EP0644558A1 - Câble insulative structure - Google Patents
Câble insulative structure Download PDFInfo
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- EP0644558A1 EP0644558A1 EP94402087A EP94402087A EP0644558A1 EP 0644558 A1 EP0644558 A1 EP 0644558A1 EP 94402087 A EP94402087 A EP 94402087A EP 94402087 A EP94402087 A EP 94402087A EP 0644558 A1 EP0644558 A1 EP 0644558A1
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- matrix
- une
- structure according
- semiconductor layer
- insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
Definitions
- the present invention relates to an isolation structure for medium, high and very high voltage cables carrying direct or alternating current.
- These cables generally consist of a conductive core surrounded by an isolation structure which is coaxial with it.
- This structure comprises at least a first semiconductor layer placed in contact with the core of the cable, itself surrounded by a second electrically insulating layer, in turn covered by a third semiconductor layer.
- Other outer layers are used to protect the cable.
- the insulating layer is usually based on high density or low density polyethylene, crosslinked polyethylene, or alternatively ethylenepropylene-diene terpolymer with methylene main chain (EPDM).
- EPDM ethylenepropylene-diene terpolymer with methylene main chain
- the semiconductor layers are generally composed of a polar matrix, most often a copolymer of ethylene and alkyl acrylate, which is loaded with carbon black.
- the amount of filler varies according to the nature of the carbon black used. For an acetylene black or an oven black, the proportion of filler is generally between 28% and 40%.
- the dielectric strength of such a cable is very much linked to the quality of the interface between the semiconductor layer and the insulating layer.
- the slightest roughness at this interface can cause a strengthening of the electric field and lead to breakdown and perforation of the insulating layer.
- the matrix of semiconductor layers of high-voltage cables currently on the market is generally based on a polymer with a high melt index or "melt index" of around of 17 (A high "melt index” is the sign of the presence of low molar masses, it is measured according to ASTM standards reference D1238 or NFT 51-016), and having a very wide distribution in molar masses.
- a high "melt index” is the sign of the presence of low molar masses, it is measured according to ASTM standards reference D1238 or NFT 51-016), and having a very wide distribution in molar masses.
- Nonpolar matrices based on an ethylene copolymer (EPR: thermoplastic ethylene-propylene elastomer, or EPDM: ethylene-propylene-diene terpolymer with methylene main chain), to which they add oils or plasticizers to facilitate obtaining a good surface condition of the semiconductor layer.
- EPR thermoplastic ethylene-propylene elastomer
- EPDM ethylene-propylene-diene terpolymer with methylene main chain
- the object of the present invention is to provide an insulation structure for medium, high and very high voltage cables carrying direct or alternating current, having dielectric characteristics more stable over time than those known up to now.
- the object of the present invention is an insulation structure for a cable comprising at least a first semiconductor layer contiguous and coaxial with the core of the cable, surrounded by a second electrically insulating layer, itself covered by a third semiconductor layer.
- the semiconductor layers are composed exclusively of a matrix comprising apolar polymers whose components have a molar mass greater than 1000 and of a conductive filler.
- the components of the matrix have a molecular weight greater than 5000.
- the semiconductor layers contain low molecular weight compounds or additives, such as oils or plasticizers, these compounds migrate into the insulating layer. This phenomenon results in the formation of space charges which will cause an electrical field reinforcement and may subsequently lead to breakdowns.
- This field reinforcement is linked to the quantity of charges formed but also to their mobility: a quantity of uniformly distributed charges not giving as strong a field reinforcement as the same quantity of localized charges. This migration can occur during installation or during cable operation.
- composition according to the invention comprising only compounds of high molar mass, prevents the migration of species in the insulating layer and thereby the accumulation of space charges nearby interfaces.
- the matrix is chosen from polyethylene, polypropylene, polystyrene, and their copolymers, the polymer alloys chosen from polyethylene, polypropylene, polystyrene, and their copolymers, and mixtures of the selected compounds. among polyethylene, polypropylene, polystyrene, their copolymers, and the alloys mentioned above.
- the matrix is chosen from polyolefinic thermoplastic elastomers and their mixtures.
- the matrix will depend on the quality of its interface with the insulating layer and the mechanical properties of the semiconductor layer obtained, without requiring the use of additives.
- the present invention has the advantage of stabilizing the dielectric characteristics of the insulation structure by suppressing the migration of low molecular weight compounds. As a result, the quality of the interface between the different layers becomes a less critical parameter.
- the filler is a carbon black containing as few impurities as possible.
- the matrix also contains a crosslinking agent. After the material has been shaped by extrusion, it can be crosslinked in order to improve its thermomechanical properties. These properties are particularly critical for cables carrying alternating current.
- the pressure wave test is carried out using the installation shown in FIG. 1. This test makes it possible to evaluate the strengthening of the electric field in an isolation structure.
- the installation shown in Figure 1 consists of a laser 10 "YAg” whose beam is sent to a target 11 corresponding to the sample 1 of which each semiconductor constitutes an electrode (+) and (-).
- This beam absorbed at the surface of electrode 2 (-) decomposes this surface by pyrolysis, and the gases emitted cause a pressure wave which crosses the sample. This wave modulates the image charges on the electrodes and gives access to the volume charge density in the sample.
- a photodiode 12 makes it possible to synchronize a detector 13 with the laser 10.
- the circuit is electrically supplied by a high voltage supply 14 provided with a resistor 15.
- the recorded data are transferred to be processed by a computer 16 and represented as a function of time over a graphic recorder 17.
- the laser 10 sends a wave to the target 11 causing the appearance of space charges and the modification of the distribution of the electric field which is then measured by the detector 13.
- Example 4 A sample similar to that described in Example 4 is prepared but by adding to the matrix of the semiconductor layers, a paraffinic oil in an amount of 5% by weight relative to the matrix.
Abstract
Description
La présente invention concerne une structure d'isolement pour câble moyenne, haute, et très haute tension transportant du courant continu ou alternatif.The present invention relates to an isolation structure for medium, high and very high voltage cables carrying direct or alternating current.
Ces câbles sont généralement constitués d'une âme conductrice entourée d'une structure d'isolement qui lui est coaxiale. Cette structure comporte au moins une première couche semi-conductrice placée au contact de l'âme du câble, elle-même entourée d'une deuxième couche électriquement isolante, à son tour recouverte par une troisième couche semi-conductrice. D'autres couches extérieures servent à la protection du câble.These cables generally consist of a conductive core surrounded by an isolation structure which is coaxial with it. This structure comprises at least a first semiconductor layer placed in contact with the core of the cable, itself surrounded by a second electrically insulating layer, in turn covered by a third semiconductor layer. Other outer layers are used to protect the cable.
La couche isolante est habituellement à base de polyéthylène haute densité ou basse densité, de polyéthylène réticulé, ou bien encore de terpolymère d'éthylènepropylène-diène à chaîne principale méthylène (EPDM).The insulating layer is usually based on high density or low density polyethylene, crosslinked polyethylene, or alternatively ethylenepropylene-diene terpolymer with methylene main chain (EPDM).
Les couches semi-conductrices sont en général composées d'une matrice polaire, le plus souvent un copolymère d'éthylène et d'acrylate d'alkyl, qui est chargée par du noir de carbone. La quantité de charge varie suivant la nature du noir de carbone utilisé. Pour un noir d'acétylène ou un noir au four, la proportion de charge est généralement comprise entre 28% et 40%.The semiconductor layers are generally composed of a polar matrix, most often a copolymer of ethylene and alkyl acrylate, which is loaded with carbon black. The amount of filler varies according to the nature of the carbon black used. For an acetylene black or an oven black, the proportion of filler is generally between 28% and 40%.
La rigidité diélectrique d'un tel câble est très liée à la qualité de l'interface entre la couche semi-conductrice et la couche isolante. La moindre aspérité au niveau de cette interface peut provoquer un renforcement du champ électrique et conduire au claquage et à la perforation de la couche isolante.The dielectric strength of such a cable is very much linked to the quality of the interface between the semiconductor layer and the insulating layer. The slightest roughness at this interface can cause a strengthening of the electric field and lead to breakdown and perforation of the insulating layer.
Pour obtenir lors de l'extrusion une interface aussi lisse que possible, la matrice des couches semi-conductrices des câbles haute tension actuellement commercialisés est généralement à base d'un polymère d'indice de fluidité ou "melt index" élevé de l'ordre de 17 (Un "melt index" élevé est le signe de la présence de faibles masses molaires, il est mesuré suivant les normes ASTM référence D1238 ou NFT 51-016), et possédant une distribution très large en masses molaires. Mais on a constaté dans la couche isolante, à proximité des couches semi-conductrices, l'apparition de charges d'espace dont l'accumulation entraine une détérioration de la tenue diélectrique de l'isolant pouvant aller jusqu'au claquage.To obtain as smooth an interface as possible during extrusion, the matrix of semiconductor layers of high-voltage cables currently on the market is generally based on a polymer with a high melt index or "melt index" of around of 17 (A high "melt index" is the sign of the presence of low molar masses, it is measured according to ASTM standards reference D1238 or NFT 51-016), and having a very wide distribution in molar masses. However, it has been observed in the insulating layer, near the semiconductor layers, the appearance of space charges, the accumulation of which leads to a deterioration in the dielectric strength of the insulator, which can go as far as breakdown.
Certains fabricants de semi-conducteurs utilisent des matrices apolaires à base d'un copolymère de l'éthylène (EPR: élastomère thermoplastique d'éthylène-propylène , ou EPDM: terpolymère d'éthylène-propylène-diène à chaîne principale méthylène), auxquelles ils ajoutent des huiles ou des plastifiants pour faciliter l'obtention d'un bon état de surface de la couche semi-conductrice. Or ces huiles ou plastifiants diffusent dans la couche isolante et créent au niveau de l'interface entre la couche semi-conductrice et la couche isolante, où le champ électrique est le plus élevé, une région de plus faible rigidité diélectrique.Some semiconductor manufacturers use nonpolar matrices based on an ethylene copolymer (EPR: thermoplastic ethylene-propylene elastomer, or EPDM: ethylene-propylene-diene terpolymer with methylene main chain), to which they add oils or plasticizers to facilitate obtaining a good surface condition of the semiconductor layer. However, these oils or plasticizers diffuse in the insulating layer and create at the interface between the semiconductor layer and the insulating layer, where the electric field is the highest, a region of lower dielectric strength.
La présente invention a pour but de procurer une structure d'isolement pour câble moyenne, haute, et très haute tension transportant du courant continu ou alternatif, présentant des caractéristiques diélectriques plus stables au cours du temps que celles connues jusqu'à présent.The object of the present invention is to provide an insulation structure for medium, high and very high voltage cables carrying direct or alternating current, having dielectric characteristics more stable over time than those known up to now.
L'objet de la présente invention est une structure d'isolement pour câble comportant au moins une première couche semi-conductrice contigüe et coaxiale à l'âme du câble, entourée d'une deuxième couche électriquement isolante, elle-même recouverte par une troisième couche semi-conductrice. Les couches semi-conductrices sont composée exclusivement d'une matrice comportant des polymères apolaires dont les composants ont une masse molaire supérieure à 1000 et d'une charge conductrice.The object of the present invention is an insulation structure for a cable comprising at least a first semiconductor layer contiguous and coaxial with the core of the cable, surrounded by a second electrically insulating layer, itself covered by a third semiconductor layer. The semiconductor layers are composed exclusively of a matrix comprising apolar polymers whose components have a molar mass greater than 1000 and of a conductive filler.
De préférence, les composants de la matrice ont une masse moléculaire supérieure à 5000.Preferably, the components of the matrix have a molecular weight greater than 5000.
Si les couches semi-conductrices contiennent des composés de faibles masses molaires ou des additifs, comme des huiles ou des plastifiants, ces composés migrent dans la couche isolante. Ce phénomène a pour conséquence la formation de charges d'espaces qui vont provoquer des renforcement de champ électrique et peuvent conduire ultérieurement à des claquages. Ce renforcement de champ est lié à la quantité de charges formées mais également à leur mobilité: une quantité de charges uniformément réparties ne donnant pas de renforcement de champ aussi important que la même quantité de charges localisées. Cette migration peut se produire au cours de la mise en oeuvre ou au cours du fonctionnement du câble.If the semiconductor layers contain low molecular weight compounds or additives, such as oils or plasticizers, these compounds migrate into the insulating layer. This phenomenon results in the formation of space charges which will cause an electrical field reinforcement and may subsequently lead to breakdowns. This field reinforcement is linked to the quantity of charges formed but also to their mobility: a quantity of uniformly distributed charges not giving as strong a field reinforcement as the same quantity of localized charges. This migration can occur during installation or during cable operation.
L'emploi d'une couche semi-conductrice de composition selon l'invention ne comportant que des composés de masse molaire élevée, empêche la migration d'espèces dans la couche isolante et par là même l'accumulation de charges d'espace à proximité des interfaces.The use of a semiconductor layer of composition according to the invention comprising only compounds of high molar mass, prevents the migration of species in the insulating layer and thereby the accumulation of space charges nearby interfaces.
Selon une première variante de réalisation, la matrice est choisie parmi le polyéthylène, le polypropylène, le polystyrène, et leurs copolymères, les alliages de polymères choisis parmi le polyéthylène, le polypropylène, le polystyrène, et leurs copolymères, et les mélanges des composés choisis parmi le polyéthylène, le polypropylène, le polystyrène, leurs copolymères, et les alliages précédemment cités.According to a first alternative embodiment, the matrix is chosen from polyethylene, polypropylene, polystyrene, and their copolymers, the polymer alloys chosen from polyethylene, polypropylene, polystyrene, and their copolymers, and mixtures of the selected compounds. among polyethylene, polypropylene, polystyrene, their copolymers, and the alloys mentioned above.
Selon une deuxième variante de réalisation, la matrice est choisie parmi les élastomères thermoplastiques polyoléfiniques et leurs mélanges.According to a second alternative embodiment, the matrix is chosen from polyolefinic thermoplastic elastomers and their mixtures.
Du choix des polymères constituants la matrice dépendra la qualité de son interface avec la couche isolante et les propriétés mécaniques de la couche semi-conductrice obtenue, sans nécessiter le recours à des additifs.On the choice of the constituent polymers, the matrix will depend on the quality of its interface with the insulating layer and the mechanical properties of the semiconductor layer obtained, without requiring the use of additives.
La présente invention a pour avantage de stabiliser les caractéristiques diélectriques de la structure d'isolement en supprimant la migration des composés de faible masse molaire. En conséquence, la qualité de l'interface entre les différentes couches devient un paramètre moins critique.The present invention has the advantage of stabilizing the dielectric characteristics of the insulation structure by suppressing the migration of low molecular weight compounds. As a result, the quality of the interface between the different layers becomes a less critical parameter.
La charge est un noir de carbone contenant le moins possible d'impuretés. On peut utiliser un noir au four ou un noir "KETJEN", mais on choisira de préférence, un noir d'acétylène qui est beaucoup plus pur.The filler is a carbon black containing as few impurities as possible. We can use a black oven or a black "KETJEN", but we will preferably choose an acetylene black which is much purer.
Dans certain cas la matrice contient en outre un agent de réticulation. Après mise en forme du matériau par extrusion, on peut le réticuler en vue d'améliorer ses propriétés thermomécaniques. Ces propriétés sont particulièrement critiques pour les câbles transportant du courant alternatif.In some cases the matrix also contains a crosslinking agent. After the material has been shaped by extrusion, it can be crosslinked in order to improve its thermomechanical properties. These properties are particularly critical for cables carrying alternating current.
D'autres caractéristiques et avantages de la présente invention apparaitront à la lecture des exemples suivants, donnés bien entendu à titre illustratif et non limitatif, et en référence au dessin annexé dans lequel:
- la figure 1 montre le schéma général de l'installation d'essai de l'onde de pression,
- la figure 2 représente une vue de dessus de l'échantillon de la structure d'isolement pour l'essai de l'onde de pression,
- la figure 3 une coupe schématique de l'échantillon de la figure 2.
- Figure 1 shows the general diagram of the pressure wave test facility,
- FIG. 2 represents a top view of the sample of the insulation structure for testing the pressure wave,
- Figure 3 a schematic section of the sample of Figure 2.
L'essai de l'onde de pression est effectué à l'aide de l'installation représentée sur la figure 1. Ce test permet d'évaluer le renforcement du champ électrique dans une structure d'isolement.The pressure wave test is carried out using the installation shown in FIG. 1. This test makes it possible to evaluate the strengthening of the electric field in an isolation structure.
Un échantillon 1 de la structure d'isolement pour l'essai de l'onde de pression est représenté vue de dessus sur la figure 2 et en coupe sur la figure 3. Sur une surface circulaire de diamètre A 20mm, on trouve superposées:
- une
première couche 2 semi-conductrice d'épaisseur B 0,5mm, - une
deuxième couche 3 électriquement isolante d'épaisseur C 0,8mm, - une
troisième couche 4 semi-conductrice identique à lacouche 2.
- a
first semiconductor layer 2 of thickness B 0.5 mm, - a second electrically insulating
layer 3 of thickness C 0.8 mm, - a
third semiconductor layer 4 identical tolayer 2.
L'installation représentée sur la figure 1, se compose d'un laser 10 "YAg" dont le faisceau est envoyé sur une cible 11 correspondant à l'échantillon 1 dont chaque semiconducteur constitue une électrode (+) et (-). Ce faisceau absorbé en surface de l'électrode 2 (-) décompose cette surface par pyrolyse, et les gaz émis provoquent une onde de pression qui traverse l'échantillon. Cette onde module les charges-images sur les électrodes et donne accès à la densité de charge volumique dans l'échantillon.The installation shown in Figure 1, consists of a
Une photodiode 12 permet de synchroniser un détecteur 13 au laser 10. Le circuit est alimenté électriquement par une alimentation haute tension 14 munie d'une résistance 15. Les données enregistrées sont transférées pour être traitées par un ordinateur 16 et représentées en fonction du temps sur un enregisteur graphique 17. Le laser 10 envoie une onde sur la cible 11 provoquant l'apparition de charges d'espace et la modification de la répartition du champ électrique qui alors est mesurée par le détecteur 13.A
On réalise un échantillon de la structure d'isolement selon l'art antérieur, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice polaire à base d'un copolymère d'éthylène et d'acrylate d'alkyl dont le "melt index" a pour valeur 8 et dont la teneur en ester est de 20%, à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice,
- une deuxième couche électriquement isolante composée d'un élastomère thermoplastique oléfinique,
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of a polar matrix based on a copolymer of ethylene and alkyl acrylate whose "melt index" has the value 8 and whose ester content is 20%, which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix,
- a second electrically insulating layer composed of an olefinic thermoplastic elastomer,
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. On constate l'apparition dans des proportions importantes de charges négatives à la cathode 2. Le renforcement du champ est alors supérieur à 20% et les charges restent piégées dans le matériau plusieurs heures après la coupure de la tension.This sample is then subjected to the pressure wave test using the installation shown in FIG. 1. We note the appearance in significant proportions of negative charges at the
On réalise un échantillon de la structure d'isolement selon l'art antérieur, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice polaire à base d'un copolymère d'éthylène et d'acrylate d'alkyl dont le "melt index" a pour valeur 8 et dont la teneur en ester est de 20%, à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice,
- une deuxième couche électriquement isolante composée d'un polyéthylène réticulé chimiquement(PRC),
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of a polar matrix based on a copolymer of ethylene and alkyl acrylate whose "melt index" has the value 8 and whose ester content is 20%, which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix,
- a second electrically insulating layer composed of a chemically crosslinked polyethylene (PRC),
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. On constate l'apparition dans des proportions importantes de charges négatives à proximité de la cathode 2 et qui restent piégées dans la matrice de la couche isolante après coupure de la tension. Le renforcement du champ est supérieur à 20%.This sample is then subjected to the pressure wave test using the installation shown in FIG. 1. We note the appearance in significant proportions of negative charges near the
On réalise un échantillon de la structure d'isolement selon l'invention, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice apolaire à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice; la matrice contient d'une part 20% de polyéthylène (PE) dont le "melt index" a pour
valeur 2 et dont la masse molaire est comprise entre 10³ et 10⁷ et centrée sur 1,1.10⁶, et d'autre part 80% d'un copolymère d'éthylène et de propylène contenant environ 50% en poids d'éthylène dont la viscosité "MOONEY" (mesurée selon la norme NFT 43005) est de l'ordre de 40 et dont la masse molaire est comprise entre 10³ et 10⁷ et centrée sur 1,2.10⁵, - une deuxième couche électriquement isolante composée d'un polyéthylène réticulé chimiquement (PRC),
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of an apolar matrix to which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix; the matrix contains on the one hand 20% of polyethylene (PE) whose "melt index" has the
value 2 and whose molar mass is between 10³ and 10⁷ and centered on 1.1.10⁶, and on the other hand 80% of a copolymer of ethylene and propylene containing approximately 50% by weight of ethylene whose viscosity "MOONEY" (measured according to standard NFT 43005) is of the order of 40 and whose molar mass is between 10³ and 10⁷ and centered on 1.2.10⁵, - a second electrically insulating layer composed of a chemically crosslinked polyethylene (PRC),
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ électrique est inférieur à 10%, et après coupure de la tension il ne subsiste pas de charges piégées dans le matériau isolant.This sample is then subjected to the pressure wave test using the installation shown in Figure 1. The reinforcement of the electric field is less than 10%, and after cutting the voltage there does not remain charges trapped in the insulating material.
On réalise un échantillon de la structure d'isolement selon l'invention, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice apolaire à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice; la matrice contient d'une part 20% de polyéthylène (PE) dont le "melt index" a pour
valeur 2 et dont la masse molaire est centrée sur 1,1.10⁶, et d'autre part 80% d'un copolymère d'éthylène et de propylène contenant environ 50% en poids d'éthylène dont la viscosité "MOONEY" (selon la norme NFT 43005) est de l'ordre de 40 et dont la masse molaire est comprise entre 10³ et 10⁷ et centrée sur 1,2.10⁵, - une deuxième couche électriquement isolante composée d'un élastomère thermoplastique oléfinique,
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of an apolar matrix to which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix; the matrix contains on the one hand 20% of polyethylene (PE) whose "melt index" has the
value 2 and whose molar mass is centered on 1.1.10⁶, and on the other hand 80% of a copolymer of ethylene and propylene containing about 50% by weight of ethylene whose viscosity "MOONEY" (according to standard NFT 43005) is of the order 40 and whose molar mass is between 10³ and 10⁷ and centered on 1.2.10⁵, - a second electrically insulating layer composed of an olefinic thermoplastic elastomer,
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ électrique est inférieur à 10%, et après coupure de la tension il ne subsiste pas de charges piégées dans le matériau isolant.This sample is then subjected to the pressure wave test using the installation shown in Figure 1. The reinforcement of the electric field is less than 10%, and after cutting the voltage there does not remain charges trapped in the insulating material.
Un échantillon analogue à celui décrit dans l'exemple 4 est préparé mais en ajoutant à la matrice des couches semi-conductrices, une huile paraffinique à raison de 5% en poids par rapport à la matrice.A sample similar to that described in Example 4 is prepared but by adding to the matrix of the semiconductor layers, a paraffinic oil in an amount of 5% by weight relative to the matrix.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ dans ce cas est de 140%.This sample is then subjected to the pressure wave test using the installation shown in FIG. 1. The reinforcement of the field in this case is 140%.
Bien entendu la présente invention n'est pas limitée aux modes de réalisation décrits , mais elle est suceptible de nombreuses variantes accessibles à l'homme de l'art sans que l'on ne s'écarte de l'esprit de l'invention. En particulier, on pourra sans sortir du cadre de l'invention remplacer tout moyen par un moyen équivalent.Of course the present invention is not limited to the embodiments described, but it is susceptible to numerous variants accessible to those skilled in the art without departing from the spirit of the invention. In particular, without going beyond the scope of the invention, any means can be replaced by equivalent means.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311234A FR2710447B1 (en) | 1993-09-21 | 1993-09-21 | Isolation structure for cable. |
FR9311234 | 1993-09-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0644558A1 true EP0644558A1 (en) | 1995-03-22 |
EP0644558B1 EP0644558B1 (en) | 1999-06-02 |
EP0644558B2 EP0644558B2 (en) | 2003-05-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94402087A Expired - Lifetime EP0644558B2 (en) | 1993-09-21 | 1994-09-20 | Câble insulative structure |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0644558B2 (en) |
JP (1) | JP3658018B2 (en) |
KR (1) | KR100323179B1 (en) |
CN (1) | CN1122285C (en) |
DE (1) | DE69418804T3 (en) |
DK (1) | DK0644558T4 (en) |
FR (1) | FR2710447B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1634913A1 (en) * | 2004-09-10 | 2006-03-15 | Borealis Technology Oy | Semiconductive polymer composition |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004178867A (en) * | 2002-11-25 | 2004-06-24 | Mitsubishi Cable Ind Ltd | Power cable |
JP4866545B2 (en) * | 2004-12-03 | 2012-02-01 | 株式会社フジクラ | Cable and twisted cable |
CH698074B1 (en) * | 2005-11-11 | 2009-05-15 | Studer Ag Draht & Kabelwerk | Multi-conductor cable for transmitting rectangular extending alternating currents. |
EP2711934B1 (en) * | 2012-09-25 | 2018-07-11 | Nexans | Silicone multilayer insulation for electric cable |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0057604A1 (en) * | 1981-01-30 | 1982-08-11 | Nippon Unicar Company Limited | Semi-conductive polyolefin compositions, laminates thereof and cables covered with same |
JPH0456009A (en) * | 1990-06-22 | 1992-02-24 | Central Res Inst Of Electric Power Ind | Improving method for semiconductive layer interface of polyolefin insulated cable |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115798A (en) † | 1978-03-01 | 1979-09-08 | Fujikura Ltd | Semiconductive composition for power cable |
JPS5562610A (en) † | 1978-10-31 | 1980-05-12 | Dainichi Nippon Cables Ltd | Power cable |
JPS57199108A (en) † | 1981-06-01 | 1982-12-07 | Showa Electric Wire & Cable Co | Crosslinked polyethylene insulated power cable |
AU615804B2 (en) † | 1988-09-30 | 1991-10-10 | Exxon Chemical Patents Inc. | Linear ethylene interpolymer blends of interpolymers having narrow molecular weight and composition distributions |
US5246783A (en) † | 1991-08-15 | 1993-09-21 | Exxon Chemical Patents Inc. | Electrical devices comprising polymeric insulating or semiconducting members |
JP4056009B2 (en) * | 2000-01-31 | 2008-03-05 | 東芝テック株式会社 | Inline type pump |
-
1993
- 1993-09-21 FR FR9311234A patent/FR2710447B1/en not_active Expired - Lifetime
-
1994
- 1994-09-17 KR KR1019940023808A patent/KR100323179B1/en not_active IP Right Cessation
- 1994-09-20 EP EP94402087A patent/EP0644558B2/en not_active Expired - Lifetime
- 1994-09-20 JP JP22505494A patent/JP3658018B2/en not_active Expired - Fee Related
- 1994-09-20 DK DK94402087T patent/DK0644558T4/en active
- 1994-09-20 DE DE69418804T patent/DE69418804T3/en not_active Expired - Lifetime
- 1994-09-21 CN CN94113695A patent/CN1122285C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0057604A1 (en) * | 1981-01-30 | 1982-08-11 | Nippon Unicar Company Limited | Semi-conductive polyolefin compositions, laminates thereof and cables covered with same |
JPH0456009A (en) * | 1990-06-22 | 1992-02-24 | Central Res Inst Of Electric Power Ind | Improving method for semiconductive layer interface of polyolefin insulated cable |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 16, no. 254 (E - 1213) 9 June 1992 (1992-06-09) * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1634913A1 (en) * | 2004-09-10 | 2006-03-15 | Borealis Technology Oy | Semiconductive polymer composition |
WO2006027261A1 (en) * | 2004-09-10 | 2006-03-16 | Borealis Technology Oy | Semiconductive polymer composition |
WO2006027262A1 (en) * | 2004-09-10 | 2006-03-16 | Borealis Technology Oy | Semiconductive polymer composition |
KR100839947B1 (en) * | 2004-09-10 | 2008-06-19 | 보레알리스 테크놀로지 오와이 | Semiconductive polymer composition |
EP1978040A1 (en) | 2004-09-10 | 2008-10-08 | Borealis Technology Oy | Semiconductive polymer composition |
US7732711B2 (en) | 2004-09-10 | 2010-06-08 | Borealis Technology Oy | Semiconductive polymer composition |
US8124877B2 (en) | 2004-09-10 | 2012-02-28 | Borealis Technology Oy | Semiconductive polymer composition |
Also Published As
Publication number | Publication date |
---|---|
DK0644558T4 (en) | 2003-09-22 |
FR2710447A1 (en) | 1995-03-31 |
EP0644558B2 (en) | 2003-05-28 |
DE69418804T2 (en) | 1999-12-09 |
CN1122285C (en) | 2003-09-24 |
JP3658018B2 (en) | 2005-06-08 |
EP0644558B1 (en) | 1999-06-02 |
DK0644558T3 (en) | 1999-12-13 |
DE69418804T3 (en) | 2004-04-01 |
DE69418804D1 (en) | 1999-07-08 |
KR950009752A (en) | 1995-04-24 |
CN1108789A (en) | 1995-09-20 |
KR100323179B1 (en) | 2002-06-27 |
FR2710447B1 (en) | 1995-11-10 |
JPH07169324A (en) | 1995-07-04 |
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