EP0697474A1 - Aufnahmebehälter für elektronische Teile - Google Patents

Aufnahmebehälter für elektronische Teile Download PDF

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Publication number
EP0697474A1
EP0697474A1 EP94305582A EP94305582A EP0697474A1 EP 0697474 A1 EP0697474 A1 EP 0697474A1 EP 94305582 A EP94305582 A EP 94305582A EP 94305582 A EP94305582 A EP 94305582A EP 0697474 A1 EP0697474 A1 EP 0697474A1
Authority
EP
European Patent Office
Prior art keywords
containers
electronic parts
electrically
rotating cage
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP94305582A
Other languages
English (en)
French (fr)
Other versions
EP0697474B1 (de
Inventor
Eugene Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Taiwan Ltd
Original Assignee
General Instrument of Taiwan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Instrument of Taiwan Ltd filed Critical General Instrument of Taiwan Ltd
Priority to ES94305582T priority Critical patent/ES2114661T3/es
Priority to DE1994608312 priority patent/DE69408312T2/de
Priority to EP19940305582 priority patent/EP0697474B1/de
Publication of EP0697474A1 publication Critical patent/EP0697474A1/de
Application granted granted Critical
Publication of EP0697474B1 publication Critical patent/EP0697474B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C25D17/20—Horizontal barrels

Definitions

  • the present invention relates to a containing apparatus for electronic parts, and particularly to an electronic part container used in an electroplating process, whereby bending of load wires of an electronic part is prevented during the electroplating operation and the deposition thickness is relatively evenly distributed, and what is more, the apparatus is capable of being incorporated into an automatic production line so as to enhance production efficiency and prevent hazards induced by manual operation.
  • the conventional apparatus is provided with a plurality of tanks "A” and a metal piece serving as an anode, such as tin, lead, copper, silver, and the like.
  • Electronic parts are firstly put into a rolling barrel “C” and then the rolling barrel “C” is disposed in the electroplating apparatus as shown in FIG. 1.
  • an electronically-conducting shaft “D” is provided at the center of the conventional rolling barrel “C”.
  • the substantially cylindrical wall of the rolling barrel “C” is composed of a number of covers "C1" on which a plurality of aperatures are formed so that the electrolyte can flow through the rolling barrel.
  • a large quantity of electronic parts are put in the barrel “C” so as to be electroplated.
  • the rolling barrel “C” are rotatably connected to a cantilever “E” which is connected with an actuating rod “F” which is able to rotate and/or vertically translate the rolling barrel “C”.
  • a phenomenon of bent lead wires of an electronic part is induced during the electroplating operation.
  • the electrically-conducting shaft is provided with a plurality of electrically-conducting rings "D'" so as to avoid collisions between electronic parts.
  • the bending problem still can not be solved effectively.
  • the conventional apparatus has the following disadvantages:
  • FIG. 3 is a schematic diagram of an electronic part
  • the reference numeral "3" is used to designate the body of the electronic part such as resistor, capacitor and the like.
  • Two lead wires 31 extend outwardly longitudinally along the body 3. Due to the point discharge effect, during the electroplating process a lead wire 31 is divided into a low current density zone (L.C.D), a medium current density zone (M.C.D) and a high current density (H.C.D).
  • L.C.D low current density zone
  • M.C.D medium current density zone
  • H.C.D high current density
  • the high current density zone (H.C.D) will be cut away after the electroplating process is finished, leaving only the low current density zone and/or a part of medium current zone. Therefore, electroplating quality of the low current density zone is an important factor of influencing the quality of an electronic part.
  • Thickness Alloy proportion (percentage of tin in a tin-lead alloy) H.C.D Average:552.5 ⁇ inches 83.5% STD.
  • STD.DEV standard deviation Thickness Alloy proportion (percentage of tin in a tin-lead alloy) L.C.D.
  • the present invention firstly intends to provide a containing apparatus for electronic parts used in electroplating process comprising a plurality of containers whose orientations are respectively tangential to a shaft thereof.
  • the container is partitioned into a plurality of compartments by baffle plates.
  • Two end walls of each compartments are provided with a plurality of thorns for enhancing the probability of contact between the electronic parts and the cathode.
  • the electronic parts are kept their wires from being bent so as to eliminate the necessity of straightening the bent wires.
  • the containers are each positioned substantially tangential to the shaft. Therefore, the fluidity of electrolyte is increased and hence the uniformity of the electroplating thickness is easily achieved.
  • the present secondly intends to provide a containing apparatus for electronic parts used in electroplating process of which the containers are so spacious that the electronic parts therein will not crowd together. Thereupon, a coating on the surface of the electronic part is complete, namely having better quality.
  • the present invention thirdly intends to provide a containing apparatus for electronic parts used in electroplaing process which comprises a plurality of containers disposed inside a rotating cage. Each of the containers is substantially tangential to the shaft so as to facilitate the circulation of the electrolyte. Therefore, the coating is evenly distributed.
  • the containing apparatus 1 for electronic parts of the present invention mainly comprises a rotating cage 4 and a plurality of electronic part containers 2.
  • Each of the connecting seats 42 comprises a guiding slot 45 for guiding and receiving the respective electronic part container 2 therein and a knob 43 for fixing the container 2 in the guiding slot 45.
  • the containers 2 are arranged in a tangent direction.
  • the rotating cage 4 is provided with a plurality of connecting seats 42 which are substantially tangent to a pseudo shaft (as indicated by phantom line 41') thereof.
  • the connecting seat 42 is further provided with an electrically-conducting copper piece 44 which is capable of being contact with electrically-conducting copper pieces on two ends of the container 2 so as to form a current path.
  • the rotating cage 4 is connected to the conventional actuating rod "F" so as to move around in the tank "A".
  • the container 2 takes the form of a thin and rectangular box.
  • the thin box 2 is provided with a plurality of baffle plates 22 which are evenly spaced so as to define a plurality of compartments 21. Thorns are provided to the side walls of each compartment 21 so as to form thorny walls 23 made of electrically-conducting material.
  • the thorny walls 23 are connected to the eletrically-conducting copper pieces 24 on the two end of the container 2.
  • the container 2 has a cap 25 which is able to keep electronic parts therein from being dropped out.
  • the cap 25 has a water-permeable screen 26 thereon and the bottom of the container 2 is also water-permeable. By means of the water-permeable characteristics of the container 2, the electrolyte is easily circulated.
  • each electronic part 3 is perpendicular to the thorny walls such that the lead wires of each electronic part is able to contact with the thorny walls 23. Since the orientation of every electronic part 3 is the same and no collision occurs to one another, the lead wires 31 of the electronic parts 3 almost will not suffer from being bent. Furthermore, the probability of contact between the electronic parts and the cathode is greatly increased.
  • the electroplating apparatus of the present invention is able to achieve the following advantages:
  • Thickness Alloy proportion: (percentage of tin in a tin-lead alloy) M.C.D. Average value:478 ⁇ inches 84.2% STD.
  • the present invention makes the thickness of the L.C.D. zone and that of the H.C.D. almost equal. Therefore, the quality of the electronic part can be improved.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
EP19940305582 1994-07-28 1994-07-28 Aufnahmebehälter für elektronische Teile Expired - Lifetime EP0697474B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ES94305582T ES2114661T3 (es) 1994-07-28 1994-07-28 Aparato contenedor para piezas electronicas.
DE1994608312 DE69408312T2 (de) 1994-07-28 1994-07-28 Aufnahmebehälter für elektronische Teile
EP19940305582 EP0697474B1 (de) 1994-07-28 1994-07-28 Aufnahmebehälter für elektronische Teile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19940305582 EP0697474B1 (de) 1994-07-28 1994-07-28 Aufnahmebehälter für elektronische Teile

Publications (2)

Publication Number Publication Date
EP0697474A1 true EP0697474A1 (de) 1996-02-21
EP0697474B1 EP0697474B1 (de) 1998-01-28

Family

ID=8217786

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19940305582 Expired - Lifetime EP0697474B1 (de) 1994-07-28 1994-07-28 Aufnahmebehälter für elektronische Teile

Country Status (3)

Country Link
EP (1) EP0697474B1 (de)
DE (1) DE69408312T2 (de)
ES (1) ES2114661T3 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1335177A (en) * 1918-09-18 1920-03-30 Copper Products Company Electrolytic method and apparatus
US1367567A (en) * 1917-03-03 1921-02-08 Harry A Sedgwick Electroplating-machine
FR2038654A5 (en) * 1969-03-21 1971-01-08 Savy Sife Current connector for the drum of an - electrolysis vat

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1367567A (en) * 1917-03-03 1921-02-08 Harry A Sedgwick Electroplating-machine
US1335177A (en) * 1918-09-18 1920-03-30 Copper Products Company Electrolytic method and apparatus
FR2038654A5 (en) * 1969-03-21 1971-01-08 Savy Sife Current connector for the drum of an - electrolysis vat

Also Published As

Publication number Publication date
DE69408312T2 (de) 1998-08-20
EP0697474B1 (de) 1998-01-28
ES2114661T3 (es) 1998-06-01
DE69408312D1 (de) 1998-03-05

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