EP0698677A3 - Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes - Google Patents

Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes Download PDF

Info

Publication number
EP0698677A3
EP0698677A3 EP95111826A EP95111826A EP0698677A3 EP 0698677 A3 EP0698677 A3 EP 0698677A3 EP 95111826 A EP95111826 A EP 95111826A EP 95111826 A EP95111826 A EP 95111826A EP 0698677 A3 EP0698677 A3 EP 0698677A3
Authority
EP
European Patent Office
Prior art keywords
leadframes
gold plating
stripped material
finished product
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95111826A
Other languages
English (en)
French (fr)
Other versions
EP0698677A2 (de
EP0698677B1 (de
Inventor
Franz Dr. Kaspar
Norbert Dr. Normann
Gerd Schaudt
Thilo Uhrig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Contacts and Refining GmbH
Original Assignee
Doduco GmbH and Co
Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4436071A external-priority patent/DE4436071C2/de
Application filed by Doduco GmbH and Co, Doduco GmbH and Co KG Dr Eugen Duerrwaechter filed Critical Doduco GmbH and Co
Publication of EP0698677A2 publication Critical patent/EP0698677A2/de
Publication of EP0698677A3 publication Critical patent/EP0698677A3/de
Application granted granted Critical
Publication of EP0698677B1 publication Critical patent/EP0698677B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

Bandförmiges Halbzeug, welches insbesondere für Leadframes für die Halbleitertechnologie eingesetzt wird, wird fortlaufend, selektiv, galvanisch vergoldet, in dem das Halbzeug in einem ersten Schritt mit einem Goldbad bei höherer Stromdichte und danach in einem weiteren Schritt mit einem Goldbad bei niedrigerer Stromdichte behandelt wird.
EP95111826A 1994-07-28 1995-07-28 Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes Expired - Lifetime EP0698677B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4426862 1994-07-28
DE4426862 1994-07-28
DE4436071A DE4436071C2 (de) 1994-07-28 1994-10-10 Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes und nach dem Verfahren vergoldete Leadframes
DE4436071 1994-10-10

Publications (3)

Publication Number Publication Date
EP0698677A2 EP0698677A2 (de) 1996-02-28
EP0698677A3 true EP0698677A3 (de) 1998-08-26
EP0698677B1 EP0698677B1 (de) 2002-10-09

Family

ID=25938782

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95111826A Expired - Lifetime EP0698677B1 (de) 1994-07-28 1995-07-28 Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes

Country Status (2)

Country Link
EP (1) EP0698677B1 (de)
ES (1) ES2184776T3 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2147311A (en) * 1983-09-29 1985-05-09 Hara J B O Electrodepositing precious metal alloys
EP0222232A1 (de) * 1985-11-11 1987-05-20 Electroplating Engineers of Japan Limited Vorrichtung zum selektiven Metallbeschichten von Steckverbinderkontaktstiften
EP0370239A1 (de) * 1988-11-19 1990-05-30 Degussa Aktiengesellschaft Vorrichtung zur selektiven galvanischen Beschichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2147311A (en) * 1983-09-29 1985-05-09 Hara J B O Electrodepositing precious metal alloys
EP0222232A1 (de) * 1985-11-11 1987-05-20 Electroplating Engineers of Japan Limited Vorrichtung zum selektiven Metallbeschichten von Steckverbinderkontaktstiften
EP0370239A1 (de) * 1988-11-19 1990-05-30 Degussa Aktiengesellschaft Vorrichtung zur selektiven galvanischen Beschichtung

Also Published As

Publication number Publication date
ES2184776T3 (es) 2003-04-16
EP0698677A2 (de) 1996-02-28
EP0698677B1 (de) 2002-10-09

Similar Documents

Publication Publication Date Title
Kocks et al. Physics and phenomenology of strain hardening: the FCC case
DE69706910D1 (de) Herstellungsverfahren einer T-förmigen Gate-Elektrode in einem Halbleiterbauelement, und die T-förmige Gate-Elektrode
IT8321432A0 (it) I singoli fattori 1, 2, 3, 4 e 5della teicomicina a2 puri ed il metodo per la loro produzione.
EP0664925A4 (de) Verbindungsstruktur fur integrierte schaltung und verfahren zu deren herstellung.
CA2072136A1 (en) Stereolithographic construction techniques
DE3578399D1 (de) Verfahren zum verformen im festen zustand.
DE69417211D1 (de) Planariezierungsverfahren für die Herstellung von integrierten Schaltkreisen, insbesondere für nichtflüssige Halbleiterspeicheranordnungen
KR970064838A (ko) 와이어 소우용 와이어 제조방법 및 이로부터 제조된 와이어소우용 와이어
DE3577776D1 (de) Verfahren zur herstellung submikronischer graeben, z.b. in halbleitermaterial und nach diesem verfahren hergestellte anordnungen.
EP0698677A3 (de) Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes
SG65193G (en) Method for production of tin-cobalt,tin-nickel,or tin-lead binary alloy electroplating bath and electroplating bath produced thereby
FR2649530B1 (fr) Brin supraconducteur multifilamentaire
FR2380743A1 (fr) Microgranules contenant de la methionine et procede de fabrication
DE3774701D1 (de) Extrusionsmundstueck und verfahren zu seiner herstellung.
US4883774A (en) Silver flashing process on semiconductor leadframes
CA2239622A1 (en) Method for producing a mother plate for electrolytic cleaning and a mother plate produced according to said method
JPS57116924A (en) Inner wire
TW354382B (en) Method for fabricating a switching device by anodization, and anodizing interconnection
JPS57189821A (en) Manufacture of synthetic resin film
DE69505341D1 (de) HALBLEITER-HETEROSTRUKTUR, DIE EINE II-VI-VERBINDUNG ENTHÄLT, IN OHMSCHEM KONTAKT MIT EINEM p-GaAs SUBSTRAT
ATE51047T1 (de) Verfahren zum herstellen eines mehrlagigen, einlitzigen und kompakten verstaerkungscordes fuer elastomere erzeugnisse und nach diesem verfahren hergestellter verstaerkungscord.
JPS56118344A (en) Bonding wire
DE3662009D1 (en) Process for electroplating steel wires and coated wires thus produced
TW344122B (en) Method for making semiconductor devices having electroplated leads
JPS6448431A (en) Assembly system of semiconductor device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE DK ES FR GB IT SE

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: DODUCO GMBH + CO DR. EUGEN DUERRWAECHTER I.K.

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: DODUCO GMBH

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE DK ES FR GB IT SE

17P Request for examination filed

Effective date: 19981005

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: AMI DODUCO GMBH

17Q First examination report despatched

Effective date: 19991026

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE DK ES FR GB IT SE

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 59510414

Country of ref document: DE

Date of ref document: 20021114

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030109

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030109

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20030120

ET Fr: translation filed
REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2184776

Country of ref document: ES

Kind code of ref document: T3

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20030710

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20050628

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20050701

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20050719

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20050721

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060728

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20060731

Year of fee payment: 12

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070201

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20060728

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20070330

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20060729

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060729

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070728