EP0673547A4 - Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird. - Google Patents
Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird.Info
- Publication number
- EP0673547A4 EP0673547A4 EP94901644A EP94901644A EP0673547A4 EP 0673547 A4 EP0673547 A4 EP 0673547A4 EP 94901644 A EP94901644 A EP 94901644A EP 94901644 A EP94901644 A EP 94901644A EP 0673547 A4 EP0673547 A4 EP 0673547A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- εaid
- component
- liquid
- leadframe
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 126
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 126
- 239000007788 liquid Substances 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000002048 anodisation reaction Methods 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 230000000717 retained effect Effects 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000565 sealant Substances 0.000 description 4
- 238000004049 embossing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000005394 sealing glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Definitions
- Figure 1 shows in exploded isometric view a metal electronic package as known from the prior art.
- Figure 2 shows in top planar view an epoxy sheet for stamping a window frame of adhesive as known from the prior art.
- FIG. 1 shows in exploded isometric view an adhesively sealed electronic package 10 as known from the prior art.
- the adhesively sealed electronic package 10 has a base component 12 and a cover component 14.
- the base component 12 and cover component 14 are made from a variety of materials such as ceramics, molded plastics and metals. Metallic materials such as copper, aluminum and their alloys have proven successful. The high thermal conductivity of the metals effectively dissipate heat from an encased semiconductor device.
- a leadframe 16 is disposed between and adhesively bonded to both the base component 12 and cover component 14.
- a second window frame shaped adhesive sheet 20 bonds the other side of the leadframe 16 to the cover component 14.
- the five components, the base component 12, first adhesive sheet 18, leadframe 16, second adhesive sheet 20 and cover component 14 must be accurately aligned in a machined fixture for assembly. Different fixtures are required for each size package and lead configuration.
- Package assembly is completed as illustrated in Figure 9 by the placement of a cover component 14 on the second adhesive.
- the package 48 i ⁇ then thermally cured.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US98786792A | 1992-12-09 | 1992-12-09 | |
| US987867 | 1992-12-09 | ||
| PCT/US1993/011337 WO1994014193A1 (en) | 1992-12-09 | 1993-11-22 | Electronic package sealed with a dispensable adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0673547A1 EP0673547A1 (de) | 1995-09-27 |
| EP0673547A4 true EP0673547A4 (de) | 1996-03-13 |
Family
ID=25533645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP94901644A Withdrawn EP0673547A4 (de) | 1992-12-09 | 1993-11-22 | Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0673547A4 (de) |
| JP (1) | JPH08505266A (de) |
| AU (1) | AU5616194A (de) |
| CA (1) | CA2150569A1 (de) |
| WO (1) | WO1994014193A1 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE508138C2 (sv) * | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
| SE508139C2 (sv) * | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
| KR100697624B1 (ko) * | 2005-07-18 | 2007-03-22 | 삼성전자주식회사 | 접착제 흐름 제어를 위한 표면 구조를 가지는 패키지 기판및 이를 이용한 반도체 패키지 |
| WO2019093269A1 (ja) * | 2017-11-09 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | 蓋体および電子装置 |
| JP6929210B2 (ja) * | 2017-12-11 | 2021-09-01 | 株式会社ブリヂストン | タイヤ |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622433A (en) * | 1984-03-30 | 1986-11-11 | Diacon, Inc. | Ceramic package system using low temperature sealing glasses |
| US4629824A (en) * | 1984-12-24 | 1986-12-16 | Gte Products Corporation | IC package sealing technique |
| US4704626A (en) * | 1985-07-08 | 1987-11-03 | Olin Corporation | Graded sealing systems for semiconductor package |
| US5023398A (en) * | 1988-10-05 | 1991-06-11 | Olin Corporation | Aluminum alloy semiconductor packages |
| US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
| EP0447884A2 (de) * | 1990-03-23 | 1991-09-25 | Motorola, Inc. | Halbleitervorrichtung mit einer bei niederer Temperatur ausgehärteten Epoxy-Vergussmasse und Verfahren zu ihrer Herstellung |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4139726A (en) * | 1978-01-16 | 1979-02-13 | Allen-Bradley Company | Packaged microcircuit and method for assembly thereof |
| US5013871A (en) * | 1988-02-10 | 1991-05-07 | Olin Corporation | Kit for the assembly of a metal electronic package |
| US5098864A (en) * | 1989-11-29 | 1992-03-24 | Olin Corporation | Process for manufacturing a metal pin grid array package |
-
1993
- 1993-11-22 WO PCT/US1993/011337 patent/WO1994014193A1/en not_active Application Discontinuation
- 1993-11-22 CA CA002150569A patent/CA2150569A1/en not_active Abandoned
- 1993-11-22 AU AU56161/94A patent/AU5616194A/en not_active Abandoned
- 1993-11-22 JP JP6514193A patent/JPH08505266A/ja active Pending
- 1993-11-22 EP EP94901644A patent/EP0673547A4/de not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622433A (en) * | 1984-03-30 | 1986-11-11 | Diacon, Inc. | Ceramic package system using low temperature sealing glasses |
| US4629824A (en) * | 1984-12-24 | 1986-12-16 | Gte Products Corporation | IC package sealing technique |
| US4704626A (en) * | 1985-07-08 | 1987-11-03 | Olin Corporation | Graded sealing systems for semiconductor package |
| US5023398A (en) * | 1988-10-05 | 1991-06-11 | Olin Corporation | Aluminum alloy semiconductor packages |
| EP0447884A2 (de) * | 1990-03-23 | 1991-09-25 | Motorola, Inc. | Halbleitervorrichtung mit einer bei niederer Temperatur ausgehärteten Epoxy-Vergussmasse und Verfahren zu ihrer Herstellung |
| US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO9414193A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0673547A1 (de) | 1995-09-27 |
| CA2150569A1 (en) | 1994-06-23 |
| WO1994014193A1 (en) | 1994-06-23 |
| JPH08505266A (ja) | 1996-06-04 |
| AU5616194A (en) | 1994-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19950608 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT NL |
|
| A4 | Supplementary search report drawn up and despatched | ||
| AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE FR GB IT NL |
|
| 17Q | First examination report despatched |
Effective date: 19971006 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 19990601 |