EP0180265A1 - Method of autocatalytically tin-plating articles of copper or a copper alloy - Google Patents
Method of autocatalytically tin-plating articles of copper or a copper alloy Download PDFInfo
- Publication number
- EP0180265A1 EP0180265A1 EP85201585A EP85201585A EP0180265A1 EP 0180265 A1 EP0180265 A1 EP 0180265A1 EP 85201585 A EP85201585 A EP 85201585A EP 85201585 A EP85201585 A EP 85201585A EP 0180265 A1 EP0180265 A1 EP 0180265A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- solution
- tin
- copper
- ions
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Definitions
- tin (IV) ions and/or a strong reduction agent for example hypophosphite or a borazane, is or are added to the solution.
- the etching rates of the said cleaning treatments are as follows:
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
- The invention relates to a method of autocatalytically tin-plating articles of copper or of a copper alloy.
- GB-PS 2 039 534 discloses an electrolessly operating tin-plating solution which consists of a strongly alkaline aqueous solution containing at least 0.20 mol/litre of bivalent tin ions. The operating temperature of said solution is between 60 and 95°C and it contains at least 1 mol/litre of alkali hydroxide.
- In a preferred embodiment a small quantity of tin (IV) ions and/or a strong reduction agent, for example hypophosphite or a borazane, is or are added to the solution. As a result of this an improvement of the quality of the deposit and the deposition rate is achieved.
- However, the soldering properties of tin deposited electrolessly directly on a copper surface are insufficient in practice without additions. Even with an addition of hypophosphite, which for practical reasons is rather to be avoided, the desired soldering properties are often not obtained.
- In an article by A. Molenaar and J.J.C. Coumans in Surface Technology 16, 265-275 (1982) a method is described according to which a surface of copper or a copper alloy is subjected to a pre-treatment with a tin exchanging bath. This pre-treatment is carried out by means of an alkaline solution with cyanide ion as a complex forming agent for Cu and/or Cu++ ions and for Sn++ ions.
- In the experiments which have led to the present invention, however, it has been found that satisfactory results are not obtained in all respects with this method. The exchanged layer which is obtained from the alkaline solution has the structure of β-tin, the same modification which is also obtained from the autocatalytic solution. In spite of the fact that the same modification is deposited, often no optimum soldering properties are obtained.
- According to the invention it has been found that considerably better soldering properties are obtained if the pre-treatment for the electroless deposition of the tin is carried out with an acid reacting exchanging solution.
- In spite of the fact that the exchanged layer also comprises the alloy Cu6Sn5, better soldering properties are nevertheless obtained after growing said layer by means of the autocatalytic method which deposits tin in the form of ther β- modification, than when an alkaline exchanging solution has been used for the pre- treatment.
- These improved results cannot be well explained; they are ascribed by Applicants to the fact that adsorption of tin-II-complex having disproportionating properties is promoted by the exchanging reaction in acid medium with thiourea as a complex former for Cu++ and/or Cu ions and for Sn++ ions.
- An advantage of the use of the acid exchanging solution which preferably comprises thiourea as a complex former, as compared with the alkaline solution with cyanide, is that this solution is not poisonous.
- Various acids may be used in the exchanging solution, for example, hydrochloric acid, sulphuric acid or citric acid, but the very best results are obtained by means of a sulphuric acid solution.
- One embodiment has the following composition: 0.02 mol/l SnC12.2H 2 0 0.2 mol/l H2SO4 0.6 mol/l thiourea.
- This solution is preferably used at a temperature between 20 and 30 C, the articles being kept immersed in it for 10 minutes.
- The best result as regards the quality and the adhesion of the tin deposit is obtained when the surface of copper or the copper alloy is previously cleaned. This cleaning may be done mechanically or chemically. The chemical method may be a cleaning, polishing or etching method but the surface is preferably treated by means of a chemical polishing solution.
- One embodiment has the composition: 55 parts by volume of phosphoric acid 25 parts by volume of acetic acid 20 parts by volume of nitric acid and 0.5 parts by volume of hydrochloric acid.
- Herein the articles are kept immersed at room temperature for 30-60 seconds.
- The electroless tinplating solution, the treatment in which follows the exchange-pretreatment, comprises a solution containing at least 0.20 mol/1 of a salt of bivalent tin and at least 1 mol/1 of alkalihydroxide, works with these bath-constituents only. However, it is advantageous if the solution contains also a complex-forming agent for bivalent tin-ions, such as citrateor tartrate.The presence of tartrate is to be preferred as higher tin-concentrations are then attainable. The presence of citrate or tartrate moreover produces a tin-deposit of further improved solderability.
- By giving an additional treatment in a solution of about pH = 6 (4-8) without further constituents after the exchange-treatment and prior to the electroless Sn- plating, also the solderability and the structure of the deposited tin are favourably influenced.
- In certain cases it may be advantageous to nevertheless add hypophosphite to the autocatalytic solution. The reliability of the soldered joint is further increased by the combination of pre-treatment and addition of hypophosphite to the autocatalytic solution.
- The invention will be described in greater detail with reference to the ensueing examples.
- Copper plates having dimenions 3 x 1 cm2 were subjected to the following treatments.
- A dull Cu layer of 15/um was electro-deposited on said plates by means of an acid copper sulphate bath. They were then rinsed in water and polished in the solution of the following composition for 1 minute: 55 parts by volume of H3 P0 4
- 25 parts by volume of acetic acid
- 20 parts by volume of HNO3
- 0.5 parts by volume of HC1
- and rinsed again in demineralized water for 30 seconds. One of the methods below was then used:
- I no exchange
- II the plates were immersed at 30°C in the following solution for 10 minutes: 0.02 m SnCl2.2H2O 0.6 m thiourea 0.2 m H 2 S0 4
- III the plates were immersed at 75°C in the following solution for 5 minutes: 0.02 m SnCl2.2H2O 0.2 m NaOH 0.8 m KCN
- They were rinsed in demineralized water for 30 seconds. The plates were electrolessly tin-plated at 750C for 3 hours in the following composition:
- 0.33 m SnCl2.2H2O
- 3.85 m NaOH
- 0.66 m sodium citrate
- This method of measuring is described in the IEC standard sheet 68-2-20. The value of t1 must in practice be smaller than 1 sec. and F3/Fmax must be larger than 50%.
-
- In the same manner a test was carried out starting from copper plates without a dull electroplated copper layer. Exchange II (acid exchange with thiourea) and III (alkaline exchange with cyanide) were used.
-
- The connection wires of glow discharge lamps consisting of copper-clad wire having a diameter of 3 and 4 millimetres were subjected to the following treatment. First of all they were immersed for 10 seconds in H2SO4 (48%) at 90oC, then rinsed with demineralized water for 10 seconds and polished in the following solution for 30 seconds:
- 55 parts by volume of H 3 P0 4
- 25 parts by volume of acetic acid
- 20 parts by volume of HNO3
- 0.5 parts by volume of HC1.
- After rinsing with demineralized water for 30 seconds one of the two exchanging methods was used:
- II the connection wires were dipped at 30°C in the following solution for 15 minutes: 0.02 m SnCl2.2H20 0.6 m thiourea 0.2 m H2SO4, or
- III the connection wires were immersed at 75°C for 15 minutes in 0.02 m SnCl2.2H 2 0 0.2 m NaOH 0.8 m KCN.
- They were then rinsed again with demineralized water for 30 seconds and electrolessly tin-plated for 30 minutes by immersing in the following solution at 75°C:
- 0.33 m SnCl2.2H 2 0
- 3.85 m NaOH
- 0.66 m Na-citrate
-
- Copper plates having dimensions of 3x1 cm2 were subjected to the following treatments. First of all they were coated by electrodeposition with a dull copper layer of 15/um by means of an acid copper sulphate bath, rinsed in water and subjected to one of the following cleaning treatments:
- I immerse at 30°C for 1 minute in 55 parts by volume of H3PO4 25 parts by volume of acetic acid 20 parts by volume of HNO3 0.5 parts by volume of HC1 immerse for 1 minute in HCl 1:1 at room temperature.
- II immersevat room temperature for 1 minute in 60 ml H2SO4 60 ml H20 30 ml HN0 3 9.4 ml HC1
- immerse in HC1 at room temperature for 1 minute. III immerse in HNO 1:1 at room temperature for 1 minute. IV immerse in HC1 1:1 at room temperature for 1 minute. After each of these treatments the plates were rinsed in demineralized water for 30 seconds and then the plates were immersed at 30°C for 10 minutes in:
- 0.02 m SnCl2.2H2O
- 0.2 m thiourea
- 0.2 m H 2 S0 4
- The plates were finally tin-plated electrolessly at 75°C for 3 hours by immersing in the following solution:
- 0.33 m SnCl2.2H2O
- 3.85 m NaOH
- 0.66 m Na-citrate
- 0.90 m NaH2PO2
- The etching rates of the said cleaning treatments are as follows:
- I 2.5/um/min.
- II 11 /um/min.
- II 10 /um/min.
- IV 0 /um/min.
- After tin-plating, the plates were aged at 155°C in a hot-air furnace for 16 hours. The solderability was determined in the same manner as in example 1.
-
- Copper plates having dimensions 3 x 1 cm2 were subjected to the following treatments.
- A dull copper layer of 15/um was electrodeposited on them by means of an acid coppersulphate bath. They were subsequently rinsed in water and during one minute polished in the solution of the following composition:
- 55 parts by volume of H3PO4
- 25 parts by volume of acetic acid
- 20 parts by volume of HNO3
- 0.5 parts by volume of HC1
- Hereafter the plates were immersed during 10 minutes at 30°C in
- 0.02 m SnCl2.2H2O
- 0.6 m thiourea
- 0.2 m H2SO4
- After rinsing with demineralized water during 30 seconds one of the following three tinplating methods were applied.
- I The plates were electrolessly tin-plated during 3 hrs at 750C in a solution of the following composition: 0.33 m SnCl2.2H2O 2.5 m NaOH
- II The plates were electrolessly tin-plated during 3 hours at 75°C in a solution of the following composition: 0.33 m SnCl2.2H2O 2.5 m NaOH 0.66 m sodiumcitrate.
- This solution was prepared by dissolving the Na-citrate in about half of the volume of water and adding the SnCl2.2H20 (soln.1), dissolving NaOH in about half of the volume of water (soln 2) and combine solutions 1 and 2 while stirring vigorously.
- III The plates were electrolessly tin-plated at 75°C during 3 hours in a solution of the following composition: 0.42 m SnCl2.2H2O 2.5 m NaOH 0.50 m Na-K-tartrate
- This solution was prepared by dissolving the Na-K-tartrate in about half of the volume of water, dissolving the NaOH in the remaining volume of water, combining the two solutions and adding thereto the SnCl2.2H2O.
- Finally, the plates were rinsed in demineralized water during 30 seconds. The tin-plated samples were aged during 16 hours at 1550C in a hot-air furnace. The solderability was determined in the same way as in Example 1.
-
and finally rinsed in demineralized water for 30 seconds. The tin-plated plates were aged by heating them in a hot air furnace at 155°C for 16 hours. The solderability was determined by means of a so-called wetting balance ("Multicore Solders") as described inter alia in Circuit World 10, N° 3, pp. 4-7, 1984. The forces occurring upon providing a sample in a soldering bath in accordance with time are measured by the recording apparatus coupled to said balance. The plates were immersed edge-wise while using a slightly activated flux in a liquid soldering bath. In the first instance an upward force was exerted on the plates which decreases when the surface layer of the solder has flattened along the plate. The time expiring inbetween is indicated by t1. The wetting then causes a downward force. The fraction of said force which is measured after 3 seconds with respect to an ideally wetted plate is indicated by F3/Fmax.
and finally rinsed in demineralized water for 30 seconds. The tin-plated connection wires were aged either for 16 hours at 155°C in a hot air furnace (furnace test) or for 16 hours in steam of 100°C; RV 100% (steam test). The solderability was determined in the same manner as in example 1.
and again rinsed in demineralized water for 30 seconds.
and rinsed in demineralized water for 30 seconds.
and rinsed again in demineralized water during 30 seconds.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8403033 | 1984-10-05 | ||
NL8403033A NL8403033A (en) | 1984-10-05 | 1984-10-05 | METHOD FOR AUTOCATALYTIC TINNING OF ARTICLES FROM COPPER OR A COPPER ALLOY. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0180265A1 true EP0180265A1 (en) | 1986-05-07 |
EP0180265B1 EP0180265B1 (en) | 1989-04-19 |
Family
ID=19844566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85201585A Expired EP0180265B1 (en) | 1984-10-05 | 1985-10-02 | Method of autocatalytically tin-plating articles of copper or a copper alloy |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0180265B1 (en) |
JP (1) | JPS6191362A (en) |
KR (1) | KR860003362A (en) |
DE (1) | DE3569580D1 (en) |
NL (1) | NL8403033A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0460786A1 (en) * | 1990-06-04 | 1991-12-11 | Macdermid Incorporated | Pretreatment composition and process for tin-lead immersion plating |
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
EP0848084A1 (en) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
EP0851041A1 (en) * | 1996-12-23 | 1998-07-01 | KM Europa Metal Aktiengesellschaft | Copper tube plated on the inside with tin and process for plating of a copper tube |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101012815B1 (en) * | 2010-07-21 | 2011-02-08 | 주식회사 에이엔씨코리아 | Tin plating solution for using in chip plating process |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
GB2039534A (en) * | 1978-12-04 | 1980-08-13 | Philips Nv | Electroless tin-plating solutions |
-
1984
- 1984-10-05 NL NL8403033A patent/NL8403033A/en not_active Application Discontinuation
-
1985
- 1985-10-02 DE DE8585201585T patent/DE3569580D1/en not_active Expired
- 1985-10-02 EP EP85201585A patent/EP0180265B1/en not_active Expired
- 1985-10-03 JP JP60219273A patent/JPS6191362A/en active Pending
- 1985-10-05 KR KR1019850007338A patent/KR860003362A/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
GB2039534A (en) * | 1978-12-04 | 1980-08-13 | Philips Nv | Electroless tin-plating solutions |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0460786A1 (en) * | 1990-06-04 | 1991-12-11 | Macdermid Incorporated | Pretreatment composition and process for tin-lead immersion plating |
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
GB2271578B (en) * | 1992-09-17 | 1996-09-18 | Rieger Franz Metallveredelung | Bath for the pre-treatment of light metals,process therefor and articles produced |
EP0848084A1 (en) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
EP0848084A4 (en) * | 1996-06-05 | 1999-01-27 | Sumitomo Light Metal Ind | Internally tin-plated copper pipe manufacturing method |
EP0851041A1 (en) * | 1996-12-23 | 1998-07-01 | KM Europa Metal Aktiengesellschaft | Copper tube plated on the inside with tin and process for plating of a copper tube |
Also Published As
Publication number | Publication date |
---|---|
JPS6191362A (en) | 1986-05-09 |
KR860003362A (en) | 1986-05-23 |
EP0180265B1 (en) | 1989-04-19 |
NL8403033A (en) | 1986-05-01 |
DE3569580D1 (en) | 1989-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101058635B1 (en) | Electroless Nickel Plating Solution Composition, Flexible Printed Circuit Board and Manufacturing Method Thereof | |
CN1071805C (en) | Silver plating | |
KR101234599B1 (en) | Electroless Gold Plating Bath and Method | |
JP2004510885A (en) | Baths and methods for electroless plating of silver on metal surfaces | |
KR101393478B1 (en) | Electroless gold plating bath, electroless gold plating method and electronic parts | |
GB2043115A (en) | Method of preparing substrate surface electroless plating and products produced thereby | |
EP0180265B1 (en) | Method of autocatalytically tin-plating articles of copper or a copper alloy | |
JP4792045B2 (en) | Method for depositing a palladium layer and a palladium bath therefor | |
WO2002016668A1 (en) | Electroless displacement gold plating solution and additive for preparing said plating solution | |
EP1024211A2 (en) | Silver alloy plating bath and a method of forming a silver alloy film by means of the same | |
TW583349B (en) | Method for enhancing the solderability of a surface | |
JP4375702B2 (en) | Plating composition | |
US3969554A (en) | Precious metal sensitizing solutions | |
JP4885954B2 (en) | Electroless pure palladium plating solution | |
CN113005437B (en) | Chemical gold-precipitating liquid for printed circuit board | |
US4474838A (en) | Electroless direct deposition of gold on metallized ceramics | |
EP0156167B1 (en) | Process for the deposition of a metal from an electroless plating composition | |
US3960573A (en) | Novel precious metal sensitizing solutions | |
KR20130055956A (en) | Transferring method for conductive mesh | |
CA2023846A1 (en) | Process for the direct metallization of a non-conducting substrate | |
JP4230813B2 (en) | Gold plating solution | |
JP2005529241A (en) | Acidic solution for silver deposition and method for depositing a silver layer on a metal surface | |
CN113026004B (en) | High-phosphorus chemical nickel solution for chemical nickel gold printed circuit board | |
GB2253415A (en) | Selective process for printed circuit board manufacturing employing noble metal oxide catalyst. | |
SU1507864A1 (en) | Solution for chemical deposition of nickel-base alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT SE |
|
17P | Request for examination filed |
Effective date: 19861103 |
|
17Q | First examination report despatched |
Effective date: 19871104 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT SE |
|
REF | Corresponds to: |
Ref document number: 3569580 Country of ref document: DE Date of ref document: 19890524 |
|
ITF | It: translation for a ep patent filed |
Owner name: ING. C. GREGORJ S.P.A. |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19901001 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19901023 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 19901026 Year of fee payment: 6 |
|
ITTA | It: last paid annual fee | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19901218 Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19911002 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Effective date: 19911003 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Effective date: 19920630 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Effective date: 19920701 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
EUG | Se: european patent has lapsed |
Ref document number: 85201585.8 Effective date: 19920510 |