EP0144985B1 - Method of decreasing the formaldehyde emission of veneered chip and fibre boards - Google Patents
Method of decreasing the formaldehyde emission of veneered chip and fibre boards Download PDFInfo
- Publication number
- EP0144985B1 EP0144985B1 EP84114876A EP84114876A EP0144985B1 EP 0144985 B1 EP0144985 B1 EP 0144985B1 EP 84114876 A EP84114876 A EP 84114876A EP 84114876 A EP84114876 A EP 84114876A EP 0144985 B1 EP0144985 B1 EP 0144985B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- formaldehyde
- urea
- veneered
- chipboard
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
- B27N1/003—Pretreatment of moulding material for reducing formaldehyde gas emission
Definitions
- the invention relates to a method for reducing the release of formaldehyde from chipboard and fiber board veneered with finishing layers, the chipboard or fiber board belonging to emission class E1.
- Wood chipboards are wood chip boards that are hot pressed with a synthetic resin glue binder. Due to the size, shape and arrangement of the chips and the amount of synthetic resin, which is generally in the range of 5 to 10%, the properties of the chipboard can be varied widely.
- the chipboard can be coated with decorative films, primer films and veneers, for example with valuable woods.
- chipboard In the Federal Republic of Germany, the consumption of chipboard has increased significantly in recent years. While the production of chipboard was 3.4 million cubic meters in 1969, it rose to 4.3 million cubic meters in 1971 and was 6.2 million cubic meters in 1980.
- Urea resins or aminoplastics are by far the most widely used particle board binders. They are characterized by a favorable price and high strength of the gluing and also enable very short pressing times.
- the urea resins have the great disadvantage that they release formaldehyde during the use of the particle board, which not only has an unpleasant smell but is also harmful to health, and therefore the use of urea resins as binders is subject to certain restrictions.
- Chipboard of this emission class (E1) may be used unclad and uncoated without restriction in living rooms (cf. ETB guideline 1980: Guideline on the use of chipboard with a view to avoiding unacceptable formaldehyde concentration in the ambient air, version April 1980, Beuth-Verlag, Berlin, Cologne) .
- isocyanates have only been used to a small extent as binders for particle boards.
- Diphenylmethane diisocyanate in particular has proven to be an excellent binder with which plates of high durability can be produced.
- the price of these products has so far prevented wider use.
- the published European patent application 0 012 169 describes multilayer, predominantly aminoplast-bonded chipboard or fiberboard which, in an interior, preferably in the middle layer, has an adhesive which does not belong to the group of aminoplasts, for example diisocyanate, as a binder and which is characterized by it that only those binders are used for this interior, the hardening of which is not impaired by the presence of additional formaldehyde-reactive substances, the binders being mixed with these additional substances in the form of ammonia, ammonium carbonate, ureas, thioureas, melamine or dicyandiamide after pressing the plate, existing or released formaldehyde under the influence of moisture and / or heat directly, possibly indirectly via fission products, react to set it.
- an adhesive which does not belong to the group of aminoplasts, for example diisocyanate
- the binders being mixed with these additional substances in the form of ammonia, ammonium carbonate, ureas, thioureas,
- the published European patent application 0 006 486 relates to a process for reducing the formaldehyde release from aminoplast-bonded chipboard or fiberboard, in which urea or other ammonia-releasing substances are released onto the surface of the boards in the hot state immediately after they have been removed from the heating press aqueous solution can be applied.
- binders can increase the release of formaldehyde from the veneered or otherwise coated panels, depending on the type of coating, type of wood, thickness, cutting direction and production conditions, so that the legal requirements are no longer met.
- the formaldehyde-reducing effect of the barrier (for example due to the veneer) is lost and is completely masked (cf. Marutzky, R., Mehlhorn, L. and Wenzel, W., 1981: "Recommendations for the use of chipboard in furniture construction", lecture , held at the Mobil Oil AG symposium in Grainau on September 18, 1981). This is particularly true if the formats of the veneered panels or panels are very small (see ETB guidelines).
- the present invention is therefore based on the object of providing a method according to which it is possible to reduce the formaldehyde release from chipboard and fibreboard with applied finishing layers, the panels themselves belonging to emission class E1, the finishing layers being particularly valuable veneer woods and have been applied using high formaldehyde urea-formaldehyde resins.
- the above-mentioned object can be achieved in that the boards are treated in a manner known per se with aqueous solutions of urea and / or other compounds which release ammonia, and in that the finishing layers are then treated in a manner known per se be applied.
- the boards treated according to the invention are preferably veneered with mahogany wood.
- urea and / or other compounds which release ammonia are used as formaldehyde-reactive substances.
- ammonia such as, for example, ammonium carbonate
- the method according to the invention is not intended to reduce the formaldehyde release of the raw panels themselves, since the method according to the invention uses panels of emission class E1, the use of which in construction does not require any further reduction in their formaldehyde emissions.
- the chipboard acts as a carrier for the formaldehyde scavenger. Due to the spatial separation between the urea-formaldehyde resin and the formaldehyde scavenger, the hardening of the resin takes place undisturbed, while the free formaldehyde is trapped in the plate (cf. discussion of the prior art in DE-PS 28 51 589).
- the free formaldehyde migrates from the surfaces of the panels into the interior of the panel, where the formaldehyde scavengers are located (cf. the teaching of DE-PS 28 51 589). There the formaldehyde that diffuses into it reacts with the formaldehyde scavengers. In this way, the formaldehyde release of the veneered panels can be drastically reduced.
- aqueous solutions of urea and / or other compounds which release ammonia are used.
- the aqueous solutions can have concentrations in the range from 5% to 60%, preferably from 30% to 50%. They are easily manufactured by dissolving the corresponding compounds in water.
- Ammonium carbonate, ammonium bicarbonate can be used as compounds which release ammonia.
- Urea mixed with ammonium carbonate is preferably used. The scope of the present invention is not
- a chipboard of emission class E1 [perforator value 8.0 mg (iodometric) or 6.1 mg (photometric) / 100 g dry plate] was coated with 220 g / m2 of a 50% urea-formaldehyde resin solution (molar ratio 1: 1, 6) coated and then coated with a veneer (mahogany, thickness 0.6 mm).
- the same panel was sprayed with a 30% urea solution in a Mengo of 100 g / m2 before veneering under the same conditions and then veneered as described.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zur Verminderung der Formaldehydabgabe von mit Veredelungsschichten furnierten Span- und Faserplatten, wobei die Span- oder Faserplatten der Emissionsklasse E1 angehören.The invention relates to a method for reducing the release of formaldehyde from chipboard and fiber board veneered with finishing layers, the chipboard or fiber board belonging to emission class E1.
Unter Holzspanplatten versteht man Platten aus Holzspänen, die mit einem Bindemittel aus Kunstharzleim heißgepreßt werden. Durch Größe, Form und Anordnung der Späne und die Menge des Kunstharzanteils, die im allgemeinen im Bereich von 5 bis 10% liegt, können die Eigenschaften der Holzspanplatten stark variiert werden. Die Holzspanplatten lassen sich mit Dekorfilmen, Grundierfilmen und Furnieren, beispielsweise mit wertvollen Hölzern, beschichten.Wood chipboards are wood chip boards that are hot pressed with a synthetic resin glue binder. Due to the size, shape and arrangement of the chips and the amount of synthetic resin, which is generally in the range of 5 to 10%, the properties of the chipboard can be varied widely. The chipboard can be coated with decorative films, primer films and veneers, for example with valuable woods.
In der Bundesrepublik Deutschland ist dar Verbrauch an Holzspanplatten in den letzten Jahren sehr stark gestiegen. Während die Produktion von Holzspanplatten 1969 bei 3,4 Millionen Kubikmeter lag, stieg sie 1971 auf 4,3 Millionen Kubikmeter an und betrug 1980 bereits 6,2 Millionen Kubikmeter.In the Federal Republic of Germany, the consumption of chipboard has increased significantly in recent years. While the production of chipboard was 3.4 million cubic meters in 1969, it rose to 4.3 million cubic meters in 1971 and was 6.2 million cubic meters in 1980.
Harnstoffharze oder Aminoplaste sind die weitaus am meisten benutzten Spanplattenbindemittel. Sie zeichnen sich durch günstigen Preis und hohe Festigkeit der Verleimung aus und ermöglichen zudem sehr kurze Preßzeiten. Die Harnstoffharze besitzen jedoch den großen Nachteil, daß sie während des Gebrauchs der Spanplatten Formaldehyd abgeben, der nicht nur einen unangenehmen Geruch besitzt sondern auch gesundheitsbedenklich ist, und daher unterliegt die Verwendung von Harnstoffharzen als Bindemittel bestimmten Beschränkungen.Urea resins or aminoplastics are by far the most widely used particle board binders. They are characterized by a favorable price and high strength of the gluing and also enable very short pressing times. However, the urea resins have the great disadvantage that they release formaldehyde during the use of the particle board, which not only has an unpleasant smell but is also harmful to health, and therefore the use of urea resins as binders is subject to certain restrictions.
Es ist heute bereits möglich, auch nach anderen Verfahren aminoplastgebundene Holzspanplatten mit einer Formaldehydabgabe - gemessen nach dem Perforatorverfahren (DIN EN 120; Bestimmung von Formaldehyd in Spanplatten, Perforatormethode, Beuth-Verlag, Berlin, Köln) - von unter 10 mg/100 g atro Platte herzustellen. Bauspanplatten dieser Emissionsklasse (E1) dürfen unbeplankt und unbeschichtet uneingeschränkt in Wohnräumen eingesetzt werden (vgl. ETB-Richtlinie 1980: Richtlinie über die Verwendung von Spanplatten hinsichtlich der Vermeidung unzumutbarer Formaldehydkonzentration in der Raumluft, Fassung April 1980, Beuth-Verlag, Berlin, Köln).It is already possible today to use other methods to bond aminoplast-bonded chipboard with a release of formaldehyde - measured according to the perforator method (DIN EN 120; determination of formaldehyde in chipboard, perforator method, Beuth-Verlag, Berlin, Cologne) - of less than 10 mg / 100 g dry plate. Chipboard of this emission class (E1) may be used unclad and uncoated without restriction in living rooms (cf. ETB guideline 1980: Guideline on the use of chipboard with a view to avoiding unacceptable formaldehyde concentration in the ambient air, version April 1980, Beuth-Verlag, Berlin, Cologne) .
Isocyanate werden bisher nur in geringem Umfang als Bindemittel für Spanplatten verwendet. Speziell Diphenylmethandiisocyanat hat sich aber als ausgezeichnetes Bindemittel erwiesen, mit dem sich Platten von hoher Dauerhaftigkeit herstellen lassen. Der Preis dieser Produkte hat bisher jedoch eine breitere Anwendung verhindert.So far, isocyanates have only been used to a small extent as binders for particle boards. Diphenylmethane diisocyanate in particular has proven to be an excellent binder with which plates of high durability can be produced. However, the price of these products has so far prevented wider use.
In der veröffentlichten europäischen Patentanmeldung 0 012 169 werden mehrschichtige, vorwiegend aminoplastgebundene Span- oder Faserplatten beschrieben, die in einem Innenbereich, vorzugsweise in der Mittelschicht, als Bindemittel einen nicht zur Gruppe der Aminoplaste gehörenden Kleber, zum Beispiel Diisocyanat, aufweisen und die dadurch gekennzeichnet sind, daß für diesen Innenbereich nur solche Bindemittel verwendet werden, deren Aushärtung durch die Anwesenheit von zusätzlichen formaldehydreaktiven Stoffen nicht beeinträchtigt wird, wobei dem Bindemittel diese zusätzlichen Stoffe in Form von Ammoniak, Ammoniumcarbonat, Harnstoffen, Thioharnstoffen, Melamin oder Dicyandiamid beigemischt sind, die mit dem nach dem Pressen der Platte noch vorhandenen oder freiwerdenden Formaldehyd unter Feuchte- und/oder Wärmeeinwirkung direkt, gegebenenfalls auch indirekt über Spaltprodukte, ihn abbindend reagieren.The published European patent application 0 012 169 describes multilayer, predominantly aminoplast-bonded chipboard or fiberboard which, in an interior, preferably in the middle layer, has an adhesive which does not belong to the group of aminoplasts, for example diisocyanate, as a binder and which is characterized by it that only those binders are used for this interior, the hardening of which is not impaired by the presence of additional formaldehyde-reactive substances, the binders being mixed with these additional substances in the form of ammonia, ammonium carbonate, ureas, thioureas, melamine or dicyandiamide after pressing the plate, existing or released formaldehyde under the influence of moisture and / or heat directly, possibly indirectly via fission products, react to set it.
Die veröffentlichte europäische Patentanmeldung 0 006 486 betrifft ein Verfahren zur Verminderung der Formaldehydabgabe von aminoplastgebundenen Span- oder Faserplatten, bei dem auf die Oberfläche der Platten im heißen Zustand unmittelbar in kurzem Zeitabstand nach deren Entnahme aus der Heizpresse Harnstoffe oder andere Ammoniak abspaltende Stoffe in Form einer wäßrigen Lösung aufgebracht werden.The published European patent application 0 006 486 relates to a process for reducing the formaldehyde release from aminoplast-bonded chipboard or fiberboard, in which urea or other ammonia-releasing substances are released onto the surface of the boards in the hot state immediately after they have been removed from the heating press aqueous solution can be applied.
Diese E1-Platten werden aber in der Sperrholzindustrie in vielen Fällen mit Veredelungsschichten furniert, zum Beispiel mit Mahagoni, beispielsweise für die Herstellung von Paneelen. In der Sperrholzindustrie ist es üblich, zum Furnieren Harnstoff-Formaldehyd-Harze mit hohem Formaldehydgehalt (Molverhältnis Harnstofff : Formaldehyd 1 : 1,6 bis 1 : 1,8) als Bindemittel zwischen dem Furnier und der Platte einzusetzen. Auch bei der Aufbringung von Kunststoffoberflächen für den Möbelbau werden heißhärtende formaldehydreiche Harnstoff-Formaldehyd-Harze verwendet.In the plywood industry, however, these E1 panels are in many cases veneered with finishing layers, for example with mahogany, for example for the production of panels. It is common in the plywood industry to use urea-formaldehyde resins with a high formaldehyde content (molar ratio urea: formaldehyde 1: 1.6 to 1: 1.8) as veneers between the veneer and the board. Heat-curing formaldehyde-rich urea-formaldehyde resins are also used in the application of plastic surfaces for furniture construction.
Durch die Anwendung dieser Bindemittel kann sich die Formaldehydabgabe der furnierten bzw. anderweitig beschichteten Platten je nach Beschichtungstyp, Holzart, Dicke, Schnittrichtung und Herstellungsbedingungen so erhöhen, daß die gesetzlichen Erfordernisse nicht mehr erfüllt werden. Auch die formaldehydmindernde Wirkung des Absperrens (zum Beispiel durch das Furnier) gebt verloren und wird völlig überdeckt (vgl. Marutzky, R., Mehlhorn, L. und Wenzel, W., 1981: "Empfehlungen zur Verwendung von Spanplattan im Möbelbau", Vortrag, gehalten anläßlich des Symposiums der Mobil Oil AG in Grainau am 18. September 1981). Dies trifft insbesondere zu, wenn die Formate der furnierten Platten bzw. der Paneele sehr klein sind (vgl. ETB-Richtlinien).The use of these binders can increase the release of formaldehyde from the veneered or otherwise coated panels, depending on the type of coating, type of wood, thickness, cutting direction and production conditions, so that the legal requirements are no longer met. The formaldehyde-reducing effect of the barrier (for example due to the veneer) is lost and is completely masked (cf. Marutzky, R., Mehlhorn, L. and Wenzel, W., 1981: "Recommendations for the use of chipboard in furniture construction", lecture , held at the Mobil Oil AG symposium in Grainau on September 18, 1981). This is particularly true if the formats of the veneered panels or panels are very small (see ETB guidelines).
Der vorliegenden Erfindung liegt somit die Aufgabe zugrunde, ein Verfahren zur Verfügung zu stellen, gemäß dem es möglich ist, die Formaldehydabgabe von Span- und Faserplatten mit aufgebrachten Veredelungsschichten zu verringern, wobei die Platten selbst der Emissionsklasse E1 angehören, die Veredelungsschichten insbesondere wertvolle Furnierhölzer sind und unter Verwendung von Harnstoff-Formaldehyd-Harzen mit hohem Formaldehydgehalt aufgebracht worden sind.The present invention is therefore based on the object of providing a method according to which it is possible to reduce the formaldehyde release from chipboard and fibreboard with applied finishing layers, the panels themselves belonging to emission class E1, the finishing layers being particularly valuable veneer woods and have been applied using high formaldehyde urea-formaldehyde resins.
Das in der oben erwähnten europäischen Patentanmeldung EP-A-6486 beschriebene Verfahren eignet sich zur Lösung dieser Aufgabe nicht, da durch das Aufsprühen auf die bereits furnierten Platten von Harnstoff oder anderen Ammoniak abspaltenden Stoffen in Form einer wäßrigen Lösung die Veredelungsschichten beschädigt und stark verfürbt würden.The method described in the above-mentioned European patent application EP-A-6486 is not suitable for solving this problem, since spraying onto the already veneered panels of urea or other ammonia-releasing substances in the form of an aqueous solution would damage and severely discolour the finishing layers .
Überraschenderweise wurde jetzt gefunden, daß die oben genannte Aufgabe dadurch gelöst werden kann, daß die Platten vor dem Furnieren in an sich bekannter Weise mit wäßrigen Lösungen von Harnstoff und/oder anderen Ammoniak abspaltenden Verbindungen behandelt werden und daß anschließend in an sich bekannter Weise die Veredelungsschichten aufgebracht werden.Surprisingly, it has now been found that the above-mentioned object can be achieved in that the boards are treated in a manner known per se with aqueous solutions of urea and / or other compounds which release ammonia, and in that the finishing layers are then treated in a manner known per se be applied.
Die erfindungsgemäß behandelten Platten werden vorzugsweise mit Mahagoniholz furniert.The boards treated according to the invention are preferably veneered with mahogany wood.
Bei dem erfindungsgemäßen Verfahren werden als formaldehydreaktive Stoffe Harnstoff und/oder andere Ammoniak abspaltende Verbindungen, wie zum Beispiel Ammoniumcarbonat, verwendet. Solche Stoffe sind in der europäischen Patentanmeldung EP-A-12169 (entsprechend der DE-PS 28 29 021) beschrieben. Durch das erfindungsgemäße Verfahren soll nicht die Formaldehydabgabe der Rohplatten selbst vermindert werden, da bei dem erfindungsgemäßen Verfahren Platten der Emissionsklasse E1 verwendet werden, für deren Verwendung es im Bauwesen keiner weiteren Verringerung in ihrer Formaldehydemission bedarf. Erfindungsgemäß ist es möglich, Platten, die kaum Formaldehyd abgeben, unter Verwendung von HarnstoffFormaldehyd-Harzen zu furnieren, ohne daß die fertige furnierte Platte unzulässige Mengen an Formaldehyd abgibt. Die Spanplatte fungiert als Träger für den Formaldehydfänger. Durch die räumliche Trennung zwischen dem Harnstoff-Formaldehyd-Harz und dem Formaldehydfänger geht die Härtung des Harzes ungestört vonstatten, während der freie Formaldehyd in der Platte abgefangen wird (vgl. Erörterung des Standes der Technik in der DE-PS 28 51 589).In the process according to the invention, urea and / or other compounds which release ammonia, such as, for example, ammonium carbonate, are used as formaldehyde-reactive substances. Such substances are described in European patent application EP-A-12169 (corresponding to DE-PS 28 29 021). The method according to the invention is not intended to reduce the formaldehyde release of the raw panels themselves, since the method according to the invention uses panels of emission class E1, the use of which in construction does not require any further reduction in their formaldehyde emissions. According to the invention, it is possible to veneer panels that give off hardly any formaldehyde using urea-formaldehyde resins without the finished veneered panel giving off impermissible amounts of formaldehyde. The chipboard acts as a carrier for the formaldehyde scavenger. Due to the spatial separation between the urea-formaldehyde resin and the formaldehyde scavenger, the hardening of the resin takes place undisturbed, while the free formaldehyde is trapped in the plate (cf. discussion of the prior art in DE-PS 28 51 589).
Beim Furniervorgang wandert der frei vorliegende Formaldehyd von den Oberflächen der Platten in das Platteninnere,wo sich die Formaldehydfänger befinden (vgl. hierzu die Lehre der DE-PS 28 51 589). Dort reagiert der hineindiffundierende Formaldehyd mit den Formaldehydfängern. Auf diese Weise laßt sich die Formaldehydabgabe der furnierten Platten drastisch vermindern.During the veneer process, the free formaldehyde migrates from the surfaces of the panels into the interior of the panel, where the formaldehyde scavengers are located (cf. the teaching of DE-PS 28 51 589). There the formaldehyde that diffuses into it reacts with the formaldehyde scavengers. In this way, the formaldehyde release of the veneered panels can be drastically reduced.
Bei dem erfindungsgemäßen Verfahren werden wäßrige Lösungen von Harnstoff und/oder anderen Ammoniak abspaltenden Verbindungen verwendet. Die wäßrigen Lösungen können Konzentrationen im Bereich von 5% bis 60%, vorzugsweise von 30% bis 50%, aufweisen. Sie werden auf einfache Weise hergestellt, indem man die entsprechenden Verbindungen in Wasser löst. Als Ammoniak abspaltende Verbindungen können Ammoniumcarbonat, Ammoniumbicarbonat verwendet werden. Bevorzugt wird Harnstoff in Abmischung mit Anmoniumcarbonat verwendet. Der Anwendungsbereich der vorliegenden Erfindung ist nichtIn the process according to the invention, aqueous solutions of urea and / or other compounds which release ammonia are used. The aqueous solutions can have concentrations in the range from 5% to 60%, preferably from 30% to 50%. They are easily manufactured by dissolving the corresponding compounds in water. Ammonium carbonate, ammonium bicarbonate can be used as compounds which release ammonia. Urea mixed with ammonium carbonate is preferably used. The scope of the present invention is not
auf aminoplastharzgebundene Spanplatten der Emissionsklasse E1 beschränkt, sondern das erfindungsgemäße Verfahren läßt sich mit Erfolg auf isocyanatgebundene Spanplatten und phenolformaldehydharzgebundene Spanplatten anwenden, die von sich aus kaum oder gar keinen Formaldehyd abgeben, aber durch das Furnieren mit Aminoplastharzen als Bindemittel an Formaldehydabgabepotential gewinnen. Auch emissionsarme Faserplatten können entsprechend dem Verfahren behandelt werden.limited to aminoplast resin-bonded chipboard of emission class E1, but the process according to the invention can be successfully applied to isocyanate-bonded chipboard and phenol-formaldehyde-resin-bonded chipboard which release little or no formaldehyde on their own, but gain formaldehyde release potential by veneering with aminoplast resins as binders. Low-emission fiberboard can also be treated in accordance with the process.
Das folgende Beispiel erläutert die Erfindung, ohne sie zu beschränken.The following example illustrates the invention without restricting it.
Eine Spanplatte der Emissionsklasse E1 [Perforatorwert 8,0 mg (jodometrisch) bzw. 6,1 mg (photometrisch)/100 g atro Platte] wurde mit 220 g/m² einer 50%igen Harnstoff-Formaldehyd-Harzlösung (Molverhältnis 1:1,6) bestrichen und anschließend mit einem Furnier (Mahagoni, Dicke 0,6 mm) beschichtet.A chipboard of emission class E1 [perforator value 8.0 mg (iodometric) or 6.1 mg (photometric) / 100 g dry plate] was coated with 220 g / m² of a 50% urea-formaldehyde resin solution (molar ratio 1: 1, 6) coated and then coated with a veneer (mahogany, thickness 0.6 mm).
Zum Vergleich wurde die gleiche Platte vor dem Furnieren unter den gleichen Bedingungen mit einer 30%igen Harnstofflösung in einer Mengo von 100 g/m² besprüht und anschließend, wie beschrieben, furniert.For comparison, the same panel was sprayed with a 30% urea solution in a Mengo of 100 g / m² before veneering under the same conditions and then veneered as described.
In den folgenden Tabellen sind die Formaldehydabgabebeträge der furnierten Spanplatten nach der WKI-Methode (Roffael,E., 1975: Messung der Formaldehydabgabe. Praxisnahe Methode zur Ermittlung der Formaldehydabgabe harnstoffharzgebundener Spanplatten für das Bauwesen. Holz-Zentralblatt 101, Seiten 1403 bis 1404) wiedergegeben. Fallweise wurden auch die Formaldehydabgabebeträge der unfurnierten Platte mit angegeben. Aus den tabellierten Angaben wird deutlich, daß durch die Behandlung der Spanplatten mit formaldehydreaktiven Stoffen eine erhebliche Verminderung der Formaldehydabgabe gegenüber den unbehandelten Platten eintritt. Diese Verminderung liegt nach einer Prüfdauer von 144 h im WKI-Test bei über 30%. Die Formaldehydabgabebeträge wurden an furnierten Spanplatten nach der Perforatormethode nicht bestimmt, da die Perforatormethode auf beschichtete oder anderweitig oberflächenbehandelte Platten nach der ETB-Richtlinie nicht anwendbar ist.
Claims (5)
- Process for reducing the formaldehyde emission by chipboards and fibreboards veneered with finishing layers, the boards falling into emission class E1, and the veneer bonding being carried out with a urea formaldehyde resin as a binder, characterised in that the boards are treated, prior to veneering, in a conventional manner with aqueous solutions of urea and/or other compounds which give off ammonia, and that the finishing layers are subsequently applied in a conventional manner.
- Process according to Claim 1, characterised in that chipboards or fibreboards are used which are bound with alkaline phenol formaldehyde resins or diisocyanate resins.
- Process according to Claim 1, characterised in that the treatment with the agueous solutions is effected by spraying.
- Process according to one of the preceding claims, characterised in that the aqueous solutions have concentrations in the range from 5% to 60%.
- Process according to one of the preceding claims, characterised in that the compounds used which give off ammonia are ammonium carbonate, ammonium bicarbonate or urea in admixture with ammonium carbonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT84114876T ATE93444T1 (en) | 1983-12-07 | 1984-12-06 | PROCESS FOR REDUCING FORMALDEHYDE RELEASE FROM VENEER CHIPBOARD AND FIBERBOARD. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3344239A DE3344239C2 (en) | 1983-12-07 | 1983-12-07 | Process for reducing the formaldehyde release from chipboard and fiberboard veneered with finishing layers |
| DE3344239 | 1983-12-07 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0144985A2 EP0144985A2 (en) | 1985-06-19 |
| EP0144985A3 EP0144985A3 (en) | 1987-11-11 |
| EP0144985B1 true EP0144985B1 (en) | 1993-08-25 |
Family
ID=6216269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP84114876A Expired - Lifetime EP0144985B1 (en) | 1983-12-07 | 1984-12-06 | Method of decreasing the formaldehyde emission of veneered chip and fibre boards |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0144985B1 (en) |
| AT (1) | ATE93444T1 (en) |
| DE (2) | DE3344239C2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821636B2 (en) | 2001-03-12 | 2004-11-23 | Akzo Nobel N.V. | Method of producing formaldehyde laden layered products having reduced emission of formaldehyde |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3815204A1 (en) * | 1988-05-04 | 1989-11-16 | Gruber & Weber Gmbh Co Kg | PROCESS FOR PRODUCING COMPOSITE MATERIALS WITH REDUCED FORMALDEHYDE EMISSION |
| DE3943488C2 (en) * | 1989-09-14 | 1999-05-27 | Dieter Ekkehard Dip Autenrieth | Process for reducing or eliminating free formaldehyde with carbamates, which are generated on the substrate in the critical phase when formaldehyde is released |
| DE4234871C1 (en) * | 1992-10-17 | 1994-03-17 | Achim Dr Ing Moeller | Method and device for the production of wood-based panels |
| US6749949B2 (en) * | 2001-03-12 | 2004-06-15 | Akzo Nobel N.V. | Method of producing formaldehyde laden layered products having reduced emission of formaldehyde |
| ES2315346T3 (en) * | 2001-03-12 | 2009-04-01 | Akzo Nobel Coatings International B.V. | METHOD TO REDUCE THE EMISSION OF FORMALDEHYDE OF STRATIFIED PRODUCTS. |
| HUE039471T2 (en) * | 2007-01-11 | 2019-01-28 | Fritz Egger Gmbh & Co Og | Method for manufacturing a moulded form containing cellulose |
| EP2181818A3 (en) | 2008-10-28 | 2012-08-22 | IHD Institut für Holztechnologie Dresden gGmbH | Method for manufacturing wood fibre substances and wood fibre substances with lower emissions of volatile VOC |
| EP4023812A1 (en) | 2020-12-29 | 2022-07-06 | MM BOARD & PAPER GmbH | Method for producing wood-based products |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5028484B2 (en) * | 1971-12-15 | 1975-09-16 | ||
| FI70385C (en) * | 1978-04-28 | 1991-08-27 | Casco Ab | SAETT ATT FRAMSTAELLA CELLULOSABASERADE SKIVMATERIAL OCH KOMPOSITION HAERFOER. AL OCH COMPOSITION HAERFOER |
| DE2829021C2 (en) * | 1978-07-01 | 1980-08-28 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen | Process for reducing the formaldehyde release from chipboard |
| DE2851589C3 (en) * | 1978-11-29 | 1983-06-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 8000 München | Multi-layer chipboard or fiberboard that contains an aminoplast as a binding agent in a sub-area or sub-areas |
-
1983
- 1983-12-07 DE DE3344239A patent/DE3344239C2/en not_active Expired
-
1984
- 1984-12-06 DE DE84114876T patent/DE3486202D1/en not_active Expired - Fee Related
- 1984-12-06 AT AT84114876T patent/ATE93444T1/en not_active IP Right Cessation
- 1984-12-06 EP EP84114876A patent/EP0144985B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821636B2 (en) | 2001-03-12 | 2004-11-23 | Akzo Nobel N.V. | Method of producing formaldehyde laden layered products having reduced emission of formaldehyde |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3486202D1 (en) | 1993-09-30 |
| DE3344239A1 (en) | 1985-08-01 |
| ATE93444T1 (en) | 1993-09-15 |
| EP0144985A3 (en) | 1987-11-11 |
| DE3344239C2 (en) | 1986-07-24 |
| EP0144985A2 (en) | 1985-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0012169B1 (en) | Multi-layered, mainly aminoplast-bound particle or fibre board | |
| DE2829021C2 (en) | Process for reducing the formaldehyde release from chipboard | |
| EP0144985B1 (en) | Method of decreasing the formaldehyde emission of veneered chip and fibre boards | |
| EP0896008B1 (en) | Binder composition, its use and process for the manufacture of chip boards | |
| EP0699510B1 (en) | Method for reducing the formaldehyde emission from lignocellulosic products | |
| WO1991005020A1 (en) | Moulded items of wood or cellulose-containing substances and method for making them | |
| EP1266730B1 (en) | Method of manufacturing moisture resistant fibreboards | |
| DE2423842A1 (en) | METHOD OF MANUFACTURING FLAME-RESISTANT PANELS OR THE LIKE, A FLAME-RETARDANT MIXTURE AND A FLAME-RETARDANT BINDING COMPOSITION THAT CONTAINS SUCH A MIXTURE | |
| EP0162974A1 (en) | Process for the manufacture of products made of wood particles | |
| EP0018355B1 (en) | Wood chip board and process for its production | |
| EP0038408B1 (en) | Process for the manufacture of wood boards with a low emission of formaldehyde | |
| DE19751326C2 (en) | Process for the production of wood materials using used, residual and waste wood materials | |
| EP0307812A2 (en) | Multilayered plywood and its manufacture | |
| DE10121651B4 (en) | Process for reducing the release of formaldehyde | |
| WO2005018890A1 (en) | Method for producing a multilayer fibreboard | |
| EP1048424A2 (en) | Composite corkplate and method for the production thereof | |
| DE2615288B1 (en) | Process for the production of chipboard | |
| DD149182B3 (en) | METHOD FOR PRODUCING WOOD MATERIALS WITH VERY LOW FORMALDEHYDE LEAVE | |
| DE2724439B2 (en) | Process for the production of formaldehyde-free chipboard | |
| EP0023002B1 (en) | Process for reducing the emission of formaldehyde by chip boards | |
| EP1430101B1 (en) | Method for the production of moulded bodies comprising lignocellulose | |
| DD240167A5 (en) | EASY FLAMMABLE, PLANED PLATED PANELS, IN PARTICULAR WOOD WITH FURNISHINGS OR POULTRY PLANTS | |
| EP0254040B1 (en) | Hardener for aminoplasts, its use for sizing wooden surfaces and process for sizing wooden surfaces | |
| DE19820833A1 (en) | Recycling used chipboard and fiberboard materials | |
| EP4219106A1 (en) | Method for producing a fibre panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19841218 |
|
| AK | Designated contracting states |
Designated state(s): AT BE CH DE FR GB LI NL SE |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SWEDSPAN AB |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE FR GB LI NL SE |
|
| 17Q | First examination report despatched |
Effective date: 19890524 |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: CASCO NOBEL AB |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE FR GB LI NL SE |
|
| REF | Corresponds to: |
Ref document number: 93444 Country of ref document: AT Date of ref document: 19930915 Kind code of ref document: T |
|
| ET | Fr: translation filed | ||
| REF | Corresponds to: |
Ref document number: 3486202 Country of ref document: DE Date of ref document: 19930930 |
|
| GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 19940307 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed | ||
| EAL | Se: european patent in force in sweden |
Ref document number: 84114876.0 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19971127 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19971209 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19971212 Year of fee payment: 14 Ref country code: AT Payment date: 19971212 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 19971218 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 19971223 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 19980106 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19980217 Year of fee payment: 14 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981206 Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981206 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981207 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981231 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981231 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981231 |
|
| BERE | Be: lapsed |
Owner name: CASCO NOBEL A.B. Effective date: 19981231 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990701 |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19981206 |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990831 |
|
| NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 19990701 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19991001 |