EP0733429A1 - Scie à fil et procédé pour la coupe des plaquettes d'une pièce - Google Patents

Scie à fil et procédé pour la coupe des plaquettes d'une pièce Download PDF

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Publication number
EP0733429A1
EP0733429A1 EP96104480A EP96104480A EP0733429A1 EP 0733429 A1 EP0733429 A1 EP 0733429A1 EP 96104480 A EP96104480 A EP 96104480A EP 96104480 A EP96104480 A EP 96104480A EP 0733429 A1 EP0733429 A1 EP 0733429A1
Authority
EP
European Patent Office
Prior art keywords
wire
measuring
workpiece
sections
wire guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96104480A
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German (de)
English (en)
Other versions
EP0733429B1 (fr
Inventor
Karl Egglhuber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0733429A1 publication Critical patent/EP0733429A1/fr
Application granted granted Critical
Publication of EP0733429B1 publication Critical patent/EP0733429B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Definitions

  • the invention relates to a wire saw for severing wafers from a workpiece, in particular for severing semiconductor wafers from rod-shaped or block-shaped semiconductor material.
  • the invention also relates to a sawing method in which a wire saw according to the invention is used.
  • the feed device effects a relative movement of the wire sections and the workpiece running perpendicular to the axes of rotation of the wire guide rollers in guide grooves.
  • a material-removing sawing aid which is also referred to as "slurry”
  • the wire sections work through the workpiece with the formation of parallel sawing gaps.
  • feed devices are known with which the workpiece is guided against the stationary wire frame, as well as those with which the saw head of the wire saw is guided against the stationary workpiece.
  • several wire frames of a wire saw can also be used to machine several workpieces at the same time.
  • EP-433 956 A1 for example, a wire saw is described with which two workpieces can be sawed simultaneously.
  • each sawn semiconductor wafer has side surfaces which are as flat as possible and are located opposite one another in parallel.
  • the so-called "warp" of the slices is a known measure of the deviation of the actual slice shape from the ideal shape aimed for. As a rule, the "warp" must not exceed a few ⁇ m.
  • Each wire section of the wire frame should therefore ideally be in the flat cutting surface provided for it at any time during the sawing process.
  • the intended cutting surfaces are imaginary surfaces lying parallel to one another, which cross the workpiece and between which the semiconductor wafers to be separated from the workpiece are located.
  • any movement of the wire sections across the intended cutting surfaces has with the result that the shape (geometry) of the semiconductor wafers produced will deviate from the target.
  • the causes that lead to a misalignment of the wire sections in relation to the intended cutting surfaces include, in particular, cutting forces occurring during sawing, which deflect the wire sections from the desired position, axial displacements of the wire guide rollers due to thermal expansion as a result of the heating of the drive of the wire guide rollers, the bearings of the wire guide rollers and the wire guide rollers themselves, and bearing play as a result of the continuous stress on the bearings over a period of a few hours for a sawing operation.
  • the feed device is also a source of error if the feed guide is not manufactured with sufficient precision or if cutting forces cause the feed frame to spring open. In both of the last-mentioned cases, the workpiece is moved transversely to the intended cutting surfaces, which de facto also leads to the wire sections being outside the intended cutting surfaces.
  • the machine frame and the load-bearing parts of the feed device and the saw head are generally designed as heavy and mechanically stable parts, temperature control devices also being provided for their thermal stabilization.
  • the object of the invention is to provide a wire saw and a sawing method with which, in particular, semiconductor wafers with improved geometric quality can be produced.
  • a wire saw for cutting discs from a workpiece with a machine frame, with a feed device, with a roller system combined to form a saw head, consisting of several wire guide rollers, which are connected to bearing spindles and are rotatably supported and at least one of which is driven, and with at least one wire frame used as a sawing tool made of wire sections arranged parallel between two wire guide rollers and perpendicular to the axes of the wire guide rollers are moved around the roller system and work with the aid of the feed device, with the supply of abrasive means and with the formation of a plurality of parallel saw gaps, along the provided cutting surfaces through the workpiece, characterized by a tracking system for tracking the wire sections into the intended cutting surfaces, with at least one measuring device and at least one adjusting device, the measuring device showing an incorrect position of the wire sections in relation to the intended cutting surfaces by measurements of the Distance to a measuring location is determined, the spatial position of which depends on the incorrect position of the wire sections, and the actuating device by
  • a method for separating disks from a workpiece with the aid of a wire saw which is characterized in that an incorrect position of the wire sections in relation to the intended cutting surfaces is determined with the aid of a measuring device by the distance to a measuring location is measured, the spatial position of which is dependent on the incorrect position of the wire sections, and in the event of a deviation of the measured distance from a desired distance, a compensating movement of the wire sections with the aid of an adjusting device or the workpiece is brought, which brings the wire sections into the intended cutting surfaces.
  • a basic idea of the present invention is that movements of the wire sections or of the workpiece, which lead to incorrect positions of the wire sections in relation to the intended cutting surfaces, are determined and compensated for.
  • wire sections get out of the intended cutting surfaces particularly due to heat-induced axial movements of the bearing spindles of the wire guide rollers of the wire frame or the wire guide rollers of the wire frame or due to bearing play.
  • Each of the wire guide rollers of the wire frame is mounted on one side in a fixed bearing and on the opposite side in a floating bearing. When a wire guide roller is heated, it extends from the side of the fixed bearing to the side of the floating bearing. The wire sections that are closer to the fixed bearing move less than the wire sections closer to the floating bearing.
  • movements of the wire sections transverse to the intended cutting surfaces are determined by observing changes in the axial position of the wire guide rollers of the wire frame or their bearing spindles.
  • the amount and direction of a change in position is determined using a distance measurement. It is particularly preferred to determine the changes in position of a wire guide roller of the wire frame in the axial center thereof.
  • the measurement at this point of a wire guide roller provides a very precise, average value for the misalignment of the wire sections in relation to the intended cutting surfaces.
  • a similarly accurate estimate of the misalignment of the wire sections can be obtained by observing changes in the axial position of locations on the axis of the wire guide roller or its bearing spindle, which are at or almost at the level of the first and last wire section of the wire frame.
  • the change in position of a location at the level of the first and the change in location of a location at the level of the last wire section of the wire guide roller is measured and averaged.
  • the resulting measured value shows how far the wire sections have left the intended cutting surfaces on average.
  • only the axial change in position of a location at the level of the first wire section or only the axial change in position of a location at the level of the last wire section or only the axial change in position of the shaft mirror of the bearing spindle can be used.
  • the invention proposes to move the measuring location dependent on axial movements of the wire guide rollers or their bearing spindles onto the surface of a special measuring element.
  • this measuring element is connected to one of the preferred locations mentioned on the axis of the wire guide roller or its bearing spindle, so that any change in position of this location is noticeable by a change in position of the same name of the measuring location.
  • This measuring location on the surface of the measuring element must be easily accessible for distance measurements.
  • the distance from a stationary measuring device to the measuring location is measured.
  • the measuring device is preferably located on the machine frame or is connected to it. Suitable measuring devices are known devices for measuring distance based on an optical, hydraulic, pneumatic, capacitive or inductive measuring principle.
  • the requirement of good accessibility of the measuring location can be met, for example, by the measuring element extending close to the measuring head of the measuring device.
  • a measuring device with an elongated measuring head for example a measuring rod, can be provided, which is brought close to the measuring location and at the tip of which is the sensor measuring the distance.
  • Movements of the workpiece transverse to the intended cutting surfaces are determined by measuring the distance from a measuring device to a measuring location, the spatial position of which is dependent on corresponding movements of the workpiece.
  • the measuring location is preferably on the workpiece, the workpiece holder, for example on the feed housing, or on measuring elements which are connected to the workpiece or the workpiece holder.
  • the amount of misalignment of the wire sections corresponds to the amount of the measured change in distance before and after the movement of the workpiece.
  • suitable measuring devices are also measuring devices which determine the distance to the measuring location by mechanical scanning.
  • Any deviation of the distance determined by a measuring device from a target distance indicates an incorrect position of the wire sections in relation to the intended cutting surfaces.
  • the nominal distance is the distance that is measured when the wire sections are in the intended cutting surfaces are located.
  • Detected deviations of the measured distance from the target distance are transmitted to an actuating device which brings about a compensatory movement of the wire sections or the workpiece.
  • the wire sections are brought into the intended cutting surfaces by the compensating movement.
  • Suitable actuators are known and include, for example, piezoelectric translators, thermal rods and hydraulic, pneumatic, magnetic or mechanical actuators.
  • an adjusting device is provided for each wire guide roller of a wire gate used as a sawing tool, so that each of the wire guide rollers can be caused to perform a compensating movement independently of the other wire guide roller.
  • the saw head does not have to be moved.
  • only one adjusting device is provided with which a compensating movement of the workpiece, the housing of the feed device or the saw head can be brought about.
  • the tracking system can be used to compensate for the movement of a wire guide roller of the wire frame or by counter-rotating Compensating movements of both wire guide rollers of the wire frame bring about a certain orientation of the wire sections with respect to the workpiece.
  • This is of great use, for example, if the workpiece is a crystal rod made of semiconductor material and the intended cutting surfaces are intended to cross the crystal lattice at a certain angle. So that the respective adjusting device can initiate the required compensating movement of the wire guide roller, a target distance must be specified which corresponds to the desired orientation of the wire sections.
  • the goal can also be to produce disks with parallel side faces, the profile of which, however, is not straight, but deviates from a straight line in a predetermined manner, for example curved , wavy or stepped appears.
  • the tracking system of the wire saw enables such specially shaped discs to be manufactured with high precision.
  • the desired distance is intentionally changed during the sawing process in such a way that the actuating device causes the workpiece or the wire sections to make a compensating movement, which brings the wire sections into the intended, in this case non-flat cutting surfaces.
  • the tracking system can be used at the end of a sawing operation after the feed movement has ended to cause the wire sections to move sideways. This makes sense if the wire sections have already penetrated the bar of the workpiece holder on which the workpiece was fixed. Due to the sideways movement, which must at least correspond to the path length between two wire sections, the disks are separated from the rest of the workpiece holder. The loose ones Disks can then be picked up from a provided transport tray.
  • Another advantage of the tracking system is that bearing play, which occurs due to wear of the bearing spindles, can be recognized and remedied at an early stage.
  • the roller system shown in Figure 1 consists of four wire guide rollers 14, around which a finite wire is wound. Between each two wire guide rollers is a wire gate 13, which is formed by a plurality of wire sections arranged in parallel. An arrow indicates that a rod-shaped workpiece 10 is moved against a wire gate 13a used as a sawing tool.
  • the wire guide rollers of this wire gate are provided with the reference number 14a.
  • each wire saw shown in Figures 2 to 5 is equipped with a roller system according to Figure 1. Furthermore, each wire saw has a feed device 18, with which the workpiece 10 fastened to the feed table 9 in a downward feed movement against the wire gate 13a of the roller system is moved. Only one wire guide roller 14a of the wire frame is visible in the side view. All of the following descriptions in connection with this wire guide roller also apply in a corresponding manner to the second wire guide roller of the wire frame in front of it.
  • the wire guide roller 14a is mounted between a fixed bearing 6 and a floating bearing 7.
  • the wire guide roller is connected to the bearings via bearing spindles 19.
  • the fixed bearing 6 is preferably preloaded axial bearings, for example roller bearings preloaded with springs, or hydrostatic bearings.
  • Axial movements of the wire guide roller 14a across the intended cutting surfaces are monitored by a measuring device 2a, which is located on a reference plate 8.
  • the reference plate 8 is attached to the machine frame and is preferably made of a material with a low coefficient of thermal expansion.
  • Another measuring device 2b is fastened on the reference plate 8 above the measuring device 2a.
  • the common fastening on the reference plate ensures that the distance measurements carried out with the measuring devices 2a and 2b only disclose movements of the workpiece and / or the wire sections transverse to the intended cutting surfaces.
  • the measuring head of the measuring device 2b is designed as an elongated measuring rod 3, which extends sideways to close to the measuring rail 5 and at the tip of which is the sensor for distance measurement, not shown in the figures.
  • the measuring rail 5 is fastened parallel to the feed guide on the feed device 18 moved with the workpiece 10. The measuring location for determining an incorrect position of the wire sections is on the side surface 5a of the measuring rail 5.
  • the embodiment according to FIG. 2 is first explained in more detail.
  • the wire guide roller 14a is connected to the bearing spindles 19 by means of flanges 20 and screws 21. Further the wire guide roller is connected in its axial center to a measuring shaft 4a directed towards the measuring device 2a.
  • the measuring shaft used as the measuring element is centered in the hollow bearing spindle 19 by axially elastic guide elements 16 and secured against rotation.
  • the measuring location for determining an incorrect position of the wire sections of the wire gate is located on the end face 4b of the measuring shaft 4a pointing towards the measuring device.
  • the fixed bearing 6 is shown enlarged with the bearing spindle 19.
  • Cooling channels 11 are provided in the bearing spindle, through which a coolant flows, which ensures effective internal cooling of the bearing spindle and partly also of the wire guide roller.
  • the cooling channels 11 preferably have a conical shape which causes the coolant to be flushed through the cooling channels as a result of the rotational movement of the wire guide roller.
  • further cooling channels 12 through which coolant flows are provided on the bearing side.
  • the distance measurement with the measuring device 2b indicates a movement of the workpiece transversely to the intended cutting surfaces because a deviation from the desired distance from the amount ⁇ y is determined
  • the actuating devices 1 of both wire guide rollers 14a become active and, by means of a corresponding power transmission, shift each wire guide roller 14a from the amount ⁇ y.
  • the computer control records the distances measured after the compensating movement with the measuring devices 2a and 2b as new target distances, on which the subsequent distance measurements are based.
  • each wire guide roller 14a is individually axially displaced
  • only one actuating device can be provided with which the entire saw head is moved.
  • the deviations from the respective target distance determined by the measuring devices 2 a are averaged and the mean value is used as the basis for a possible action of the adjusting device.
  • a measuring shaft 4c is provided as the measuring element, which is connected to the wire guide roller 14a in its axial center and fixed in the fixed bearing 6.
  • the measuring location is on the end face 4e of the measuring shaft facing the measuring device 2a.
  • the measuring shaft 4c is centered in the hollow bearing spindle by an axially elastic holding element 16.
  • the actuating device 1 which is shown as a mechanically operating adjusting gear, transmits a force via the fixed bearing 6 and the measuring shaft 4c to the wire guide roller 14a after a determined distance deviation, whereby the wire guide roller is caused to perform an axial compensating movement.
  • the reaction to a detected deviation in the distance of the amount ⁇ x or ⁇ y takes place in the same manner as described above in connection with the embodiment according to FIG. 2.
  • FIG. 1 Another embodiment of the invention is shown in FIG.
  • two measuring disks 4f are provided as measuring elements on each side of the wire guide roller 14a in the immediate vicinity of the first and last wire section of the wire frame.
  • Each measuring disc can be part of the bearing spindle or can be fixed as an independent component between the bearing spindle and the wire guide roller.
  • the measuring disks can be made of a material with a low coefficient of thermal expansion or consist of metal or be coated with metal. Because of the comparatively small thickness of the measuring disks, the result of the distance measurement is practically not adversely affected by thermal expansion of the measuring disks in the axial direction.
  • a measuring device 2a attached to the reference plate 8 belongs to each measuring disk 4f.
  • the measuring point for the distance measurements is located on the side surfaces 4d of the measuring disks facing the measuring devices.
  • the measuring head of the measuring devices is designed as an elongated measuring rod 3 which reaches up to close to side surfaces 4d.
  • the embodiment shown is also equipped with an adjusting device 1 which can bring about movements of the workpiece.
  • the force is introduced by the actuating device onto the housing 17 of the feed device 18.
  • This housing 17 is held on the machine frame 22 by elastic holding elements 15.
  • linear guides can also be provided, along which the feed housing can be moved with the workpiece.
  • the axial movements of the wire guide roller are measured approximately at the level of the first and last wire section.
  • the actuating device will also move the housing of the feed device by the amount ⁇ x.
  • the distances determined after the displacement of the measuring devices 2a and 2b are used as the new target distances in subsequent measuring cycles. If there is a deviation from the amount ⁇ y during the measurement with the measuring device 2b, the adjusting device will bring about a compensating movement of the housing of the feed device by the amount - ⁇ y, so that the original desired distance is reached again.
  • two adjusting devices can be provided, each of which can be used to cause axial movements of the wire guide rollers.
  • a measuring shaft 4g is provided as the measuring element, which is fastened in the hollow bearing spindle at the level of the first wire section and centered by the axially elastic holding element 16.
  • a central screw 23 inserted from the side of the floating bearing 7 holds the wire guide roller 14a and the bearing spindles 19 together.
  • the measuring location is located at the measuring device 2a front end 4h of the measuring shaft 4g.
  • Axial compensation movements of the wire guide roller are brought about after a determined deviation of the measured distance from the target distance from the actuating device 1. The force required for this is introduced into the fixed bearing 6 and transmitted to the wire guide roller 14a via the bearing spindle 19.
  • a determined deviation from the amount ⁇ x is followed by a shift of the wire guide roller by the amount - ⁇ x, so that the original target distance is reached again.
  • the two wire guide rollers 14a of the wire frame 13a are axially displaced by the amount ⁇ y using the adjusting devices 1.
  • FIGS. 2 to 5 are to be regarded as examples by which the subject matter of the invention is not restricted.
  • the number of wire guide rollers used and the wire frames used as a sawing tool can be varied.
  • a feed device moving the saw head can also be realized.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP96104480A 1995-03-23 1996-03-21 Scie à fil et procédé pour la coupe des plaquettes d'une pièce Expired - Lifetime EP0733429B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19510625 1995-03-23
DE19510625A DE19510625A1 (de) 1995-03-23 1995-03-23 Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück

Publications (2)

Publication Number Publication Date
EP0733429A1 true EP0733429A1 (fr) 1996-09-25
EP0733429B1 EP0733429B1 (fr) 1999-01-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP96104480A Expired - Lifetime EP0733429B1 (fr) 1995-03-23 1996-03-21 Scie à fil et procédé pour la coupe des plaquettes d'une pièce

Country Status (6)

Country Link
US (1) US5616065A (fr)
EP (1) EP0733429B1 (fr)
JP (1) JP3010426B2 (fr)
KR (1) KR0171513B1 (fr)
DE (2) DE19510625A1 (fr)
TW (1) TW353781B (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0837115A1 (fr) * 1996-10-17 1998-04-22 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Suspension de sciage et procédé pour couper des plaquettes d'un cristal
EP0875325A1 (fr) * 1997-04-24 1998-11-04 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Scia à fil, dispositif de montage et unité d'entretien d'un ensemble de rouleau de guidage d'un fil de sciage, et procédé pour changer un ensemble de rouleau de guidage d'un fil de sciage
EP1004383A1 (fr) * 1998-11-25 2000-05-31 Meyer & Burger AG Rouleau de guidage du fil de sciage dans une scie à fil à système de refroidissement
US6098610A (en) * 1997-07-10 2000-08-08 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Wire saw and method of using it
CH696389A5 (de) * 2002-02-19 2007-05-31 Meyer & Burger Ag Maschf Drahtsäge.
WO2010109141A1 (fr) * 2009-03-27 2010-09-30 Jean-Pierre Medina Procede et machine de fabrication d'un semi-conducteur, du type cellule photovoltaïque ou composant electronique similaire
DE102011084454B3 (de) * 2011-10-13 2013-01-17 Solarworld Innovations Gmbh Drahtführungsrolle
CN102039638B (zh) * 2009-10-26 2013-04-24 英利能源（中国）有限公司 一种利用切割线切割基片的切割方法
EP2638999A1 (fr) * 2012-03-14 2013-09-18 Siemens Aktiengesellschaft Agencement de scie à fil
EP2422942B1 (fr) * 2010-08-27 2014-04-30 Gambini International S.A. Système de coupe pour des rouleaux de matériau en bande, en particulier papier
CN104416686A (zh) * 2013-08-21 2015-03-18 应用材料瑞士有限责任公司 具有传感器布置的丝锯装置和监控丝锯装置操作的方法
CN107283012A (zh) * 2017-06-20 2017-10-24 陈壮壮 一种可调式线切割加工辊
CN108407116A (zh) * 2018-03-30 2018-08-17 青岛高测科技股份有限公司 并线检测装置、方法及包括该并线检测装置的金刚线切片机

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JP2885270B2 (ja) * 1995-06-01 1999-04-19 信越半導体株式会社 ワイヤーソー装置及びワークの切断方法
CH691673A5 (de) * 1995-09-08 2001-09-14 Tokyo Seimitsu Co Ltd Vorrichtung zur Erfassung eines Drahtführungsfehlers an einer Drahtsäge.
CH691036A5 (fr) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Dispositif de sciage par fil pour la découpe de tranches fines comprenant un mécanisme pour le taillage in situ des gorges des cylindres guide-fils.
US5937844A (en) * 1996-03-26 1999-08-17 Shin-Etsu Handotai Co., Ltd. Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing
JPH09286021A (ja) * 1996-04-22 1997-11-04 Komatsu Electron Metals Co Ltd 半導体インゴットの切断方法
US6024080A (en) * 1997-07-07 2000-02-15 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US6279564B1 (en) 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
KR20010021539A (ko) * 1997-07-07 2001-03-15 존 비. 호드스덴 다이아몬드 함유 와이어를 이용하여 작업물을 얇게절단하기 위한 장치 및 방법
US5878737A (en) * 1997-07-07 1999-03-09 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
DE19732719B4 (de) * 1997-07-30 2007-05-31 Heraeus Quarzglas Gmbh & Co. Kg Seilsäge
US6065462A (en) * 1997-11-28 2000-05-23 Laser Technology West Limited Continuous wire saw loop and method of manufacture thereof
JPH11179644A (ja) * 1997-12-16 1999-07-06 Tokyo Seimitsu Co Ltd ワイヤソー
US6102024A (en) * 1998-03-11 2000-08-15 Norton Company Brazed superabrasive wire saw and method therefor
AU2000251024A1 (en) 2000-05-31 2001-12-11 Memc Electronic Materials S.P.A. Wire saw and process for slicing multiple semiconductor ingots
US6352071B1 (en) 2000-06-20 2002-03-05 Seh America, Inc. Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
DE10159832A1 (de) * 2001-12-06 2003-06-26 Wacker Siltronic Halbleitermat Halbleiterscheibe aus Silicium und Verfahren zu deren Herstellung
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EP2638999A1 (fr) * 2012-03-14 2013-09-18 Siemens Aktiengesellschaft Agencement de scie à fil
CN104416686A (zh) * 2013-08-21 2015-03-18 应用材料瑞士有限责任公司 具有传感器布置的丝锯装置和监控丝锯装置操作的方法
CN107283012A (zh) * 2017-06-20 2017-10-24 陈壮壮 一种可调式线切割加工辊
CN107283012B (zh) * 2017-06-20 2018-12-21 绍兴市上虞舜东橡塑制品有限公司 一种可调式线切割加工辊
CN108407116A (zh) * 2018-03-30 2018-08-17 青岛高测科技股份有限公司 并线检测装置、方法及包括该并线检测装置的金刚线切片机

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TW353781B (en) 1999-03-01
DE59601098D1 (de) 1999-02-18
EP0733429B1 (fr) 1999-01-07
US5616065A (en) 1997-04-01
JPH08267446A (ja) 1996-10-15
DE19510625A1 (de) 1996-09-26

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