EP0616360A3 - Procédé et appareil pour refroidir des disques semi-conducteurs. - Google Patents

Procédé et appareil pour refroidir des disques semi-conducteurs. Download PDF

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Publication number
EP0616360A3
EP0616360A3 EP9494104187A EP94104187A EP0616360A3 EP 0616360 A3 EP0616360 A3 EP 0616360A3 EP 9494104187 A EP9494104187 A EP 9494104187A EP 94104187 A EP94104187 A EP 94104187A EP 0616360 A3 EP0616360 A3 EP 0616360A3
Authority
EP
European Patent Office
Prior art keywords
semiconductor wafers
cooling semiconductor
cooling
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP9494104187A
Other languages
German (de)
English (en)
Other versions
EP0616360A2 (fr
Inventor
Akihiro Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP0616360A2 publication Critical patent/EP0616360A2/fr
Publication of EP0616360A3 publication Critical patent/EP0616360A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP9494104187A 1993-03-17 1994-03-17 Procédé et appareil pour refroidir des disques semi-conducteurs. Ceased EP0616360A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32361 1993-03-17
US08/032,361 US5345999A (en) 1993-03-17 1993-03-17 Method and apparatus for cooling semiconductor wafers

Publications (2)

Publication Number Publication Date
EP0616360A2 EP0616360A2 (fr) 1994-09-21
EP0616360A3 true EP0616360A3 (fr) 1994-10-19

Family

ID=21864555

Family Applications (1)

Application Number Title Priority Date Filing Date
EP9494104187A Ceased EP0616360A3 (fr) 1993-03-17 1994-03-17 Procédé et appareil pour refroidir des disques semi-conducteurs.

Country Status (4)

Country Link
US (1) US5345999A (fr)
EP (1) EP0616360A3 (fr)
JP (1) JPH06326181A (fr)
KR (1) KR100314573B1 (fr)

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* Cited by examiner, † Cited by third party
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EP0138254A1 (fr) * 1983-09-30 1985-04-24 Philips Electronics Uk Limited Support électrostatique et procédé pour charger
JPH0487321A (ja) * 1990-07-31 1992-03-19 Japan Synthetic Rubber Co Ltd 真空処理装置の被処理物保持装置
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KR940022750A (ko) 1994-10-21
KR100314573B1 (ko) 2002-04-06
JPH06326181A (ja) 1994-11-25
EP0616360A2 (fr) 1994-09-21
US5345999A (en) 1994-09-13

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