EP0536795B1 - Method for the manufacture of wood chipboards and medium density wood fibreboards - Google Patents

Method for the manufacture of wood chipboards and medium density wood fibreboards Download PDF

Info

Publication number
EP0536795B1
EP0536795B1 EP92117336A EP92117336A EP0536795B1 EP 0536795 B1 EP0536795 B1 EP 0536795B1 EP 92117336 A EP92117336 A EP 92117336A EP 92117336 A EP92117336 A EP 92117336A EP 0536795 B1 EP0536795 B1 EP 0536795B1
Authority
EP
European Patent Office
Prior art keywords
wood
binder
chip
fibre
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92117336A
Other languages
German (de)
French (fr)
Other versions
EP0536795A1 (en
Inventor
Brigitte Dr.Ing. Dix
Dr. Edmone Roffael Prof.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6442348&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0536795(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP0536795A1 publication Critical patent/EP0536795A1/en
Application granted granted Critical
Publication of EP0536795B1 publication Critical patent/EP0536795B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/02—Mixing the material with binding agent
    • B27N1/0209—Methods, e.g. characterised by the composition of the agent

Definitions

  • the invention relates to a method for producing chipboard and medium-density fibreboard according to the preamble of the main claim.
  • Dried chips or wet fibers are glued with binders for the production of such chipboard or wood fiber boards.
  • the binder content is 5 to 12% - based on dry fiber or chip material.
  • the binder is usually sprayed onto the chips or wood fibers.
  • the glued chips are formed into particle boards and then pressed.
  • the glued fibers are dried, formed into fiber mats and finally pressed into fiber boards under heat and pressure.
  • the pressing temperature in the fiber and chipboard production is usually between 150 and 230 ° C.
  • the pressing times depend on the thickness of the plates produced and are around 7 to 15 sec / mm, depending on the pressing temperature.
  • the binder introduced changes into the water-insoluble state by hardening.
  • Aminoplasts such as UF resins or phenoplasts such as PF resins and tannins and adhesives based on PMDI are preferably used as binders.
  • the pressed sheets must be sanded to remove the press skin and to produce a coatable or paintable surface after the pressing process.
  • about 1 mm is removed from each side of the board for medium-density fiberboard, a little less for chipboard. This leads to losses in the fiber material and to a high total consumption of binder in the manufacturing process.
  • the binder-containing grinding dust is then burned, which releases the pollutants emitted from the binder and hardening accelerators. This is a disadvantage.
  • the object of the present invention is to provide a process for the production of chipboard and medium-density fiberboard, in which the proportion of thermosetting binders in the outer layers of the fiberboard and chipboard is reduced without the handling of the chipboard and fiber mat during transport until pressing to affect.
  • this is provided on both sides or only on one broad side with a layer of chips or fibers which contain a non-thermosetting binder.
  • This can be carried out by first sprinkling a nonwoven layer containing a non-thermally hardenable binder into the mold, along with further layers of chips or fibers containing thermally hardenable binders and then as the last layer again the fibers or chips with a non-thermosetting layer Binder are added.
  • Thermally non-curing binders give the chips or fibers good cold tack, but are not themselves crosslinkable.
  • the thickness of the layer containing a non-thermosetting binder is advantageously 0.5-1 mm.
  • technical non-thermosetting binders can preferably be used Lignins can be used.
  • sulfite and sulfate waste liquor and organosolvlignins can be used for this. Leaches of sulfite have a high cold tack.
  • the lignin sulfonates are inert so that they do not harden during the pressing process.
  • This binder can be used repeatedly; after pressing and sanding, it can be removed from the wood material by simply washing it out.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Stringed Musical Instruments (AREA)

Abstract

A process for the manufacture of wood chip boards and medium density wood fibre boards is described, in which the wood chips or wood fibres provided with binder are formed into chip or fibre mats and subsequently pressed at elevated temperature to form boards. The process is distinguished in that during the forming process at least one surface of the chip or fibre mat is provided with a layer of wood chips or wood fibres containing thermally non-curing binder and the chip or fibre mats thus formed are subsequently pressed.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von Spanplatten und mitteldichten Holzfaserplatten gemäß dem Oberbegriff des Hauptanspruches.The invention relates to a method for producing chipboard and medium-density fibreboard according to the preamble of the main claim.

Für die Herstellung von solchen Span- bzw. Holzfaserplatten werden getrocknete Späne bzw. nasse Fasern mit Bindemitteln beleimt. Der Bindemittelanteil beträgt 5 bis 12% - bezogen auf trockenes Faser- bzw. Spanmaterial. Meistens wird das Bindemittel auf die Späne oder Holzfasern aufgedüst. Die beleimten Späne werden zu Spanplatten geformt und anschließend gepreßt. Demgegenüber werden die beleimten Fasern getrocknet, zu Fasermatten geformt und zu Faserplatten unter Wärme und Druck fertiggepreßt. Die Preßtemperatur bei der Faser- und auch Spanplattenherstellung liegt üblicherweise zwischen 150 und 230° C. Die Preßzeiten sind von der Dicke der hergestellten Platten abhängig und liegen bei etwa 7 bis 15 sec/mm, je nach Preßtemperatur. Während des Preßvorganges geht das eingebrachte Bindemittel durch Härtung in den wasserunlöslichen Zustand über. Als Bindemittel werden vorzugsweise Aminoplaste wie UF-Harze oder Phenoplaste wie PF-Harze und Tannine eingesetzt sowie Klebstoffe auf Basis von PMDI. Die gepreßten Platten müssen zur Entfernung der Preßhaut und zur Erzeugung einer beschichtungsfähigen oder lackierfähigen Oberfläche nach dem Preßvorgang geschliffen werden. Beim Schleifvorgang wird bei mitteldichten Faserplatten etwa 1 mm pro Plattenseite entfernt, bei Spanplatten etwas weniger. Dies führt zu Verlusten im Fasermaterial und zu einem hohen Gesamtverbrauch an Bindemittel bei dem Herstellungsprozeß. Darüber hinaus wird der bindemittelhaltige Schleifstaub anschließend verbrannt, wodurch die aus dem Bindemittel und Härtungsbeschleunigern emittierten Schadstoffe freigesetzt werden. Dies ist nachteilig.Dried chips or wet fibers are glued with binders for the production of such chipboard or wood fiber boards. The binder content is 5 to 12% - based on dry fiber or chip material. The binder is usually sprayed onto the chips or wood fibers. The glued chips are formed into particle boards and then pressed. In contrast, the glued fibers are dried, formed into fiber mats and finally pressed into fiber boards under heat and pressure. The pressing temperature in the fiber and chipboard production is usually between 150 and 230 ° C. The pressing times depend on the thickness of the plates produced and are around 7 to 15 sec / mm, depending on the pressing temperature. During the pressing process, the binder introduced changes into the water-insoluble state by hardening. Aminoplasts such as UF resins or phenoplasts such as PF resins and tannins and adhesives based on PMDI are preferably used as binders. The pressed sheets must be sanded to remove the press skin and to produce a coatable or paintable surface after the pressing process. During the grinding process, about 1 mm is removed from each side of the board for medium-density fiberboard, a little less for chipboard. This leads to losses in the fiber material and to a high total consumption of binder in the manufacturing process. In addition, the binder-containing grinding dust is then burned, which releases the pollutants emitted from the binder and hardening accelerators. This is a disadvantage.

Aus der DE-OS 36 29 586 ist ein Verfahren zur Verringerung der Verluste an Holzfaserplattenmaterial bekannt. Danach soll das Holzfaservlies vor dem Verpressen beidseitig mit Holzstaub versehen und zusammen mit der Fasermatte verpreßt werden. Anschließend werden die Holzstaubschichten abgeschliffen. Bei diesem Verfahren werden zwar die Verluste an Holzfaserplattenmaterial reduziert, jedoch bleibt der Anteil an eingesetzten Bindemitteln und damit nach Verbrennung der abgeschliffenen Schichten entstandenen Schadstoffe unverändert.From DE-OS 36 29 586 a method for reducing the loss of wood fiber board material is known. Then the wood fiber fleece should be provided with wood dust on both sides before pressing and pressed together with the fiber mat. Then the Sanded layers of wood dust. With this process, the losses of wood fiber board material are reduced, but the proportion of binders used and thus the pollutants generated after combustion of the sanded layers remains unchanged.

Nach dem in der DE-PS 11 76 354 beschriebenen Verfahren werden die Formlinge zwischen zwei nicht bindemittelhaltigen Schichten verpreßt. Jedoch fehlt bei diesem Verfahren die durch den Zusatz von Bindemitteln entstehende vorteilhafte Klebewirkung bzw. Kaltklebrigkeit der Deckschichten auf den inneren beleimten Schichten..According to the process described in DE-PS 11 76 354, the moldings are pressed between two layers which do not contain binder. However, this method lacks the advantageous adhesive effect or cold tackiness of the cover layers on the inner glued layers resulting from the addition of binders.

Aufgabe der vorliegenden Erfindung ist es, ein Verfahren zur Herstellung von Spanplatten und mitteldichten Faserplatten anzugeben, bei dem der Anteil an duroplastischen Bindemitteln in den äußeren Schichten der Faser- und Spanplatten reduziert wird ohne die Handhabung der Span- und Fasermatten bei dem Transport bis zum Pressen zu beeinträchtigen.The object of the present invention is to provide a process for the production of chipboard and medium-density fiberboard, in which the proportion of thermosetting binders in the outer layers of the fiberboard and chipboard is reduced without the handling of the chipboard and fiber mat during transport until pressing to affect.

Diese Aufgabe ist durch das im Hauptanspruch angegebene Verfahren gelöst. Die Unteransprüche stellen weitere vorteilhafte Ausbildungen dar.This object is achieved by the method specified in the main claim. The subclaims represent further advantageous developments.

Nach dem erfindungsgemäßen Verfahren wird während des Formungsvorganges der Späne bzw. Fasern zu einer Matte diese beidseitig oder nur an ihrer einen Breitseite mit einer Schicht aus Spänen bzw.Fasern, welche ein nicht thermohärtbares Bindemittel enthalten, versehen. Dies kann in dieser Weise durchgeführt werden, daß in die Form zunächst eine ein nicht thermisch härtbares Bindemittel enthaltende Vliesschicht gestreut wird, daneben weitere Schichten aus thermisch härtbare Bindemittel enthaltenden Spänen oder Fasern und anschließend als letzte Schicht wieder die Fasern bzw. Späne mit einem nicht thermohärtbarem Bindemittel zugegeben werden. Thermisch nichthärtende Bindemittel verleihen den Spänen bzw. Fasern eine gute Kaltklebrigkeit, sind jedoch selbst nicht vernetzbar. Dies hat den Vorteil, daß die mit einem thermisch nicht härtbaren Bindemittel beleimten Fasern an der Oberfläche der mit härtbaren Bindemittel beleimten Fasern hatten bleiben. Hierdurch wird auch die Handhabung der beleimten Fasern in Fasermatte wesentlich erleichtert, da die Reibung einer feuchten Span- oder Faserschicht in der Presse oder an einer unter dem Formling wegzuziehenden Förderunterlage erheblich höher ist als die einer trockenen Span- oder Faserschicht. Nach dem Pressen läßt sich die das nicht härtende Bindemittel enthaltende Schicht leicht abschleifen. Die nicht härtbaren Bindemittel werden durch den Preßvorgang nicht in den wasserunlöslichen Zustand überführt, unter anderem deshalb, weil die Preßzeiten sehr kurz sind. Die nach dem Pressen abgeschliffenen Deckschichten können gegebenenfalls wiederverwendet werden, da das darin enthaltene Bindemittel noch wasserlöslich ist. Dieses Verfahren führt zur Verringerung des Bindemittelaufwandes überhaupt, da das abgeschliffene Material wiederholt verwendet werden kann. Die Dicke der ein nicht thermohärtbares Bindemittel enthaltenden Schicht beträgt vorteilhafterweise 0,5 - 1 mm. Gemäß einer vorteilhaften Ausgestaltung des Verfahrens können als nicht thermohärtbare Bindemittel vorzugsweise technische Lignine eingesetzt werden. Insbesondere können hierfür Sulfit-, Sulfatablauge sowie Organosolvlignine eingesetzt werden. Sulfitablaugen haben eine hohe Kaltklebrigkeit. Die Ligninsulfonate sind reaktionsträge, so daß sie während des Preßvorganges nicht aushärten. Dieses Bindemittel kann wiederholt verwendet werden; es läßt sich nach dem Pressen und Schleifen aus dem Holzmaterial durch einfaches Auswaschen entfernen.According to the method according to the invention, during the shaping process of the chips or fibers into a mat, this is provided on both sides or only on one broad side with a layer of chips or fibers which contain a non-thermosetting binder. This can be carried out by first sprinkling a nonwoven layer containing a non-thermally hardenable binder into the mold, along with further layers of chips or fibers containing thermally hardenable binders and then as the last layer again the fibers or chips with a non-thermosetting layer Binder are added. Thermally non-curing binders give the chips or fibers good cold tack, but are not themselves crosslinkable. This has the advantage that the fibers glued with a thermally non-curable binder remained on the surface of the fibers glued with curable binders. This also greatly facilitates the handling of the glued fibers in the fiber mat, since the friction of a moist chip or fiber layer in the press or on a conveying base to be removed under the molding is considerably higher than that of a dry chip or fiber layer. After pressing, the layer containing the non-hardening binder can be easily ground off. The non-hardenable binders are not converted into the water-insoluble state by the pressing process, among other things because the pressing times are very short. The cover layers ground off after pressing can, if necessary, be reused, since the binder contained therein is still water-soluble. This process leads to a reduction in the amount of binder, since the ground material can be used repeatedly. The thickness of the layer containing a non-thermosetting binder is advantageously 0.5-1 mm. According to an advantageous embodiment of the method, technical non-thermosetting binders can preferably be used Lignins can be used. In particular, sulfite and sulfate waste liquor and organosolvlignins can be used for this. Leaches of sulfite have a high cold tack. The lignin sulfonates are inert so that they do not harden during the pressing process. This binder can be used repeatedly; after pressing and sanding, it can be removed from the wood material by simply washing it out.

Claims (7)

  1. A method of producing wood chip boards and medium density wood fibre boards, wherein wood chips or wood fibres provided with binder are shaped into chip or fibre mats and then pressed into boards at elevated temperature, characterised in that during the shaping operation at least one surface of the chip or fibre mat is provided with a layer of wood chips or wood fibres containing a non-thermosetting binder, and in that the chip or fibre mats thus shaped are then pressed.
  2. A method according to Claim 1, characterized that the binder is a non-thermosetting resin.
  3. A method according to Claim 1, characterized that the binder is an industrial lignin.
  4. A method according to Claim 3, characterized that the binder is sulphate waste liqueur.
  5. A method according to Claim 3, characterized that the binder is organosol lignin.
  6. A method according to Claim 1, characterized that the binder is a tannin (e.g. from quebracho wood, mimoza bark or chestnut wood).
  7. A method according to Claim 1, characterized that the chip or fibre layer containing non-thermosetting binder is 0.5 to 1 mm thick.
EP92117336A 1991-10-09 1992-10-09 Method for the manufacture of wood chipboards and medium density wood fibreboards Expired - Lifetime EP0536795B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4133445 1991-10-09
DE4133445A DE4133445C2 (en) 1991-10-09 1991-10-09 Process for the production of chipboard and medium density fibreboard

Publications (2)

Publication Number Publication Date
EP0536795A1 EP0536795A1 (en) 1993-04-14
EP0536795B1 true EP0536795B1 (en) 1995-01-11

Family

ID=6442348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92117336A Expired - Lifetime EP0536795B1 (en) 1991-10-09 1992-10-09 Method for the manufacture of wood chipboards and medium density wood fibreboards

Country Status (4)

Country Link
EP (1) EP0536795B1 (en)
AT (1) ATE116896T1 (en)
DE (2) DE4133445C2 (en)
DK (1) DK0536795T3 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2463170C2 (en) * 2009-03-31 2012-10-10 Флоринг Текнолоджиз Лтд. Method of making panel and panel made thereby

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE166093T1 (en) * 1993-10-13 1998-05-15 Bakelite Ag BINDING AGENT BASED ON TANNING MATERIALS.
DE4431316C1 (en) * 1994-09-02 1996-05-02 Schlingmann Gmbh & Co Process for reducing the release of formaldehyde from chipboard or fiberboard
ATE166279T1 (en) * 1996-02-09 1998-06-15 Schlingmann Gmbh & Co METHOD FOR PRODUCING LOW-FORMALDEHYDE TANNINE BONDED WOOD CHIPBOARD AND FIBERBOARD
US5955023A (en) * 1996-11-27 1999-09-21 Callutech, Llc Method of forming composite particle products
DE10129750B4 (en) * 2001-06-20 2006-09-07 Institut für Holztechnologie Dresden gGmbH Material of wood particles, binders and aggregates and process for its preparation
CN114083638B (en) * 2021-09-30 2022-07-12 千年舟新材科技集团股份有限公司 Preparation method of bamboo oriented strand board for load-bearing structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3308218A (en) * 1961-05-24 1967-03-07 Wood Conversion Co Method for producing bonded fibrous products
DE1176354B (en) * 1962-03-16 1964-08-20 Max Himmelheber Dipl Ing Process to improve the surface quality of wood chipboard and / or the conveying conditions of chipboard moldings
DE1228798B (en) * 1965-08-12 1966-11-17 Max Himmelheber Dipl Ing Wood-based panel, in particular chipboard
US4193814A (en) * 1973-03-06 1980-03-18 Canadian Patents & Development Ltd. Binding lignocellulosic materials
DE2500884B2 (en) * 1975-01-10 1978-08-03 Deutsche Novopan Gmbh, 3400 Goettingen Process for the production of chipboard from a mixture of wood chips and isocyanate
DE3629586A1 (en) * 1986-08-30 1988-03-10 Kunnemeyer Hornitex METHOD FOR PRODUCING WOOD FIBER PANELS
SE455001B (en) * 1986-10-03 1988-06-13 Rune Simonson METHOD OF MANUFACTURING PRODUCTS CONTAINING FIBERS
DE3820376A1 (en) * 1988-06-15 1989-12-21 Novopan Gmbh METHOD FOR PRODUCING MULTI-LAYERED CHIPBOARDS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2463170C2 (en) * 2009-03-31 2012-10-10 Флоринг Текнолоджиз Лтд. Method of making panel and panel made thereby

Also Published As

Publication number Publication date
EP0536795A1 (en) 1993-04-14
ATE116896T1 (en) 1995-01-15
DK0536795T3 (en) 1995-04-24
DE4133445A1 (en) 1993-04-15
DE4133445C2 (en) 1995-04-20
DE59201191D1 (en) 1995-02-23

Similar Documents

Publication Publication Date Title
DE102006018277B4 (en) Building board and method for producing a building board
EP1915253B2 (en) Light-weight multilayer engineered wood board
DE4434876B4 (en) Process and plant for the continuous production of a multilayer board
DE1299115B (en) Extruded chipboard
EP0536795B1 (en) Method for the manufacture of wood chipboards and medium density wood fibreboards
DE19738953C1 (en) Method and device for the production of molded articles from comminuted material
EP0258703B1 (en) Method of making fibre board
DE69730412T2 (en) Process for the production of cellulose composites
EP0639434B1 (en) Method for the manufacture of medium density wood fibre boards (MDF)
EP3587108A1 (en) Coated sandwich panel
EP1575744B1 (en) Combination material and method for the production thereof
EP1688230B1 (en) Method for continuous manufacturing of fiberboards from wood
EP0144985A2 (en) Method of decreasing the formaldehyde emission of veneered chip and fibre boards
EP0018355B1 (en) Wood chip board and process for its production
DE10344598B3 (en) Process for preparation of postformed wooden plates
EP0548758B1 (en) Board and method to manufacture it
DE921051C (en) Process for the production of shaped bodies from shredded wood
EP0365708B1 (en) Method for producing wooden or fiber material articles
DE10130526A1 (en) Process for the production of wood-based panels
EP1048424A2 (en) Composite corkplate and method for the production thereof
AT397805B (en) METHOD FOR PRODUCING A SYNTHETIC RESIN PRINTING BODY
DE1808375A1 (en) Paper press
WO2005018890A1 (en) Method for producing a multilayer fibreboard
CH645394A5 (en) Process for the production of mouldings based on thermoplastic dispersions and wood particles
DE2246591C3 (en) Process for the production of wood-based materials

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT DE DK FR GB IT SE

17P Request for examination filed

Effective date: 19930319

17Q First examination report despatched

Effective date: 19940629

RIN1 Information on inventor provided before grant (corrected)

Inventor name: PROF. DR. EDMONE ROFFAEL

Inventor name: DIX, BRIGITTE, DR.ING.

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT DE DK FR GB IT SE

REF Corresponds to:

Ref document number: 116896

Country of ref document: AT

Date of ref document: 19950115

Kind code of ref document: T

EAL Se: european patent in force in sweden

Ref document number: 92117336.5

REF Corresponds to:

Ref document number: 59201191

Country of ref document: DE

Date of ref document: 19950223

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19950220

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

PLBI Opposition filed

Free format text: ORIGINAL CODE: 0009260

26 Opposition filed

Opponent name: KUNZ GMBH & CO.

Effective date: 19951010

PLAV Examination of admissibility of opposition

Free format text: ORIGINAL CODE: EPIDOS OPEX

PLBF Reply of patent proprietor to notice(s) of opposition

Free format text: ORIGINAL CODE: EPIDOS OBSO

PLBF Reply of patent proprietor to notice(s) of opposition

Free format text: ORIGINAL CODE: EPIDOS OBSO

PLBF Reply of patent proprietor to notice(s) of opposition

Free format text: ORIGINAL CODE: EPIDOS OBSO

PLBL Opposition procedure terminated

Free format text: ORIGINAL CODE: EPIDOS OPPC

PLBM Termination of opposition procedure: date of legal effect published

Free format text: ORIGINAL CODE: 0009276

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: OPPOSITION PROCEDURE CLOSED

27C Opposition proceedings terminated

Effective date: 19981130

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20000925

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20001020

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20001023

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20001025

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20001027

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20001221

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20011009

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20011009

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20011009

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20011010

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20011009

EUG Se: european patent has lapsed

Ref document number: 92117336.5

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20020628

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20020702

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051009