EP0295446A3 - Méthode de fabrication d'un contact électrique - Google Patents
Méthode de fabrication d'un contact électrique Download PDFInfo
- Publication number
- EP0295446A3 EP0295446A3 EP88107979A EP88107979A EP0295446A3 EP 0295446 A3 EP0295446 A3 EP 0295446A3 EP 88107979 A EP88107979 A EP 88107979A EP 88107979 A EP88107979 A EP 88107979A EP 0295446 A3 EP0295446 A3 EP 0295446A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical contact
- production
- pressed
- traces
- contacted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
- H01C10/30—Adjustable resistors the contact sliding along resistive element
- H01C10/32—Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873717306 DE3717306A1 (de) | 1987-05-22 | 1987-05-22 | Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte |
DE3717306 | 1987-05-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0295446A2 EP0295446A2 (fr) | 1988-12-21 |
EP0295446A3 true EP0295446A3 (fr) | 1990-06-13 |
Family
ID=6328187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP88107979A Ceased EP0295446A3 (fr) | 1987-05-22 | 1988-05-18 | Méthode de fabrication d'un contact électrique |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0295446A3 (fr) |
DE (1) | DE3717306A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3731328C1 (de) * | 1987-09-17 | 1989-01-12 | Ruf Kg Wilhelm | Potentiometer und Verfahren zu dessen Herstellung |
DE4012077A1 (de) * | 1990-04-14 | 1991-10-17 | Philips Patentverwaltung | Flexible leiterplatte |
DE10141222A1 (de) * | 2001-08-23 | 2003-03-13 | Hella Kg Hueck & Co | Verfahren zur Herstellung einer Verbindungsanordnung sowie nach diesem Verfahren hergestellte Verbindungsanordnung |
DE10141218B4 (de) * | 2001-08-23 | 2021-04-29 | HELLA GmbH & Co. KGaA | Verfahren zur Herstellung einer Verbindungsanordnung sowie nach diesem Verfahren hergestellte Verbindungsanordnung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2441209A1 (de) * | 1974-08-28 | 1976-03-11 | Erie Elektronik Gmbh | Elektrische anschlusskontaktierung |
GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
EP0152851A2 (fr) * | 1984-02-17 | 1985-08-28 | Wärme- Und Elektrotechnik B. Ruthenberg Gmbh | Procédé pour fabriquer une enveloppe isolante autour de la zone de transition entre des câbles plats multiconducteurs et des rangées de fiches ou broches de contact connectées auxdits conducteurs ainsi que câble plat multiconducteur muni d'un tel enveloppe isolante |
DE3442951A1 (de) * | 1984-11-24 | 1986-05-28 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektrische schaltungsplatte mit flaechenhaften leitungszuegen, die aus einem isolierenden material besteht |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3374400A (en) * | 1964-09-02 | 1968-03-19 | Fujitsu Ltd | Compound electronic unit |
US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
US3501582A (en) * | 1968-04-18 | 1970-03-17 | Burroughs Corp | Electrical assembly |
FR2076686A5 (fr) * | 1970-01-23 | 1971-10-15 | Sovcor Electronique | |
US3729573A (en) * | 1971-01-25 | 1973-04-24 | Motorola Inc | Plastic encapsulation of semiconductor devices |
US3774232A (en) * | 1971-11-11 | 1973-11-20 | Circuit Stik Inc | Package for integrated circuit chip |
DE2316058B2 (de) * | 1973-03-30 | 1975-06-12 | Ernst Roederstein Spezialfabrik Fuer Kondensatoren Gmbh, 8300 Landshut | Dickschichtschaltung |
AU2743477A (en) * | 1976-08-26 | 1979-03-08 | Motorola, Inc | Molded printed circuit board |
US4479106A (en) * | 1982-02-12 | 1984-10-23 | Alps Electric Co., Ltd. | Rotary electric component |
DE8600928U1 (de) * | 1986-01-16 | 1987-06-11 | Philips Patentverwaltung GmbH, 22335 Hamburg | Montageplatte bzw. aus Montageplatten gebildetes Montagegestell |
-
1987
- 1987-05-22 DE DE19873717306 patent/DE3717306A1/de active Granted
-
1988
- 1988-05-18 EP EP88107979A patent/EP0295446A3/fr not_active Ceased
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2441209A1 (de) * | 1974-08-28 | 1976-03-11 | Erie Elektronik Gmbh | Elektrische anschlusskontaktierung |
GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
EP0152851A2 (fr) * | 1984-02-17 | 1985-08-28 | Wärme- Und Elektrotechnik B. Ruthenberg Gmbh | Procédé pour fabriquer une enveloppe isolante autour de la zone de transition entre des câbles plats multiconducteurs et des rangées de fiches ou broches de contact connectées auxdits conducteurs ainsi que câble plat multiconducteur muni d'un tel enveloppe isolante |
DE3442951A1 (de) * | 1984-11-24 | 1986-05-28 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektrische schaltungsplatte mit flaechenhaften leitungszuegen, die aus einem isolierenden material besteht |
Also Published As
Publication number | Publication date |
---|---|
DE3717306C2 (fr) | 1989-05-24 |
EP0295446A2 (fr) | 1988-12-21 |
DE3717306A1 (de) | 1988-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB IT |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB IT |
|
17P | Request for examination filed |
Effective date: 19901212 |
|
17Q | First examination report despatched |
Effective date: 19920701 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 19940210 |