EP0714774B1 - Verfahren zur Herstellung micromechanischer Düsen oder Flüssigkeitsstrahlen - Google Patents

Verfahren zur Herstellung micromechanischer Düsen oder Flüssigkeitsstrahlen Download PDF

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Publication number
EP0714774B1
EP0714774B1 EP95402686A EP95402686A EP0714774B1 EP 0714774 B1 EP0714774 B1 EP 0714774B1 EP 95402686 A EP95402686 A EP 95402686A EP 95402686 A EP95402686 A EP 95402686A EP 0714774 B1 EP0714774 B1 EP 0714774B1
Authority
EP
European Patent Office
Prior art keywords
substrate
nozzles
coating
formation
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95402686A
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English (en)
French (fr)
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EP0714774A1 (de
Inventor
Yves Fouillet
Gilles Delapierre
Marie-Thérèse Delaye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
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Publication date
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Publication of EP0714774A1 publication Critical patent/EP0714774A1/de
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Publication of EP0714774B1 publication Critical patent/EP0714774B1/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Definitions

  • the present invention relates to a method of micromechanical manufacture of nozzles for jets of liquid. It applies to all systems using high precision liquid jets in the field medical, biology or even printing, for example.
  • the invention applies to particular to the manufacture of nozzles for heads drip or jet inkjet printers continued.
  • the achieving inkjet nozzles is a step decisive insofar as it conditions quality of printing. Also, to make the nozzles do we have use of techniques known in microelectronics.
  • the document (1) referenced to the end of this description describes a method of precise manufacture of circular nozzles by engraving holes in an orientation silicon wafer crystal clear ⁇ 100 ⁇ .
  • Document (2) referenced at the end of the present description, relates to a process similar for manufacturing on the same substrate a plurality of nozzles. These nozzles allow the formation of liquid jets perpendicular to the plane of the substrate in which they are formed.
  • Methods of machining fine grooves using surface of an orientation silicon wafer crystalline ⁇ 100 ⁇ and ⁇ 110 ⁇ , presented in the document (1) can also be used for the manufacture of nozzles including the liquid ejection axis is parallel to the substrate wafer.
  • One or more grooves 10 are engraved on the surface 12 of a first substrate 14.
  • a second substrate 16 is sealed on the first substrate 14 of so as to cover the grooves 10 and thus form canals.
  • the whole of the first and second substrates is then cut perpendicular to the grooves 10 to open the channels and form nozzles 18 which lead to the cut face 20 represented by a broken line.
  • One or more reservoirs 22 are also provided, in connection with one or more nozzles 18 to feed them with a liquid, such as ink for example.
  • a print head also has active elements such as electrodes or piezoelectric printing control elements which for reasons of simplification do not appear not in the figure.
  • the etching of the grooves in the substrate 14 and sealing the second substrate on the first substrate are well-controlled operations currently and therefore pose no problem particular.
  • the cutting of the substrates is, in known manner, produced by means of blades machining the substrates, in this case silicon, by pulling out material.
  • Cutting substrates poses two major problems illustrated in FIG. 2 which is a view, on a larger scale scale, from face 20 after cutting.
  • the first problem is due to dust 22 which result from cutting and which pollute the interior of the nozzles 18 and which can, in certain case, form a plug obstructing the nozzles 18. A delicate cleaning of the nozzles, after cutting, turns out thus necessary.
  • a second problem is due to the training of scales 24 on the intersection edges 26 of the plane for cutting the face 20 and the nozzles 18. These scales have detrimental effects on the quality of the jets.
  • the scales entrain dispersions in the direction of the jets as well as instabilities that can modify dynamic behavior jets.
  • the size of the scales depends on the conditions of cutting.
  • the document (4) referenced at the end of the present description describes on this subject a method for minimize the size of the scales.
  • the outlet face at the nozzles is obtained by a first cut with a resin-based blade 100 to 250 ⁇ m (4 to 10 mils) thick and having a rotation speed of 32,000 to 45,000 rpm.
  • the complete cutting of the two substrates is carried out with a standard blade, but thinner than the previous one.
  • the improvement proposed by the document is therefore not sufficient. This is for example the case of printers with continuous ink jets.
  • Polishing operations on the face of cutting can possibly be considered.
  • the outlet plan of the nozzles corresponds to a crystal plane ⁇ 111 ⁇ of the machined silicon by anisotropic chemical etching of an oriented substrate according to ⁇ 110 ⁇ . A second precut substrate is then aligned with the nozzle outlet plane.
  • This solution has the advantage of not carrying out the plan nozzle outlet by sawing. Because of the laws of silicon etching it is however impossible in this case of having jets perpendicular to the plane of outlet of the nozzles if they are produced by a anisotropic attack. In the article cited above, the nozzles are produced by isotropic etching, we know that the quality is lower than that of a anisotropic etching.
  • An object of the present invention is, by therefore, to propose a manufacturing process micromechanics of high precision nozzles which does not have the aforementioned disadvantages of the processes known.
  • Another object of the invention is to propose a process which allows the manufacture of nozzles whose edges with the liquid ejection face are devoid of scales.
  • the imperfections and the scales that occur during the cutting operation occur in the protective coating inside and are disposed of at the same time as this coating leaving a clean nozzle.
  • the method of the invention therefore makes it possible to manufacture nozzles with perfect spray quality whatever the cutting mode.
  • Cutting mode and / or the thickness of the coating are chosen so that the size of the scales is smaller than the thickness of the coating; The coating thus fills its role in protecting the nozzle.
  • the first substrate is an orientation slice crystal ⁇ 100 cristall and, during step a) of the process, we form of grooves by anisotropic etching with stop on ⁇ 111 ⁇ planes of the crystal lattice of the first substrate.
  • the first and second substrates can be chosen from identical or different materials. However, according to a preferential implementation of the process, the first and the second substrate are in silicon.
  • the coating made of silicon oxide, can be removed in a hydrofluoric acid bath.
  • This structure is subjected for example to a bath potassium hydroxide, symbolized by arrows, to carry out anisotropic etching of grooves 110.
  • the engraving time is chosen sufficient to get grooves by stop on two planes crystallographic ⁇ 111 ⁇ of the crystal lattice of silicon. This allows to exploit the perfect quality geometric crystal orientations.
  • the tank can, depending on a variant also be performed directly in the first substrate.
  • the layer 130 of silicon nitride is eliminated and the surfaces 112, 112 'to be sealed respectively substrates undergo a bath which makes them hydrophilic.
  • the two substrates After rinsing and drying, the two substrates are sealed directly. They are positioned then pressed together to get the structure shown in Figure 4 where the second substrate covers the grooves to form channels.
  • a first heat treatment is carried out to create chemical bonds at the 112 interface, 112 'between the two substrates 114 and 116 and for thus ensuring good mechanical behavior of all.
  • a coating protection in the canal It is in the example described of a layer of silicon oxide 138 obtained by heat treatment under a flow oxygen. Such an oxidation treatment allows a precise control of the thickness of layer 138. For allow this oxidation, an access port to channels should be provided. This is for example a orifice 140 of the reservoir 122. The thickness of the layer 138 must be sufficient to avoid scales in silicon. A thickness of the order of 1 to 4 ⁇ m is suitable in the example described.
  • the process continues by cutting the substrates assembled, perpendicular to the channels, to form nozzles 118 which open on one side 120.
  • This surface and the cutting line are shown in broken lines in Figure 4.
  • the cutting is carried out for example by a resin blade diamond.
  • This operation also defines the length of the nozzles which, depending on the application envisaged, results from a compromise between the problems hydraulic pressure drop of the liquid jets and stability and accuracy issues in the direction of the jets.
  • FIG. 5 shows the face 120 of the substrates after cutting.
  • a nozzle 118 and the oxide layer 138 which forms the coating of interior protection.
  • the layer extends over the face 112 ′ of the substrate 116 delimiting the nozzle and on the faces corresponding to the crystallographic planes ⁇ 111 ⁇ of the substrate 114.
  • scales 124 are formed on layer 138 and 122 silicon oxide dust is deposited in the nozzle 118.
  • the cut structure is finally immersed in a hydrofluoric acid bath which not only removes the oxide layer 138 but also all the dust 122.
  • a hydrofluoric acid bath which not only removes the oxide layer 138 but also all the dust 122.
  • a nozzle 118 whose opening on the face 120 is perfectly net.
  • the initial depth of grooves and the thickness of the coating layer are determined so as to obtain, after elimination of this layer a nozzle whose hydraulic diameter corresponds to the envisaged application.
  • This hydraulic diameter is for example of the order of a few tens of micrometers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Nozzles (AREA)

Claims (6)

  1. Verfahren zur Herstellung mikromechanischer Düsen für Flüssigkeitsstrahlen, folgende Schritte umfassend:
    a) Bilden von wenigstens einer Rinne (110) in der Oberfläche (112) eines ersten Substrats (114),
    b) Zusammenfügen des ersten Substrats (114) mit einem die Rille (110) überdeckenden zweiten Substrat (116), um wenigstens einen Kanal zu bilden, und, der Reihe nach:
    c) Bilden eines Innenschutzüberzugs (138) des Kanals,
    d) Durchschneiden des ersten (114) und des zweiten (116) Substrats senkrecht zum Kanal, um wenigstens eine Düse (118) für einen Flüssigkeitsstrahl zu bilden,
    e) Entfernen des Innenschutzüberzugs (138).
    dadurch gekennzeichnet,
    daß die Bildung des Schutzüberzugs (138) durch thermische Oxidation der Kanalwände erfolgt.
  2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß man außerdem eine Öffnung (140) und/oder einen Speicher (122) zur Versorgung jeder Düse (118) in wenigstens einem der genannten Substrate (116, 118) herstellt.
  3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß man, wobei das erste Substrat eine Scheibe der Orientierung 〈100〉 ist, während des Schritts a) Rinnen (110) bildet, durch anisotrope Ätzung mit Anhalten auf den Flächen 〈111〉 des Kristallgitters des ersten Substrats (114).
  4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das erste (114) und das zweite (116) Substrat aus Silicium sind.
  5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß man den Innenschutzüberzug (138), der durch Siliciumoxid gebildet wird, in einem Fluorwasserstoffsäure-Bad entfernt.
  6. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß man während des Schritts a) auf einer Fläche (112) des ersten Substrats eine Schicht (130) aus Siliciumnitrid bildet, in dieser Schicht entsprechend der Richtung 〈110〉 orientierte, die Lage der Rillen (110) definierende Längsöffnungen (132) herstellt, das erste Substrat einem Kaliumhydroxid-Bad unterzieht, um eine anisotrope Ätzung durchzuführen, und dann nach der Ätzung die Siliciumnitridschicht entfernt.
EP95402686A 1994-12-01 1995-11-29 Verfahren zur Herstellung micromechanischer Düsen oder Flüssigkeitsstrahlen Expired - Lifetime EP0714774B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9414461A FR2727648B1 (fr) 1994-12-01 1994-12-01 Procede de fabrication micromecanique de buses pour jets de liquide
FR9414461 1996-11-26

Publications (2)

Publication Number Publication Date
EP0714774A1 EP0714774A1 (de) 1996-06-05
EP0714774B1 true EP0714774B1 (de) 1998-07-08

Family

ID=9469382

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95402686A Expired - Lifetime EP0714774B1 (de) 1994-12-01 1995-11-29 Verfahren zur Herstellung micromechanischer Düsen oder Flüssigkeitsstrahlen

Country Status (5)

Country Link
US (1) US5781994A (de)
EP (1) EP0714774B1 (de)
JP (1) JPH08216415A (de)
DE (1) DE69503340T2 (de)
FR (1) FR2727648B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2845813B2 (ja) * 1996-06-17 1999-01-13 新潟日本電気株式会社 静電式インクジェット記録ヘッドの製造方法
FR2761199B1 (fr) 1997-03-21 1999-04-16 Commissariat Energie Atomique Procede de realisation de deux cavites communicantes dans un substrat en materiau monocristallin par gravure chimique anisotrope
CH694453A5 (de) * 1998-07-24 2005-01-31 Genspec Sa Mikromechanisch hergestellte Düse zur Erzeugung reproduzierbarer Tröpfchen.
FR2790092B1 (fr) 1999-02-24 2001-03-30 Commissariat Energie Atomique Procede de determination d'un analyte present dans une solution
US6150277A (en) * 1999-08-30 2000-11-21 Micron Technology, Inc. Method of making an oxide structure having a finely calibrated thickness
SE0004594D0 (sv) * 2000-12-12 2000-12-12 Gyros Ab Microscale nozzie
US7111401B2 (en) * 2003-02-04 2006-09-26 Eveready Battery Company, Inc. Razor head having skin controlling means
GB2410464A (en) 2004-01-29 2005-08-03 Hewlett Packard Development Co A method of making an inkjet printhead
JP4639718B2 (ja) * 2004-09-22 2011-02-23 セイコーエプソン株式会社 液体噴射ヘッドの圧力発生室形成板製造装置、液体噴射ヘッドの圧力発生室形成板製造方法及び液体噴射ヘッド
JP4636378B2 (ja) * 2005-09-16 2011-02-23 富士フイルム株式会社 液体吐出ヘッドおよびその製造方法
FR2930457B1 (fr) * 2008-04-24 2010-06-25 Commissariat Energie Atomique Procede de fabrication de microcanaux reconfigurables

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US4106976A (en) * 1976-03-08 1978-08-15 International Business Machines Corporation Ink jet nozzle method of manufacture
EP0042932A3 (de) * 1980-06-30 1984-07-25 International Business Machines Corporation Verfahren zur Herstellung hohler rohrartiger Körper
JPS603267A (ja) * 1983-06-20 1985-01-09 Fujitsu Ltd フアクシミリのポ−リング方式
JPS6018352A (ja) * 1983-07-12 1985-01-30 Ricoh Co Ltd インクジエツトヘツドの製造方法
JPS6032673A (ja) * 1983-08-03 1985-02-19 Seiko Epson Corp インクジェットヘッドの製造方法
US4601777A (en) * 1985-04-03 1986-07-22 Xerox Corporation Thermal ink jet printhead and process therefor
US4612554A (en) * 1985-07-29 1986-09-16 Xerox Corporation High density thermal ink jet printhead
US4639748A (en) * 1985-09-30 1987-01-27 Xerox Corporation Ink jet printhead with integral ink filter
US4863560A (en) * 1988-08-22 1989-09-05 Xerox Corp Fabrication of silicon structures by single side, multiple step etching process
US4878992A (en) 1988-11-25 1989-11-07 Xerox Corporation Method of fabricating thermal ink jet printheads
US4899181A (en) * 1989-01-30 1990-02-06 Xerox Corporation Large monolithic thermal ink jet printhead
JPH037349A (ja) * 1989-06-05 1991-01-14 Canon Inc インクジェット記録ヘッドの吐出口形成方法
US4961821A (en) * 1989-11-22 1990-10-09 Xerox Corporation Ode through holes and butt edges without edge dicing
US5160577A (en) * 1991-07-30 1992-11-03 Deshpande Narayan V Method of fabricating an aperture plate for a roof-shooter type printhead
US5160403A (en) * 1991-08-09 1992-11-03 Xerox Corporation Precision diced aligning surfaces for devices such as ink jet printheads
JP2960608B2 (ja) * 1992-06-04 1999-10-12 キヤノン株式会社 液体噴射記録ヘッドの製造方法
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
JP3132291B2 (ja) * 1993-06-03 2001-02-05 ブラザー工業株式会社 インクジェットヘッドの製造方法
US5620614A (en) * 1995-01-03 1997-04-15 Xerox Corporation Printhead array and method of producing a printhead die assembly that minimizes end channel damage

Also Published As

Publication number Publication date
EP0714774A1 (de) 1996-06-05
FR2727648B1 (fr) 1997-01-03
JPH08216415A (ja) 1996-08-27
DE69503340T2 (de) 1999-02-11
FR2727648A1 (fr) 1996-06-07
DE69503340D1 (de) 1998-08-13
US5781994A (en) 1998-07-21

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