EP0189781A1 - Method for making a flat coil, and a flat coil for a shock wave tube - Google Patents

Method for making a flat coil, and a flat coil for a shock wave tube Download PDF

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Publication number
EP0189781A1
EP0189781A1 EP86100419A EP86100419A EP0189781A1 EP 0189781 A1 EP0189781 A1 EP 0189781A1 EP 86100419 A EP86100419 A EP 86100419A EP 86100419 A EP86100419 A EP 86100419A EP 0189781 A1 EP0189781 A1 EP 0189781A1
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Prior art keywords
flat coil
spiral
layer
carrier
shock wave
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EP86100419A
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German (de)
French (fr)
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EP0189781B1 (en
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Georg Naser
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Siemens AG
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Siemens AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

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  • the invention relates to a method for producing a spiral flat coil for a shock wave tube and a spiral flat coil for the shock wave tube. It also relates to a flat coil for a shock wave tube for crushing concrements in a patient, for example kidney stones.
  • DE-OS 33 12 014 Shock wave tubes of this type have been known for a long time ("Akustician Beihefte", 1962, Issue 1, pages 185-202). According to recent investigations, e.g. specified in DE-OS 33 12 014, used in medical technology for crushing concrements in the body of a patient.
  • DE-OS 33 12 014 describes a shock wave tube for this purpose. Due to the high pressure pulse of approx. 100 bar, the materials of such a shock wave tube are subjected to high stresses with every shock wave emission. The discharge coil and the membrane are particularly exposed to high mechanical forces.
  • a spherical cap-shaped coil is provided, the spherical cap shape z. B. by subsequent processing, such as turning out a flat coil. This procedure is very expensive and requires sophisticated processing tools.
  • the object of the invention is to design a method of the type mentioned in the introduction in such a way that a flat coil with any spiral shape can be produced with simple means.
  • a mask in the form of a spiral is photographically transferred to a printed circuit board with a carrier layer, with an electrically conductive layer above and with a light-sensitive top layer, in that the top layer is developed, in that the gaps between the spiral passages of the transferred mask are etched away from the electrically conductive layer, that the spiral passages remaining on the electrically conductive layer are galvanically reinforced, and that the printed circuit board is then glued onto a flat coil carrier.
  • a flat coil produced by the method is characterized according to the invention in that it is composed of a) a carrier layer, b) a spiral made of copper attached to the carrier layer and c) a disk provided as a flat coil carrier made of a reverberant and electrically non-conductive material, whereby the disc is glued to the spiral and / or the carrier layer.
  • the advantage of the method is that coils with any spiral shape can be easily produced. No complex mechanical processing tools such as a lathe or milling machine are required for this.
  • a particularly advantageous embodiment of the method is that the circuit board is glued to the flat coil carrier with its surface carrying the spiral.
  • this measure ensures that the non-conductive part of the circuit board simultaneously serves as an insulating film between the coil and a membrane in front of it.
  • the assembly of the essential components of the shock wave tube, namely flat coil, insulating foil and membrane, is thereby considerably simplified.
  • FIG. 1 denotes a shock wave tube in general, the essential components of which consist of a flat coil carrier 3 with associated spiral coil 4 (shown in FIGS. 3 and 4), an insulating film 5 and a membrane 7. Holding means for the coil 4, the insulating film 5 and the membrane 7 are not shown.
  • a high-voltage pulse of short duration is applied to the flat coil 4 in order to trigger a shock wave. Due to the electromagnetic interaction of the coil 4 with the membrane 7, the membrane 7 is knocked away from the coil 4; it creates the shock wave.
  • the coil 4 must have a defined shape for the shock wave tube 1 to function properly and to produce a certain desired wave shape.
  • the surface of the coil 4 can, for. B. be flat if the generation of a flat shock wave is desired, or concave catotte-shaped if the shock wave generated with it should focus on a point. In addition to the defined shape of the coil 4, it is of great importance that the insulation between the coil turns is flawless, e.g. B. without air pockets.
  • the voltage pulses that act on the coil 4 are in the order of magnitude between 10 and 30 kV.
  • a round ceramic disk is assumed. This disc has, for example, a thickness of 40 mm with a diameter of 155 mm.
  • smaller slices e.g. 60 mm diameter with a thickness of 15 mm.
  • a printed circuit board 9 is another starting material. It is provided for the production of the actual coil 4.
  • the printed circuit board 9 consists of an electrically non-conductive carrier layer 11, which preferably consists of polyimide. This polyimide film can have a thickness of approx. 200 ⁇ m.
  • One side of the carrier layer 11 is provided with a thin layer 13 made of an electrically conductive substance, in particular a copper layer approximately 7 ⁇ m thick.
  • a light-sensitive top layer 15 is in turn applied to the copper layer 13.
  • FIG. 2 shows the flat coil carrier 3 and the printed circuit board 9 processed after a first and second method step.
  • a mask - (not shown) in which - depending on the type of photosensitive upper layer 15 - the Spirafform in positive or Negative representation is contained, by subsequent exposure of the parts of the light-sensitive layer 15 not covered by the mask, by development and etching of the spaces between the spiral passages 13a, the printed circuit board 9 shown in FIG. 2 results. It consists of the carrier layer 11 and parts of the original one Copper layer 13. The spiral paths 13a now form a flat coil 4 with a spiral course of the turns.
  • the spiral copper layer 13 is shown, after the latter has been galvanized to a total thickness of approximately 7 ⁇ m. B. was amplified about 150 microns.
  • the spiral produced in this way with the spiral ducts 13a is suitable for withstanding the high voltage and current surge during the generation of shock waves if the individual spiral ducts 13a are at a sufficient distance from one another.
  • FIG. 4 shows the finished arrangement of flat coil carrier 3 and integrated coil 4.
  • the spaces between the spiral copper layer 13a have now been filled with a synthetic resin 17.
  • the coil 4 is glued to the end of the flat coil carrier 3.
  • the entire end face of the flat coil carrier 3 can also be coated with synthetic resin in one operation.
  • the printed circuit board 4 may be also bonded in principle with both the support layer 11 as the layer 1 3 against the flat coil support. 3
  • the advantage of the second embodiment is that the carrier layer 11 can simultaneously serve as an insulating film 5 in order to electrically isolate the coil 4 from the membrane 7.
  • Aluminum oxide ceramics are preferably used as materials for the flat coil carrier 3, but good results have also been achieved with filled and unfilled epoxy resin.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Surgical Instruments (AREA)

Abstract

1. Process for producing a spiral-shaped flat coil (4) for a shock wave tube, characterized in that a mask in the form of a spiral is photographically transmitted on to a printed circuit board (9) having a supporting layer (11), with an electroconductive layer (13) lying thereabove and a light-sensitive top layer (15), in that the top layer (15) is developed, in that the spaces between the spiral courses (13a) of the transmitted mask are etched from the electro-conductive layer (13), in that the remaining spiral courses (13a) of the electroconductive layer (13) are galvanically strengthened, and in that subsequently the printed circuit board (9) is affixed on to a flat coil support (3).

Description

Die Erfindung betrifft ein Verfahren zur Herstellung einer spiralförmigen Flachspule für ein Stoßwellenrohr und eine spiralförmige Flachspule für das Stoßwellenrohr. Sie bezieht sich auch auf eine Flachspule für ein Stoßwellenrohr zum Zertrümmern von Konkrementen in einem Patienten, beispielsweise von Nierensteinen.The invention relates to a method for producing a spiral flat coil for a shock wave tube and a spiral flat coil for the shock wave tube. It also relates to a flat coil for a shock wave tube for crushing concrements in a patient, for example kidney stones.

Stoßwellenrohre dieser Art sind an sich seit längerer Zeit bekannt ("Akustische Beihefte", 1962, Heft 1, Seiten 185 - 202). Sie können nach neueren Untersuchungen, wie z.B. in der DE-OS 33 12 014 angegeben, in der Medizintechnik zur Zertrümmerung von Konkrementen im Körper eines Patienten eingesetzt werden. In der DE-OS 33 12 014 ist ein Stoßwellenrohr für diesen Zweck beschrieben. Aufgrund des hohen abgegebenen Druckimpulses von ca. 100 bar werden die Materialien eines solchen Stoßwellenrohrs bei jeder Stoßwellenemission hoch beansprucht Besonders die Entladungsspule und die Membran werden hohen mechanischen Kräften ausgesetzt. Beim Gegenstand der DE-OS 33 12 014 ist eine kugelkalottenförmige Spule vorgesehen, deren Kugelkalottenform z. B. durch nachträgliche Bearbeitung, wie Ausdrehen einer Flachspule, zustandekommt. Diese Vorgehensweise ist recht materialaufwendig und benötigt anspruchsvolle Bearbeitungswerkzeuge.Shock wave tubes of this type have been known for a long time ("Akustische Beihefte", 1962, Issue 1, pages 185-202). According to recent investigations, e.g. specified in DE-OS 33 12 014, used in medical technology for crushing concrements in the body of a patient. DE-OS 33 12 014 describes a shock wave tube for this purpose. Due to the high pressure pulse of approx. 100 bar, the materials of such a shock wave tube are subjected to high stresses with every shock wave emission. The discharge coil and the membrane are particularly exposed to high mechanical forces. In the subject of DE-OS 33 12 014 a spherical cap-shaped coil is provided, the spherical cap shape z. B. by subsequent processing, such as turning out a flat coil. This procedure is very expensive and requires sophisticated processing tools.

Aufgabe der Erfindung ist es, ein Verfahren der eingangs genannten Art so auszugestalten, daß eine Flachspulen mit beliebiger Spiralenform mit einfachen Mitteln hergestellt werden kann.The object of the invention is to design a method of the type mentioned in the introduction in such a way that a flat coil with any spiral shape can be produced with simple means.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß eine Maske in SpiraJenform fotografisch auf eine Leiterplatte mit einer Trägerschicht, mit einer darüber liegenden elektrisch leitfähigen Schicht und mit einer lichtempfindlichen Oberschicht übertragen wird, daß die Oberschicht entwickelt wird, daß die Zwischenräume zwischen den Spiralgängen der übertragenen Maske von der elektrisch leitfähigen Schicht abgeätzt werden, daß die auf der elektrisch leitfähigen Schicht verbleibenden Spiralgänge galvanisch verstärkt werden, und daß anschließend die Leiterplatte auf einen Flachspulenträger aufgeklebt wird.This object is achieved according to the invention in that a mask in the form of a spiral is photographically transferred to a printed circuit board with a carrier layer, with an electrically conductive layer above and with a light-sensitive top layer, in that the top layer is developed, in that the gaps between the spiral passages of the transferred mask are etched away from the electrically conductive layer, that the spiral passages remaining on the electrically conductive layer are galvanically reinforced, and that the printed circuit board is then glued onto a flat coil carrier.

Eine nach dem Verfahren hergestellte Flachspule zeichnet sich erfindungsgemäß dadurch aus, daß sie zusammengesetzt ist aus a) einer Trägerschicht, b) einer auf der Trägerschicht befestigten Spirale aus Kupfer und c) einer als Flachspulenträger vorgesehenen Scheibe aus einem schallharten und elektrisch nicht leitenden Material, wobei die Scheibe mit der Spirale und/oder der Trägerschicht verklebt ist.A flat coil produced by the method is characterized according to the invention in that it is composed of a) a carrier layer, b) a spiral made of copper attached to the carrier layer and c) a disk provided as a flat coil carrier made of a reverberant and electrically non-conductive material, whereby the disc is glued to the spiral and / or the carrier layer.

Vorteil des Verfahrens ist es, daß Spulen mit beliebiger Spiralenform problemlos hergestellt werden können. Dazu werden keine aufwendigen mechanischen Bearbeitungswerkzeuge, wie beispielsweise eine Drehbank oder eine Fräsmaschine, benötigt.The advantage of the method is that coils with any spiral shape can be easily produced. No complex mechanical processing tools such as a lathe or milling machine are required for this.

Eine besonders vorteilhafte Ausgestaltung des Verfahrens besteht darin, daß die Leiterplatte mit ihrer die Spirale tragenden Oberfläche am Flachspulenträger verklebt wird. Durch diese Maßnahme wird bei einem Stoßwellenrohr erreicht, daß der nicht leitende Teil der Leiterplatte gleichzeitig als Isolierfolie zwischen der Spule und einer ihr vorgelagerten Membran dient Die Montage der wesentlichen Komponenten des Stoßwellenrohres, nämlich Flachspule, lsolierfolie und Membran, wird dadurch wesentlich vereinfacht.A particularly advantageous embodiment of the method is that the circuit board is glued to the flat coil carrier with its surface carrying the spiral. With a shock wave tube, this measure ensures that the non-conductive part of the circuit board simultaneously serves as an insulating film between the coil and a membrane in front of it. The assembly of the essential components of the shock wave tube, namely flat coil, insulating foil and membrane, is thereby considerably simplified.

Weitere Vorteile der Erfindung ergeben sich aus der Beschreibung der Figuren in Verbindung mit den Unteransprüchen. Es zeigen jeweils im Querschnitt

  • Fig. 1 in einer auseinandergezogenen Darstellung einen Spulenträger und eine Leiterplatte in Verbindung mit einer Isolierfolie und einer Membran eines Stoßwellenrohres, Fig. 2 den Spulenträger und die Leiterplatte mit ausgeätzten Zwischenräumen zwischen den Spiralgängen,
  • Fig. 3 den Spulenträger und die Leiterplatte mit galvanisch verstärkten Spulengängen und
  • Fig. 4 die fertige Flachspulenanordnung bestehend aus dem Spulenträger und der damit verklebten, aus der Leiterplatte gefertigten spiralförmigen Spule.
Further advantages of the invention result from the description of the figures in connection with the subclaims. They each show in cross section
  • 1 is an exploded view of a coil carrier and a circuit board in connection with an insulating film and a membrane of a shock wave tube, FIG. 2 shows the coil carrier and the circuit board with etched spaces between the spiral paths,
  • Fig. 3, the coil carrier and the circuit board with galvanically reinforced coil turns and
  • Fig. 4 shows the finished flat coil assembly consisting of the coil carrier and the glued, made from the circuit board spiral coil.

Zur Erleichterung der Übersichtlichkeit ist in den Figuren auf eine maßstabsgerechte Darstellung der einzelnen Schichtdicken verzichtet. Diese ergeben sich aus der folgenden Beschreibung.In order to facilitate clarity, the individual layer thicknesses are not shown to scale in the figures. These result from the following description.

In Figur 1 ist mit 1 ganz allgemein ein Stoßwellenrohr bezeichnet, welches in seinen wesentlichen Komponenten aus einem Flachspulenträger 3 mit zugehöriger spiralförmiger Spule 4 (in Figur 3 und 4 gezeigt), einer Isolierfolie 5 und einer Membran 7 besteht. Haltemittel für die Spule 4, die lsolierfolie 5 und die Membran 7 sind nicht gezeigt.In FIG. 1, 1 denotes a shock wave tube in general, the essential components of which consist of a flat coil carrier 3 with associated spiral coil 4 (shown in FIGS. 3 and 4), an insulating film 5 and a membrane 7. Holding means for the coil 4, the insulating film 5 and the membrane 7 are not shown.

Zum Auslösen einer Stoßwelle wird auf die Flachspule 4 ein Hochspannungsimpuls kurzer Dauer gegeben. Aufgrund der elektromagnetischen Wechselwirkung der Spule 4 mit der Membran 7 wird die Membran 7 von der Spule 4 weggeschlagen; sie erzeugt so die Stoßwelle. Für ein einwandfreies Funktionieren des Stoßwellenrohrs 1 und die Herstellung einer bestimmten gewünschten Wellenform muß die Spule 4 eine definierte Form haben. Die Oberfläche der Spule 4 kann z. B. eben sein, wenn die Erzeugung einer ebenen Stoßwelle gewünscht ist, oder konkav katottenförmig, wenn die damit erzeugte Stoßwelle fokussierend auf einen Punkt zulaufen soll. Neben der definierten Form der Spule 4 ist es von großer Wichtigkeit, daß die Isolation zwischen den Spulengängen einwandfrei ist, z. B. ohne Lufteinschiüsse. Die Spannungsimpulse, die die Spule 4 beaufschlagen, liegen in der Größenordnung zwischen 10 und 30 kV.A high-voltage pulse of short duration is applied to the flat coil 4 in order to trigger a shock wave. Due to the electromagnetic interaction of the coil 4 with the membrane 7, the membrane 7 is knocked away from the coil 4; it creates the shock wave. The coil 4 must have a defined shape for the shock wave tube 1 to function properly and to produce a certain desired wave shape. The surface of the coil 4 can, for. B. be flat if the generation of a flat shock wave is desired, or concave catotte-shaped if the shock wave generated with it should focus on a point. In addition to the defined shape of the coil 4, it is of great importance that the insulation between the coil turns is flawless, e.g. B. without air pockets. The voltage pulses that act on the coil 4 are in the order of magnitude between 10 and 30 kV.

Bei der Herstellung des Flachspulenträgers 3 mit angesetzter Spule 4 wird ausgegangen von einer runden keramischen Scheibe. Diese Scheibe hat beispielsweise eine Dicke von 40 mm bei einem Durchmesser von 155 mm. Es sind bei Durchführung des vorliegend geschilderten Verfahrens aber auch kleinere Scheiben von z.B. 60 mm Durchmesser bei einer Dicke von 15 mm hergestellt worden.In the manufacture of the flat coil carrier 3 with the coil 4 attached, a round ceramic disk is assumed. This disc has, for example, a thickness of 40 mm with a diameter of 155 mm. When carrying out the method described here, smaller slices of e.g. 60 mm diameter with a thickness of 15 mm.

Neben dieser Scheibe, die aus einer Keramik besteht und als Flachspulenträger 3 dient, ist eine Leiterplatte 9 weiteres Ausgangsmaterial. Sie ist zur Herstellung der eigentlichen Spule 4 vorgesehen. Die Leiterplatte 9 besteht aus einer elektrisch nicht leitenden Trägerschicht 11, die vorzugsweise aus Polyimid besteht. Diese Polyimidfolie kann eine Dicke von ca. 200 µm haben. Eine Seite der Trägerschicht 11 ist mit einer dünnen Schicht 13 aus einer elektrisch leitfähigen Substanz, insbesondere einer Kupferschicht von ca. 7 um Dicke, versehen.In addition to this disc, which consists of a ceramic and serves as a flat coil support 3, a printed circuit board 9 is another starting material. It is provided for the production of the actual coil 4. The printed circuit board 9 consists of an electrically non-conductive carrier layer 11, which preferably consists of polyimide. This polyimide film can have a thickness of approx. 200 µm. One side of the carrier layer 11 is provided with a thin layer 13 made of an electrically conductive substance, in particular a copper layer approximately 7 μm thick.

Auf der Kupferschicht 13 ist wiederum eine lichtempfindliche Oberschicht 15 aufgebracht.A light-sensitive top layer 15 is in turn applied to the copper layer 13.

In der Figur 2 sind der Flachspulenträger 3 und die nach einem ersten und zweiten Verfahrensschritt verarbeitete Leiterplatte 9 dargestellt. Durch Auflegen einer Maske - (nicht gezeigt), in welcher - je nach Art der lichbempfindlichen Oberschicht 15 - die Spirafform in positiver oder negativer Darstellung enthalten ist, durch anschließende Belichtung der nicht durch die Maske abgedeckten Teile der lichtempfindlichen Schicht 15, durch Entwicklung und Ausätzung der Zwischenräume zwischen den Spiralgängen 13a ergibt sich die in Figur 2 gezeigte Leiterplatte 9. Sie besteht aus der Trägerschicht 11 und Teilen der ursprünglichen Kupferschicht 13. Die Spiralgänge 13a bilden nun eine flache Spule 4 mit einen spiralförmigen Verlauf der Windungen.FIG. 2 shows the flat coil carrier 3 and the printed circuit board 9 processed after a first and second method step. By putting on a mask - (not shown) in which - depending on the type of photosensitive upper layer 15 - the Spirafform in positive or Negative representation is contained, by subsequent exposure of the parts of the light-sensitive layer 15 not covered by the mask, by development and etching of the spaces between the spiral passages 13a, the printed circuit board 9 shown in FIG. 2 results. It consists of the carrier layer 11 and parts of the original one Copper layer 13. The spiral paths 13a now form a flat coil 4 with a spiral course of the turns.

In der Figur 3 ist neben dem Flachspulenträger 3 die spiratförmige Kupferschicht 13 dargestellt, nachdem letztere durch einen Galvanisiervorgang von ca. 7 um auf eine Gesamtstärke von z. B. ca. 150 um verstärkt wurde. Die so erzeugte Spirale mit den Spiralgängen 13a ist geeignet, dem hohen Spannungs- und Stromstoß bei der Stoßwellenerzeugung standzuhalten, wenn die einzelnen Spiralgänge 13a einen ausreichenden Abstand voneinander aufweisen.In FIG. 3, in addition to the flat coil support 3, the spiral copper layer 13 is shown, after the latter has been galvanized to a total thickness of approximately 7 μm. B. was amplified about 150 microns. The spiral produced in this way with the spiral ducts 13a is suitable for withstanding the high voltage and current surge during the generation of shock waves if the individual spiral ducts 13a are at a sufficient distance from one another.

In Figur 4 ist die fertige Anordnung von Flachspulenträger 3 und integrierter Spule 4 dargestellt Die Zwischenräume zwischen der spiralförmigen Kupferschicht 13a sind nun mit einem Kunstharz 17 ausgefüllt worden. Die Spule 4 ist stimseitig an den Flachspulenträger 3 geklebt Zum besseren Verkleben der Spule 4 mit dem Flachspulenträger 3 und zum Auffüllen der Zwischenräume kann auch in einem Arbeitsgang die gesamte Stirnseite des Flachspulenträgers 3 mit Kunstharz bestrichen worden sein.FIG. 4 shows the finished arrangement of flat coil carrier 3 and integrated coil 4. The spaces between the spiral copper layer 13a have now been filled with a synthetic resin 17. The coil 4 is glued to the end of the flat coil carrier 3. To better glue the coil 4 to the flat coil carrier 3 and to fill up the gaps, the entire end face of the flat coil carrier 3 can also be coated with synthetic resin in one operation.

Die Leiterplatte 4 kann prinzipiell sowohl mit der Trägerschicht 11 als auch mit der Schicht 13 gegen den Flachspulenträger 3 geklebt werden. Vorteil der zweiten Ausführungsform ist es jedoch, daß die Trägerschicht 11 gleichzeitig als Isolierfolie 5 dienen kann, um die Spule 4 von der Membran 7 elektrisch zu isolieren.The printed circuit board 4 may be also bonded in principle with both the support layer 11 as the layer 1 3 against the flat coil support. 3 However, the advantage of the second embodiment is that the carrier layer 11 can simultaneously serve as an insulating film 5 in order to electrically isolate the coil 4 from the membrane 7.

Als Materialien für den Flachspulenträger 3 kommt vorzugsweise Aluminiumoxid-Keramik in Frage, wobei aber auch mit gefülltem und ungefülltem Epoxydharz gute Ergebnisse erzielt wurden.Aluminum oxide ceramics are preferably used as materials for the flat coil carrier 3, but good results have also been achieved with filled and unfilled epoxy resin.

Claims (9)

1. Verfahren zur Herstellung einer spiralförmigen Flachspule für ein Stoßwellenrohr, dadurch gekennzeichnet, daß eine Maske in Spiralenform fotografisch auf eine Leiterplatte (9) mit einer Trägerschicht (11), mit einer darüber liegenden eiektrisch leitfähigen Schicht (13) und mit einer lichtempfindlichen Oberschicht (15) übertragen wird, daß die Oberschicht (15) entwickelt wird, daß dei Zwischenräume zwischen den Spiralgängen (10) der übertragenen Maske von der elektrisch leitfähigen Schicht (13) abgeätzt werden, daß die auf der elektrisch leitfähigen Schicht (13) verbleibenden SpiraJgänge (13a) galvanisch verstärkt werden, und daß anschließend die Leiterplatte (9) auf einen Flachspulenträger (3) aufgeklebt wird.1. A method for producing a spiral flat coil for a shock wave tube, characterized in that a mask in spiral form photographically on a printed circuit board (9) with a carrier layer (11), with an electrically conductive layer (13) and a light-sensitive top layer ( 15) that the upper layer (15) is developed, that the spaces between the spiral passages (10) of the transferred mask are etched away by the electrically conductive layer (13), that the spiral passages (13) remaining on the electrically conductive layer (13) 13a) are galvanically reinforced, and that the printed circuit board (9) is then glued onto a flat coil carrier (3). 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Trägerschicht (11) eine Polyimidfolie und als elektrisch leitfähige Schicht (13) eine Kupferschicht vorgesehen ist.2. The method according to claim 1, characterized in that a polyimide film is provided as the carrier layer (11) and a copper layer is provided as the electrically conductive layer (13). 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß die Polyimidfolie (11) ca. 200 µm dick und die Kupferschicht (13) ca. 7 µm dick sind (Fig. 1,2).3. The method according to claim 2, characterized in that the polyimide film (11) is approximately 200 microns thick and the copper layer (13) are approximately 7 microns thick (Fig. 1 , 2). 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Spiralgänge (13a) galvanisch auf ca. 150 um Dicke verstärkt werden (Fig. 3).4. The method according to any one of claims 1 to 3, characterized in that the spiral passages (13a) are galvanically reinforced to about 150 microns thick (Fig. 3). 5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Leiterplatte (9) mit ihrer die SpiraJgänge (13a) tragenden Oberfläche am Flachspulenträger (3) verklebt wird.5. The method according to any one of claims 1 to 4 , characterized in that the circuit board (9) is glued to the flat coil carrier (3) with its surface bearing the spiral passages (13a). 6. Spiralförmige Flachspule für ein Stoßwellenrohr, dadurch gekennzeichnet , daß sie zusammengesetzt ist aus a) einer Trägerschicht (11), b) einer auf der Trägerschicht (11) befestigten Spirale - (13a) aus Kupfer und c) einer als Flachspulenträger (3) vorgesehenen Scsheibe aus einem schallharten und elektrisch nicht leitenden Material, wobei die Scheibe mit der Spirale (13a) und/oder der Trägerschicht (11) verklebt ist. 6. Spiral flat coil for a shock wave tube, characterized in that it is composed of a) a carrier layer (11), b) a spiral attached to the carrier layer ( 1 1) - (13a) made of copper and c) a disk provided as a flat coil support (3) made of a reverberant and electrically non-conductive material, the disk being glued to the spiral (13a) and / or the support layer (11). 7. Flachspule nach Anspruch 6, dadurch gekennzeichnet, daß der Flachspulenträger (3) aus einer Keramik besteht7. Flat coil according to claim 6, characterized in that the flat coil support (3) consists of a ceramic 8. Flachspule nach Anspruch 6, dadurch gekennzeichnet, daß der Flachspulenträger (3) aus einem Epoxidharz besteht.8. Flat coil according to claim 6, characterized in that the flat coil support (3) consists of an epoxy resin. 9. Flachspule nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, daß zum Verkleben der Scheibe (3) mit der Spirale (13a) und/oder der Trägerschicht (11) ein Harz (17) vorgesehen ist9. Flat coil according to one of claims 6 to 8, characterized in that a resin (17) is provided for gluing the disc (3) with the spiral (13a) and / or the carrier layer (11)
EP86100419A 1985-01-28 1986-01-14 Method for making a flat coil, and a flat coil for a shock wave tube Expired EP0189781B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853502770 DE3502770A1 (en) 1985-01-28 1985-01-28 METHOD FOR PRODUCING A FLAT COIL AND FLAT COIL FOR A SHOCK SHAFT PIPE
DE3502770 1985-01-28

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EP0189781A1 true EP0189781A1 (en) 1986-08-06
EP0189781B1 EP0189781B1 (en) 1989-05-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP86100419A Expired EP0189781B1 (en) 1985-01-28 1986-01-14 Method for making a flat coil, and a flat coil for a shock wave tube

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EP (1) EP0189781B1 (en)
JP (1) JPS61176334A (en)
DE (2) DE3502770A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0435838A2 (en) * 1989-12-19 1991-07-03 International Business Machines Corporation Sputtering apparatus
GB2290171A (en) * 1994-06-03 1995-12-13 Plessey Semiconductors Ltd Inductor chip device
US6837859B2 (en) 2001-09-10 2005-01-04 Siemens Aktiengesellschaft Shock wave source with a coil carrier having a non-circular contour
US6849053B2 (en) 2001-09-10 2005-02-01 Siemens Aktiengesellschaft Shock wave source with a wave damping coil carrier

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05100223A (en) * 1991-04-03 1993-04-23 Riyoosan:Kk Light source device
DE102006040728A1 (en) * 2006-08-31 2008-03-13 Siemens Ag Method and device for producing an electronic module

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US3189767A (en) * 1963-01-28 1965-06-15 Gen Electric Ultrasonic transmitting means and method of producing same
FR2209273A1 (en) * 1972-12-05 1974-06-28 Dainippon Printing Co Ltd
DE3312014A1 (en) * 1983-04-02 1984-10-11 Wolfgang Prof. Dr. 7140 Ludwigsburg Eisenmenger Device for the contactless crushing of concrements in the body of living beings
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors

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Publication number Priority date Publication date Assignee Title
US3189767A (en) * 1963-01-28 1965-06-15 Gen Electric Ultrasonic transmitting means and method of producing same
FR2209273A1 (en) * 1972-12-05 1974-06-28 Dainippon Printing Co Ltd
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors
DE3312014A1 (en) * 1983-04-02 1984-10-11 Wolfgang Prof. Dr. 7140 Ludwigsburg Eisenmenger Device for the contactless crushing of concrements in the body of living beings

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0435838A2 (en) * 1989-12-19 1991-07-03 International Business Machines Corporation Sputtering apparatus
EP0435838A3 (en) * 1989-12-19 1991-10-02 International Business Machines Corporation Sputtering apparatus
GB2290171A (en) * 1994-06-03 1995-12-13 Plessey Semiconductors Ltd Inductor chip device
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
US6837859B2 (en) 2001-09-10 2005-01-04 Siemens Aktiengesellschaft Shock wave source with a coil carrier having a non-circular contour
US6849053B2 (en) 2001-09-10 2005-02-01 Siemens Aktiengesellschaft Shock wave source with a wave damping coil carrier

Also Published As

Publication number Publication date
JPH0459897B2 (en) 1992-09-24
EP0189781B1 (en) 1989-05-03
DE3663208D1 (en) 1989-06-08
JPS61176334A (en) 1986-08-08
DE3502770A1 (en) 1986-07-31

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