CA2161516A1 - Thin film pegless permanent orifice plate mandrel - Google Patents
Thin film pegless permanent orifice plate mandrelInfo
- Publication number
- CA2161516A1 CA2161516A1 CA 2161516 CA2161516A CA2161516A1 CA 2161516 A1 CA2161516 A1 CA 2161516A1 CA 2161516 CA2161516 CA 2161516 CA 2161516 A CA2161516 A CA 2161516A CA 2161516 A1 CA2161516 A1 CA 2161516A1
- Authority
- CA
- Canada
- Prior art keywords
- mandrel
- layer
- titanium
- photoresist layer
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000010409 thin film Substances 0.000 title description 33
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 17
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims abstract description 5
- 238000010276 construction Methods 0.000 claims abstract description 4
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 4
- 150000002367 halogens Chemical class 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 34
- 238000001020 plasma etching Methods 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000000992 sputter etching Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000007547 defect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001010 compromised effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000002920 hazardous waste Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
A mandrel is used in the manufacture of an ink jet orifice plate. The mandrel comprises a glass substrate and an etched Titanium-Tungsten layer having a thickness of approximately 2000.ANG. to 5000.ANG.
residing on the substrate. The mandrel is manufactured by depositing a 2000.ANG. to 5000.ANG. thick layer of Titanium-Tungsten on a substrate, and then depositing a photoresist layer on the Titanium-Tungsten layer in a spin coater. The photoresist layer is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer. The next step is to plasma etch the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold. Finally, the remaining photoresist layer is stripped to complete construction of the mandrel, so the mandrel is reusable without any additional preparation.
residing on the substrate. The mandrel is manufactured by depositing a 2000.ANG. to 5000.ANG. thick layer of Titanium-Tungsten on a substrate, and then depositing a photoresist layer on the Titanium-Tungsten layer in a spin coater. The photoresist layer is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer. The next step is to plasma etch the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold. Finally, the remaining photoresist layer is stripped to complete construction of the mandrel, so the mandrel is reusable without any additional preparation.
Description
THIN FILM PEGLESS PERMANENT ORIFICE PLATE MANDREL
Technical Field The present invention relates to the field of electroplating and, more particularly, to the field of manufacturing orifice plate mandrels using thin film processes.
Back~round Art In continuous ink jet printing, electrically conductive ink is supplied under pressure to a manifold region that distributes the ink to a plurality of orifices, typically arranged in a linear array(s). The ink discharges from the orifices in filaments which break into droplet streams. Individual droplet streams are selectively charged in the region of the break off from the filaments and charge drops are deflected from their normal trajectories. The deflected drops may be caught and recirculated, and the undeflected drops allowed to proceed to a print receiving medium.
Drops are charged by a charge plate having a plurality of charging electrodes along one edge, and a corresponding plurality of connecting leads along one surface. The edge of the charge plate having the charging electrodes is placed in close proximity to the break off point of the ink jet filaments, and charges applied to the leads to induce charges in the drops as they break off from the filaments.
The prior art method for producing orifice plates utilizes a conductive brass mandrel in which photoresist orifice pegs are applied. Metal mandrels are comparatively poor in quality due to surface scratches and defects inherent in metal substrates. Photoresist thickness variation is another degrading factor in this technique which, combined with the low quality brass substrate, produces an inferior orifice plate. Another disadvantage to this method is the hazardous waste generated from etchants, strippers and dissolved metals into waste streams. Furthermore, the non-reusability of this mandrel makes this process extremely expensive.
U.S. Pat. No. 3,703,450 describes a method for making a precision conductive mesh screen.
First, this method constructs a mandrel. The prior art mandrel is constructed by placing a master plate with the screen pattern on the glass substrate and by vapor depositing a thin film through the interstices of the master plate to form the screen's pattern on the glass. After removing the master plate from the glass substrate, the method deposits photoresist over the entire glass plate. Next, the method exposes and develops the photoresist to produce a layer of thin film in a screen pattern covered with a layer of photoresist in the same screen pattern. Next, the method deposits silicon monoxide on the entire glass substrate and removes the silicon monoxide and photoresist from the thin film pattern. This nonreusable mandrel is now ready for manufacturing the screen. This prior art mandrel has several disadvantages. It cannot manufacture small geometry devices as pointed out in U.S. Pat. No. 4,549,939 discussed below. Also, the complicated prior art process for making this mandrel has low yields.
U.S. Pat. No. 4,549,939 describes another prior art thin film mandrel and the method of making it. This prior art process constructs the prior art mandrel by forming a stained pattern shield on a glass substrate and depositing a conductive and transparent thin film onto the substrate. Next, the prior art method coats the thin film with resist and shines a light through the glass substrate and the transparent thin film to expose the unshielded photoresist. Finally, the photoresist is developed and forms the mold for electroforming. The prior art mandrel formed by this process has several disadvantages. It is non-reusable and of poor quality due to resist broken after the use of a conductive thin film that is transparent; a costly and exotic material.
U.S. Pat. No. 4,528,577 describes another prior art mandrel and the method of making it. This prior art method of manufacturing orifice plates for thermal ink jet printheads electroforms nickel onto a stainless steel mandrel plate that contains either a re-etched orifice pattern or a photoresist orifice pattern. Unfortunately, stainless steel mandrel plates always contain a large number of scratches and defects. These scratches and defects arise from characteristics of the stainless steel material and from the manufacturing process. The scratches and defects, which can not be eliminated, degrade the quality of the orifice plates manufactured from stainless steel mandrels. These inferior orifice plates produce inferior print quality. The method and apparatus in accordance with the present invention obviate these problems with mandrels in the prior art.
In the electroplating process, as in U.S.
Patent No. 4,773,971, the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate. Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects and pinholes, and is dimensionally unstable.
It is seen then that there is a need for an improved mandrel for use in the manufacture of ink jet orifice plates.
s Summary of the Invention This need is met by the improved method of manufacturing ink jet orifice plates using a pegless thin film reusable mandrel.
In accordance with one aspect of the present invention, a mandrel is used in the manufacture of an ink jet orifice plate. The mandrel comprises a glass substrate and an etched Titanium-Tungsten layer having a thickness of approximately 2000A to soooA residing on the substrate.
In accordance with another aspect of the present invention, a method of making a mandrel for an ink jet orifice plate is disclosed. The method comprises the steps of sputter depositing a 2000A to 500 oA thick layer of Titanium-Tungsten on a - substrate, and then depositing a photoresist layer on the Titanium-Tungsten layer in a spin coater, i.e., using a spin coating process. The photoresist layer is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer.
The next step is to plasma etch the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold. Finally, the remaining photoresist layer is stripped to complete construction of the mandrel.
It is an object of the present invention to manufacture orifice plates using a thin film pegless mandrel. Other objects and advantages of the invention will be apparent from the following description and the appended claims.
Brief Description of the Drawings Fig. lA is a top view of a plasma etched thin film permanent mandrel with the orifice patterned, in accordance with the present invention;
Fig. lB is a side view of the plasma etched thin film permanent mandrel, in accordance with one embodiment of the present invention;
Fig. lC is a top view of a nickel plated thin film permanent mandrel, in accordance with another embodiment of the present invention;
Figs. 2A-2H show the steps used to manufacture the thin film pegless orifice plate mandrel of the present invention.
Detailed Description of the Preferred Embodiments The manufacturing of high quality precision orifice plates is highly desirable for ink-jet printheads. One method to accompli~h this is by using a thin film pegless (void in the conductive layer) reusable mandrel. The mandrel is manufactured by sputtering, or sputter etching, or reactive ion etching a conductive thin film metal such as Titanium/Tungsten onto a smooth substrate such as glass. Next, a standard photolithographic process is used to define an appropriate orifice plate pattern in the photoresist. The unprotected thin film Titanium/Tungsten within the photoresist pattern is removed by a plasma etching process. The photoresist is then removed from the conductive thin film and the mandrel can be electroplated to produce orifice plates. This method produces a pegless thin film mandrel that can be manufactured using standard photolithographic and plasma etching techniques that yield a high resolution mandrel in which orifice plates can be produced. The electroformed orifice plates can be reproduced and have the identical high resolution characteristics of the pegless thin film mandrel taking advantage of the dimensional stability.
In the electroplating process, the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate. Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects, pinholes and dimensionally unstable. The pegless mandrel exposes the defect free glass substrate that is not compromised by previous manufacturing processes. The mandrel of the present invention is unique because of the use of Titanium-Tungsten as the conductive layer, and also because the mandrel can be plasma etched to define the conductive film mold. Plasma etching allows for the voids in the conductive layer to be of high resolution.
Referring now to the drawings, Fig. lA is a top view of a plasma etched thin film permanent mandrel 10 with a patterned orifice 12. Fig. lB
illustrates a side view of the plasma etched thin film permanent mandrel 10. Fig. lC is a top view of a nickel plated thin film permanent mandrel 10', with a patterned orifice 12'.
The process for manufacturing the thin film pegless orifice plate mandrel 10 or 10' of the present invention is best illustrated in Figs. 2A-2H.
The process starts with a glass substrate or silicon wafer, or a polished silicon wafer, or a plastic, or any smooth, nonconducting surface 14, as shown in Fig. 2A. As shown in Fig. 2B, a conductive thin film metal 16 is deposited on the glass substrate 14 by a suitable process such as a sputter etching process or reactive ion etching process. The thin film is typically constructed from a Titanium/Tungsten material. However, alternate embodiments could use different conductive materials. Next, as illustrated in Fig. 2C, a photoresist layer 18 is applied atop the Titanium/ Tungsten layer. The photoresist layer 18 is then exposed to actinic radiation and developed to produce the orifice pattern. In Fig. 2E, the Titanium-Tungsten layer is plasma etched to define the orifice mold. In Fig. 2F, the photoresist layer 18 is removed, allowing the thin film permanent mandrel to be nickel plated, with nickel plating layer 20, as shown in Fig. 2G. finally, as illustrated in Fig. 2H, the nickel orifice plate 20 is removed from the thin film permanent mandrel, allowing the mandrel to be reused, with no additional preparation.
Continuing with Figs. lA-lC and 2A-2H, the mandrel comprises a glass substrate 14 with an etched Titanium-Tungsten layer 16 residing on the substrate. The Titanium-Tungsten layer 16 typically has a thickness of approximately 2000A to 5000A. The mandrel is manufactured by sputter depositing the 2000A to 5000A thick layer 16 of Titanium-Tungsten on the substrate 14, and then depositing a photoresist layer 18 on the Titanium-Tungsten layer 16, using a spin coating process. The photoresist layer 18 is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer 18. The next step is to plasma etch the Titanium-Tungsten layer 16, such as with a Halogen containing gas, to form an etched conducting film mold. Finally, the rem~;n;ng photoresist layer is stripped to complete construction of the mandrel.
Industrial Applicability and Advantages The present invention is useful in the field of ink jet printing, and has the advantage of providing an improved mandrel. The present invention provides the further advantage of providing a reusable thin film pegless permanent orifice plate mandrel. The advantage of providing a reusable thin film pegless permanent orifice plate mandrel is that from a single mandrel numerous orifice plates can be produced. This has the further advantage of reducing the cost of fabricating orifice plates compared to conventional methods such as metal mandrels with photoresist pegs that are limited to producing a single orifice plate.
Having described the invention in detail and by reference to the preferred embodiment thereof, it will be apparent that other modifications and variations are possible without departing from the scope of the invention defined in the appended claims .
Technical Field The present invention relates to the field of electroplating and, more particularly, to the field of manufacturing orifice plate mandrels using thin film processes.
Back~round Art In continuous ink jet printing, electrically conductive ink is supplied under pressure to a manifold region that distributes the ink to a plurality of orifices, typically arranged in a linear array(s). The ink discharges from the orifices in filaments which break into droplet streams. Individual droplet streams are selectively charged in the region of the break off from the filaments and charge drops are deflected from their normal trajectories. The deflected drops may be caught and recirculated, and the undeflected drops allowed to proceed to a print receiving medium.
Drops are charged by a charge plate having a plurality of charging electrodes along one edge, and a corresponding plurality of connecting leads along one surface. The edge of the charge plate having the charging electrodes is placed in close proximity to the break off point of the ink jet filaments, and charges applied to the leads to induce charges in the drops as they break off from the filaments.
The prior art method for producing orifice plates utilizes a conductive brass mandrel in which photoresist orifice pegs are applied. Metal mandrels are comparatively poor in quality due to surface scratches and defects inherent in metal substrates. Photoresist thickness variation is another degrading factor in this technique which, combined with the low quality brass substrate, produces an inferior orifice plate. Another disadvantage to this method is the hazardous waste generated from etchants, strippers and dissolved metals into waste streams. Furthermore, the non-reusability of this mandrel makes this process extremely expensive.
U.S. Pat. No. 3,703,450 describes a method for making a precision conductive mesh screen.
First, this method constructs a mandrel. The prior art mandrel is constructed by placing a master plate with the screen pattern on the glass substrate and by vapor depositing a thin film through the interstices of the master plate to form the screen's pattern on the glass. After removing the master plate from the glass substrate, the method deposits photoresist over the entire glass plate. Next, the method exposes and develops the photoresist to produce a layer of thin film in a screen pattern covered with a layer of photoresist in the same screen pattern. Next, the method deposits silicon monoxide on the entire glass substrate and removes the silicon monoxide and photoresist from the thin film pattern. This nonreusable mandrel is now ready for manufacturing the screen. This prior art mandrel has several disadvantages. It cannot manufacture small geometry devices as pointed out in U.S. Pat. No. 4,549,939 discussed below. Also, the complicated prior art process for making this mandrel has low yields.
U.S. Pat. No. 4,549,939 describes another prior art thin film mandrel and the method of making it. This prior art process constructs the prior art mandrel by forming a stained pattern shield on a glass substrate and depositing a conductive and transparent thin film onto the substrate. Next, the prior art method coats the thin film with resist and shines a light through the glass substrate and the transparent thin film to expose the unshielded photoresist. Finally, the photoresist is developed and forms the mold for electroforming. The prior art mandrel formed by this process has several disadvantages. It is non-reusable and of poor quality due to resist broken after the use of a conductive thin film that is transparent; a costly and exotic material.
U.S. Pat. No. 4,528,577 describes another prior art mandrel and the method of making it. This prior art method of manufacturing orifice plates for thermal ink jet printheads electroforms nickel onto a stainless steel mandrel plate that contains either a re-etched orifice pattern or a photoresist orifice pattern. Unfortunately, stainless steel mandrel plates always contain a large number of scratches and defects. These scratches and defects arise from characteristics of the stainless steel material and from the manufacturing process. The scratches and defects, which can not be eliminated, degrade the quality of the orifice plates manufactured from stainless steel mandrels. These inferior orifice plates produce inferior print quality. The method and apparatus in accordance with the present invention obviate these problems with mandrels in the prior art.
In the electroplating process, as in U.S.
Patent No. 4,773,971, the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate. Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects and pinholes, and is dimensionally unstable.
It is seen then that there is a need for an improved mandrel for use in the manufacture of ink jet orifice plates.
s Summary of the Invention This need is met by the improved method of manufacturing ink jet orifice plates using a pegless thin film reusable mandrel.
In accordance with one aspect of the present invention, a mandrel is used in the manufacture of an ink jet orifice plate. The mandrel comprises a glass substrate and an etched Titanium-Tungsten layer having a thickness of approximately 2000A to soooA residing on the substrate.
In accordance with another aspect of the present invention, a method of making a mandrel for an ink jet orifice plate is disclosed. The method comprises the steps of sputter depositing a 2000A to 500 oA thick layer of Titanium-Tungsten on a - substrate, and then depositing a photoresist layer on the Titanium-Tungsten layer in a spin coater, i.e., using a spin coating process. The photoresist layer is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer.
The next step is to plasma etch the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold. Finally, the remaining photoresist layer is stripped to complete construction of the mandrel.
It is an object of the present invention to manufacture orifice plates using a thin film pegless mandrel. Other objects and advantages of the invention will be apparent from the following description and the appended claims.
Brief Description of the Drawings Fig. lA is a top view of a plasma etched thin film permanent mandrel with the orifice patterned, in accordance with the present invention;
Fig. lB is a side view of the plasma etched thin film permanent mandrel, in accordance with one embodiment of the present invention;
Fig. lC is a top view of a nickel plated thin film permanent mandrel, in accordance with another embodiment of the present invention;
Figs. 2A-2H show the steps used to manufacture the thin film pegless orifice plate mandrel of the present invention.
Detailed Description of the Preferred Embodiments The manufacturing of high quality precision orifice plates is highly desirable for ink-jet printheads. One method to accompli~h this is by using a thin film pegless (void in the conductive layer) reusable mandrel. The mandrel is manufactured by sputtering, or sputter etching, or reactive ion etching a conductive thin film metal such as Titanium/Tungsten onto a smooth substrate such as glass. Next, a standard photolithographic process is used to define an appropriate orifice plate pattern in the photoresist. The unprotected thin film Titanium/Tungsten within the photoresist pattern is removed by a plasma etching process. The photoresist is then removed from the conductive thin film and the mandrel can be electroplated to produce orifice plates. This method produces a pegless thin film mandrel that can be manufactured using standard photolithographic and plasma etching techniques that yield a high resolution mandrel in which orifice plates can be produced. The electroformed orifice plates can be reproduced and have the identical high resolution characteristics of the pegless thin film mandrel taking advantage of the dimensional stability.
In the electroplating process, the orifices are formed by overplating the voids within the conductive film and onto the underlying smooth glass substrate. Other methods of orifice plate manufacturing processes rely on overplating a photoresist peg that is prone to defects, pinholes and dimensionally unstable. The pegless mandrel exposes the defect free glass substrate that is not compromised by previous manufacturing processes. The mandrel of the present invention is unique because of the use of Titanium-Tungsten as the conductive layer, and also because the mandrel can be plasma etched to define the conductive film mold. Plasma etching allows for the voids in the conductive layer to be of high resolution.
Referring now to the drawings, Fig. lA is a top view of a plasma etched thin film permanent mandrel 10 with a patterned orifice 12. Fig. lB
illustrates a side view of the plasma etched thin film permanent mandrel 10. Fig. lC is a top view of a nickel plated thin film permanent mandrel 10', with a patterned orifice 12'.
The process for manufacturing the thin film pegless orifice plate mandrel 10 or 10' of the present invention is best illustrated in Figs. 2A-2H.
The process starts with a glass substrate or silicon wafer, or a polished silicon wafer, or a plastic, or any smooth, nonconducting surface 14, as shown in Fig. 2A. As shown in Fig. 2B, a conductive thin film metal 16 is deposited on the glass substrate 14 by a suitable process such as a sputter etching process or reactive ion etching process. The thin film is typically constructed from a Titanium/Tungsten material. However, alternate embodiments could use different conductive materials. Next, as illustrated in Fig. 2C, a photoresist layer 18 is applied atop the Titanium/ Tungsten layer. The photoresist layer 18 is then exposed to actinic radiation and developed to produce the orifice pattern. In Fig. 2E, the Titanium-Tungsten layer is plasma etched to define the orifice mold. In Fig. 2F, the photoresist layer 18 is removed, allowing the thin film permanent mandrel to be nickel plated, with nickel plating layer 20, as shown in Fig. 2G. finally, as illustrated in Fig. 2H, the nickel orifice plate 20 is removed from the thin film permanent mandrel, allowing the mandrel to be reused, with no additional preparation.
Continuing with Figs. lA-lC and 2A-2H, the mandrel comprises a glass substrate 14 with an etched Titanium-Tungsten layer 16 residing on the substrate. The Titanium-Tungsten layer 16 typically has a thickness of approximately 2000A to 5000A. The mandrel is manufactured by sputter depositing the 2000A to 5000A thick layer 16 of Titanium-Tungsten on the substrate 14, and then depositing a photoresist layer 18 on the Titanium-Tungsten layer 16, using a spin coating process. The photoresist layer 18 is cured, and a patterned photomask is positioned on the photoresist layer. The photoresist layer is exposed to actinic radiation and then developed to produce a photomask pattern on the photoresist layer 18. The next step is to plasma etch the Titanium-Tungsten layer 16, such as with a Halogen containing gas, to form an etched conducting film mold. Finally, the rem~;n;ng photoresist layer is stripped to complete construction of the mandrel.
Industrial Applicability and Advantages The present invention is useful in the field of ink jet printing, and has the advantage of providing an improved mandrel. The present invention provides the further advantage of providing a reusable thin film pegless permanent orifice plate mandrel. The advantage of providing a reusable thin film pegless permanent orifice plate mandrel is that from a single mandrel numerous orifice plates can be produced. This has the further advantage of reducing the cost of fabricating orifice plates compared to conventional methods such as metal mandrels with photoresist pegs that are limited to producing a single orifice plate.
Having described the invention in detail and by reference to the preferred embodiment thereof, it will be apparent that other modifications and variations are possible without departing from the scope of the invention defined in the appended claims .
Claims (8)
1. A mandrel for an ink jet orifice plate, the mandrel comprising:
a substrate; and an etched Titanium-Tungsten layer residing on said substrate.
a substrate; and an etched Titanium-Tungsten layer residing on said substrate.
2. A mandrel as claimed in claim 1 wherein the substrate comprises glass.
3. A mandrel as claimed in claim 1 wherein said etched Titanium-Tungsten layer comprises a thickness of approximately 2000.ANG. to 5000.ANG. .
4. A mandrel as claimed in claim 1 wherein the mandrel is reusable.
5. A method of making a mandrel for an ink jet orifice plate, the method comprising the steps of:
providing a substrate;
depositing a layer of Titanium-Tungsten on said substrate;
depositing a photoresist layer on the Titanium-Tungsten layer;
curing said photoresist layer;
positioning a photomask having a pattern on the photoresist layer;
exposing the photoresist layer to actinic radiation;
developing the photoresist layer to produce a photomask pattern on the photoresist layer;
plasma etching the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold; and stripping the remaining photoresist layer to complete construction of said mandrel.
providing a substrate;
depositing a layer of Titanium-Tungsten on said substrate;
depositing a photoresist layer on the Titanium-Tungsten layer;
curing said photoresist layer;
positioning a photomask having a pattern on the photoresist layer;
exposing the photoresist layer to actinic radiation;
developing the photoresist layer to produce a photomask pattern on the photoresist layer;
plasma etching the Titanium-Tungsten layer with a Halogen containing gas to form an etched conducting film mold; and stripping the remaining photoresist layer to complete construction of said mandrel.
6. A method of making a mandrel as claimed in claim 5 wherein the step of depositing a layer of Titanium-Tungsten on said substrate further comprises the step of using a sputter etching process.
7. A method of making a mandrel as claimed in claim 5 wherein the step of depositing a photoresist layer on the Titanium-Tungsten layer further comprises the step of using a spin coating process.
8. A method of making a mandrel as claimed in claim 5 wherein the mandrel is reusable.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33106094A | 1994-10-28 | 1994-10-28 | |
| US08/331,060 | 1994-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2161516A1 true CA2161516A1 (en) | 1996-04-29 |
Family
ID=23292467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2161516 Abandoned CA2161516A1 (en) | 1994-10-28 | 1995-10-26 | Thin film pegless permanent orifice plate mandrel |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0713929B1 (en) |
| CA (1) | CA2161516A1 (en) |
| DE (1) | DE69508705T2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11129483A (en) * | 1997-07-03 | 1999-05-18 | Canon Inc | Orifice plate for liquid jet head and production thereof, liquid jet head having orifice plate and production thereof |
| RU2151066C1 (en) * | 1998-11-03 | 2000-06-20 | Самсунг Электроникс Ко., Лтд. | Microinjector nozzle plate assembly and method for its manufacture |
| US20030143492A1 (en) | 2002-01-31 | 2003-07-31 | Scitex Digital Printing, Inc. | Mandrel with controlled release layer for multi-layer electroformed ink jet orifice plates |
| CN109216405A (en) * | 2017-06-30 | 2019-01-15 | 苏州苏大维格光电科技股份有限公司 | The manufacturing method of AMOLED metal mask plate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3703450A (en) | 1971-04-01 | 1972-11-21 | Dynamics Res Corp | Method of making precision conductive mesh patterns |
| US4528577A (en) | 1982-11-23 | 1985-07-09 | Hewlett-Packard Co. | Ink jet orifice plate having integral separators |
| US4549939A (en) | 1984-04-30 | 1985-10-29 | Ppg Industries, Inc. | Photoelectroforming mandrel and method of electroforming |
| US4773971A (en) | 1986-10-30 | 1988-09-27 | Hewlett-Packard Company | Thin film mandrel |
| US5149419A (en) * | 1991-07-18 | 1992-09-22 | Eastman Kodak Company | Method for fabricating long array orifice plates |
-
1995
- 1995-10-20 DE DE1995608705 patent/DE69508705T2/en not_active Expired - Fee Related
- 1995-10-20 EP EP19950307490 patent/EP0713929B1/en not_active Expired - Lifetime
- 1995-10-26 CA CA 2161516 patent/CA2161516A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE69508705D1 (en) | 1999-05-06 |
| EP0713929B1 (en) | 1999-03-31 |
| EP0713929A1 (en) | 1996-05-29 |
| DE69508705T2 (en) | 1999-07-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0273552B2 (en) | Method of making mandrels for use in a deposition process | |
| US5560837A (en) | Method of making ink-jet component | |
| US4770740A (en) | Method of manufacturing valve element for use in an ink-jet printer head | |
| US5443713A (en) | Thin-film structure method of fabrication | |
| EP0320192B1 (en) | Thin film device for an ink jet printhead and process for manufacturing same | |
| US4954225A (en) | Method for making nozzle plates | |
| US4229265A (en) | Method for fabricating and the solid metal orifice plate for a jet drop recorder produced thereby | |
| US20100294654A1 (en) | Micro-metal-mold with patterns of grooves, protrusions and through-openings, processes for fabricating the mold, and micro-metal-sheet product made from the mold | |
| CN102124409A (en) | Process for fabricating multi-level metal parts by the UV-LIGA technique | |
| US3878061A (en) | Master matrix for making multiple copies | |
| US3703450A (en) | Method of making precision conductive mesh patterns | |
| US20080149488A1 (en) | Solvent-soluble stamp for nano-imprint lithography and method of manufacturing the same | |
| US4839001A (en) | Orifice plate and method of fabrication | |
| JP3851789B2 (en) | Mandrel and orifice plate electroformed using the same | |
| EP0713929B1 (en) | Thin film pegless permanent orifice plate mandrel | |
| KR102520739B1 (en) | Method of fabricating a timepiece component and component obtained from this method | |
| US3833482A (en) | Matrix for forming mesh | |
| EP0520760A1 (en) | Method for producing orifice plate | |
| JPH08142334A (en) | Production of ink jet nozzle plate | |
| JPH09300573A (en) | Electrocast thin metal plate and manufacture thereof | |
| JPH08142333A (en) | Matrix of nozzle plate and production of nozzle plate | |
| US20050276914A1 (en) | Method for manufacturing light guide plate mold cores | |
| KR100275372B1 (en) | Method of manufacturing circuit board | |
| KR100248517B1 (en) | Micro coil manufacturing method | |
| JPH07113193A (en) | Production of metal mold for molding diffraction grating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |