EP0299099A1 - Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable - Google Patents

Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable Download PDF

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Publication number
EP0299099A1
EP0299099A1 EP87110116A EP87110116A EP0299099A1 EP 0299099 A1 EP0299099 A1 EP 0299099A1 EP 87110116 A EP87110116 A EP 87110116A EP 87110116 A EP87110116 A EP 87110116A EP 0299099 A1 EP0299099 A1 EP 0299099A1
Authority
EP
European Patent Office
Prior art keywords
pressing
silver
copper
press
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP87110116A
Other languages
German (de)
English (en)
Other versions
EP0299099B1 (fr
Inventor
Konrad Dr. Herz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inovan Stroebe KG
Inovan GmbH and Co KG Metalle und Bauelemente
Original Assignee
Inovan Stroebe KG
Inovan GmbH and Co KG Metalle und Bauelemente
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inovan Stroebe KG, Inovan GmbH and Co KG Metalle und Bauelemente filed Critical Inovan Stroebe KG
Priority to EP87110116A priority Critical patent/EP0299099B1/fr
Priority to AT87110116T priority patent/ATE60163T1/de
Priority to DE8787110116T priority patent/DE3767487D1/de
Publication of EP0299099A1 publication Critical patent/EP0299099A1/fr
Application granted granted Critical
Publication of EP0299099B1 publication Critical patent/EP0299099B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer

Definitions

  • the invention relates to a method for applying a solderable or weldable layer either made of silver, silver-copper and other silver alloys or of copper, copper-nickel or other copper alloys, on the back (bottom) of a silver / MeO contact plate with Me components , preferably made of cadmium, tin, zinc, copper, bismuth, molybdenum, tungsten or indium, in which the MeO particles are fibrous (skewered) and with their fiber longitudinal direction are approximately perpendicular to the contact surface.
  • Modern electrical switching devices are characterized by a small design, high functional reliability and a long service life. These features depend in large part on the design of the electrical contacts, in particular special from the choice of the contact material.
  • a material made of a silver alloy with metal oxide components has proven to be optimal in recent years.
  • a particularly noteworthy group is a silver-cadmium oxide alloy.
  • Such contact material can be produced in various ways.
  • a silver base metal alloy can thus be oxidized through, or oxidized silver / base metal particles can also be joined together by pressing, sintering and, if necessary, re-stamping.
  • a targeted termination of the oxidation process can ensure that the underside of the silver / base metal sheet or a corresponding block remains free of metal oxide components, so that this underside can be soldered or welded without difficulty.
  • the underside has to be machined so that the contact made of this material can be soldered or welded.
  • the oxides are also deformed in the longitudinal direction during the forming process and / or broken down into smaller particles. It has been shown that the properties of these silver / metal oxide materials depend on the orientation of the metal oxide fibers to the contact surface.
  • the contact plates required for switching devices in energy technology are separated from the semi-finished product in such a way that the fiber direction of the oxides is either parallel or perpendicular to the subsequent contact surface. It is known from numerous studies that the switching properties of the contact plates, in particular the material burn-off, when the fibers are arranged perpendicular to the button, are considerably more favorable than with parallel alignment. The greater the fiber structure of the oxides, the greater this effect. This influence of anisotropy was observed to an increased extent, in particular also on contact materials which were produced in a reaction spray process, for example according to DE-PS 29 29 630. In the case of contacts produced in this way, in an economical manner, it is therefore expedient, in order to achieve reduced contact material erosion or silver savings, to produce contact plates with an oxide fiber direction oriented perpendicular to the button.
  • the object of the invention is to provide contact plates made of silver / MeO material with a fiber direction of the metal oxides lying approximately perpendicular to the contact surface with a solderable and weldable underside.
  • This underside which can be soldered and welded, should not only allow good adhesion to be established with the contact carrier, which is made of copper or a copper alloy, but should also be inexpensive to implement.
  • the layer is applied as a film or powder by hot press cladding by hot press welding in an inert gas or reducing atmosphere.
  • the layer is also hot-plated on the contact plate, but not, as is known, by the usual hot roll cladding with a high degree of deformation, but by hot-pressure welding, that is practically without reshaping the layer to be plated.
  • hot-pressure welding that is practically without reshaping the layer to be plated.
  • the hot press plating according to the invention should take place under an inert gas or, better still, under a reducing atmosphere.
  • This not only avoids oxidation of the connection surfaces with certainty, but also ensures that during the warming up of the parts, an at least superficial reduction takes place, the metal oxide particles on the surface of the connection point are thus converted to metals. Since the silver-metal oxide materials are more or less brittle at room temperature, a close approximation of the atoms in the platelet surface and plating layer is only guaranteed when they are warm and under pressure.
  • the metallic connection is improved by diffusion and healing processes.
  • the pressing temperature is expedient, depending on the alloy composition of the layer material used, between 500 ° C. and 900 ° C.
  • the surrounding atmosphere has proven itself to be hydrogen gas, nitrogen or a mixture of these gases, which not only achieve good results, but also are inexpensive.
  • the level of the required pressure is advantageously between 2000 and 8000 bar. It depends on the level of the selected pressing temperature, the material combination of the layer structure and the type and geometry of the press punch and die.
  • pre-press-post-press very good joining properties arise when the plating is carried out in two stages (pre-press-post-press). This may be due to the fact that all gas inclusions impairing the connection are pressed out of the connection zone during the pre-pressing. If, according to a further feature of the invention, a pressing tool with a stamp is used during the pre-pressing, the working side of which is convex, then even if only a small amount of shaping work is done, which may also benefit the connection. In addition, a uniform layer thickness of the applied solderable and weldable layer can also be achieved during repressing.
  • a contact plate is inserted into a press die (1, 11), the MeO particles of which run in a fibrous form and, as indicated by dashed lines, are perpendicular to the contact surface.
  • a foil (or metal powder) (2) made of solderable or weldable material is placed on it and is to be connected to the contact plate (3). Since the connection is to be made by hot pressure welding, the press die (1, 11) is made of high-temperature steel, graphite or ceramic.
  • a stamp (4) or a pair of stamps (14) presses the foil (or the metal powder) (2) onto the contact plate (3) and thus provides the Connection between these two parts.
  • the pressing or plating takes place under an inert gas atmosphere or a reducing atmosphere.
  • the hot press cladding or hot press welding should take place in two stages, pre-pressing and post-pressing.
  • a stamp (24) FIG. 3a
  • a convex working surface (5) is expediently used, so that a component results after the pre-pressing, as shown in FIG. 3c.
  • the layer thickness of the cladding is then somewhat thinner in the middle of the plate than at the edge. As a result, a reduction in the layer thickness at the edge of the platelet, as is frequently observed as a result of burr formation in the case of single-stage pressing, can be avoided in the subsequent step.
  • re-pressing Fig.
  • the layer is brought back into the desired shape with the usual embossing die (4), so that a contact plate (13) (Fig.) Provided with a solderable and weldable layer (12) is then 3f) with a uniform plating layer thickness.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
EP87110116A 1987-07-14 1987-07-14 Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable Expired - Lifetime EP0299099B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP87110116A EP0299099B1 (fr) 1987-07-14 1987-07-14 Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable
AT87110116T ATE60163T1 (de) 1987-07-14 1987-07-14 Verfahren zum herstellen von silber/me0kontaktpl|ttchen mit loet- oder schweissfaehiger unterseite.
DE8787110116T DE3767487D1 (de) 1987-07-14 1987-07-14 Verfahren zum herstellen von silber/me0-kontaktplaettchen mit loet- oder schweissfaehiger unterseite.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP87110116A EP0299099B1 (fr) 1987-07-14 1987-07-14 Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable

Publications (2)

Publication Number Publication Date
EP0299099A1 true EP0299099A1 (fr) 1989-01-18
EP0299099B1 EP0299099B1 (fr) 1991-01-16

Family

ID=8197126

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87110116A Expired - Lifetime EP0299099B1 (fr) 1987-07-14 1987-07-14 Procédé de fabrication de plaquettes de contact d'argent et oxydes de métal à couche soudable ou brasable

Country Status (3)

Country Link
EP (1) EP0299099B1 (fr)
AT (1) ATE60163T1 (fr)
DE (1) DE3767487D1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011550A1 (fr) * 1991-12-04 1993-06-10 Siemens Aktiengesellschaft Contact avec un revetement de contact en argent et procede pour sa fabrication
WO1995008833A1 (fr) * 1993-09-20 1995-03-30 Siemens Aktiengesellschaft Procede permettant de fixer un revetement de contact en argent-oxyde metallique sur un support de contact metallique, et revetement de contact correspondant
EP1387370A1 (fr) * 2002-08-03 2004-02-04 INOVAN GmbH & Co. KG Metalle und Bauelemente Demi-produit en forme de bande
WO2010051922A3 (fr) * 2008-11-06 2010-07-01 Ami Doduco Gmbh Procédé pour produire un demi-produit, demi-produit pour contacts électriques, et pièce de contact
EP2946395A1 (fr) * 2013-01-16 2015-11-25 Tyco Electronics Austria GmbH Élément de contact, relais comprenant un élément de contact et procédé pour fabriquer un élément de contact

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1550507A (fr) * 1966-12-09 1968-12-20
DE2436927A1 (de) * 1974-07-31 1976-02-19 Siemens Ag Verfahren und vorrichtung zum pulvermetallurgischen herstellen von formteilen fuer elektrische kontaktstuecke
DE2625846A1 (de) * 1976-06-09 1977-12-22 Siemens Ag Halbzeug zur kontaktherstellung
EP0022980A1 (fr) * 1979-07-21 1981-01-28 DORNIER SYSTEM GmbH Procédé pour la fabrication de poudre d'argent

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1550507A (fr) * 1966-12-09 1968-12-20
DE2436927A1 (de) * 1974-07-31 1976-02-19 Siemens Ag Verfahren und vorrichtung zum pulvermetallurgischen herstellen von formteilen fuer elektrische kontaktstuecke
DE2625846A1 (de) * 1976-06-09 1977-12-22 Siemens Ag Halbzeug zur kontaktherstellung
EP0022980A1 (fr) * 1979-07-21 1981-01-28 DORNIER SYSTEM GmbH Procédé pour la fabrication de poudre d'argent

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011550A1 (fr) * 1991-12-04 1993-06-10 Siemens Aktiengesellschaft Contact avec un revetement de contact en argent et procede pour sa fabrication
US5598629A (en) * 1991-12-04 1997-02-04 Siemens Aktiengesellschaft Process for making contact with a silver contact base
US5799771A (en) * 1991-12-04 1998-09-01 Siemens Aktiengesellschaft Contact with a silver contact base and process for making the same
WO1995008833A1 (fr) * 1993-09-20 1995-03-30 Siemens Aktiengesellschaft Procede permettant de fixer un revetement de contact en argent-oxyde metallique sur un support de contact metallique, et revetement de contact correspondant
CN1047462C (zh) * 1993-09-20 1999-12-15 西门子公司 接触层与金属接触衬底连接的方法,及有关的接触层
EP1387370A1 (fr) * 2002-08-03 2004-02-04 INOVAN GmbH & Co. KG Metalle und Bauelemente Demi-produit en forme de bande
WO2010051922A3 (fr) * 2008-11-06 2010-07-01 Ami Doduco Gmbh Procédé pour produire un demi-produit, demi-produit pour contacts électriques, et pièce de contact
RU2497632C2 (ru) * 2008-11-06 2013-11-10 Додуко Гмбх Способ изготовления полуфабриката детали для электрических контактов, полуфабрикат детали и деталь электрического контакта
US8992826B2 (en) 2008-11-06 2015-03-31 Doduco Gmbh Method for producing a semifinished product and semifinished product for electrical contacts and contact piece
EP2946395A1 (fr) * 2013-01-16 2015-11-25 Tyco Electronics Austria GmbH Élément de contact, relais comprenant un élément de contact et procédé pour fabriquer un élément de contact

Also Published As

Publication number Publication date
ATE60163T1 (de) 1991-02-15
EP0299099B1 (fr) 1991-01-16
DE3767487D1 (de) 1991-02-21

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