EP0680657A1 - Materiau de support pour bandes impregne d'une composition epoxy - Google Patents

Materiau de support pour bandes impregne d'une composition epoxy

Info

Publication number
EP0680657A1
EP0680657A1 EP93920469A EP93920469A EP0680657A1 EP 0680657 A1 EP0680657 A1 EP 0680657A1 EP 93920469 A EP93920469 A EP 93920469A EP 93920469 A EP93920469 A EP 93920469A EP 0680657 A1 EP0680657 A1 EP 0680657A1
Authority
EP
European Patent Office
Prior art keywords
tape
epoxides
flexible tape
tape backing
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP93920469A
Other languages
German (de)
English (en)
Inventor
Krishnamurthy Sridhar
Richard W. Pribnow
James N. Kellen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of EP0680657A1 publication Critical patent/EP0680657A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/205—Adhesives in the form of films or foils characterised by their carriers characterised by the backing impregnating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only

Definitions

  • Photoinitiators for cationically sensitive species reside in three main classes, i.e., aryldiazonium salts; sulfonium salts, iodonium salts, and related compounds, commonly called "onium” salts, and organometallic compounds; see, Photocrosslinking of Epoxy Resins, Advances in Polymer Science 78, F. Lohse & H. Zweifel, Springer-Verlag Publ., 1986, pages 61-81.
  • the use of epoxy resins in tape backings is also known in the art.
  • a strip of adhesive tape (2.54 cm x 25.4 cm) is applied with adhesive contact to the cleaned and polished surface of a Type 302 steel plate (5 cm x 12.2 cm x 0.16 cm) . Constant pressure is applied to the tape strip by slowly rolling a 2 kg rubber coated steel roller two passes over the plate at a speed of 5 cm/sec. Approximately 12.2 cm of tape extends beyond one end of the steel plate. The adhesive tape is then conditioned for 20 mins. Adhesion measurement requires that the steel plate is positioned with its length vertically disposed. The tape extension hangs from the lower edge of the plate. The end of the tape extension, farthest away from the steel plate, is folded to cause adhesive-to- adhesive contact and form a tab of approximately 2.54 cm long.
  • the opposite side of the backing is wiped with a degreasing solvent, and then the release liner is removed from the test tape.
  • the specimen tape is applied lengthwise so that the degreased side is in contact with the newly exposed adhesive surface of the test tape.
  • 7.62 cm strips of a single sided, aggressive adhesive, tape are placed across the width of each end of the steel panel and the specimen tape to hold it in position.
  • An additional strip 30.5 cm long x 1.27 cm wide is placed lengthwise in adhesive-to- adhesive contact such that approximately 15 cm of the aggressive adhesive tape extends beyond one end of the steel panel.
  • the steel panel is placed with its longitudinal axis in a vertical orientation with the aggressive tape extension hanging from its lower end.
  • the end of the tape, furthest from the plate is folded back in adhesive contact with itself to form an end tab approximately 1.27 cm long.
  • a U shaped loop is formed with adhesive on the outer face of the U. Further application of force produces tension in the tape loop and causes the aggressive adhesive tape to urge 100% removal of adhesive from the specimen tape.
  • the test is run by separating the jaws of the tester at 30.5 cm per minute. As the sample stretches, the force applied is increased to a level at which failure and rupture occurs in the central portion of the sample. Measurement of tensile is obtained by determining the maximum force per unit width just before failure. Elongation is measured as the percent increase in length of the sample, under maximum load, before failure.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un matériau de support pour bandes flexibles comprenant un substrat revêtu d'une composition époxy photopolymérisée contenant une pluralité d'époxydes comprenant au moins un époxyde choisi dans le groupe constitué des époxydes de bisphénole A et des époxydes cycloaliphatiques, et au moins un époxyde aliphatique, 0,1 % à 2 % d'au moins un initiateur cationique organométallique pouvant amorcer la polymérisation à des longueurs d'onde de 200 à 600 nm, et au moins un agent accélérateur. Le matériau de support selon l'invention est complètement durci après une exposition à un rayonnement de 1 à 15 secondes, sans étape de chauffage.
EP93920469A 1992-10-09 1993-09-01 Materiau de support pour bandes impregne d'une composition epoxy Withdrawn EP0680657A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95893092A 1992-10-09 1992-10-09
US958930 1992-10-09
PCT/US1993/008288 WO1994009497A1 (fr) 1992-10-09 1993-09-01 Materiau de support pour bandes impregne d'une composition epoxy

Publications (1)

Publication Number Publication Date
EP0680657A1 true EP0680657A1 (fr) 1995-11-08

Family

ID=25501454

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93920469A Withdrawn EP0680657A1 (fr) 1992-10-09 1993-09-01 Materiau de support pour bandes impregne d'une composition epoxy

Country Status (5)

Country Link
EP (1) EP0680657A1 (fr)
JP (1) JPH08502527A (fr)
CN (1) CN1086626A (fr)
CA (1) CA2144418A1 (fr)
WO (1) WO1994009497A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667893A (en) * 1992-10-09 1997-09-16 Minnesota Mining And Manufacturing Company Substrate coated or impregnated with flexible epoxy composition
DE19960466A1 (de) * 1999-12-15 2001-09-20 Beiersdorf Ag Klebeband, insbesondere zum Maskieren einer KTL-Grundierung
CN1957041A (zh) * 2004-05-28 2007-05-02 雅宝公司 阻燃性聚氨酯及其添加剂
JP5150436B2 (ja) * 2008-09-26 2013-02-20 株式会社寺岡製作所 耐熱性粘着テープ
DE102009035097A1 (de) * 2009-07-29 2011-02-03 Siemens Aktiengesellschaft Flächenisolierfolie und Anwendung dazu
NL1038884C2 (en) * 2011-06-23 2013-01-02 Holland Novochem Technical Coatings B V Protective polymer layers.
CN102982923A (zh) * 2012-12-04 2013-03-20 江苏亚威变压器有限公司 一种应用在变压器中的新型绝缘纸
EP3593362A1 (fr) * 2017-03-10 2020-01-15 3M Innovative Properties Company Matériau d'isolation électrique

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286047A (en) * 1979-07-25 1981-08-25 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9409497A1 *

Also Published As

Publication number Publication date
JPH08502527A (ja) 1996-03-19
WO1994009497A1 (fr) 1994-04-28
CA2144418A1 (fr) 1994-04-28
CN1086626A (zh) 1994-05-11

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