EP0315707B1 - Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten - Google Patents

Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten Download PDF

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Publication number
EP0315707B1
EP0315707B1 EP87116528A EP87116528A EP0315707B1 EP 0315707 B1 EP0315707 B1 EP 0315707B1 EP 87116528 A EP87116528 A EP 87116528A EP 87116528 A EP87116528 A EP 87116528A EP 0315707 B1 EP0315707 B1 EP 0315707B1
Authority
EP
European Patent Office
Prior art keywords
adapter
plate
test
circuit board
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87116528A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0315707A1 (de
Inventor
Paul Mang
Savvas Arampoglou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mania GmbH and Co
Original Assignee
Mania GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to AT87116528T priority Critical patent/ATE75319T1/de
Application filed by Mania GmbH and Co filed Critical Mania GmbH and Co
Priority to DE8787116528T priority patent/DE3778548D1/de
Priority to ES198787116528T priority patent/ES2030694T3/es
Priority to EP87116528A priority patent/EP0315707B1/de
Priority to DE8807847U priority patent/DE8807847U1/de
Priority to US07/213,621 priority patent/US4834659A/en
Priority to CA000570805A priority patent/CA1271565A/en
Priority to JP63167015A priority patent/JPH087249B2/ja
Publication of EP0315707A1 publication Critical patent/EP0315707A1/de
Application granted granted Critical
Publication of EP0315707B1 publication Critical patent/EP0315707B1/de
Priority to HK133996A priority patent/HK133996A/xx
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Definitions

  • the present invention relates to an adapter for adapting the uniform contact grid of an electronic test device for printed circuit boards to the non-uniform contact configuration of the connection points on a printed circuit board to be tested according to the preamble of claim 1.
  • the "universal adapter" according to EP-B1-26 824 has a base plate which rests on the basic grid of the test device and which is provided with continuous channels or bores in accordance with the uniform contact grid of the test device. At a distance above the basic grid, ie on the side of the base plate facing away from the basic grid of the test device, an arrangement of two adapter plates spaced apart from one another is arranged with the aid of fixed spacers. These adapter plates are identical with holes that correspond to the connection points of the circuit board to be tested are distributed.
  • needle-shaped, longitudinally resilient test pins are then inserted, which can be deflected resiliently at least in their lower section transversely to the longitudinal extent of the test pins in order to compensate for any misalignment between the bores mentioned and the channels.
  • the adapter is also provided with an alignment device that aligns the circuit board to be tested with the adapter. This is done, for example, by means of suitable fixing pins which engage in correspondingly arranged fixing bores in the test specimen.
  • the two (inner and outer) adapter plates which are drilled identically for each test specimen and have a certain distance from one another, it is ensured that the test pins in their area adjacent to the circuit board run exactly vertically to the surface of the circuit board and thus come into exact contact with the connection points on the circuit board to be tested. even if the lower area of the test pins, which is further away from the circuit board, should be deflected.
  • connection points can be provided for complex circuit boards and a resilient test pin is required for each connection point, the cost of such an adapter increases very sharply with the number of connection points, since resilient in the longitudinal direction Test pins require a considerable manufacturing effort.
  • test pins have a minimum diameter that can hardly be undershot, which represents the natural limit for the possible test pin density.
  • an "active basic grid” was created, in which the contacts of the basic grid of the circuit board test device are spring-mounted essentially in the direction of the longitudinal axis of the test pins.
  • This active basic grid is placed on the rigid, hard-wired basic grid of the circuit board test device and is used to ensure, when using rigid test pins, that the contact pressure at all test points contacted by the rigid test pins is sufficiently high and as uniform as possible.
  • EP-A1-0 215 146 shows a generic adapter ("Adapter 85"), the upper adapter plate of which is drilled for the test specimen lies against the circuit board to be tested and whose rigid contourless test pins enforce an additional elastic plate which, due to the elasticity of the material, the test pins when Prevent fiddling with the adapter regardless of the actual test device from falling out. This can in a later inspection of the same printed circuit board, the not inconsiderable amount of work to assemble the adapter is saved and instead the adapter is kept again until it is used again.
  • this adapter has the advantage that very cheaply manufactured rigid and completely contourless test pins can be used, the assembly of the adapter is complicated by the fact that the test pins cannot simply "fall” into the adapter, but through the elastic plate with a certain amount Force must be pushed through. *) *) Furthermore, this adapter has an inner adapter plate, the grid of which, however, neither corresponds to the grid of the outer adapter plate nor to that of the base plate.
  • EP-A1-0 233 511 shows a generic adapter, but for testing wafers with chips.
  • This adapter has a base plate and an outer guide plate which has guide channels for the test needles drilled specifically for the test specimen and, if necessary, resiliently comes into contact with the test specimen, the needle tips attacking the contact surfaces of the test specimen.
  • a second inner guide plate is provided, the task of which is to keep the needles bent out sideways in order thereby to achieve an axial suspension.
  • the hole arrangement of the inner guide plate is either horizontally offset or kept larger or smaller with respect to the outer guide plate.
  • circuit board test devices have been developed which are able to carry out simultaneous double-sided testing of double-sided circuit boards. This then also leads to the need for adapters for such test devices.
  • This object is achieved by the adapter according to claim 1.
  • This novel design provides an adapter which is constructed with rigid pins and acts on an "active basic grid" and can be used with the same basic structure for the one-sided and two-sided testing of printed circuit boards. Due to the uniform structure of the adapter - regardless of whether for one-sided or simultaneous two-sided testing - all additional devices are like For example, pin setting devices that build such an adapter, always the same.
  • a further inner adapter plate is provided between the outer adapter plate and the base plate, and the test pins in the area between the inner and outer adapter plate are given a cross-sectional widening whose width is greater than the diameter of the specimen-specific bores in these adapter plates. This ensures that the test pins do not fall out when handling the adapter equipped with test pins, regardless of the actual electronic test device.
  • the resilient spacer can be manufactured particularly inexpensively if it is designed as an essentially annular spring element (claim 2), in particular if it is produced as a mass-produced plastic injection-molded part (claim 3).
  • the at least one adapter board ie the adapter plate lying against the printed circuit board to be tested, in the areas of lower test pin density in relation to the test pin density on the other side of the circuit board to be tested is supported by additional suitable supporting means, in order to avoid bending or warping of the outer adapter plate, which serves as a support for the circuit board if there are no test pins, if no or few contact pins on one side of the Attack the circuit board to counteract the contact pressure of a larger number of contact pins acting on the other side of the circuit board. It is conceivable that these additional support means for the at least one adapter plate in different
  • the support means are in the form of separate resilient support pins which support the underside of the outer adapter plate and run essentially perpendicularly to it through additional holes in the inner adapter plate which may be present up to the base plate resting on the actual test device, into which the outer adapter plate extends recorded load is derived.
  • the support pins are resilient in the longitudinal direction. As a result, the variable distance between the at least one (outer) adapter plate and the base plate built up a back pressure proportional to the load by the support pins.
  • the adapter according to the invention consists of three plates which are connected to one another via resilient spacer elements and spacers.
  • the base plate 23 is connected to the inner adapter plate 22 via a longitudinally resilient spacer 24, which in turn is screwed to the outer adapter plate 21 via a spacer 27.
  • the two adapter plates 21 and 22 are provided with (specimen-specific) adapter plate bores 28 in accordance with the pattern of the contacts to be tested on the circuit board 10 (test object), i.e. the bore pattern in the two plates 21 and 22 is identical insofar as these bores for the passage of the test pins 25 are provided.
  • the inner one Adapter plate 22, 32 must also be provided with additional support pin holes 15.
  • the adapter plates are made of electrically non-conductive material such as plexiglass, epoxy, GRP plates etc.
  • the lower base (raster) plate 23 of the adapter according to FIG. 1 is provided with basic raster channels 29 in accordance with the pattern of the contacts of the printed circuit board testing device, which channels are produced, for example, by drilling or the like.
  • This means that the basic grid plate 23 is provided with completely evenly distributed channels in accordance with the pattern of the contacts of the circuit board test device, while the two adapter plates 21 and 22 are provided with possibly irregularly distributed, specimen-specific adapter plate bores 28.
  • test pins can be flexibly deflected in their lower section facing the basic grid plate 23 in order to compensate for any misalignment between the adapter plate bores 28 and the basic grid channels 29 or to adapt to local increases in the contact point density on the to create circuit board 10 to be tested.
  • test pins 25 do not fall out when handling the adapter according to FIG. 1, the test pins in the area between the two adapter plates 21 and 22 are provided with a cross-sectional widening or test pin thickening 16, the width of which is greater than the diameter of the adapter plate bores 28.
  • a test pin thickening can be produced, for example, in an otherwise smooth, contourless test pin in a simple manner by squeezing it in this area by suitable means. Other possibilities for this are evident from the embodiments in FIG. 6.
  • additional support pins 26 are inserted between the outer adapter plate 21 and the basic grid plate 23 in areas of reduced test pin density.
  • additional support pin bores 15 are provided in those areas of the inner adapter plate 22 which contain fewer bores 28, after inspection or on the basis of an exact calculation, into which, after the adapter of FIG. 1 has been fitted (with the outer adapter plate 21 removed)
  • Support pins 26 - approximately as shown in FIG. 4 - are used.
  • the support pins 26 consist of a pin with a head 14 and a spring 13 which is wound around this pin 26. For example, by a cross-sectional deformation 17 remains at the lower end of the support pin the compression spring 13 connected to the support pin when removed. As shown in FIG.
  • the head 14 of the support pin rests on the lower side of the outer adapter plate 21, ie, the side facing away from the printed circuit board, while the lower end of the support pin and the region of the cross-sectional deformation 17 are arranged in a channel 29 of the basic grid plate 23.
  • the spring 13 abuts the base grid plate 23 because its diameter is larger than the diameter of the channels 29. In this way, the support pins 26 can intercept excessive local stress on the outer adapter plates 21 and transmit them into the base plate 23 via the spring 13. This lies on the insulating material blocks 41 of the basic contact field 40 and is supported on the latter.
  • a fixing pin 12 can be provided in the outer adapter plate 21 in order to precisely arrange the test object 10 with the aid of a corresponding fixing pin bore in relation to the test pins 25 or the test specimen-specific adapter plate bores 28.
  • the device under test 10 is thus centered on the adapter by this fixing pin, so that the position of the contact points on the device under test coincides with the position of the test pins in the adapter.
  • the hole diameter in the test-specific plates of the adapter is slightly larger than the diameter the rigid pins used (e.g. rigid pins with 0.8 mm diameter, holes 28 in the adapter plates 0.85 mm to 0.9 mm diameter.
  • the basic grid plate 23 is drilled in the grid of the contact points of the test device or provided with channels 29.
  • the diameter of these bores is determined so that test pins with different diameters or cross sections and the support pins 26 can be used.
  • the holes in the basic grid plate 23 are also to be countersunk, that is to say provided with a small inlet funnel, so that it is easier to equip the adapter with the test pins.
  • the basic grid plate 23 and at least the inner adapter plate 22 are to be made of transparent material, so that the manual loading of the adapter is facilitated and the visual check for short circuits between the pins 25 of the adapter can be carried out easily.
  • the assembly takes place of the adapter with the pins 25 or if necessary also with the support pins 26 with the outer adapter plate 21 removed, which is then placed after the finished fitting of the adapter and screwed to the spacer 27 in order to secure the test pins and support pins in the adapter.
  • An alternative embodiment of such a resilient spacer is designated in FIG. 2 by reference number 34.
  • Such a resilient support ring is also shown in FIG. 5 and can be a piece of pipe in appropriate dimensions with mounting holes or a plastic injection molded part.
  • FIG. 2 shows an adapter arrangement with two adapters according to FIG. 1 for simultaneously contacting a test specimen 10 on both sides.
  • the two adapters - apart from the alternatively designed resilient spacers 24 and 34 - are identical.
  • the adapter 20 serves to contact the underside of the test object and the adapter 30 serves to contact the top of the test object.
  • the lower adapter 20 rests on the lower contact base field 40 of the printed circuit board test device (not shown in more detail), the base field of the test device being equipped with resilient contact elements 42.
  • These resilient contact elements are inserted into the bores of an insulating material block 41 and are connected to the test electronics of the actual circuit board test device via plug elements. The resilient contacts of the contact field are therefore assigned to the test device.
  • the upper adapter 30 is attached to the upper contact base field 50 of the circuit board tester.
  • the upper contact basic field 50 of the test device is constructed like the lower basic field 40. Both basic contact fields 40 and 50 can be via a suitable, not shown Mechanism to be moved towards each other, with the test electronics being moved. The distance between the lower and the upper contact base fields 40 and 50 is therefore reduced.
  • the rigid test pins 25, 35 of both adapters 20, 30 enter the corresponding holes (for example 43 in FIG. 3) of the active basic grid field 40, 50 through the bores of the base plates 23, 33, so that the spring contact elements 42, 52 are compressed will.
  • the distances between the basic grid plates 23 and 33 and the specimen-specific adapter plates 21, 22 and 31, 32 change because these adapter plates are held by resilient spacers 24 and 34, respectively.
  • the support pins 26 also dip into the bores (for example 43 in FIG. 3) of the contact basic field grid 40 or 50 of the circuit board tester, the compression springs 13 of the support pins 26 being compressed.
  • the test pins 25 of the lower adapter 20 press the test specimen 10 against the outer test specimen-specific adapter plate 31 of the upper adapter 30, this plate 31 being supported by the support pins 36.
  • the test pins 35 of the upper adapter 30 press the test specimen 10 against the outer test specimen-specific plate 21 of the lower adapter 20, this plate 21 in turn being supported by the support pins 26.
  • the device under test 10 is thus between the two outer adapter plates specific to the device under test 21 or 22 clamped and can only deform if the test specimen-specific adapter plates are also deformed, but this is largely prevented by the support pins 26 and 36.
  • the compression spring 13 of the support pins 26 can compensate for the pressure force of several test pins, relatively few support pins 26 are used in the adapter.
  • the number and spacing of the support pins to one another depend on the number of test pins for contacting the two sides of the test specimen, and the arrangement of the support pins can be carried out on the basis of an estimated value or on the basis of an exact calculation.
  • an adapter When contacting a test object according to FIG. 2 on two sides, an adapter is used for each test object side, as shown.
  • the two adapters can be aligned with each other via centering pins, not shown.
  • location holes are drilled for the centering pins in the test-piece-specific adapter plates 31 and 21 outside the hole pattern of the contact points.
  • the assembly and equipping of an adapter takes place in such a way that the basic grid plate and the inner specimen-specific adapter plate are mounted on the resilient spacer will.
  • the test pins are then inserted through the holes in the adapter plate and can be deflected sideways by several millimeters if necessary - for example, a high test point concentration in local areas of the circuit board.
  • the adapter can be equipped with the test pins either manually or by a machine. Then the outer adapter plate is put on. If the two adapter plates are transparent, you can visually check whether the test pins touch each other and short circuits occur. With the fitted adapter, an adapter test can then be carried out on the test device in order to check the number and arrangement of the test pins and to determine whether there are short circuits in the adapter.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
EP87116528A 1987-11-09 1987-11-09 Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten Expired - Lifetime EP0315707B1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE8787116528T DE3778548D1 (de) 1987-11-09 1987-11-09 Adapter fuer eine vorrichtung zur elektronischen pruefung von leiterplatten.
ES198787116528T ES2030694T3 (es) 1987-11-09 1987-11-09 Adaptador para un dispositivo de comprobacion electronico de placas de circuito impreso.
EP87116528A EP0315707B1 (de) 1987-11-09 1987-11-09 Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten
AT87116528T ATE75319T1 (de) 1987-11-09 1987-11-09 Adapter fuer eine vorrichtung zur elektronischen pruefung von leiterplatten.
DE8807847U DE8807847U1 (de) 1987-11-09 1988-06-16 Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten
US07/213,621 US4834659A (en) 1987-11-09 1988-06-30 Adaptor in apparatus for electronically testing printed circuit boards
CA000570805A CA1271565A (en) 1987-11-09 1988-06-30 Adaptor in apparatus for electronically testing printed circuit boards
JP63167015A JPH087249B2 (ja) 1987-11-09 1988-07-06 印刷回路基板の電子検査装置用アダプタ
HK133996A HK133996A (en) 1987-11-09 1996-07-25 Adapter for a device for electronic testing of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP87116528A EP0315707B1 (de) 1987-11-09 1987-11-09 Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten

Publications (2)

Publication Number Publication Date
EP0315707A1 EP0315707A1 (de) 1989-05-17
EP0315707B1 true EP0315707B1 (de) 1992-04-22

Family

ID=8197434

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87116528A Expired - Lifetime EP0315707B1 (de) 1987-11-09 1987-11-09 Adapter für eine Vorrichtung zur elektronischen Prüfung von Leiterplatten

Country Status (8)

Country Link
US (1) US4834659A (ja)
EP (1) EP0315707B1 (ja)
JP (1) JPH087249B2 (ja)
AT (1) ATE75319T1 (ja)
CA (1) CA1271565A (ja)
DE (2) DE3778548D1 (ja)
ES (1) ES2030694T3 (ja)
HK (1) HK133996A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4035978A1 (de) * 1990-02-16 1991-08-22 Luther Erich Verfahren und vorrichtung zum laden eines adapters fuer ein leiterplattenpruefgeraet
DE69212195T2 (de) 1991-04-11 1996-12-19 Methode Electronics Inc Gerät zum elektronischen Testen von gedruckten Leiterplatten oder ähnlichem
DE69109869T2 (de) * 1991-12-06 1995-09-21 Sigmatech Co Ltd Apparat zur Inspektion der inneren Schaltung eines Halbleiters.
DE9401114U1 (de) * 1994-01-24 1995-02-16 Siemens AG, 80333 München Anschlußmodul
US5575076A (en) * 1994-07-13 1996-11-19 Methode Electronics, Inc. Circuit board testing fixture with registration plate
US5898314A (en) * 1996-02-26 1999-04-27 Delaware Capital Formation, Inc. Translator fixture with force applying blind pins
US5939892A (en) * 1996-04-12 1999-08-17 Methode Electronics, Inc. Circuit board testing fixture
DE29616272U1 (de) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter zum Prüfen von elektrischen Leiterplatten
DE10004974A1 (de) * 2000-02-04 2001-08-09 Atg Test Systems Gmbh Adapter zum Prüfen von Leiterplatten und Nadel für einen solchen Adapter
US9113845B2 (en) * 2009-01-08 2015-08-25 Given Imaging Ltd. Device and method for assembling in vivo sensing devices
DE102009016181A1 (de) * 2009-04-03 2010-10-14 Atg Luther & Maelzer Gmbh Kontaktierungseinheit für eine Testvorrichtung zum Testen von Leiterplatten
KR101845652B1 (ko) * 2017-01-17 2018-04-04 주식회사 텝스 부품 실장된 웨이퍼 테스트를 위한 하이브리드 프로브 카드

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233511A1 (de) * 1986-01-27 1987-08-26 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Prüfeinrichtung zur Wafer-Prüfung

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US3330522A (en) * 1965-12-10 1967-07-11 Clevite Corp Vibration isolating mount
US3676776A (en) * 1970-01-19 1972-07-11 Siemens Ag Testing probe construction
US3970934A (en) * 1974-08-12 1976-07-20 Akin Aksu Printed circuit board testing means
US4099120A (en) * 1976-04-19 1978-07-04 Akin Aksu Probe head for testing printed circuit boards
DE2933862A1 (de) * 1979-08-21 1981-03-12 Paul Mang Vorrichtung zur elektronischen pruefung von leiterplatten.
US4626776A (en) * 1984-06-07 1986-12-02 O. B. Test Group, Inc. Programmable test fixture
DE3524229A1 (de) * 1984-07-10 1986-01-16 Ingun Prüfmittelbau GmbH & Co KG Elektronik, 7750 Konstanz Vorrichtung zum pruefen von pruefpunkten einer elektronischen leiterplatte od. dgl. als pruefling mittels kontaktstiften
ATE36197T1 (de) * 1985-09-16 1988-08-15 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten oder dergleichen.
JPS6267469A (ja) * 1985-09-20 1987-03-27 Kyoei Sangyo Kk プリント配線板検査機用アダプタ
DE3539720A1 (de) * 1985-11-08 1987-05-14 Martin Maelzer Adapter fuer ein leiterplattenpruefgeraet
JPS62144078A (ja) * 1985-12-19 1987-06-27 Hitachi Electronics Eng Co Ltd 格子変換器
JPS62162388A (ja) * 1986-01-13 1987-07-18 松下電器産業株式会社 プリント配線板用検査装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233511A1 (de) * 1986-01-27 1987-08-26 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Prüfeinrichtung zur Wafer-Prüfung

Also Published As

Publication number Publication date
CA1271565A (en) 1990-07-10
HK133996A (en) 1996-08-02
JPH01143977A (ja) 1989-06-06
ES2030694T3 (es) 1992-11-16
ATE75319T1 (de) 1992-05-15
DE8807847U1 (de) 1988-08-04
US4834659A (en) 1989-05-30
JPH087249B2 (ja) 1996-01-29
DE3778548D1 (de) 1992-05-27
EP0315707A1 (de) 1989-05-17

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