EP1048424A2 - Composite corkplate and method for the production thereof - Google Patents
Composite corkplate and method for the production thereof Download PDFInfo
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- EP1048424A2 EP1048424A2 EP00108679A EP00108679A EP1048424A2 EP 1048424 A2 EP1048424 A2 EP 1048424A2 EP 00108679 A EP00108679 A EP 00108679A EP 00108679 A EP00108679 A EP 00108679A EP 1048424 A2 EP1048424 A2 EP 1048424A2
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- cork
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
Definitions
- the invention relates to a cork composite panel with a glued Lignocellulose particles such as wood chips or fibers pressed carrier layer and at least one with the Carrier layer connected top layer made of cork. Furthermore concerns the invention a method for producing a multilayer Composite chipboard or fibreboard, in which at least one Layer consists of cork particles.
- Cork boards are needed for many purposes, e.g. as insulation panels in refrigerators. It is also known to have floors, Walls and ceilings for noise or impact sound insulation or to be covered with cork boards for thermal insulation or to dress up from a base layer of wood or Fiber material and a thin top layer of cork. For Manufacture of such composite panels, it is common to have a prefabricated one Cork board on the surface in a separate process glue on the already finished carrier board. The Production of composite panels with wood chips in the middle layer and cork particles in the top layer in one step As far as is known, the pressing process is not state of the art.
- a binder for the production of chipboard can use acid curing modified and unmodified urea formaldehyde resins (UF resins), phenol formaldehyde resins (PF resins) and adhesives based on diisocyanates (PMDI) become.
- Another method can also use tannin formaldehyde resins (TF resins) as binders for manufacturing of wood chipboard are used (EP-PS 0 788 866).
- TF resins tannin formaldehyde resins
- binders such as starch and proteins have so far not achieved any industrial importance as binders, in principle, however, they can work alone or in combination can be used with other binders.
- Chipboard and fiberboard can be made in one or more layers become. In the different layers there can be different Binders are used. So are chipboards with aminoplast resins known in the outer layers while for the middle layer a binder based on diisocyanate (PMDI) is used (EP-PS-0 012 169). To reduce formaldehyde release is the addition of formaldehyde-active substances in the layers glued with PMDI recommended (EP-PS 0 012 169).
- PMDI diisocyanate
- cork boards with urea formaldehyde resins and made with melamine modified urea formaldehyde resins. The production of cork boards can be done on conventional press systems chipboard production.
- cork has an inherent tendency to spring back, which is why high grinding losses after pressing by grinding must be expected.
- the relatively high resilience is due to the fact that the bulk density of the cork is relatively low and reaches values of approx. 0.1 g / cm 3 , so the cork has high bulk densities of 0.6-0.7 g / cm after compression 3 , as is common with chipboard, and a high tendency to spring back.
- Cork particles for the production of cork boards can either be obtained from the first peeling of the cork oak after about 25 years of growth or from residues from bottle cork production.
- the cork oak trees reach around 25 years of age, they are peeled for the first time, after which the trees are peeled once every 9 to 10 years.
- the cork oaks can reach an age of 150 to 160 years.
- the first peeling "virgin cork” is relatively hard and unsuitable for the production of bottle cork.
- Bottle cork is only extracted from the bark of the oak cork trees after the second peeling. Both the so-called "virgin cork” and the remains from bottle cork production can be used for the production of cork boards.
- the cork particles are crushed and dried in conventional drum dryers to a moisture content of 1% or less. After drying, the granules or particles are glued with the binder, sprinkled into cork mats and then pressed hot.
- the bulk density of the cork boards produced is usually 0.5-0.55 g / cm 3 .
- Cork boards for the floor area are usually made with a provided moisture-resistant glue. This can be alkaline curing phenol formaldehyde resins are used. This however, contain free phenols that can be released. Cork boards for the wall area are usually made with urea formaldehyde resins manufactured. Because of the ones already mentioned Open structure of the cork boards can inadmissible this formaldehyde Deliver quantities. Cork boards for the floor area need have a certain hardness according to ISO 3810. These requirements are difficult to reach.
- Cork plates that come into direct contact with food can be provided with protein glue.
- the invention is based on the object Cork composite panel to create the easier and with less Process and cost expenditure can be produced than before and good has physical properties.
- the cork composite panel described here is therefore not as before in several successive steps by gluing separately manufactured prefabricated chipboard and cork boards, but as a whole in one and the same operation.
- the simplification due to the formation of the composite panel in one Process step means a substantial reduction in manufacturing costs.
- the composite panel has the advantage of particularly good and close connection between those through the joint pressing formed layers. The process of There is no need to sand chipboard after it has been manufactured the one-step operation when the backing layer consists of the two Sides are provided with cork boards in the top layer.
- a cork cover layer made of glued cork particles can build up one or both sides of the carrier layer.
- Production can take place in the manner known in principle in the case of multilayer chipboard. Accordingly, conventional wood chips can be glued for a carrier or middle layer, while cork particles can be glued for the or each top layer. In a scattering station, the cork particles can be scattered into the outer zones of the composite panels by top layer machines, while the middle layer is formed from scattered wood chips. The sprinkled chip / cork cake is then pressed in a press and the glue connecting the particles is cured.
- the pressing pressure can be, for example, 15 to 35 kg / cm 2 , the pressing temperature, for example, 150 to 250 ° C.
- the following are suitable for gluing the cork and middle layers: Isocyanate, phenolic resin, melamine urea phenolic resin, urea resin and PVAC glue, but especially natural glue such as preferably tannin.
- Isocyanate phenolic resin
- melamine urea phenolic resin melamine urea resin
- PVAC glue but especially natural glue such as preferably tannin.
- natural glue such as preferably tannin.
- Glue can expediently be used for the different layers Glue can be used.
- the thickness and density of the composite panels can vary depending on the Purpose to be varied. For insulation purposes, the Usually a low density is aimed for. This can be about increasing of the share of the cork top layers. So it can Cork layer between 15% and 75% of the total board weight turn off.
- the total panel thickness can be used for the insulation purposes mentioned at the beginning for example, 4 mm to 70 mm, while the top layer thickness depending on the total panel thickness and requirement 1 to 10 mm can be.
- the plates For comparison, 12 mm thick cork boards with a melamine formaldehyde resin manufactured, the plates contained no wood chips in the middle class, but both in the cover as well cork shot in the middle class. The binder expenditure was included 12% in both the top and middle class. The so produced plates had a formaldehyde emission in the Test chamber of 0.12 ppm and a springback according to ISO 3810 from 3% on.
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- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
Die Erfindung betrifft eine Korkverbundplatte mit einer aus beleimten Lignocellulosepartikeln wie insbesondere Holzspänen oder -fasern gepreßten Trägerschicht und mindestens einer mit der Trägerschicht verbundenen Deckschicht aus Kork. Ferner betrifft die Erfindung ein Verfahren zur Herstellung einer mehrschichtigen Verbundspan- oder -faserplatte, bei der mindestens eine Schicht aus Korkteilchen besteht.The invention relates to a cork composite panel with a glued Lignocellulose particles such as wood chips or fibers pressed carrier layer and at least one with the Carrier layer connected top layer made of cork. Furthermore concerns the invention a method for producing a multilayer Composite chipboard or fibreboard, in which at least one Layer consists of cork particles.
Korkplatten werden für viele Verwendungszwecke benötigt, z.B. als Isolierplatten in Kühlschränken. Ferner ist es bekannt, Fußböden, Wände und Decken zur Geräusch- oder Trittschalldämmung oder auch zur thermischen Isolierung mit Korkplatten zu belegen oder zu verkleiden, die aus einer Trägerschicht aus Holz oder Fasermaterial und einer dünnen Deckschicht aus Kork besteht. Zur Herstellung derartiger Verbundplatten ist es üblich, eine vorgefertigte Korkplatte in einem separaten Vorgang auf die Oberfläche der ebenfalls schon fertigen Trägerplatte aufzuleimen. Die Herstellung von Verbundplatten mit Holzspänen in der Mittelschicht und Korkpartikeln in der Deckschicht in einem einstufigen Preßvorgang ist - soweit bekannt - nicht Stand der Technik.Cork boards are needed for many purposes, e.g. as insulation panels in refrigerators. It is also known to have floors, Walls and ceilings for noise or impact sound insulation or to be covered with cork boards for thermal insulation or to dress up from a base layer of wood or Fiber material and a thin top layer of cork. For Manufacture of such composite panels, it is common to have a prefabricated one Cork board on the surface in a separate process glue on the already finished carrier board. The Production of composite panels with wood chips in the middle layer and cork particles in the top layer in one step As far as is known, the pressing process is not state of the art.
Für die Herstellung von Spanplatten werden Holzspäne mit einem Bindemittel beleimt und anschließend zu Spanmatten gestreut und heiß gepreßt. Als Bindemittel für die Herstellung von Spanplatten können säurehärtende modifizierte und unmodifizierte Harnstofformaldehydharze (UF-Harze), Phenolformaldehydharze (PF-Harze) und Klebstoffe auf der Basis von Diisocyanaten (PMDI) eingesetzt werden. Nach einem anderen Verfahren können auch Tanninformaldehydharze (TF-Harze) als Bindemittel für die Herstellung von Holzspanplatten eingesetzt werden (EP-PS 0 788 866). Bei der Herstellung von Tanninformaldehydharzen kommen pflanzliche Extrakte zum Einsatz. Weitere Bindemittel wie Stärke und Proteine haben bislang keine industrielle Bedeutung als Bindemittel erlangt, sie können im Prinzip jedoch für sich allein oder in Kömbination mit anderen Bindemitteln eingesetzt werden.For the production of chipboard, wood chips with a Binder glued and then sprinkled into chip mats and hot pressed. As a binder for the production of chipboard can use acid curing modified and unmodified urea formaldehyde resins (UF resins), phenol formaldehyde resins (PF resins) and adhesives based on diisocyanates (PMDI) become. Another method can also use tannin formaldehyde resins (TF resins) as binders for manufacturing of wood chipboard are used (EP-PS 0 788 866). In the Plant extracts come from making tannin formaldehyde resins for use. Other binders such as starch and proteins have so far not achieved any industrial importance as binders, in principle, however, they can work alone or in combination can be used with other binders.
Span- und Faserplatten können ein- oder mehrschichtig hergestellt werden. In den verschiedenen Schichten können verschiedene Bindemittel eingesetzt werden. So sind Spanplatten mit Aminoplast-Harzen in den Außenschichten bekannt, während für die Mittelschicht ein Bindemittel auf der Basis von Diisocyanat (PMDI) verwendet wird (EP-PS-0 012 169). Zur Reduzierung der Formaldehydabgabe wird die Zugabe von formaldehydaktiven Stoffen in den mit PMDI verleimten Schichten empfohlen (EP-PS 0 012 169).Chipboard and fiberboard can be made in one or more layers become. In the different layers there can be different Binders are used. So are chipboards with aminoplast resins known in the outer layers while for the middle layer a binder based on diisocyanate (PMDI) is used (EP-PS-0 012 169). To reduce formaldehyde release is the addition of formaldehyde-active substances in the layers glued with PMDI recommended (EP-PS 0 012 169).
Nicht nur Holzspäne und Holzfasern lassen sich mit Harnstoffformaldehydharzen zu Platten verleimen, sondern auch Korkteilchen. So werden Korkplatten mit Harnstofformaldehydharzen und mit Melamin modifizierten Harnstofformaldehydharzen hergestellt. Die Herstellung von Korkplatten kann auf üblichen Preßanlagen der Spanplattenherstellung erfolgen.Not only wood chips and wood fibers can be mixed with urea formaldehyde resins glue to plates, but also cork particles. So cork boards with urea formaldehyde resins and made with melamine modified urea formaldehyde resins. The production of cork boards can be done on conventional press systems chipboard production.
Eine Schwierigkeit bei der Herstellung von Korkplatten liegt darin, daß Kork eine inhärente Tendenz zur Rückfederung hat, weshalb man mit hohen Abschliffverlusten nach dem Pressen durch Schleifen rechnen muß. Das relativ hohe Rückfederungsvermögen ist darauf zurückzuführen, daß die Rohdichte des Korks relativ niedrig ist und Werte von ca. 0,1 g/cm3 erreicht, insofern weist der Kork nach einer Verdichtung hohe Rohdichten von 0,6-0,7 g/cm3 auf, wie dies bei Spanplatten üblich ist, und eine hohe Tendenz zur Rückfederung.A difficulty in the manufacture of cork boards is that cork has an inherent tendency to spring back, which is why high grinding losses after pressing by grinding must be expected. The relatively high resilience is due to the fact that the bulk density of the cork is relatively low and reaches values of approx. 0.1 g / cm 3 , so the cork has high bulk densities of 0.6-0.7 g / cm after compression 3 , as is common with chipboard, and a high tendency to spring back.
Korkteilchen für die Herstellung von Korkplatten können entweder aus der ersten Schälung der Korkeichen nach etwa 25 Wachstumsjahren gewonnen werden oder aus Resten bei der Flaschenkorkherstellung. Wenn die Bäume der Korkeiche ein Alter von etwa 25 Jahren erreicht haben, werden sie zum ersten Mal geschält, danach werden die Bäume einmal in 9 bis 10 Jahren abgeschält. Die Korkeichen können ein Alter von 150 bis 160 Jahre erreichen. Die erste Schälung "Jungfrauenkork" ist relativ hart und für die Herstellung von Flaschenkork ungeeignet. Flaschenkork wird erst nach der zweiten Schälung aus der Rinde der Eichenkorkbäume gewonnen. Sowohl der sogenannte "Virginkork" als auch die Reste aus der Flaschenkorkherstellung können für die Produktion von Korkplatten eingesetzt werden. Hierfür werden die Korkteilchen zerkleinert und in üblichen Trommeltrocknern bis zu einem Feuchtigkeitsgehalt von 1 % oder darunter getrocknet. Nach dem Trocknen werden die Granulate bzw. Teilchen mit dem Bindemittel beleimt, zu Korkmatten gestreut und anschließend heiß gepreßt. Die Rohdichte der hergestellten Korkplatten beträgt in der Regel 0,5-0,55 g/cm3.Cork particles for the production of cork boards can either be obtained from the first peeling of the cork oak after about 25 years of growth or from residues from bottle cork production. When the cork oak trees reach around 25 years of age, they are peeled for the first time, after which the trees are peeled once every 9 to 10 years. The cork oaks can reach an age of 150 to 160 years. The first peeling "virgin cork" is relatively hard and unsuitable for the production of bottle cork. Bottle cork is only extracted from the bark of the oak cork trees after the second peeling. Both the so-called "virgin cork" and the remains from bottle cork production can be used for the production of cork boards. For this purpose, the cork particles are crushed and dried in conventional drum dryers to a moisture content of 1% or less. After drying, the granules or particles are glued with the binder, sprinkled into cork mats and then pressed hot. The bulk density of the cork boards produced is usually 0.5-0.55 g / cm 3 .
Neben dem bereits erwähnten Rückfederungsvermögen der Korkplatten weisen die Platten ein relativ hohes Formaldehydabgabevermögen auf, wenn die Platten mit Aminoplastharzen als Bindemittel hergestellt werden. Dies hängt u.a. damit zusammen, daß die Platten wegen ihrer niedrigen Rohdichte offenporig sind, sie weisen deshalb einen niedrigen Diffusionswiderstand auf (Roffael 1982 Fornaldehydabgabe von Spanplatten und anderen Werkstofen, DRW-Verlag, ISBN 387181301x).In addition to the resilience of the cork boards already mentioned the plates have a relatively high formaldehyde release capacity on when the plates with aminoplast resins as binders getting produced. This depends, among other things. together with the fact that Plates are porous because of their low bulk density, they therefore have a low diffusion resistance (Roffael 1982 Fornaldehyde release of chipboard and other materials, DRW publishing house, ISBN 387181301x).
Korkplatten für den Bodenbereich werden in der Regel mit einer feuchtigkeitsbeständigen Verleimung versehen. Hierfür können alkalisch härtende Phenolformaldehydharze eingesetzt werden. Diese enthalten jedoch freie Phenole, die abgegeben werden können. Korkplatten für den Wandbereich werden in der Regel mit Harnstofformaldehydharzen hergestellt. Wegen der bereits erwähnten offenen Struktur der Korkplatten können diese Formaldehyd in unzulässigen Mengen abgeben. Korkplatten für den Bodenbereich müssen eine bestimmte Härte nach ISO 3810 aufweisen. Diese Anforderungen sind schwer erreichbar.Cork boards for the floor area are usually made with a provided moisture-resistant glue. This can be alkaline curing phenol formaldehyde resins are used. This however, contain free phenols that can be released. Cork boards for the wall area are usually made with urea formaldehyde resins manufactured. Because of the ones already mentioned Open structure of the cork boards can inadmissible this formaldehyde Deliver quantities. Cork boards for the floor area need have a certain hardness according to ISO 3810. These requirements are difficult to reach.
Korkplatten, die in unittelbare Berührung mit Lebensmittel kommen, können mit Proteinleim versehen werden.Cork plates that come into direct contact with food, can be provided with protein glue.
Hiervon ausgehend liegt der Erfindung die Aufgabe zugrunde, eine Korkverbundplatte zu schaffen, die einfacher und mit geringerem Verfahrens- und Kostenaufwand herstellbar ist als bisher und gute physikalische Eigenschaften hat. Vorzugsweise wird möglichst geringe Formaldehydabgabe angestrebt.Proceeding from this, the invention is based on the object Cork composite panel to create the easier and with less Process and cost expenditure can be produced than before and good has physical properties. Preferably, if possible low formaldehyde release aimed.
Diese Aufgabe wird durch die in den Patentansprüchen angegebenen Merkmale gelöst.This object is achieved by those specified in the claims Features resolved.
Es wurde überraschend gefunden, daß die Nachteile bei der bekannten Herstellung von Korkplatten vermieden werden können, wenn die Korkgranulate bzw. Teilchen und Holzspäne in einem Vorgang zu Kork-Spanplatten verleimt werden. Es handelt sich bei den Spänen für die Mittellage vorzugsweise um solche, die üblicherweise bei der Herstellung von Spanplatten eingesetzt werden. Ferner wurde überraschend gefunden, daß Tannine ohne Zugabe von Formaldehyd für die Bindung der Deckschichten von Korkteilchen eingesetzt werden können.It has surprisingly been found that the disadvantages of the known Production of cork boards can be avoided when the cork granules or particles and wood chips in one operation be glued to cork chipboard. It is about the chips for the middle layer preferably around those that are usually be used in the production of chipboard. It was also surprisingly found that tannins without the addition of Formaldehyde for binding the top layers of cork particles can be used.
Die hier beschriebene Korkverbundplatte wird also nicht wie bisher in mehreren aufeinanderfolgenden Schritten durch Verleimen getrennt vorgefertigter Span- und Korkplatten hergestellt, sondern als Ganzes in einem und demselben Arbeitsgang. Die Vereinfachung aufgrund der Bildung der Verbundplatte in einem einzigen Verfahrensschritt bedeutet eine wesentliche Reduzierung der Herstellungskosten. Außerdem hat die Verbundplatte den Vorteil einer besonders guten und engen Verbindung zwischen den durch das gemeinsame Verpressen gebildeten Schichten. Auch der Vorgang des Schleifens von Spanplatten nach ihrer Herstellung entfällt bei dem einstufigen Arbeitsgang, wenn die Trägerschicht aus den beiden Seiten mit Korkplatten in der Deckschicht versehen ist.The cork composite panel described here is therefore not as before in several successive steps by gluing separately manufactured prefabricated chipboard and cork boards, but as a whole in one and the same operation. The simplification due to the formation of the composite panel in one Process step means a substantial reduction in manufacturing costs. In addition, the composite panel has the advantage of particularly good and close connection between those through the joint pressing formed layers. The process of There is no need to sand chipboard after it has been manufactured the one-step operation when the backing layer consists of the two Sides are provided with cork boards in the top layer.
Eine Korkdeckschicht aus beleimten Korkpartikeln kann sich auf einer oder auch auf beiden Seiten der Trägerschicht befinden.A cork cover layer made of glued cork particles can build up one or both sides of the carrier layer.
Die Herstellung kann in der Weise erfolgen, wie sie prinzipiell an sich bei mehrschichtigen Spanplatten bekannt ist. Demgemäß können für eine Träger- oder Mittelschicht herkömmliche Holzspäne beleimt werden, während für die bzw. jede Deckschicht Korkpartikel beleimt werden. In einer Streustation können die Korkpartikel von Deckschichtmaschinen in die Außenzonen der Verbundplatten gestreut werden, während die Mittelschicht aus gestreuten Holzspänen gebildet wird. Anschließend wird der gestreute Span/Kork-Kuchen in einer Presse gepreßt und der die Partikel verbindende Leim ausgehärtet. Der Preßdruck kann hierbei beispielsweise 15 bis 35 kg/cm2 betragen, die Preßtemperatur beispielsweise 150 bis 250°C.Production can take place in the manner known in principle in the case of multilayer chipboard. Accordingly, conventional wood chips can be glued for a carrier or middle layer, while cork particles can be glued for the or each top layer. In a scattering station, the cork particles can be scattered into the outer zones of the composite panels by top layer machines, while the middle layer is formed from scattered wood chips. The sprinkled chip / cork cake is then pressed in a press and the glue connecting the particles is cured. The pressing pressure can be, for example, 15 to 35 kg / cm 2 , the pressing temperature, for example, 150 to 250 ° C.
Zur Verleimung der Kork- und Mittelschichten eignen sich u.a. Isocyanat, Phenolharz, Melaminharnstoffphenolharz, Harnstoffharz und PVAC-Leim, insbesondere aber Naturleim wie vorzugsweise Tannin. Zweckmäßig kann für die verschiedenen Schichten derselbe Leim verwendet werden.The following are suitable for gluing the cork and middle layers: Isocyanate, phenolic resin, melamine urea phenolic resin, urea resin and PVAC glue, but especially natural glue such as preferably tannin. The same can expediently be used for the different layers Glue can be used.
Die Dicke und die Dichte der Verbundplatten kann je nach dem Verwendungszweck variiert werden. Für die Dämmzwecke wird in der Regel eine niedrige Dichte angestrebt. Dies kann über die Erhöhung des Anteils der Korkdeckschichten erfolgen. So kann die Korkschicht zwischen 15 % und 75 % des gesamten Plattengewichtes ausmachen.The thickness and density of the composite panels can vary depending on the Purpose to be varied. For insulation purposes, the Usually a low density is aimed for. This can be about increasing of the share of the cork top layers. So it can Cork layer between 15% and 75% of the total board weight turn off.
Für die eingangs genannten Dämmzwecke kann die Gesamtplattendicke beispielsweise 4 mm bis 70 mm betragen, während die Deckschichtdicke je nach Gesamtplattendicke und Anforderung 1 bis 10 mm betragen kann.The total panel thickness can be used for the insulation purposes mentioned at the beginning for example, 4 mm to 70 mm, while the top layer thickness depending on the total panel thickness and requirement 1 to 10 mm can be.
Die Erfindung soll durch das folgende, nicht einschränkende Beispiel verdeutlicht werden.The invention is intended to be illustrated by the following, non-limiting example be made clear.
Dreischichtige, 12 mm dicke Span-Kork-Platten wurden mit einer Rohdichte von 0,6 g/cm2 hergestellt. Hierfür wurden Kiefernholzspäne, die vorher auf eine Feuchte von ca. 5 % getrocknet wurden, mit einem Tanninformaldehydharz beleimt. Der Bindemittelaufwand betrug 10 %, bezogen auf das Gewicht der Holzspäne. Des weiteren wurde Korkschrot mit einem formaldehydfreien Tannin-Bindemittel beleimt. Der Bindemittelaufwand betrug 12 %, bezogen auf das Korkgemisch. Die mit dem formaldehydfreien Tanninbindemittel beleimten Korkteilchen wurden für die Deckschichten der herzustellenden Span-Kork-Platten eingesetzt. Für die Mittelschichten wurden die mit Tanninformaldehydharzen beleimten Späne verwendet. Nach der Beleimung der Späne und der Korkteilchen wurden in an sich üblicher Weise dreischichtige Span-Kork-Matten gestreut, bei denen die Späne die Mittelschichten und der beleimte Korkschrot die Deckschichten bildeten. Die dreischichtigen Matten wurden in einer beheizten Presse bei 190° C für 12 Minuten gepreßt. Die hergestellten dreischichtigen Span-Kork-Platten wurden auf ihre physikalischen Eigenschaften nach ISO 3810 sowie auf ihre Formaldehydabgabe in einer Prüfkammer untersucht. Die Querzugfestigkeit lag bei 1,5 N/mm2, die Formaldehydabgabe gemäß EN 717.1 bei 0,01 ppm in der Prüfkammer. Folgende Prüfbedingungen herrschten in der Kammer.
- relative Luftfeuchte
- 45 %
- Temperatur
- 23° C
- Raumbeladung
- 1 m2/1 m3
- relative humidity
- 45%
- temperature
- 23 ° C
- Room loading
- 1 m 2/1 m 3
Die Rückfederung nach ISO 3810 lag bei < 2 %, somit erfüllt die Platte die Anforderung von ISO 3810. The springback according to ISO 3810 was <2%, thus fulfilling the Platte the requirement of ISO 3810.
Zum Vergleich wurden 12 mm dicke Korkplatten mit einem Melaminformaldehydharz hergestellt, die Platten enthielten keine Holzspäne in der Mittelschicht, sondern sowohl in der Deck- als auch in der Mittelschicht Korkschrot. Der Bindemittelaufwand lag bei 12 % sowohl in der Deck- als auch in der Mittelschicht. Die so hergestellten Platten wiesen eine Formaldehydemission in der Prüfkammer von 0,12 ppm und eine Rückfederung nach ISO 3810 von 3 % auf.For comparison, 12 mm thick cork boards with a melamine formaldehyde resin manufactured, the plates contained no wood chips in the middle class, but both in the cover as well cork shot in the middle class. The binder expenditure was included 12% in both the top and middle class. The so produced plates had a formaldehyde emission in the Test chamber of 0.12 ppm and a springback according to ISO 3810 from 3% on.
Claims (18)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE29907260U | 1999-04-23 | ||
DE29907260 | 1999-04-23 | ||
DE1999121019 DE19921019A1 (en) | 1999-05-06 | 1999-05-06 | Cork composite plate, useful as thermal and acoustic insulation, comprises layers of wood particles and cork particles, treated with glue and compressed simultaneously |
DE19921019 | 1999-05-06 |
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EP1048424A2 true EP1048424A2 (en) | 2000-11-02 |
EP1048424A3 EP1048424A3 (en) | 2001-01-03 |
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EP00108679A Withdrawn EP1048424A3 (en) | 1999-04-23 | 2000-04-20 | Composite corkplate and method for the production thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100429056C (en) * | 2006-06-20 | 2008-10-29 | 江苏大盛板业有限公司 | Method for producing aldehyde-free soft board made of wheat straw |
GB2471096A (en) * | 2009-06-16 | 2010-12-22 | Eco Mats Ltd | Laminated composites based on natural materials |
BE1018993A3 (en) * | 2009-04-16 | 2011-12-06 | Unilin Bvba | PLATE MATERIAL, METHODS FOR MANUFACTURING PLATE MATERIAL AND PANEL CONTAINING SUCH PLATE MATERIAL. |
CN109627406A (en) * | 2018-12-29 | 2019-04-16 | 大亚人造板集团有限公司 | A kind of preparation method and application of ultralow free formaldehyde high water resistance cyanurotriamide modified urea resin is in low imbibition moisture-proof floor substrate |
WO2024189389A1 (en) * | 2023-03-10 | 2024-09-19 | Dion Warren Nicholas | Building panel |
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FR1489279A (en) * | 1966-08-04 | 1967-07-21 | Tableros De Gerona | Process for the manufacture of panels and resulting panel |
EP0012169A1 (en) * | 1978-11-29 | 1980-06-25 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Multi-layered, mainly aminoplast-bound particle or fibre board |
WO1993024719A1 (en) * | 1992-05-26 | 1993-12-09 | Tesch Guenter | Cork covering, in particular floor cork covering |
EP0788866A2 (en) * | 1996-02-09 | 1997-08-13 | Schlingmann GmbH & Co. | Method for the fabrication of particle boards and fibreboards with low formaldehyde content using tannin based binders |
Family Cites Families (1)
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JPS63221008A (en) * | 1987-03-11 | 1988-09-14 | Ooshika Shinko Kk | Preparation of composite board |
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2000
- 2000-04-20 EP EP00108679A patent/EP1048424A3/en not_active Withdrawn
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FR1489279A (en) * | 1966-08-04 | 1967-07-21 | Tableros De Gerona | Process for the manufacture of panels and resulting panel |
EP0012169A1 (en) * | 1978-11-29 | 1980-06-25 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Multi-layered, mainly aminoplast-bound particle or fibre board |
WO1993024719A1 (en) * | 1992-05-26 | 1993-12-09 | Tesch Guenter | Cork covering, in particular floor cork covering |
EP0788866A2 (en) * | 1996-02-09 | 1997-08-13 | Schlingmann GmbH & Co. | Method for the fabrication of particle boards and fibreboards with low formaldehyde content using tannin based binders |
Non-Patent Citations (2)
Title |
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DATABASE WPI Section Ch, Week 198843 Derwent Publications Ltd., London, GB; Class A32, AN 1988-302645 XP002146625 & JP 63 221008 A (OSHIKA SHINKO CO), 14. September 1988 (1988-09-14) * |
DATABASE WPI Section Ch, Week 199443 Derwent Publications Ltd., London, GB; Class A81, AN 1994-347736 XP002146624 & JP 06 088242 B (UCHIYAMA KOGYO KK), 9. November 1994 (1994-11-09) * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100429056C (en) * | 2006-06-20 | 2008-10-29 | 江苏大盛板业有限公司 | Method for producing aldehyde-free soft board made of wheat straw |
BE1018993A3 (en) * | 2009-04-16 | 2011-12-06 | Unilin Bvba | PLATE MATERIAL, METHODS FOR MANUFACTURING PLATE MATERIAL AND PANEL CONTAINING SUCH PLATE MATERIAL. |
BE1019618A3 (en) * | 2009-04-16 | 2012-09-04 | Unilin Bvba | PLATE MATERIAL, METHODS FOR MANUFACTURING PLATE MATERIAL AND PANEL CONTAINING SUCH PLATE MATERIAL. |
GB2471096A (en) * | 2009-06-16 | 2010-12-22 | Eco Mats Ltd | Laminated composites based on natural materials |
CN109627406A (en) * | 2018-12-29 | 2019-04-16 | 大亚人造板集团有限公司 | A kind of preparation method and application of ultralow free formaldehyde high water resistance cyanurotriamide modified urea resin is in low imbibition moisture-proof floor substrate |
WO2024189389A1 (en) * | 2023-03-10 | 2024-09-19 | Dion Warren Nicholas | Building panel |
Also Published As
Publication number | Publication date |
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EP1048424A3 (en) | 2001-01-03 |
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