d'une plaque postérieure (14) avec une surface extérieure et une surface intérieure, la plaque postérieure comprenant un substrat transparent, une pluralité d'électrodes ,opaques, et une surface active définie par une pluralité d'émetteurs de champ (20) formés sur les électrodes opaques ;
    la création d'un élément de positionnement de paroi déformable (44), un motif de concentration de rangée (76) de hauteur h1 et un motif de concentration de colonne (64) de hauteur h2 par des étapes comprenant l'application d'un matériau photoconfigurable (64, 72) pratiquement à toute la surface interne, l'exposition du matériau à un rayonnement UV à travers la surface extérieure, le développement du matériau, et la cuisson de ce dernier ;
    le revêtement du matériau photoconfigurable cuit avec une couche conductrice ; et
    la création d'une électrode de concentration électriquement isolée des électrodes opaques.
  18. Procédé selon la revendication 17, dans lequel h1 est inférieur à ou égal à h2.
  19. Procédé selon la revendication 17, dans lequel h1 est supérieur à ou égal à h2.
  20. Plaque faciale d'un dispositif d'affichage à émission de champ, comprenant :
    un substrat (12) définissant un côté intérieur de plaque faciale ;
    une pluralité d'éléments d'image luminophores (32) disposés sur le côté intérieur de la plaque faciale ;
    une grille de matrice de noir (37) constituée d'une pluralité de bandes de garde de colonne et de rangée sur le côté intérieur de la plaque faciale ; caractérisé en ce que ladite plaque faciale comprend
    un élément de préhension (42, 42a, 42b) formé dans une bande de garde de colonne ou de rangée, l'élément de préhension configuré pour saisir une entretoise allongée (20) et la supporter par rapport aux pluralités d'éléments d'image luminophores.
  21. Plaque faciale selon la revendication 20, dans laquelle l'élément de préhension d'entretoise comprend une tranchée de réception (46).
  22. Plaque faciale selon la revendication 21, dans laquelle la tranchée de réception est disposée adjacente à une pluralité d'intervalles (34) d'absorption de déformation.
  23. Plaque faciale selon la revendication 20, 21 ou 22, dans laquelle la tranchée de réception possède une première partie plus proche du côté intérieur de la plaque faciale qu'une seconde partie et la seconde partie est évasée vers l'intérieur par rapport à la première partie.
  24. Plaque faciale selon la revendication 20, 21 ou 22, dans laquelle la tranchée de réception possède une première extrémité évasée.
  25. Plaque faciale selon la revendication 24, dans laquelle la tranchée de réception comprend en outre une seconde extrémité évasée.
  26. Plaque faciale selon l'une quelconque des revendications 20 à 25, dans laquelle un fiduciel de plaque faciale (45) est formé dans la matrice de noir.
  27. Plaque faciale selon l'une quelconque des revendications 20 à 26, dans laquelle la matrice de noir est constituée d'un matériau photoconfigurable.
  28. Plaque faciale selon l'une quelconque des revendications 20 à 26, dans laquelle la matrice de noir est en polyamide.
  29. Ensemble comprenant une plaque faciale telle que définie dans l'une quelconque des revendications 20 à 28, et une entretoise allongée (20) reçue dans l'élément de préhension d'entretoise, l'entretoise étant une paroi, un segment de paroi, ou un montant.
  30. Ensemble selon la revendication 29, dans lequel l'entretoise (20) est une paroi ou un segment de paroi.
  31. Ensemble selon les revendications 29 ou 30, dans lequel une extrémité de l'entretoise est montée à demeure sur le substrat (12) de la plaque faciale.
  32. Ensemble selon la revendication 29, 30 ou 31, dans lequel l'entretoise est redressée dans l'élément de préhension.
  33. Ensemble selon la revendication 29, 30, 31 ou 32, dans lequel l'entretoise dans l'élément de préhension est pratiquement optiquement invisible pour un observateur regardant une surface extérieure de la plaque faciale.
  34. Ensemble selon l'une quelconque des revendications 29 à 33, comprenant en outre une plaque postérieure ayant un côté intérieur de plaque postérieure (14), l'entretoise étant montée par rapport à un élément de positionnement correspondant (44) formé sur le côté intérieur de la plaque postérieure.
  35. Procédé d'assemblage d'une plaque faciale (12) et d'une plaque postérieure (14) d'un dispositif d'affichage à émission de champ, comprenant :
    a) l'introduction dans un élément de préhension (42) sur un coté intérieur d'une première de la plaque faciale et de la plaque postérieure, d'une extrémité ou bord de l'entretoise allongée (20) sous la forme d'une paroi, d'un segment de paroi ou d'un montant, pour supporter l'entretoise par rapport à celui-ci ; et
    b) introduction d'une extrémité ou bord opposé de l'entretoise dans un élément de positionnement (44) formé sur un côté intérieur de l'autre de la plaque faciale et de la plaque postérieure, pour aligner et maintenir la position de la plaque faciale (12) par rapport à la plaque postérieure (14), pour ainsi aligner une pluralité d'éléments d'image luminophores (32) de la plaque faciale avec des émetteurs de champ correspondants de la plaque postérieure.
  36. Procédé selon la revendication 35, comprenant en outre l'étape de positionnement de la plaque faciale et de la plaque postérieure par des fiduciels d'alignement (45, 47) sur celles-ci, préalablement à l'étape (b).
  37. Procédé de fabrication d'un dispositif d'affichage à émission de champ comprenant le procédé de la revendication 17, 18, 19, 35 ou 36.
  38. Structure de plaque postérieure (14) pour un affichage à émission de champ comprenant :
    un substrat de plaque postérieure transparent ;
    au moins deux électrodes opaques ;
    une pluralité d'électrodes transparentes orthogonales aux électrodes opaques ;
    une pluralité d'émetteurs de champ (22) formés sur les électrodes opaques ;
    une grille de concentration (36) comprenant une surface extérieure et une couche électriquement conductrice disposée sensiblement sur la surface extérieure, la grille de concentration (36) étant alignée sur les électrodes opaques et les électrodes transparentes et électriquement isolée des électrodes transparentes et des électrodes opaques, caractérisée en ce que la grille de concentration (36) comprend un élément de préhension de paroi d'entretoise (42) avec une tranchée de réception (46) adaptée pour recevoir une paroi d'entretoise (20).
  39. Structure selon la revendication 38, dans laquelle le substrat de plaque postérieure est transparent, la structure comprenant en outre :
    une pluralité d'électrodes opaques ;
    une pluralité d'électrodes transparentes orthogonales aux électrodes opaques ;
    une pluralité d'émetteurs de champ (22) formés sur les électrodes transparentes ;
    une électrode de concentration comprenant une surface extérieure et une couche électriquement conductrice disposée sensiblement sur la surface extérieure, l'électrode de concentration étant alignée sur les électrodes transparentes et électriquement isolée des électrodes transparentes et des électrodes opaques ; et un circuit de commande délivrant du courant à l'affichage.
  40. Structure selon la revendication 39 comprenant en outre :
    une pluralité d'éléments de positionnement (44) de paroi d'entretoise formés sur un côté intérieur de la plaque postérieure (14) ;
    une pluralité de nervures déformables disposées dans les éléments de positionnement de paroi (44) dans une direction orthogonale aux éléments de positionnement de paroi (44).
  41. Structure selon la revendication 39, dans laquelle les électrodes transparentes comprennent des sections opaques.
  42. Structure selon la revendication 41, dans laquelle la pluralité d'émetteurs de champ (22) sont formés sur les sections opaques des électrodes transparentes.
  43. Dispositif selon la revendication 1, comprenant en outre :
    une pluralité de sous-éléments d'image luminophores (32) disposés sur le côté intérieur de la plaque faciale (12) ;
    une pluralité d'émetteurs de champ (22) qui émettent des électrons dirigés sur un sous-élément d'image correspondant (32) ; et
    une pluralité d'écrans de dispersion (38) entourant chaque sous-élément d'image (32) et définissant une zone de sous-élément d'image, les écrans de dispersion réduisant le nombre d'électrons dispersés dans la zone de sous-élément d'image s'échappant de la zone de sous-élément d'image, dans lequel la hauteur des écrans de dispersion (38) entourant un sous-élément d'image (32) est suffisante pour réduire le nombre d'électrons dispersés s'échappant de leur zone de sous-élément d'image correspondant et de frapper un sous-élément d'image incorrect (32).
  44. Affichage selon la revendication 43, dans lequel la hauteur des écrans de dispersion (38) entourant un sous-élément d'image (32) est suffisante pour réduire le nombre d'électrons dispersés s'échappant de leur zone de sous-élément d'image correspondante et charger une surface isolante dans l'enveloppe (18).
  45. Dispositif selon la revendication 1, comprenant en outre :
    une pluralité de sous-éléments d'image luminophores disposés sur le côté intérieur de la plaque faciale ;
    une pluralité d'émetteurs de champ (22) émettant des électrons dirigés vers un sons-élément d'image correspondant (32) ;
    une pluralité d'écrans de dispersion (38) entourant chaque sous-élément d'image (32) et définissant une zone de sous-élément d'image, les écrans de dispersion (38) réduisant le nombre d'électrons dispersés dans la zone de sous-élément d'image s'échappant de la zone de sous-élément d'image, dans lequel la hauteur des écrans de dispersion entourant un sous-élément d'image (32) est suffisante pour réduire le nombre d'électrons dispersés s'échappant de leur zone de sous-image correspondante et charger une surface isolante interne dans l'enveloppe (18) ; et
    une gorge de positionnement formée dans une bande de garde de colonne ou de rangée, la gorge de positionnement étant adaptée pour recevoir un support interne de la structure support et la fixer par rapport aux sous-éléments d'image luminophores (32).
  46. Dispositif selon la revendication 45, dans lequel la hauteur des écrans de dispersion (38) entourant un sous-élément d'image (32) est suffisante pour réduire le nombre d'électrons dispersés s'échappant de leur zone de sous-élément d'image correspondante et frappant un élément d'image non correspondant (32).
  47. Dispositif selon la revendication 45, dans lequel la hauteur des écrans de dispersion (38) est d'environ 20 à 200 µm au-delà d'une hauteur des sous-éléments d'image luminophores (32).
  48. Dispositif selon la revendication 45, dans lequel la hauteur des écrans de dispersion (38) est d'environ 20 à 100 µm au-delà d'une hauteur des sous-éléments d'image luminophores (32).
  49. Dispositif selon la revendication 45, dans lequel les sous-éléments d'image luminophores (32) ont une hauteur s'étendant d'environ 1 à 30 µm depuis le côté intérieur de la plaque faciale (12) dans l'enveloppe (18).
  50. Dispositif selon la revendication 49, dans lequel les écrans de dispersion (38) ont une hauteur d'environ 12 µm s'étendant au-delà des sous-éléments d'image luminophores (32).
  51. Dispositif selon la revendication 49, dans lequel les écrans de dispersion (38) ont une hauteur d'environ 25 µm s'étendant au-delà des sous-éléments d'image luminophores (32).
  52. Dispositif selon la revendication 49, dans lequel les écrans de dispersion (38) ont une hauteur d'environ 50 µm s'étendant au-delà des sous-éléments d'image luminophores (32).
  53. Dispositif selon la revendication 49, dans lequel les écrans de dispersion (38) ont une hauteur d'environ 75 µm s'étendant au-delà des sous-éléments d'image luminophores (32).
  54. Dispositif selon la revendication 49, dans lequel les écrans de dispersion (38) ont une hauteur d'environ 100 µm s'étendant au-delà des sous-éléments d'image luminophores (32).
  55. Dispositif selon la revendication 45, dans lequel les écrans de dispersion (38) entourant un sous-élément d'image (32) sont de hauteur suffisante pour réduire le nombre d'électrons dispersés de leur zone de sous-élément d'image correspondante et de charger le support interne.
  56. Dispositif selon la revendication 45, dans lequel les écrans de dispersion (38) sont réalisés en un matériau choisi parmi le groupe constitué de polyamide, métal, verre et céramique.
  57. Dispositif selon la revendication 45, comprenant une interface de verre d'écran de dispersion (38) réalisé en un matériau absorbant optique.
  58. Dispositif selon la revendication 45, dans lequel une tension égale à ou supérieure à 1 kV est appliquée entre la plaque postérieure (14) et la plaque faciale (12).
  59. Dispositif selon la revendication 45, dans lequel une tension égale à ou supérieure à 3 kV est appliquée entre la plaque postérieure (14) et la plaque faciale (12).
  60. Dispositif selon la revendication 43 ou 45, dans lequel une tension égale à ou supérieure à 5 kV est appliquée entre la plaque postérieure (14) et la plaque faciale (12).
  61. Dispositif selon la revendication 43 ou 45, dans lequel une tension égale à ou supérieure à 7 kV est appliquée entre la plaque postérieure (14) et la plaque faciale (12).
  62. Dispositif selon la revendication 43 ou 45, dans lequel une tension appliquée entre la plaque postérieure (14) et la plaque faciale (12) est d'environ 10 kV.
  63. Procédé selon la revendication 17, comprenant en outre :
    l'exposition de la surface interne à un rayonnement UV par l'intermédiaire d'un masque sur un côté interne d'un substrat de plaque postérieure (14).
  64. Procédé selon la revendication 17, dans lequel la couche conductrice est une couche métallique.
  65. Procédé selon la revendication 17, dans lequel l'électrode de concentration est créée en étuvant la plaque postérieure (14).
  66. Procédé selon la revendication 17, dans lequel l'électrode de concentration est créée en cuisant la plaque postérieure (14).
  67. Procédé selon la revendication 17, 63, 64 ou 66, dans lequel l'électrode de concentration présente une configuration de grille.
EP95940804A 1994-11-21 1995-11-20 Dispositif a emission de champs muni de structures interieures permettant d'aligner les pixels de phosphore sur les emetteurs de champ correspondants Expired - Lifetime EP0740846B1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US08/343,075 US5578899A (en) 1994-11-21 1994-11-21 Field emission device with internal structure for aligning phosphor pixels with corresponding field emitters
US343075 1994-11-21
US08/343,074 US5650690A (en) 1994-11-21 1994-11-21 Backplate of field emission device with self aligned focus structure and spacer wall locators
US343803 1994-11-21
US343074 1994-11-21
US08/343,803 US5543683A (en) 1994-11-21 1994-11-21 Faceplate for field emission display including wall gripper structures
PCT/US1995/015226 WO1996016429A2 (fr) 1994-11-21 1995-11-20 Dispositif a emission de champs muni de structures interieures permettant d'aligner les pixels de phosphore sur les emetteurs de champ correspondants

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EP0740846A1 EP0740846A1 (fr) 1996-11-06
EP0740846B1 true EP0740846B1 (fr) 2003-04-16

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JP (1) JP3270054B2 (fr)
AT (1) ATE237869T1 (fr)
AU (1) AU4243596A (fr)
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WO (1) WO1996016429A2 (fr)

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WO1996016429A2 (fr) 1996-05-30
JP3270054B2 (ja) 2002-04-02
EP0740846A1 (fr) 1996-11-06
AU4243596A (en) 1996-06-17
ATE237869T1 (de) 2003-05-15
DE69530373D1 (de) 2003-05-22
WO1996016429A3 (fr) 1996-08-08
JPH10509834A (ja) 1998-09-22
DE69530373T2 (de) 2004-02-12

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