EP0698677A3 - Method for gold plating of stripped material, especially for leadframes - Google Patents

Method for gold plating of stripped material, especially for leadframes Download PDF

Info

Publication number
EP0698677A3
EP0698677A3 EP95111826A EP95111826A EP0698677A3 EP 0698677 A3 EP0698677 A3 EP 0698677A3 EP 95111826 A EP95111826 A EP 95111826A EP 95111826 A EP95111826 A EP 95111826A EP 0698677 A3 EP0698677 A3 EP 0698677A3
Authority
EP
European Patent Office
Prior art keywords
leadframes
gold plating
stripped material
finished product
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95111826A
Other languages
German (de)
French (fr)
Other versions
EP0698677A2 (en
EP0698677B1 (en
Inventor
Franz Dr. Kaspar
Norbert Dr. Normann
Gerd Schaudt
Thilo Uhrig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Contacts and Refining GmbH
Original Assignee
Doduco GmbH and Co
Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4436071A external-priority patent/DE4436071C2/en
Application filed by Doduco GmbH and Co, Doduco GmbH and Co KG Dr Eugen Duerrwaechter filed Critical Doduco GmbH and Co
Publication of EP0698677A2 publication Critical patent/EP0698677A2/en
Publication of EP0698677A3 publication Critical patent/EP0698677A3/en
Application granted granted Critical
Publication of EP0698677B1 publication Critical patent/EP0698677B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

Bandförmiges Halbzeug, welches insbesondere für Leadframes für die Halbleitertechnologie eingesetzt wird, wird fortlaufend, selektiv, galvanisch vergoldet, in dem das Halbzeug in einem ersten Schritt mit einem Goldbad bei höherer Stromdichte und danach in einem weiteren Schritt mit einem Goldbad bei niedrigerer Stromdichte behandelt wird.Band-shaped semi-finished product, which is particularly suitable for lead frames is used for semiconductor technology, is continuously, selectively, electroplated, in which the semi-finished product in a first step with a Gold bath at higher current density and then in one further step with a gold bath at lower Current density is treated.

EP95111826A 1994-07-28 1995-07-28 Method for gold plating of stripped material, especially for leadframes Expired - Lifetime EP0698677B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4426862 1994-07-28
DE4426862 1994-07-28
DE4436071A DE4436071C2 (en) 1994-07-28 1994-10-10 Process for gilding band-shaped semi-finished products, in particular for lead frames, and lead frames gold-plated according to the process
DE4436071 1994-10-10

Publications (3)

Publication Number Publication Date
EP0698677A2 EP0698677A2 (en) 1996-02-28
EP0698677A3 true EP0698677A3 (en) 1998-08-26
EP0698677B1 EP0698677B1 (en) 2002-10-09

Family

ID=25938782

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95111826A Expired - Lifetime EP0698677B1 (en) 1994-07-28 1995-07-28 Method for gold plating of stripped material, especially for leadframes

Country Status (2)

Country Link
EP (1) EP0698677B1 (en)
ES (1) ES2184776T3 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2147311A (en) * 1983-09-29 1985-05-09 Hara J B O Electrodepositing precious metal alloys
EP0222232A1 (en) * 1985-11-11 1987-05-20 Electroplating Engineers of Japan Limited Plating device for minute portions of connector terminals
EP0370239A1 (en) * 1988-11-19 1990-05-30 Degussa Aktiengesellschaft Apparatus for selective electroplating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2147311A (en) * 1983-09-29 1985-05-09 Hara J B O Electrodepositing precious metal alloys
EP0222232A1 (en) * 1985-11-11 1987-05-20 Electroplating Engineers of Japan Limited Plating device for minute portions of connector terminals
EP0370239A1 (en) * 1988-11-19 1990-05-30 Degussa Aktiengesellschaft Apparatus for selective electroplating

Also Published As

Publication number Publication date
EP0698677A2 (en) 1996-02-28
EP0698677B1 (en) 2002-10-09
ES2184776T3 (en) 2003-04-16

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