EP0190820A3 - Metalldünnschichtleitersystem aus Zirkon - Google Patents

Metalldünnschichtleitersystem aus Zirkon Download PDF

Info

Publication number
EP0190820A3
EP0190820A3 EP86300113A EP86300113A EP0190820A3 EP 0190820 A3 EP0190820 A3 EP 0190820A3 EP 86300113 A EP86300113 A EP 86300113A EP 86300113 A EP86300113 A EP 86300113A EP 0190820 A3 EP0190820 A3 EP 0190820A3
Authority
EP
European Patent Office
Prior art keywords
zirconium
layer
metal conductor
film metal
conductor systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP86300113A
Other languages
English (en)
French (fr)
Other versions
EP0190820A2 (de
Inventor
Earl R. Helderman
Robert E. Holmes
Robert R. Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of EP0190820A2 publication Critical patent/EP0190820A2/de
Publication of EP0190820A3 publication Critical patent/EP0190820A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
EP86300113A 1985-02-01 1986-01-09 Metalldünnschichtleitersystem aus Zirkon Withdrawn EP0190820A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/697,099 US4847445A (en) 1985-02-01 1985-02-01 Zirconium thin-film metal conductor systems
US697099 1985-02-01

Publications (2)

Publication Number Publication Date
EP0190820A2 EP0190820A2 (de) 1986-08-13
EP0190820A3 true EP0190820A3 (de) 1988-08-10

Family

ID=24799788

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86300113A Withdrawn EP0190820A3 (de) 1985-02-01 1986-01-09 Metalldünnschichtleitersystem aus Zirkon

Country Status (3)

Country Link
US (1) US4847445A (de)
EP (1) EP0190820A3 (de)
JP (1) JPS61185951A (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751349A (en) * 1986-10-16 1988-06-14 International Business Machines Corporation Zirconium as an adhesion material in a multi-layer metallic structure
JPH0383398A (ja) * 1989-08-26 1991-04-09 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
US5098860A (en) * 1990-05-07 1992-03-24 The Boeing Company Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers
US5126283A (en) * 1990-05-21 1992-06-30 Motorola, Inc. Process for the selective encapsulation of an electrically conductive structure in a semiconductor device
US5641579A (en) * 1993-02-05 1997-06-24 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating
US5639564A (en) * 1993-02-05 1997-06-17 Baldwin Hardware Corporation Multi-layer coated article
US5626972A (en) * 1994-06-02 1997-05-06 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5478660A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5482788A (en) * 1994-11-30 1996-01-09 Baldwin Hardware Corporation Article having a protective coating simulating brass
US5484663A (en) * 1994-11-30 1996-01-16 Baldwin Hardware Corporation Article having a coating simulating brass
US5478659A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5552233A (en) * 1995-05-22 1996-09-03 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5654108A (en) * 1995-05-22 1997-08-05 Baldwin Hardware Corporation Article having a protective coating simulating brass
CA2176892C (en) * 1995-05-22 2002-10-29 Stephen R. Moysan, Iii Article having a decorative and protective coating simulating brass
US5667904A (en) * 1995-05-22 1997-09-16 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5693427A (en) * 1995-12-22 1997-12-02 Baldwin Hardware Corporation Article with protective coating thereon
US5783313A (en) * 1995-12-22 1998-07-21 Baldwin Hardware Corporation Coated Article
US5985468A (en) * 1997-04-30 1999-11-16 Masco Corporation Article having a multilayer protective and decorative coating
US6106958A (en) * 1997-04-30 2000-08-22 Masco Corporation Article having a coating
US5952111A (en) * 1997-04-30 1999-09-14 Masco Corporation Article having a coating thereon
US5948548A (en) * 1997-04-30 1999-09-07 Masco Corporation Coated article
US5989730A (en) * 1997-04-30 1999-11-23 Masco Corporation Article having a decorative and protective multi-layer coating
US6033790A (en) * 1997-04-30 2000-03-07 Masco Corporation Article having a coating
US6004684A (en) * 1997-04-30 1999-12-21 Masco Corporation Article having a protective and decorative multilayer coating
US5879532A (en) * 1997-07-09 1999-03-09 Masco Corporation Of Indiana Process for applying protective and decorative coating on an article
US6268060B1 (en) 1997-08-01 2001-07-31 Mascotech Coatings, Inc. Chrome coating having a silicone top layer thereon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
FR2041392A5 (de) * 1969-04-23 1971-01-29 Cii
JPS6032343A (ja) * 1983-08-02 1985-02-19 Toshiba Corp パワ−半導体モジユ−ル基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3647585A (en) * 1969-05-23 1972-03-07 Bell Telephone Labor Inc Method of eliminating pinhole shorts in an air-isolated crossover
FR2159848A5 (de) * 1971-11-05 1973-06-22 Bosch
US3860450A (en) * 1972-05-05 1975-01-14 California Inst Of Techn Method of forming magnetite thin film
DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
US4385966A (en) * 1980-10-07 1983-05-31 Bell Telephone Laboratories, Incorporated Fabrication of thin film resistors and capacitors
US4751349A (en) * 1986-10-16 1988-06-14 International Business Machines Corporation Zirconium as an adhesion material in a multi-layer metallic structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
FR2041392A5 (de) * 1969-04-23 1971-01-29 Cii
JPS6032343A (ja) * 1983-08-02 1985-02-19 Toshiba Corp パワ−半導体モジユ−ル基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 9, no. 150 (E-324)[1873], 25th June 1985; & JP-A-60 032 343 (TOSHIBA K.K.), 19-02-1985 *

Also Published As

Publication number Publication date
JPS61185951A (ja) 1986-08-19
US4847445A (en) 1989-07-11
EP0190820A2 (de) 1986-08-13

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Effective date: 19890211

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Inventor name: HOLMES, ROBERT E.

Inventor name: HELDERMAN, EARL R.

Inventor name: ZIMMERMAN, ROBERT R.