EP0327157B1 - Kontaktwerkstoff und Verfahren zu dessen Herstellung - Google Patents
Kontaktwerkstoff und Verfahren zu dessen Herstellung Download PDFInfo
- Publication number
- EP0327157B1 EP0327157B1 EP89200156A EP89200156A EP0327157B1 EP 0327157 B1 EP0327157 B1 EP 0327157B1 EP 89200156 A EP89200156 A EP 89200156A EP 89200156 A EP89200156 A EP 89200156A EP 0327157 B1 EP0327157 B1 EP 0327157B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- ions
- range
- contact material
- implanted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 230000008569 process Effects 0.000 title claims abstract description 6
- 150000004770 chalcogenides Chemical class 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 13
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 13
- 150000003624 transition metals Chemical class 0.000 claims abstract description 13
- 230000000737 periodic effect Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 82
- 150000002500 ions Chemical class 0.000 claims description 21
- 238000002513 implantation Methods 0.000 claims description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 14
- -1 nitrogen ions Chemical class 0.000 claims description 11
- 229910052786 argon Inorganic materials 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 9
- 239000010937 tungsten Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000001050 lubricating effect Effects 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 5
- 239000010970 precious metal Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052961 molybdenite Inorganic materials 0.000 description 3
- 229910052756 noble gas Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- JAAVTMIIEARTKI-UHFFFAOYSA-N [S--].[S--].[Ta+4] Chemical compound [S--].[S--].[Ta+4] JAAVTMIIEARTKI-UHFFFAOYSA-N 0.000 description 2
- CXRFFSKFQFGBOT-UHFFFAOYSA-N bis(selanylidene)niobium Chemical compound [Se]=[Nb]=[Se] CXRFFSKFQFGBOT-UHFFFAOYSA-N 0.000 description 2
- VRSMQRZDMZDXAU-UHFFFAOYSA-N bis(sulfanylidene)niobium Chemical compound S=[Nb]=S VRSMQRZDMZDXAU-UHFFFAOYSA-N 0.000 description 2
- RGPAOGPIWFDWCB-UHFFFAOYSA-N bis(tellanylidene)titanium Chemical compound [Te]=[Ti]=[Te] RGPAOGPIWFDWCB-UHFFFAOYSA-N 0.000 description 2
- 229910052798 chalcogen Inorganic materials 0.000 description 2
- 150000001787 chalcogens Chemical class 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 150000004771 selenides Chemical class 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
Definitions
- the invention relates to a contact material in the form of a layer with chalcogenides of transition metals of groups IVa to VIa of the Periodic Table of the Elements (PSE) on a substrate, a method for its production, its use for electrical contacts and an electrical contact.
- PSE Periodic Table of the Elements
- contact materials based on noble metals are preferably used for most contact systems.
- the use and further development of contact materials are therefore primarily determined by the need for substitution of precious metals, which can be achieved by reducing the proportion of alloys, by geometrically minimizing the contact volume and by developing new contact materials that can do without precious metals.
- contact materials based on high-melting metals such as tungsten, molybdenum and rhenium are used today, which are characterized not only by their high melting points, but also by high hardness and strength, which results in high wear and erosion resistance of the contacts made from them.
- high-melting metals such as tungsten, molybdenum and rhenium
- tungsten contacts can only be used to a limited extent with regard to their current carrying capacity due to the low electrical thermal conductivity, in addition, tungsten is unstable to oxygen above a temperature of 400 ° C and when switching in air, oxide foreign layers are formed which lead to an external layer resistance and thus to an increase of the contact resistance. Contact forces of at least 1 N are therefore required for reliable contacting, or frictional actuation of the contacts must be provided.
- the starting semifinished product for tungsten contacts is produced by powder metallurgy by pressing and sintering powder, however, because of the low ductility and the high strength, the mechanical processing of tungsten is difficult.
- molybdenum does not achieve the excellent contact properties of tungsten. However, it is preferred as a cheaper metal for those cases that do not necessarily require the use of tungsten.
- a self-lubricating contact structure which consists of a highly conductive substrate and a self-lubricating contact surface.
- the contact surface is a composite material made from a highly conductive, metallic component and a solid, lubricating component.
- the solid, lubricating component is preferably selected from the group consisting of silver, alloys based on silver, and copper and alloys based on copper.
- the solid, lubricating component is preferably selected from the groups consisting of graphite, molybdenum sulfide, niobium disulfide, niobium diselenide, tantalum disulfide and titanium ditelluride.
- the contact surface had the compositions 92.8% Ag, 7.2% MoS2 or 95.6% Ag, 4.4% MoS2 or 97.7% Ag, 2.3% MoS2.
- the composite material is produced by plasma spraying the components or a component mixture.
- This composite material has the disadvantage that the self-lubricating component is very poorly conductive and that it is relatively expensive.
- Plasma spraying as a production process for the above composites has the disadvantage that the ratio of the two components in the sprayed layers can only be obtained with difficulty and in a reproducible manner.
- EP-A-074630 discloses substrate / cover layer combinations in which the substrate can consist of a transition metal from group IVa to VIa of the PSE and the cover layer consists of the associated sulfide or selenide. These layer materials are produced by in-situ reaction of the substrate metal with a chalcogen-containing phase. However, there are no indications of a modification of the structure of the cover layers to improve the electrical conductivity. There is also no indication of the need to improve conductivity.
- US-A-3482202 discloses contacts with any substrate and a self-lubricating contact layer, which is a composite of a highly conductive metallic components and a solid lubricating component.
- the highly conductive metallic component is preferably selected from the group consisting of silver, silver alloys, copper and copper alloys.
- the solid, lubricating component is preferably selected from the group consisting of graphite, molybdenum disulfide, niobium disulfide, niobium diselenide, tantalum disulfide, titanium ditelluride.
- This citation is considered to be the closest prior art because it discloses contact layers of various chalcogenides from transition metals of group IVa to Vb on any substrate and this citation already has the task of providing contact materials which, in addition to very low sliding friction coefficients, also have relatively low values for have the contact resistance.
- GB-A-2056177 discloses a method for producing contact materials based on binary and ternary alloys of Cu, W, Mo, Ag, Cr, Ge, etc. Preferably copper alloys are used. Alloy formation takes place by ion implantation of known alloy materials such as Cr, Fe, Zr, Ti, V, Ge, Co, Si, Ni, Ta, W, Mo and their combinations. Here too, however, the electrical resistance of the original layers is increased by the ion implantation and only because the ion implantation enables the formation of very thin alloy layers on the copper does the conductivity of the copper have little effect. According to page 1 line 27 to page 2 line 1 is the use of material with lubricating properties expressly excluded.
- chalcogenides of the transition metals from subgroups IVa to VIa are particularly suitable as contact materials, nor that the structure of layers produced from these chalcogenides can be modified by particle bombardment in order to reduce the contact resistance by several orders of magnitude.
- the invention has for its object to provide contact materials with chalcogenides of transition metals of groups IVa to VIa of the PSE, from which thin and thick film contacts of any configuration can be produced in an economical manner, which do not have the disadvantages mentioned above and which have the particular advantage that they combine low contact resistances with very low sliding friction coefficients.
- This object is achieved in that the structure of the layer is modified by particle bombardment.
- the chalcogenides are titanium, Zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum and / or tungsten, formed from the chalcogens sulfur, selenium and / or tellurium, advantageously with ions of an implantation energy in the range of 0.5 keV to 400 keV in the chalcogenide layer and a dose in the range of 1015 to nx 1018 / cm2 are implanted.
- inert gas ions preferably nitrogen ions, or noble gas ions, preferably argon ions, are implanted in the chalcogenide layer.
- a method for producing a contact material in the form of a layer of chalcogenides of transition metals from groups IVa to VIa of the Periodic Table of the Elements (PSE) deposited on a substrate by chemical or physical vapor deposition is characterized in that the structure of the layer is modified by particle bombardment .
- Layers of chalcogenides of transition metals have very low sliding friction coefficients, but have a relatively high contact resistance R K , so that they are not very suitable as a contact material. Surprisingly, however, it has been found that the values for the contact resistance R K can be reduced by up to three orders of magnitude if the structure of the chalcogenide layers is modified during or after application to a substrate, which is advantageously achieved by particle bombardment, preferably by ion implantation can be.
- This effect is not based on doping the layer material with foreign ions, as it is e.g. is known from semiconductor technology.
- the reduction in the contact resistance of the layers according to the invention also results from bombardment with ions from elements which are generally not used for doping purposes, e.g. Noble gas or inert gas ions. It can be assumed that the improvement in the electrical conductivity or the reduction in the contact resistance of chalcogenide layers is a result of structural changes in the layers after particle bombardment. After bombardment with e.g. high-energy ions were found in studies on layers produced in the context of the present invention, an increase in the density of the layers by up to 40%.
- the particle bombardment is carried out while the layer is being applied.
- layers of greater thickness preferably a layer thickness in the range from 0.1 to 10 ⁇ m
- layers of greater thickness can also be modified in their structure, for which purpose advantageously low-energy ions with an implantation energy in the range from 0.5 keV to 100 keV and a dose in the range of 1015 to nx 1018 / cm2, preferably a dose in the range of 3 x 1015 to 1016 / cm2, are used.
- the particle bombardment is carried out after the layer has been applied.
- This method is particularly suitable if layers of smaller thickness, preferably in the range from a monolayer to 2 ⁇ m, are to be modified in their structure.
- inert gas ions preferably nitrogen ions, or noble gas ions, preferably argon ions, are implanted in the chalcogenide layer.
- the chalcogenide layer is produced by sputtering, the deposition process advantageously being supported by a magnetic field, that is to say using a magnetron.
- the chalcogenide layers can also be deposited using other methods known for the deposition of thin or thick layers.
- chemical vapor deposition such as plasma-assisted deposition from the gas phase, reactive cathode sputtering, plasma-assisted deposition from the gas phase, vapor deposition processes, ion plating processes with a high bias on the substrate or ionization are to be considered here of the layer material to be deposited in the arc, optionally in a reactive gas phase from, for example Hydrogen sulfide gas or sulfur in the gas phase.
- contact materials are provided which do not require any precious metals, from which contacts of any configuration can be made in an economically advantageous manner can be produced and which have particularly low sliding friction coefficients, even in a vacuum, which is very favorable for the production of, for example, contacts which are to be exposed to mechanical sliding or grinding stress.
- a particular advantage of the contact materials according to the invention and the contact layers produced from them is that their contact resistance is undesirably increased less than in the case of contacts made of pure base metals due to an external layer resistance due to the formation of foreign or cover layers due to, for example, oxidizing action of the surrounding medium.
- the layers according to the invention show a particularly good adhesive strength on steel substrates; intermediate layers that improve adhesion are not necessary here.
- a further significant advantage from an economic point of view is that both the cathode sputtering process, which is preferably provided for the production of the chalcogenide layers, and the ion implantation process, which is preferably provided for the structural change of the chalcogenide layers, can be carried out with commercially available machines.
- chalcogenides of the transition metals titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum and / or tungsten can be considered, which need not be stoichiometric chalcogenides.
- the layers obtained were bombarded with argon or nitrogen ions using a high-current ion implantation system:
- argon or nitrogen ions e.g. silicon or hydrogen ions can also be implanted in the chalcogenide layers.
- the implantation parameters can be determined without difficulty by the person skilled in the art in the context of the present method.
- the table below shows the values for the coefficient of friction »and the values for the contact resistance R K before and after ion implantation for different chalcogenide layers.
- the values for the respective contact resistance were measured using a gold counter electrode.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
- Physical Vapour Deposition (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3802869 | 1988-02-01 | ||
| DE3802869A DE3802869A1 (de) | 1988-02-01 | 1988-02-01 | Kontaktwerkstoff auf basis von uebergangsmetallen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0327157A2 EP0327157A2 (de) | 1989-08-09 |
| EP0327157A3 EP0327157A3 (en) | 1990-12-05 |
| EP0327157B1 true EP0327157B1 (de) | 1994-07-06 |
Family
ID=6346371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89200156A Expired - Lifetime EP0327157B1 (de) | 1988-02-01 | 1989-01-25 | Kontaktwerkstoff und Verfahren zu dessen Herstellung |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0327157B1 (enrdf_load_stackoverflow) |
| JP (1) | JPH01232614A (enrdf_load_stackoverflow) |
| AT (1) | ATE108282T1 (enrdf_load_stackoverflow) |
| DE (2) | DE3802869A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2459303C1 (ru) * | 2011-02-03 | 2012-08-20 | Открытое акционерное общество "Рязанский завод металлокерамических приборов" (ОАО "РЗМКП") | Способ изготовления магнитоуправляемого герметизированного контакта |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3482202A (en) * | 1967-03-15 | 1969-12-02 | Westinghouse Electric Corp | Electrical apparatus and self-lubricating contact |
| NL7905720A (nl) * | 1979-07-24 | 1981-01-27 | Hazemeijer Bv | Werkwijze voor het verbeteren van schakelkontakten, in het bijzonder voor vakuumschakelaars. |
| EP0088123A4 (en) * | 1981-09-11 | 1985-10-01 | Western Electric Co | CONTAINING APPARATUS ELECTRICAL CONTACTS. |
-
1988
- 1988-02-01 DE DE3802869A patent/DE3802869A1/de active Granted
-
1989
- 1989-01-25 DE DE58907989T patent/DE58907989D1/de not_active Expired - Fee Related
- 1989-01-25 AT AT89200156T patent/ATE108282T1/de active
- 1989-01-25 EP EP89200156A patent/EP0327157B1/de not_active Expired - Lifetime
- 1989-01-31 JP JP1019935A patent/JPH01232614A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE58907989D1 (de) | 1994-08-11 |
| ATE108282T1 (de) | 1994-07-15 |
| DE3802869A1 (de) | 1989-08-10 |
| DE3802869C2 (enrdf_load_stackoverflow) | 1991-02-14 |
| EP0327157A2 (de) | 1989-08-09 |
| JPH01232614A (ja) | 1989-09-18 |
| EP0327157A3 (en) | 1990-12-05 |
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