EP0713929A1 - Stiftfreie Dünnschicht für eine permanente Form für eine Düsenöffnungsplatte - Google Patents

Stiftfreie Dünnschicht für eine permanente Form für eine Düsenöffnungsplatte Download PDF

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Publication number
EP0713929A1
EP0713929A1 EP95307490A EP95307490A EP0713929A1 EP 0713929 A1 EP0713929 A1 EP 0713929A1 EP 95307490 A EP95307490 A EP 95307490A EP 95307490 A EP95307490 A EP 95307490A EP 0713929 A1 EP0713929 A1 EP 0713929A1
Authority
EP
European Patent Office
Prior art keywords
mandrel
layer
titanium
photoresist layer
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95307490A
Other languages
English (en)
French (fr)
Other versions
EP0713929B1 (de
Inventor
John W. Wolff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak Versamark Inc
Original Assignee
Kodak Versamark Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodak Versamark Inc filed Critical Kodak Versamark Inc
Publication of EP0713929A1 publication Critical patent/EP0713929A1/de
Application granted granted Critical
Publication of EP0713929B1 publication Critical patent/EP0713929B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms

Definitions

  • the present invention relates to the field of electroplating and, more particularly, to the field of manufacturing orifice plate mandrels using thin film processes.
  • electrically conductive ink is supplied under pressure to a manifold region that distributes the ink to a plurality of orifices, typically arranged in a linear array(s).
  • the ink discharges from the orifices in filaments which break into droplet streams.
  • Individual droplet streams are selectively charged in the region of the break off from the filaments and charge drops are deflected from their normal trajectories. The deflected drops may be caught and recirculated, and the undeflected drops allowed to proceed to a print receiving medium.
  • Drops are charged by a charge plate having a plurality of charging electrodes along one edge, and a corresponding plurality of connecting leads along one surface.
  • the edge of the charge plate having the charging electrodes is placed in close proximity to the break off point of the ink jet filaments, and charges applied to the leads to induce charges in the drops as they break off from the filaments.
  • the prior art method for producing orifice plates utilizes a conductive brass mandrel in which photoresist orifice pegs are applied.
  • Metal mandrels are comparatively poor in quality due to surface scratches and defects inherent in metal substrates.
  • Photoresist thickness variation is another degrading factor in this technique which, combined with the low quality brass substrate, produces an inferior orifice plate.
  • Another disadvantage to this method is the hazardous waste generated from etchants, strippers and dissolved metals into waste streams. Furthermore, the non-reusability of this mandrel makes this process extremely expensive.
  • U.S. Pat. No. 3,703,450 describes a method for making a precision conductive mesh screen.
  • This method constructs a mandrel.
  • the prior art mandrel is constructed by placing a master plate with the screen pattern on the glass substrate and by vapor depositing a thin film through the interstices of the master plate to form the screen's pattern on the glass.
  • the method deposits photoresist over the entire glass plate.
  • the method exposes and develops the photoresist to produce a layer of thin film in a screen pattern covered with a layer of photoresist in the same screen pattern.
  • the method deposits silicon monoxide on the entire glass substrate and removes the silicon monoxide and photoresist from the thin film pattern.
  • This nonreusable mandrel is now ready for manufacturing the screen.
  • This prior art mandrel has several disadvantages. It cannot manufacture small geometry devices as pointed out in U.S. Pat. No. 4,549,939 discussed below. Also, the complicated prior art process for making this mandrel has low yields.
  • U.S. Pat. No. 4,549,939 describes another prior art thin film mandrel and the method of making it.
  • This prior art process constructs the prior art mandrel by forming a stained pattern shield on a glass substrate and depositing a conductive and transparent thin film onto the substrate.
  • the prior art method coats the thin film with resist and shines a light through the glass substrate and the transparent thin film to expose the unshielded photoresist.
  • the photoresist is developed and forms the mold for electroforming.
  • the prior art mandrel formed by this process has several disadvantages. It is non-reusable and of poor quality due to resist broken after the use of a conductive thin film that is transparent; a costly and exotic material.
  • U.S. Pat. No. 4,528,577 describes another prior art mandrel and the method of making it.
  • This prior art method of manufacturing orifice plates for thermal ink jet printheads electroforms nickel onto a stainless steel mandrel plate that contains either a re-etched orifice pattern or a photoresist orifice pattern.
  • stainless steel mandrel plates always contain a large number of scratches and defects. These scratches and defects arise from characteristics of the stainless steel material and from the manufacturing process. The scratches and defects, which can not be eliminated, degrade the quality of the orifice plates manufactured from stainless steel mandrels. These inferior orifice plates produce inferior print quality.
  • the method and apparatus in accordance with the present invention obviate these problems with mandrels in the prior art.
  • the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate.
  • Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects and pinholes, and is dimensionally unstable.
  • a mandrel is used in the manufacture of an ink jet orifice plate.
  • the mandrel comprises a glass substrate and an etched Titanium-Tungsten layer having a thickness of approximately 2000 ⁇ to 5000 ⁇ residing on the substrate.
  • a method of making a mandrel for an ink jet orifice plate comprises the steps of sputter depositing a 2000 ⁇ to 5000 ⁇ thick layer of Titanium-Tungsten on a substrate, and then depositing a photoresist layer on the Titanium-Tungsten layer in a spin coater, i.e., using a spin coating process.
  • the photoresist layer is cured, and a patterned photomask is positioned on the photoresist layer.
  • the photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer.
  • the next step is to plasma etch the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold. Finally, the remaining photoresist layer is stripped to complete construction of the mandrel.
  • the manufacturing of high quality precision orifice plates is highly desirable for inkjet printheads.
  • One method to accomplish this is by using a thin film pegless (void in the conductive layer) reusable mandrel.
  • the mandrel is manufactured by sputtering, or sputter etching, or reactive ion etching a conductive thin film metal such as Titanium/Tungsten onto a smooth substrate such as glass.
  • a standard photolithographic process is used to define an appropriate orifice plate pattern in the photoresist.
  • the unprotected thin film Titanium/Tungsten within the photoresist pattern is removed by a plasma etching process.
  • the photoresist is then removed from the conductive thin film and the mandrel can be electroplated to produce orifice plates.
  • This method produces a pegless thin film mandrel that can be manufactured using standard photolithographic and plasma etching techniques that yield a high resolution mandrel in which orifice plates can be produced.
  • the electroformed orifice plates can be reproduced and have the identical high resolution characteristics of the pegless thin film mandrel taking advantage of the dimensional stability.
  • the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate.
  • Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects, pinholes and dimensionally unstable.
  • the pegless mandrel exposes the defect free glass substrate that is not compromised by previous manufacturing processes.
  • the mandrel of the present invention is unique because of the use of Titanium-Tungsten as the conductive layer, and also because the mandrel can be plasma etched to define the conductive film mold. Plasma etching allows for the voids in the conductive layer to be of high resolution.
  • Fig. 1A is a top view of a plasma etched thin film permanent mandrel 10 with a patterned orifice 12.
  • Fig. 1B illustrates a side view of the plasma etched thin film permanent mandrel 10.
  • Fig. 1C is a top view of a nickel plated thin film permanent mandrel 10', with a patterned orifice 12'.
  • Figs. 2A-2H The process for manufacturing the thin film pegless orifice plate mandrel 10 or 10' of the present invention is best illustrated in Figs. 2A-2H.
  • the process starts with a glass substrate or silicon wafer, or a polished silicon wafer, or a plastic, or any smooth, nonconducting surface 14, as shown in Fig. 2A.
  • a conductive thin film metal 16 is deposited on the glass substrate 14 by a suitable process such as a sputter etching process or reactive ion etching process.
  • the thin film is typically constructed from a Titanium/Tungsten material. However, alternate embodiments could use different conductive materials.
  • a photoresist layer 18 is applied atop the Titanium/ Tungsten layer.
  • the photoresist layer 18 is then exposed to actinic radiation and developed to produce the orifice pattern.
  • the Titanium-Tungsten layer is plasma etched to define the orifice mold.
  • the photoresist layer 18 is removed, allowing the thin film permanent mandrel to be nickel plated, with nickel plating layer 20, as shown in Fig. 2G.
  • the nickel orifice plate 20 is removed from the thin film permanent mandrel, allowing the mandrel to be reused, with no additional preparation.
  • the mandrel comprises a glass substrate 14 with an etched Titanium-Tungsten layer 16 residing on the substrate.
  • the Titanium-Tungsten layer 16 typically has a thickness of approximately 2000 ⁇ to 5000 ⁇ .
  • the mandrel is manufactured by sputter depositing the 2000 ⁇ to 5000 ⁇ thick layer 16 of Titanium-Tungsten on the substrate 14, and then depositing a photoresist layer 18 on the Titanium-Tungsten layer 16, using a spin coating process.
  • the photoresist layer 18 is cured, and a patterned photomask is positioned on the photoresist layer.
  • the photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer 18.
  • the next step is to plasma etch the Titanium-Tungsten layer 16, such as with a Halogen containing gas, to form an etched conducting film mold.
  • the remaining photoresist layer is stripped to complete construction of the mandrel.
  • the present invention is useful in the field of ink jet printing, and has the advantage of providing an improved mandrel.
  • the present invention provides the further advantage of providing a reusable thin film pegless permanent orifice plate mandrel.
  • the advantage of providing a reusable thin film pegless permanent orifice plate mandrel is that from a single mandrel numerous orifice plates can be produced. This has the further advantage of reducing the cost of fabricating orifice plates compared to conventional methods such as metal mandrels with photoresist pegs that are limited to producing a single orifice plate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
EP19950307490 1994-10-28 1995-10-20 Stiftfreie Dünnschicht für eine permanente Form für eine Düsenöffnungsplatte Expired - Lifetime EP0713929B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US331060 1981-12-15
US33106094A 1994-10-28 1994-10-28

Publications (2)

Publication Number Publication Date
EP0713929A1 true EP0713929A1 (de) 1996-05-29
EP0713929B1 EP0713929B1 (de) 1999-03-31

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EP19950307490 Expired - Lifetime EP0713929B1 (de) 1994-10-28 1995-10-20 Stiftfreie Dünnschicht für eine permanente Form für eine Düsenöffnungsplatte

Country Status (3)

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EP (1) EP0713929B1 (de)
CA (1) CA2161516A1 (de)
DE (1) DE69508705T2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0888892A3 (de) * 1997-07-03 2000-06-14 Canon Kabushiki Kaisha Düsenplatte und Herstellungsverfahren, für ein Ausstossgerät
EP0999058A3 (de) * 1998-11-03 2001-02-28 Samsung Electronics Co., Ltd. Anordnung einer Düsenplatte für eine Mikrospritzvorrichtung und Verfahren zur Herstellung derselben
EP1332879A1 (de) * 2002-01-31 2003-08-06 Scitex Digital Printing, Inc. Dorn mit kontrollierter Freisetzungsschicht für durch Elektroformung hergestellte mehrschichtige Tintenstrahlöffnungsplatte
CN109216405A (zh) * 2017-06-30 2019-01-15 苏州苏大维格光电科技股份有限公司 Amoled用金属掩膜板的制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3703450A (en) 1971-04-01 1972-11-21 Dynamics Res Corp Method of making precision conductive mesh patterns
US4528577A (en) 1982-11-23 1985-07-09 Hewlett-Packard Co. Ink jet orifice plate having integral separators
US4549939A (en) 1984-04-30 1985-10-29 Ppg Industries, Inc. Photoelectroforming mandrel and method of electroforming
EP0273552A2 (de) * 1986-10-30 1988-07-06 Hewlett-Packard Company Verfahren zur Herstellung von Matrizen für Plattierungsverfahren
US5149419A (en) * 1991-07-18 1992-09-22 Eastman Kodak Company Method for fabricating long array orifice plates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3703450A (en) 1971-04-01 1972-11-21 Dynamics Res Corp Method of making precision conductive mesh patterns
US4528577A (en) 1982-11-23 1985-07-09 Hewlett-Packard Co. Ink jet orifice plate having integral separators
US4549939A (en) 1984-04-30 1985-10-29 Ppg Industries, Inc. Photoelectroforming mandrel and method of electroforming
EP0273552A2 (de) * 1986-10-30 1988-07-06 Hewlett-Packard Company Verfahren zur Herstellung von Matrizen für Plattierungsverfahren
US4773971A (en) 1986-10-30 1988-09-27 Hewlett-Packard Company Thin film mandrel
US5149419A (en) * 1991-07-18 1992-09-22 Eastman Kodak Company Method for fabricating long array orifice plates

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0888892A3 (de) * 1997-07-03 2000-06-14 Canon Kabushiki Kaisha Düsenplatte und Herstellungsverfahren, für ein Ausstossgerät
US6328420B1 (en) 1997-07-03 2001-12-11 Canon Kabushiki Kaisha Method for manufacturing an orifice plate for use of a liquid discharge, an orifice plate, a liquid discharge provided with such orifice plate, and a method for manufacturing such liquid discharge
EP0999058A3 (de) * 1998-11-03 2001-02-28 Samsung Electronics Co., Ltd. Anordnung einer Düsenplatte für eine Mikrospritzvorrichtung und Verfahren zur Herstellung derselben
EP1332879A1 (de) * 2002-01-31 2003-08-06 Scitex Digital Printing, Inc. Dorn mit kontrollierter Freisetzungsschicht für durch Elektroformung hergestellte mehrschichtige Tintenstrahlöffnungsplatte
US7341824B2 (en) 2002-01-31 2008-03-11 Eastman Kodak Company Mandrel with controlled release layer for multi-layer electroformed ink-jet orifice plates
CN109216405A (zh) * 2017-06-30 2019-01-15 苏州苏大维格光电科技股份有限公司 Amoled用金属掩膜板的制造方法

Also Published As

Publication number Publication date
DE69508705D1 (de) 1999-05-06
EP0713929B1 (de) 1999-03-31
CA2161516A1 (en) 1996-04-29
DE69508705T2 (de) 1999-07-29

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