EP0180265A1 - Procédé pour l'étamage autocatalytique des objets en cuivre et alliages de cuivre - Google Patents
Procédé pour l'étamage autocatalytique des objets en cuivre et alliages de cuivre Download PDFInfo
- Publication number
- EP0180265A1 EP0180265A1 EP85201585A EP85201585A EP0180265A1 EP 0180265 A1 EP0180265 A1 EP 0180265A1 EP 85201585 A EP85201585 A EP 85201585A EP 85201585 A EP85201585 A EP 85201585A EP 0180265 A1 EP0180265 A1 EP 0180265A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- solution
- tin
- copper
- ions
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 16
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 8
- 238000007747 plating Methods 0.000 title claims abstract description 7
- 239000000243 solution Substances 0.000 claims abstract description 44
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea group Chemical group NC(=S)N UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 10
- 238000002203 pretreatment Methods 0.000 claims abstract description 9
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 6
- 239000012670 alkaline solution Substances 0.000 claims abstract description 5
- 150000002500 ions Chemical class 0.000 claims abstract description 5
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims abstract description 4
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 18
- FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Chemical compound O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 claims description 11
- 238000011282 treatment Methods 0.000 claims description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 229940095064 tartrate Drugs 0.000 claims description 6
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 5
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 239000001117 sulphuric acid Substances 0.000 claims description 3
- 235000011149 sulphuric acid Nutrition 0.000 claims description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 230000006872 improvement Effects 0.000 abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 239000010410 layer Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- -1 tin (IV) ions Chemical class 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 241001424397 Paralucia pyrodiscus Species 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- 229960001790 sodium citrate Drugs 0.000 description 2
- 235000011083 sodium citrates Nutrition 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 229910021205 NaH2PO2 Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- JBANFLSTOJPTFW-UHFFFAOYSA-N azane;boron Chemical compound [B].N JBANFLSTOJPTFW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Definitions
- tin (IV) ions and/or a strong reduction agent for example hypophosphite or a borazane, is or are added to the solution.
- the etching rates of the said cleaning treatments are as follows:
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8403033 | 1984-10-05 | ||
| NL8403033A NL8403033A (nl) | 1984-10-05 | 1984-10-05 | Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0180265A1 true EP0180265A1 (fr) | 1986-05-07 |
| EP0180265B1 EP0180265B1 (fr) | 1989-04-19 |
Family
ID=19844566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85201585A Expired EP0180265B1 (fr) | 1984-10-05 | 1985-10-02 | Procédé pour l'étamage autocatalytique des objets en cuivre et alliages de cuivre |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0180265B1 (fr) |
| JP (1) | JPS6191362A (fr) |
| KR (1) | KR860003362A (fr) |
| DE (1) | DE3569580D1 (fr) |
| NL (1) | NL8403033A (fr) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0460786A1 (fr) * | 1990-06-04 | 1991-12-11 | Macdermid Incorporated | Composition de prétraitement et procédé de dépôt chimique d'un alliage étain-plomb |
| US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
| US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
| US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
| US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
| GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
| US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
| EP0848084A1 (fr) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Procede de fabrication de tuyau de cuivre dont l'interieur est plaque a l'etain |
| EP0851041A1 (fr) * | 1996-12-23 | 1998-07-01 | KM Europa Metal Aktiengesellschaft | Tube en cuivre revêtu à l'interieure avec d'étain et procédé de revêtement d'un tube en cuivre |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101012815B1 (ko) * | 2010-07-21 | 2011-02-08 | 주식회사 에이엔씨코리아 | 칩 도금용 약산성 주석 도금액 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
| GB2039534A (en) * | 1978-12-04 | 1980-08-13 | Philips Nv | Electroless tin-plating solutions |
-
1984
- 1984-10-05 NL NL8403033A patent/NL8403033A/nl not_active Application Discontinuation
-
1985
- 1985-10-02 EP EP85201585A patent/EP0180265B1/fr not_active Expired
- 1985-10-02 DE DE8585201585T patent/DE3569580D1/de not_active Expired
- 1985-10-03 JP JP60219273A patent/JPS6191362A/ja active Pending
- 1985-10-05 KR KR1019850007338A patent/KR860003362A/ko not_active Application Discontinuation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
| GB2039534A (en) * | 1978-12-04 | 1980-08-13 | Philips Nv | Electroless tin-plating solutions |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0460786A1 (fr) * | 1990-06-04 | 1991-12-11 | Macdermid Incorporated | Composition de prétraitement et procédé de dépôt chimique d'un alliage étain-plomb |
| US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
| US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
| US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
| US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
| US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
| GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
| GB2271578B (en) * | 1992-09-17 | 1996-09-18 | Rieger Franz Metallveredelung | Bath for the pre-treatment of light metals,process therefor and articles produced |
| EP0848084A1 (fr) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Procede de fabrication de tuyau de cuivre dont l'interieur est plaque a l'etain |
| EP0848084A4 (fr) * | 1996-06-05 | 1999-01-27 | Sumitomo Light Metal Ind | Procede de fabrication de tuyau de cuivre dont l'interieur est plaque a l'etain |
| EP0851041A1 (fr) * | 1996-12-23 | 1998-07-01 | KM Europa Metal Aktiengesellschaft | Tube en cuivre revêtu à l'interieure avec d'étain et procédé de revêtement d'un tube en cuivre |
Also Published As
| Publication number | Publication date |
|---|---|
| NL8403033A (nl) | 1986-05-01 |
| JPS6191362A (ja) | 1986-05-09 |
| EP0180265B1 (fr) | 1989-04-19 |
| KR860003362A (ko) | 1986-05-23 |
| DE3569580D1 (en) | 1989-05-24 |
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