EP0581919B1 - Gehäuse für steuergeräte - Google Patents

Gehäuse für steuergeräte Download PDF

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Publication number
EP0581919B1
EP0581919B1 EP93902082A EP93902082A EP0581919B1 EP 0581919 B1 EP0581919 B1 EP 0581919B1 EP 93902082 A EP93902082 A EP 93902082A EP 93902082 A EP93902082 A EP 93902082A EP 0581919 B1 EP0581919 B1 EP 0581919B1
Authority
EP
European Patent Office
Prior art keywords
housing
circuit board
lamination
printed circuit
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP93902082A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0581919A1 (de
Inventor
Dieter Hussmann
Thomas Jessberger
Dieter Karr
Karl Schupp
Peter Jares
Dieter Neuhaus
Markus Harsch
Bernd Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0581919A1 publication Critical patent/EP0581919A1/de
Application granted granted Critical
Publication of EP0581919B1 publication Critical patent/EP0581919B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Definitions

  • the invention is based on a housing for control devices known from DE-A-40 23 319, for example.
  • control units there is a requirement that they are stable on the one hand and should store the electrical components securely and protect them from harmful influences, and on the other hand an electronic circuit which is accommodated in such housings should be protected against external electrical interference on the circuit.
  • interference radiation arising in the electrical circuit should not be allowed to escape to the outside.
  • components sensitive to interference radiation should also be secured against the radiation of interference-emitting components.
  • the heat generated in the electrical circuit in the component is to be safely transported away, so that there is no damage to the components or a functional impairment.
  • the housing according to the invention for control devices according to the characterizing features of claim 1 has the advantage that the heat generated by the power components is dissipated in a simple and safe manner and the housing parts are electrically and thermally connected to one another in a radiation-proof and radiation-proof manner.
  • the embodiment according to claim 9 advantageously creates a heat-conducting connection between the heat sources of the electrical circuit.
  • the webs on the one hand result in mechanical stabilization and an improvement in the vibration stability of the housing parts, on the other hand more intensive clamping of the printed circuit board and enlargement of the heat-conducting and electrically conductive connection between the housing parts.
  • FIG. 1 shows a section parallel to the parting plane of the housing parts of a first exemplary embodiment of a housing for control units
  • FIG. 2 shows a section along line II-II in FIG. 1 through the housing for control units
  • FIG. 3 shows a side view of the control housing according to the invention from FIG. 1 on the side the electrical connection
  • Figure 4 shows an enlarged detail from IV of Figure 2
  • Figure 5 is a plan view of the end face of a housing half in the parting plane between the housing halves
  • Figure 6 shows a section through the assembled housing halves of the housing according to the invention without a circuit board
  • Figure 7 shows a second embodiment of the invention with lamination embedded in the circuit board
  • FIG. 1 shows a section parallel to the parting plane of the housing parts of a first exemplary embodiment of a housing for control units
  • FIG. 2 shows a section along line II-II in FIG. 1 through the housing for control units
  • FIG. 3 shows a side view of the control housing according to the invention from FIG. 1 on the
  • FIG. 8 shows a third exemplary embodiment of the invention with a three-part housing, one housing part of which extends beyond the circuit board on the circumference, and
  • FIG. 9 shows a variant of the housing shape with a part inwards and a part outwardly bent housing wall forming a flange.
  • FIG. 10 shows a section parallel to the parting plane of the housing parts of a further exemplary embodiment of a housing for control devices,
  • FIG. 11 shows a section along line XI-XI in FIG. 10 through the housing.
  • Figure 1 shows a section through the cover 2 of a housing for control units.
  • the roughened surface shows the cut surface through the wall of the cover.
  • a flange 23 can be seen all around the cutting surface, which is shown in side view in FIG. 3 below.
  • From the cut circumferential wall 16 webs 17 protrude into the housing interior, which form niches 18 together with the circumferential wall 16, within which electrical power components 3 are arranged.
  • These are located on a circuit board 6 which is clamped between the cover 2 and a base 1 in the parting plane between the cover and the base.
  • the circuit board extends into the region of the flange 23 of the cover and a flange 24 of the same size, as can be seen in FIGS. 2 and 4.
  • One of the flanges 23 or 24 can have an outer circumferential projection 26 which surrounds the circuit board on the circumference and holds it in a preferred position. Between this circumferential projection and the flange of the other housing part, a seal 27 is inserted, which e.g. can be a round cord ring which is inserted into corresponding guide recesses 28 in the flanges.
  • the connection of the housing parts takes place after placing the circuit board 6 on the flange face 29 of the flange 24 and inserting the seal 27 by placing the cover with its flange face 30 and then clipping or screwing of the usual type.
  • the circuit board is now designed in such a way that it has the usual conductor tracks for the electrical connection of the individual components (not shown further here) and that it additionally has a lamination 10, which is preferably applied on both sides and is located in the region of the edge of the circuit board, in particular up to its outermost edge extends such that at Assembled housing halves, the end faces 30 and 29 of the cover and base come into electrically conductive and thermally conductive contact with the lamination 10.
  • the lamination either has the same layer height as that of the conductor tracks or the liner 10, as can be seen in FIG.
  • the lamination can advantageously consist of copper and be laminated on, rolled on or galvanized. The heat conduction properties are improved by the greater thickness of the lamination.
  • cooling lugs 14 of the power components are now in heat-conducting contact.
  • These cooling lugs which are available as standard, are held in safe, heat-conducting contact with the lamination either by screwing on or by soldering or in some other way.
  • the lamination extends so far into the interior of the housing that a secure heat transfer with the components is guaranteed.
  • the lamination also extends in the region of the projecting webs 17, which, with their opposite end faces, clamp the printed circuit board with lamination between them.
  • the lamination of the printed circuit board is provided on both sides to achieve better conductivity and in particular for the electrical connection of the two housing parts, and is electrically and with one another also thermally connected.
  • connecting parts 12 are provided which are passed through bores in the printed circuit board 6 and are each connected to the lamination.
  • the connecting parts 12 can already be created in one operation with the lamination with a pre-drilled circuit board, or holes are made and these holes are cast in an electrically conductive manner.
  • An end connection between the two lamination parts is also possible, which makes the arrangement particularly radiation-tight.
  • a third exemplary embodiment of the invention according to FIG. 8 shows an embodiment in which an end shielding of the printed circuit board is made possible.
  • the cover 2 shown in FIGS. 1 to 6 is made in two parts, consisting of a circumferential frame 44 and a cover part 45 made of sheet metal and flanged on the edge towards the frame 44.
  • the frame 44 is also formed from sheet metal, as is the base 46, which corresponds to the base 1 in FIGS. 1 to 6.
  • This floor has a floor pan 47 which is delimited on the circumferential side by a flange 48, between which and the frame 44 the circuit board 6 is clamped.
  • the flange 48 has a raised edge 50, which encompasses the end face of the circuit board 6 on the circumferential side and furthermore also overlaps part of the frame 44. This edge results in improved security against interference radiation or radiation.
  • the frame 44 formed from sheet metal has on the side of the printed circuit board 6 a flange region 52 which projects vertically inwards from the peripheral wall and which, with its surface 53 facing the printed circuit board, forms the end face of the frame with which the frame comes into contact with the printed circuit board 6 .
  • the lamination extends over the entire flange area.
  • FIG. 8 shows a section along the line VIII-VIII in FIG. 1 and it can be seen from this that this section is drawn through one of the webs 17. Of the Flange region 52 therefore also has these webs 17, which, however, are not quite as high as in the exemplary embodiment according to FIGS. 1 to 6.
  • the webs 17 then enclose, as in the previous exemplary embodiment, the electrical modules, which are and form power modules with higher heat development in particular Niches 18 as shown in Figure 1. This also ensures good heat dissipation to the housing surface.
  • the frame 44 can advantageously be designed as a bent sheet metal part. A cast part is also possible.
  • FIG. 9 A further embodiment variant of the housing is shown in FIG. 9, again with a two-part housing, a cover 102 and a base 101. Both parts are formed from sheet metal, the base again being designed as a base trough 147, as in the exemplary embodiment according to FIG. 8, and a circumferential, possibly has an outer flange 148 interrupted by connections.
  • the cover 102 is provided with a flange area 152, similar to FIG. 8, parts of which are bent inward from the edge of the pot-shaped cover 102 to form a flange area 152, as in FIG.
  • the heat generated in the power modules is immediately transferred to the Housing forwarded from where the heat can radiate to the outside.
  • radiant and convection heat is also emitted to the adjacent housing wall parts better than would be possible in a different arrangement of the components on the printed circuit board. In this way, the power components are cooled in an optimal way.
  • the housing according to the invention is further designed such that the housing wall 34 adjoining the peripheral wall one or more connecting pieces 19 protrude vertically inwards, which also run perpendicularly to the parting plane 33 of the housing parts and end flush with the end face 30. Corresponding nozzles projecting from the wall 35 of the other housing part are flush with these nozzles on one housing part. The end faces of these sockets 19 clamp the circuit board 6 between them, as can be seen in FIG. 2.
  • the printed circuit board is in turn provided with a plated-through lamination 21, so that the connecting piece is connected to one another in an electrically conductive manner at this point.
  • the connecting pieces thus enclose an area 37 between them or between them and the printed circuit board, which is leakproof and protects control elements 4 located therein against interference or external elements from interference radiation from the components within area 37.
  • the lamination is advantageously made of copper, which has both good electrically conductive and good heat-conducting properties.
  • FIG. 6 shows a section through the assembled housing parts for a better representation without a printed circuit board being inserted.
  • FIG. 5 shows a picture of the end face 29 of the bottom 1 of the housing facing the other housing half. Here, in the area of the nozzle 19, the bores 40 can be seen, into which the pins 39 engage.
  • FIGS. 10 and 11 show a housing in which the printed circuit board 6 is clamped between base 1 and cover 2, as in the exemplary embodiments.
  • power components 3 and control elements 4 are arranged on the top of the printed circuit board 6.
  • the printed circuit board is provided with the lamination 10 on both sides in its edge region.
  • the lamination 10 in this exemplary embodiment is designed such that individual power components 3 or power components combined in groups are enclosed in a parcel-like manner. It goes without saying that no lamination 10 is applied to the circuit board 6 in the region of conductor tracks. In these areas, the lamination is brought up to the conductor tracks without touching them.
  • webs 171 are formed which run approximately perpendicular to the surface of the printed circuit board and are connected to the peripheral walls 16 or the top of the cover 2 or the underside of the base 1. These webs 171 are designed such that they encompass or limit the plots 181 formed on the printed circuit board 6. For this purpose, the end faces of the webs 171 are on the printed circuit board 6 or on the Lamination 10 on.
  • recesses 172 are formed in the webs 171, which encompass the conductor tracks at a distance.
  • the webs 171 are each formed in the bottom 1 and cover 2 such that they are aligned with one another and each rest on the upper or lower side of the printed circuit board 6 on the corresponding lamination 10.
  • the webs 171 are oriented essentially so that they run parallel to one of the peripheral walls 16. However, you can also take any other orientation.
  • the vibration stability of the housing is significantly improved by this parcel-like structure of the printed circuit board and by the correspondingly designed webs 171 which rest on the printed circuit board 6.
  • individual power components 3 or groups of power components 3 and / or control elements 4 are housed in almost closed chambers, which on the one hand improves the heat dissipation and on the other hand the convection and thus the influence on other components is locally limited or prevented.
  • a two-part or essentially two-part housing has been shown above. It goes without saying that such a housing can also be made in three or more parts with an intermediate part lying between the cover and the bottom, in particular when e.g. two printed circuit boards are to be connected to the housing in the manner mentioned.
  • Figure 3 shows the view from the side from which the circuit is contacted.
  • a three-part plug connection 41 can be seen, which is coded with recesses 42 on the edge.
  • shielding of sensitive electrical components can be achieved in a very simple manner, and good cooling of the power components can also be achieved in a simple manner, without additional cooling elements being necessary.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
EP93902082A 1992-02-21 1993-02-05 Gehäuse für steuergeräte Expired - Lifetime EP0581919B1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE4205388 1992-02-21
DE4205388 1992-02-21
DE4224008 1992-07-21
DE4224008 1992-07-21
DE4243180 1992-12-19
DE4243180A DE4243180A1 (enrdf_load_stackoverflow) 1992-02-21 1992-12-19
PCT/DE1993/000095 WO1993017535A1 (de) 1992-02-21 1993-02-05 Gehäuse für steuergeräte

Publications (2)

Publication Number Publication Date
EP0581919A1 EP0581919A1 (de) 1994-02-09
EP0581919B1 true EP0581919B1 (de) 1996-05-22

Family

ID=27203437

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93902082A Expired - Lifetime EP0581919B1 (de) 1992-02-21 1993-02-05 Gehäuse für steuergeräte

Country Status (5)

Country Link
EP (1) EP0581919B1 (enrdf_load_stackoverflow)
JP (1) JP3842286B2 (enrdf_load_stackoverflow)
DE (2) DE4243180A1 (enrdf_load_stackoverflow)
ES (1) ES2087710T3 (enrdf_load_stackoverflow)
WO (1) WO1993017535A1 (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4337866A1 (de) * 1993-11-05 1995-05-11 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
DE4436547A1 (de) * 1994-10-13 1996-04-18 Telefunken Microelectron Gehäuse für Elektronikbaugruppen
US5594199A (en) * 1995-03-23 1997-01-14 Ford Motor Company EMI baffle for electronic control
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
JP2000517474A (ja) * 1996-08-29 2000-12-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 落下に対して鋭敏な構成素子を有する電気的な制御装置、特に、自動車の保護装置を作動するためのセンサに用いられるケーシング
DE29701502U1 (de) * 1997-01-30 1998-05-28 Robert Bosch Gmbh, 70469 Stuttgart Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
EP0872396B1 (de) * 1997-04-16 2003-05-21 Siemens Aktiengesellschaft Ventilsteuergerät
DE10120715A1 (de) * 2001-04-27 2002-11-28 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
DE10205816A1 (de) * 2002-02-13 2003-08-14 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
DE102005039706A1 (de) * 2005-08-23 2007-03-01 Hella Kgaa Hueck & Co. Leiterplattenanordnung
DE102007032510A1 (de) * 2007-07-12 2009-01-15 Robert Bosch Gmbh Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts
DE102008003787B4 (de) 2008-01-10 2021-08-19 Robert Bosch Gmbh Leiterplattenanordnung
JP5290379B2 (ja) * 2011-10-14 2013-09-18 三菱電機株式会社 無線装置及びリモートキーレスエントリー装置
JP5808703B2 (ja) * 2012-03-21 2015-11-10 日立オートモティブシステムズ株式会社 電子制御装置
JP6070977B2 (ja) * 2012-05-21 2017-02-01 日本精機株式会社 電子回路装置
JP6108957B2 (ja) * 2013-05-24 2017-04-05 本田技研工業株式会社 電子装置
DE102013227224A1 (de) 2013-12-30 2015-07-02 Robert Bosch Gmbh Leiterplattenanordnung
DE102015122913B4 (de) * 2015-12-29 2017-09-14 Kathrein-Werke Kg Hochfrequenzverstärker für Koaxialnetzwerke
JP6245483B2 (ja) * 2016-02-26 2017-12-13 日本精機株式会社 電子回路装置
JP6427550B2 (ja) * 2016-12-27 2018-11-21 本田技研工業株式会社 電子装置
DE112021002444T5 (de) * 2020-09-18 2023-02-23 Hitachi Astemo, Ltd. Elektronische Steuervorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128856A1 (de) * 1981-07-22 1983-02-10 Oelsch KG, 1000 Berlin Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte
GB2239739A (en) * 1989-11-16 1991-07-10 Motorola Gmbh Electronic circuit assemblies
DE4023319C1 (enrdf_load_stackoverflow) * 1990-07-21 1991-12-12 Robert Bosch Gmbh, 7000 Stuttgart, De

Also Published As

Publication number Publication date
DE59302666D1 (de) 1996-06-27
JPH06507049A (ja) 1994-08-04
WO1993017535A1 (de) 1993-09-02
ES2087710T3 (es) 1996-07-16
DE4243180A1 (enrdf_load_stackoverflow) 1993-08-26
EP0581919A1 (de) 1994-02-09
JP3842286B2 (ja) 2006-11-08

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