EP0517595B1 - Poliermaschine mit Druckkraftsteuerung - Google Patents

Poliermaschine mit Druckkraftsteuerung Download PDF

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Publication number
EP0517595B1
EP0517595B1 EP19920401533 EP92401533A EP0517595B1 EP 0517595 B1 EP0517595 B1 EP 0517595B1 EP 19920401533 EP19920401533 EP 19920401533 EP 92401533 A EP92401533 A EP 92401533A EP 0517595 B1 EP0517595 B1 EP 0517595B1
Authority
EP
European Patent Office
Prior art keywords
electromagnet
polishing
polishing plate
sample
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19920401533
Other languages
English (en)
French (fr)
Other versions
EP0517595A1 (de
Inventor
André Baldy
Gérard Barrois
Henri Blanc
Marcel Dominiak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
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Publication date
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Publication of EP0517595A1 publication Critical patent/EP0517595A1/de
Application granted granted Critical
Publication of EP0517595B1 publication Critical patent/EP0517595B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces

Definitions

  • the present invention relates to a polishing machine with pressure control.
  • the invention finds a particular application in the polishing of microelectronic components integrated in semiconductor wafers (in silicon for example). They can be, in particular, magnetic writing and reading heads.
  • the first document relates to heads with a so-called “horizontal” structure -car formed from a stack of layers deposited on the upper face of a semiconductor wafer -and the second to heads with a structure called “vertical” -car formed from layers deposited on the edge of such a wafer.
  • micro-machining carried out on such wafers consists, in the first case, in leveling (or “planarizing") and in polishing various intermediate sub-assemblies obtained during the production process, in defining an air gap and in bringing the assembly of the head in the general plane of the substrate, also called the flight plane.
  • the purpose of micro-machining is to define an air gap and to adjust the shape of the flight pads.
  • the machine object of this The invention is above all intended for polishing assemblies or sub-assemblies corresponding to the first category (horizontal heads), because it is in this case that the technological problems are the most difficult.
  • Figure 1 shows, by way of example of a polishing piece, a magnetic writing and reading head in a horizontal structure.
  • the assembly shown corresponds, at the last stage of production, just before final polishing.
  • This assembly includes a silicon substrate 10 in which a box has been etched, a magnetic circuit 12 made of iron-nickel alloy, a double coil 14 made of copper, a layer of silica 16 3 to 6 ⁇ m thick, a non-magnetic spacer 18 in silica approximately 1 ⁇ m thick and two upper pole pieces 20 in iron-nickel.
  • the final polishing plan is marked in broken lines and referenced 22.
  • the material removal relates to the pole pieces 20 and to the protrusions 23 in silica. In order not to alter the magnetic circuit, this removal must not reduce the thickness of the uniform layer of silica by more than 0.3 ⁇ m.
  • the final polishing plan defines the flight plan of the head.
  • Two such heads are generally placed side by side on two parallel strips called "skis", defining two flight plans, in a general catamaran structure.
  • this system is complex due because the electromagnet is placed in a rotating block, it does not allow the pressure to be controlled at very low values, since at least this pressure is that exerted by the whole of the sample support block. This system therefore makes it possible to control only an increase in pressure, compared to a minimum pressure.
  • Document EP-A-0 284 343 describes one, which comprises an inflatable balloon capable of quickly absorbing the variations in pressure exerted on the sample to be polished due to variations in the contours of the polishing tool. But this machine does not allow to control the polishing pressure.
  • the sample is assumed to be held by a support piece placed above the polishing plate.
  • the force is applied to the sample via the support head and the polishing plate is fixed.
  • the invention is equally applicable to a machine where the polishing sample is located below the polishing tool on a sample support table, the polishing tool being held by the support head on which pressure is exerted.
  • the invention relates essentially to the means represented schematically by the block 34.
  • the machine shown in Figures 3a (side view) and 3b (end view) comprises a rigid bracket 50 sliding on vertical columns 52 and 54.
  • An electromagnet 56 is powered by means 58.
  • This electromagnet is fixed at one end of the stem 50, and is provided with a movable axial rod 60.
  • This rod is equipped with a pressure sensor 62 having an outlet 64 connected to a pressure display means 65 and to the supply means 58.
  • the pressure sensor 62 (or the display means 65) is connected to a comparator 67 also receiving a setpoint signal from a generator 69.
  • the output of the comparator delivers an error signal equal to the difference, in magnitude and as a sign, between the pressure measured by the sensor and the pressure setpoint.
  • the electromagnet 56 is then controlled so that the error signal is canceled.
  • An arm 70 is mounted oscillating around two horizontal axes 72-74 integral with the bracket 50.
  • a spindle 80 supports, at its lower part, an adjustable eccentric 82 provided with a means 84 for hooking the sample support head 86.
  • This spindle is equipped, at its upper part, with a stop 90, for example a ball stop.
  • the pin 80 is fixed to the end of the arm, under the electromagnet 56.
  • the axial rod 60 of this electromagnet and its pressure sensor 62 come to bear on the stop 90.
  • a motor 91 is arranged at the other end of the arm 70 and forms a counterweight.
  • a balancing mass 92 adjustable in position, is disposed near the motor 91 and is capable of balancing the arm 70 in the position of the latter.
  • a means 93 for transmitting movement for example a toothed belt, is arranged between the motor 91 and the eccentric 82 to control the rotation of the eccentric 82.
  • Means 94, 95 are provided for vertically moving the bracket and all the means attached thereto, along the vertical columns 52, 54 until the sample is brought near the polishing plate 30.
  • the stem At rest, the stem is in high stop; the swinging arm is then slightly inclined (figure a); the ball stop is supported on the rod of the electromagnet; the pressure display 65 indicates substantially zero.
  • the sample holder 86 is hooked to the eccentric; the swinging arm 70 swings down; we find the equilibrium position (sensor at zero) by moving the balancing mass 92 (figure b).
  • the stem descends along the axes 52-54 and is locked in the low position by the jacks (figure c).
  • the oscillating arm 70 is always inclined very slightly upwards and the sample holder is approximately one millimeter from the abrasive plane 30.
  • the electromagnet 56 is then supplied with an adjustable and stable direct voltage, until the sample comes into contact with the polishing plane. Then the load is increased to the desired force value (figure d). Polishing can then be carried out by controlling the motor 91.
  • This device makes it possible to adjust and control the polishing pressure from an almost zero value to a maximum value fixed by the electromagnet chosen from 0 to 100 kg for example.
  • FIG. 5 shows, in section, a sub-assembly corresponding to a magnetic writing and reading head in a horizontal structure, of the kind which has already been mentioned in connection with FIG. 1.
  • the sub-assembly of FIG. 5 essentially comprises a silicon substrate 100, two edges of the casing 102 in silica, two vertical pads 104 in iron-nickel. This involves polishing this sub-assembly according to a plane 106 before continuing the operations of forming the upper pole piece.
  • the profile of the sub-assembly is shown in part a of Figure 6.
  • the entire recorded interval measures 1.2 mm (the units indicated are therefore in micrometers).
  • the units are in hundreds of nanometers.
  • the profile presents the shape of part b of FIG. 6.
  • the whole of the raised interval measures 4 mm (which means that the survey relates to the entire "ski" carrying the head).
  • the scale is in ten nanometers.
  • the residual overshoot in the natural curvature of the "ski” is less than or equal to 30 nm (this curvature being a fraction of the deformation of the substrate).
  • FIG. 7 shows the head after the operations for forming the non-magnetic spacer 110 and the upper pole pieces 112 made of iron-nickel. Reliefs 114 appear in the center of the head. The final polishing plan is referenced 116.
  • Part b of Figure 8 shows the reading after polishing. On the abscissa, the units are still in micrometers and on the ordinate, in tens of nanometers. No residual overshoot is detected, we only measure the natural curvature of the pad (this curvature being a fraction of the deformation of the substrate).

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Claims (3)

  1. Poliermaschine, umfassend:
    - eine Polierplatte (30),
    - eine Einrichtung (32), imstande die zu polierenden Muster (44) festzuhalten, wobei die zu polierende Fläche der Polierplatte (30) gegenüberliegt,
    - Einrichtungen (34), um eine Anpreßkraft der zu polierenden Fläche auf die Polierplatte (30) auszuüben und um das zu polierende Muster quer zu verschieben in bezug auf die feste Polierplatte (30),
    wobei diese Maschine dadurch gekennzeichnet ist, daß besagte Einrichtungen zum Ausüben der Anpreßkraft und zum Verschieben des Muster in bezug auf die Polierplatte umfassen:
    - einen steifen, auf Vertikalsäulen (52, 54) gleitenden Träger (50),
    - einen Elektromagneten (56) und seine Versorgungseinrichtungen (58), wobei der Elektromagnet an einem Ende des Trägers (50) befestigt ist, dieser Elektromagnet versehen ist mit einer beweglichen Axialstange (60) und diese Stange ausgestattet ist mit einem Druckfühler (62), der einen Ausgang (64) hat, der verbunden ist mit den Versorgungseinrichtungen (58) des Elektromagneten (56),
    - einen Komparator (67) mit zwei Eingängen, jeweils verbunden mit dem Druckfühler (62) und einem Sollwert-Generator (69), und mit einem Ausgang, verbunden mit der Versorgungsschaltung (58) des Elektromagneten (56),
    - einen Arm (70), schwenkbar um die beiden fest mit dem Träger (50) verbundenen Horizontalachsen (72-74) angebracht,
    - eine Spindel (80), die an ihrem Unterteil einen verstellbaren Exzenter (82) tragt, versehen mit einer Einrichtung (84) zum Aufhängen eine Trägerkopfes, und an ihrem Oberteil mit einem Anschlag (90) versehen ist, wobei diese Spindel (80) an einem Ende des Arms befestigt ist, unter dem Elektromagneten (56), befestigt am Träger (50), und die Axialstange (60) von diesem und ihr Druckfühler (62) sich abstützen auf dem Anschlag (90) der Spindel (80),
    - einen Motor (91), angeordnet am anderen Ende des Arms (70) und ein Gegengewicht bildend,
    - eine Ausgleichsmasse (92) mit verstellbarer Position und angeordnet in der Nähe des Motors (91), imstande, den Arm (70) in einer im wesentlichen horizontalen Stellung im Gleichgewicht zu halten,
    - eine Einrichtung (93) zum Übertragen der Bewegung zwischen dem Motor (91) und dem Exzenter (82), um die Drehung des durch die Spindel (80) getragenen Exzenters (82) zu steuern,
    - Einrichtungen (94-95) zum vertikalen Verschieben des Trägers und aller daran befestigten Einrichtungen längs der Vertikalsäulen (52, 54), bis das Muster (86) in Kontakt gebracht ist mit der Polierplatte (30).
  2. Maschine nach Anspruch 1, dadurch gekennzeichnet, daß der Trägerkopf das zu polierende Muster trägt, wobei die Polierplatte sich unter dem Tragerkopf befindet.
  3. Maschine nach Anspruch 1, dadurch gekennzeichnet, daß der Trägerkopf die Polierplatte trägt, wobei das zu polierende Muster sich unter dem Trägerkopf befindet.
EP19920401533 1991-06-06 1992-06-04 Poliermaschine mit Druckkraftsteuerung Expired - Lifetime EP0517595B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9106867 1991-06-06
FR9106867A FR2677291B1 (fr) 1991-06-06 1991-06-06 Machine de polissage a controle de pression.

Publications (2)

Publication Number Publication Date
EP0517595A1 EP0517595A1 (de) 1992-12-09
EP0517595B1 true EP0517595B1 (de) 1995-09-06

Family

ID=9413542

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19920401533 Expired - Lifetime EP0517595B1 (de) 1991-06-06 1992-06-04 Poliermaschine mit Druckkraftsteuerung

Country Status (3)

Country Link
EP (1) EP0517595B1 (de)
DE (1) DE69204558T2 (de)
FR (1) FR2677291B1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0696495B1 (de) * 1994-08-09 1999-10-27 Ontrak Systems, Inc. Linear Poliergerät und Wafer Planarisierungsverfahren
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
CN106475885A (zh) * 2016-10-24 2017-03-08 无锡市明骥智能机械有限公司 加工件抛光机构
CN107081669B (zh) * 2017-05-22 2019-05-24 山东鲁发橡塑制品集团有限公司 一种塑胶件抛光装置
CN112605848A (zh) * 2020-11-29 2021-04-06 厦门理工学院 电磁式重心可调抛光盘机构及抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2539561A (en) * 1946-12-13 1951-01-30 John M Wolfskill Piezoelectric crystal lapping apparatus
US2799974A (en) * 1954-05-14 1957-07-23 Corning Glass Works Polishing apparatus
JPS6090668A (ja) * 1983-10-19 1985-05-21 Seiko Epson Corp 鏡面研磨方法
DE3520713A1 (de) * 1985-06-10 1986-12-11 Fa. Peter Wolters, 2370 Rendsburg Steuervorrichtung fuer den bearbeitungsdruck an laepp-, hon- und poliermaschinen
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
CH684321A5 (de) * 1988-04-07 1994-08-31 Arthur Werner Staehli Einrichtung an einer Zweischeibenläppmaschine.
JPH01310859A (ja) * 1988-06-09 1989-12-14 Toyoda Mach Works Ltd ポリシング加工機

Also Published As

Publication number Publication date
FR2677291B1 (fr) 1995-12-15
DE69204558D1 (de) 1995-10-12
FR2677291A1 (fr) 1992-12-11
DE69204558T2 (de) 1996-04-18
EP0517595A1 (de) 1992-12-09

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