EP0688610B1 - Breitstrahlprüfkopf für die Ultraschallprüftechnik - Google Patents
Breitstrahlprüfkopf für die Ultraschallprüftechnik Download PDFInfo
- Publication number
- EP0688610B1 EP0688610B1 EP95108243A EP95108243A EP0688610B1 EP 0688610 B1 EP0688610 B1 EP 0688610B1 EP 95108243 A EP95108243 A EP 95108243A EP 95108243 A EP95108243 A EP 95108243A EP 0688610 B1 EP0688610 B1 EP 0688610B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- beam probe
- probe according
- recess
- broad beam
- side face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 title claims description 21
- 239000013078 crystal Substances 0.000 claims description 27
- 239000000523 sample Substances 0.000 claims description 21
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
Definitions
- the invention relates to a wide-beam test head for ultrasonic testing technology, with an elongated, piezoelectric crystal, the one Aspect ratio of at least 1: 2 and has a thickness that is smaller is 1/5 of the smaller side dimension.
- Wide-beam probes are used in ultrasonic testing technology if a large test track width is to be achieved. There is the order small transmitter test heads, which are assigned broad-beam test heads as receivers are and vice versa. Wide beam probes of this type are from DE 24 31 429 C1 known.
- Wide-beam test heads are understood to mean test heads that have an elongated, mostly have rectangular piezoelectric transducers. With these Transducers are only within the scope of the present invention So crystals and foils are not included.
- Typical wide beam probes have a rectangular crystal an aspect ratio of 1: 2.5 to 1: 3.5.
- a typical probe for 4 MHZ has transducer dimensions of 6 x 17 x 0.25 mm.
- edge elevation in wide beam probes is for ultrasonic testing technology disadvantageous because errors are overestimated in the marginal area compared to the area in the middle of the crystal.
- edge ridges already to compensate in the broad jet test head so that the edge field is about has the same sensitivity as the area of the center of the wide beam probe.
- This task is based on the previously known wide beam probe solved in that in the area of each of the two narrow sides, a recess is provided, either as a hole in the immediate vicinity the narrow side or as an incision starting from the narrow side, e.g. B. a slot is formed.
- the edge elevation i.e. the higher sensitivity compared to Plateau in the area of the edges is achieved by a simple mechanical measure eliminated.
- the area of the piezoelectric crystal is in the range the narrow side of the substantially rectangular and preferably rectangular piezoelectric crystal is reduced in that the Recess is formed. It's either a hole which is in the immediate vicinity of the narrow side, or lies as a Incision in front of that starting from the narrow side in the area nearby the narrow side is incorporated. Through the recess made in this way the boundary behavior is specifically influenced. The recess becomes so big chosen that the edge elevation is eliminated. If the recess becomes too large executed, the edge elevation can even be reversed to its opposite will. Overall, the invention thus enables metered adjustment the sound field characteristics of a wide beam probe in the area of the edges.
- the area of the recess is relatively small, it is at most 5% preferably at most 2% of the area of the piezoelectric crystal.
- the recess can be worked into the piezoelectric crystal that the machining process starts from a main surface of the crystal, for example by drilling the hole, but it can also do so be carried out that the processing begins on a narrow side, for example by sawing, e.g. B. with a diamond saw.
- the recess is arranged in the area of the middle of the narrow side. She is in an area within a few millimeters of the Narrow side removed. Typically, the hole is in an area that is a maximum of 3, preferably a maximum of 2 mm from the narrow side. The incision is a maximum of 2 mm from the narrow side. For larger ones These dimensions can be caused by vibrations, i.e. at lower probe frequencies however be exceeded.
- the recess penetrates the crystal completely, so it does not become one Blind bore executed, rather the hole is from both main surfaces accessible from the crystal. Likewise is the incision through the thickness of the crystal.
- FIG. 1 shows the diagram of a wide-beam test head for ultrasonic test technology according to the state of the art, i.e. without any recess.
- This Diagram was, like the diagram to be discussed later according to FIG. 4, recorded with an automatic sound field measuring device.
- a steel ball with a diameter of 8 mm in 30 served as a reflector mm water depth.
- the diagram has essentially the shape of an isosceles Trapezes, there are clear edge elevations 20. Their sensitivity is 2 to 4 dB above essentially one plateau-shaped region 22.
- FIG. 2 shows a crystal 24 for four MHz, it has a length of 17 mm, a width of 6 mm and a thickness of 0.25 mm. He is known per se Way with electrodes and associated connections, the latter belong to the prior art and are therefore not shown here.
- the crystal 24 has two opposite narrow sides 26, they are corresponding the stated dimensions 6 mm long and 0.25 mm high. On the center plane of each of the two narrow sides 26 is at a distance d from the narrow side 26 a bore 28 is made through the crystal 24 goes through. It has a diameter b, in the embodiment shown here coincides with d, but from d by +/- 50% maximum can deviate. In the exemplary embodiment shown, the bore diameter is b is 1.1 mm, typical values are between 1 and 1.2 mm. The The axis of the bore 28 extends perpendicular to the main surface of the crystal 24. The two holes of the crystal 24 are identical.
- each Narrow side 26 made an incision 30 in the form of a saw slot, he has a cutting width of 1 mm and is 1.2 mm deep, typical values for the depth of cut is between 1 and 1.5 mm. In this case, too Notch 30 through the thickness of the crystal.
- the test head After introducing the recess designed as a bore 28 or cut 30 the test head with the usual matching layer, also protective layer called, provided. Through them the two recesses of the Filled in crystal 24. Water therefore has no access to the areas of the Recesses.
- the protective layer causes the cutouts in the finished Test head can no longer be recognized.
- Backing also called damping body
- damping body is referred to the DE book J. Krautkrämer and H. Krautkrämer, material testing with ultrasound, 4th edition, there in particular pages 218 - 219.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
Claims (10)
- Breitstrahlprüfkopf für die Ultraschallprüftechnik, mit einem länglichen, piezoelektrischen Kristall (24), der ein Seitenverhältnis von mindestens 1:2 aufweist und eine Dicke hat, die kleiner ist als 1/5 der kleineren Seitenabmessung, dadurch gekennzeichnet, daß im Bereich jederbeiden Schmalseiten (26) jeweils eine Ausnehmung vorgesehen ist, die entweder als ein Loch (28) in unmittelbarer Nähe der Schmalseite (26) oder als ein von der Schmalseite (26) ausgehender Einschnitt (30) ausgebildet ist.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß die Ausnehmung (28, 30) eine Fläche hat, die zwischen 1 und 1,5 mm2 liegt.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß das Loch (28) sich in unmittelbarer Nähe der Schmalseite (26) befindet.
- Breitstrahlprüfkopf nach Anspruch 3, dadurch gekennzeichnet, daß das Loch (28) von der Schmalseite (26) um wenige Zehntel mm getrennt ist.
- Breitstrahlprüfkopf nach Anspruch 3, dadurch gekennzeichnet, daß das Loch (28) zur Schmalseite (26) hin offen ist.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß die Ausnehmung (28, 30) im Bereich der Mitte der Schmalseite (26) angeordnet ist.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß die Ausnehmung (28, 30) ein gesägter Schlitz ist, der 0,5 bis 1,5 mm ausgehend von der Schmalseite (26) in den Kristall (24) hineinragt.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß die Ausnehmung (28, 30) durch eine Schutzschicht verschlossen und überdeckt ist.
- Breitstrahlprükopf nach Anspruch 1, dadurch gekennzeichnet, daß er ein relativ hartes Backing aufweist.
- Breitstrahlprüfkopf nach Anspruch 1, dadurch gekennzeichnet, daß die beiden Ausnehmungen (28, 30) ausführungsgleich sind.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4421436 | 1994-06-21 | ||
DE4421436 | 1994-06-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0688610A2 EP0688610A2 (de) | 1995-12-27 |
EP0688610A3 EP0688610A3 (de) | 1996-07-24 |
EP0688610B1 true EP0688610B1 (de) | 1998-10-28 |
Family
ID=6520979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95108243A Expired - Lifetime EP0688610B1 (de) | 1994-06-21 | 1995-05-24 | Breitstrahlprüfkopf für die Ultraschallprüftechnik |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0688610B1 (de) |
DE (2) | DE59504040D1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59711179D1 (de) * | 1996-10-28 | 2004-02-12 | Intelligendt Sys & Serv Gmbh | Ultraschallwandler |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5527733A (en) * | 1978-08-17 | 1980-02-28 | Matsushita Electric Ind Co Ltd | Frequency adjustment for disk piezoelectric ceramic oscillator |
JPS5647200A (en) * | 1979-09-26 | 1981-04-28 | Tohoku Metal Ind Ltd | Adjusting method for resonance frequency of piezoelectric vibrator |
-
1995
- 1995-05-24 DE DE59504040T patent/DE59504040D1/de not_active Expired - Fee Related
- 1995-05-24 EP EP95108243A patent/EP0688610B1/de not_active Expired - Lifetime
- 1995-06-09 DE DE19521153A patent/DE19521153A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0688610A3 (de) | 1996-07-24 |
DE19521153A1 (de) | 1996-01-04 |
EP0688610A2 (de) | 1995-12-27 |
DE59504040D1 (de) | 1998-12-03 |
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