EP0252295A3 - Solutions de décapage du cuivre - Google Patents

Solutions de décapage du cuivre Download PDF

Info

Publication number
EP0252295A3
EP0252295A3 EP87108025A EP87108025A EP0252295A3 EP 0252295 A3 EP0252295 A3 EP 0252295A3 EP 87108025 A EP87108025 A EP 87108025A EP 87108025 A EP87108025 A EP 87108025A EP 0252295 A3 EP0252295 A3 EP 0252295A3
Authority
EP
European Patent Office
Prior art keywords
copper
etching solutions
circuit boards
etching
chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87108025A
Other languages
German (de)
English (en)
Other versions
EP0252295A2 (fr
Inventor
Michael Backus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of EP0252295A2 publication Critical patent/EP0252295A2/fr
Publication of EP0252295A3 publication Critical patent/EP0252295A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
EP87108025A 1986-07-09 1987-06-03 Solutions de décapage du cuivre Withdrawn EP0252295A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863623504 DE3623504A1 (de) 1986-07-09 1986-07-09 Kupferaetzloesungen
DE3623504 1986-07-09

Publications (2)

Publication Number Publication Date
EP0252295A2 EP0252295A2 (fr) 1988-01-13
EP0252295A3 true EP0252295A3 (fr) 1989-03-15

Family

ID=6305009

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87108025A Withdrawn EP0252295A3 (fr) 1986-07-09 1987-06-03 Solutions de décapage du cuivre

Country Status (4)

Country Link
US (1) US4849124A (fr)
EP (1) EP0252295A3 (fr)
JP (1) JPS6326385A (fr)
DE (1) DE3623504A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885128A (en) * 1985-07-30 1989-12-05 Janez Megusar Method for improving performance of irradiated structural materials
FR2621052A1 (fr) * 1987-09-25 1989-03-31 Solvay Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP3974305B2 (ja) * 1999-06-18 2007-09-12 エルジー フィリップス エルシーディー カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
US6841084B2 (en) * 2002-02-11 2005-01-11 Nikko Materials Usa, Inc. Etching solution for forming an embedded resistor
PT1572829E (pt) * 2002-11-29 2012-01-11 Du Pont Refrigerantes para refrigeração
US20050026799A1 (en) * 2003-07-15 2005-02-03 Marvin Detar Water-based paint stripper
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
US7357879B2 (en) * 2004-03-03 2008-04-15 Ibiden Co., Ltd. Etching solution, method of etching and printed wiring board
US7541275B2 (en) * 2004-04-21 2009-06-02 Texas Instruments Incorporated Method for manufacturing an interconnect
JP4631394B2 (ja) * 2004-10-29 2011-02-16 日立化成工業株式会社 金属のエッチング液及び及びプリント配線板の製造方法
US8303832B2 (en) * 2009-08-17 2012-11-06 Palo Alto Research Center Incorporated Solid inks for masks for printed circuit boards and other electronic devices
US8211617B2 (en) 2009-08-17 2012-07-03 Palo Alto Research Center Incorporated Solid inks for printed masks
CN111542648A (zh) * 2018-01-05 2020-08-14 株式会社Adeka 组合物和蚀刻方法
US11678433B2 (en) 2018-09-06 2023-06-13 D-Wave Systems Inc. Printed circuit board assembly for edge-coupling to an integrated circuit
US11647590B2 (en) 2019-06-18 2023-05-09 D-Wave Systems Inc. Systems and methods for etching of metals
US12033996B2 (en) 2019-09-23 2024-07-09 1372934 B.C. Ltd. Systems and methods for assembling processor systems

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1232984B (de) * 1961-08-04 1967-01-26 Fmc Corp AEtzmittel und Verfahren zum AEtzen von Kupfertiefdruckformen
US3756957A (en) * 1971-03-15 1973-09-04 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metallic materials
FR2251631A1 (fr) * 1973-11-19 1975-06-13 Tokai Electro Chemical Co
DE2557269A1 (de) * 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
DE2739494A1 (de) * 1977-08-30 1979-03-08 Kolbe & Co Hans Verfahren zum herstellen von elektrischen leiterplatten und basismaterial fuer solche
DE2942504A1 (de) * 1979-10-20 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Aetzloesung zum aetzen von kupfer
GB2131454A (en) * 1982-12-07 1984-06-20 Jury Ivanovich Naumov Process for regeneration of iron-copper chloride etching solution

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2908557A (en) * 1957-01-07 1959-10-13 Rca Corp Method of etching copper
US3650957A (en) * 1970-07-24 1972-03-21 Shipley Co Etchant for cupreous metals
JPS5221460B1 (fr) * 1971-04-26 1977-06-10
US4110237A (en) * 1973-11-19 1978-08-29 Tokai Denka Kabushiki Kaisha Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
US3926699A (en) * 1974-06-17 1975-12-16 Rbp Chemical Corp Method of preparing printed circuit boards with terminal tabs
JPS5871628A (ja) * 1981-10-23 1983-04-28 Fujitsu Ltd 半導体装置の製造方法
CA1196560A (fr) * 1981-11-24 1985-11-12 Gerardus A. Somers Agent et methode de demetallisation
JPS58197277A (ja) * 1982-05-08 1983-11-16 Mitsubishi Gas Chem Co Inc 金属の化学的溶解処理液
US4443295A (en) * 1983-06-13 1984-04-17 Fairchild Camera & Instrument Corp. Method of etching refractory metal film on semiconductor structures utilizing triethylamine and H2 O2

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1232984B (de) * 1961-08-04 1967-01-26 Fmc Corp AEtzmittel und Verfahren zum AEtzen von Kupfertiefdruckformen
US3756957A (en) * 1971-03-15 1973-09-04 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metallic materials
FR2251631A1 (fr) * 1973-11-19 1975-06-13 Tokai Electro Chemical Co
DE2557269A1 (de) * 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
DE2739494A1 (de) * 1977-08-30 1979-03-08 Kolbe & Co Hans Verfahren zum herstellen von elektrischen leiterplatten und basismaterial fuer solche
DE2942504A1 (de) * 1979-10-20 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Aetzloesung zum aetzen von kupfer
GB2131454A (en) * 1982-12-07 1984-06-20 Jury Ivanovich Naumov Process for regeneration of iron-copper chloride etching solution

Also Published As

Publication number Publication date
DE3623504A1 (de) 1988-01-21
JPS6326385A (ja) 1988-02-03
EP0252295A2 (fr) 1988-01-13
US4849124A (en) 1989-07-18

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Effective date: 19910926

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Inventor name: BACKUS, MICHAEL