EP0111482A4 - Apparatus for trimming of piezoelectric components. - Google Patents

Apparatus for trimming of piezoelectric components.

Info

Publication number
EP0111482A4
EP0111482A4 EP19820902309 EP82902309A EP0111482A4 EP 0111482 A4 EP0111482 A4 EP 0111482A4 EP 19820902309 EP19820902309 EP 19820902309 EP 82902309 A EP82902309 A EP 82902309A EP 0111482 A4 EP0111482 A4 EP 0111482A4
Authority
EP
European Patent Office
Prior art keywords
housing
laser
electromagnetic energy
trimming
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19820902309
Other languages
German (de)
French (fr)
Other versions
EP0111482A1 (en
Inventor
Roger Claes
Jean Vannoppen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
GTE Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTE Products Corp filed Critical GTE Products Corp
Publication of EP0111482A1 publication Critical patent/EP0111482A1/en
Publication of EP0111482A4 publication Critical patent/EP0111482A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H13/00—Measuring resonant frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient

Definitions

  • the subject invention relates to the fabrication of piezoelectric components and, more particularly, to the frequency trimming of same.
  • piezoelectric materials that is materials characterized by an ability to transform elec ⁇ trical energy to mechanical energy, and vice versa, have widespread application in electronic equipment.
  • such materials are extensively used, for example, as resonators and filters and as such are required to exhi ⁇ bit stringent frequency response (accuracy and stability) characteristics.
  • both bulk and surface wave filters and resonators typically demand some degree of "trimming" to compensate for finite tolerances attribut ⁇ able to material and production variances.
  • quartz filters are typically comprised of two or more resonators arranged in various configurations.
  • the filters composite frequency response can be trimmed by adjusting the resonant frequency of the component resonators irrespective of whether the resonator are arranged as discrete blanks, stacked arrays or multi-resonator structures deposited on a single wafer.
  • FIG. 1 depicts a representative surface acoustic wave (SAW) filter including a number of interdigitated fingers (21), some of which (22), have been disconnected so as to achieve frequency trimming.
  • SAW surface acoustic wave
  • Such effects are posited to to have their origin in the thermal or mechanical stres ⁇ ses induced by moisture, changes in air pressure, and stray capacitance introduced by the encapsulation process. Because such phenomena are effectively inamenable to amelioration once the component has been sealed, it is necessary that they be anticipated and, to the extent predictable, accomodated during the trimming procedure. That is, the resonant frequency of the device is trimmed to a frequency offset by a predetermined amount from the desired frequency with the expectation that the final frequency, after encapulation, will be accurate.
  • an apparatus for trimming piezoelectric components of the type chracterized by a piezoelectric substrate upon which is depositied a conductive material includes a housing for the device at least a portion of which is substantially transparent to electromagnetic energy at a predetermined wavelength.
  • Laser means pro ⁇ vides energy at the predetermined wavelength and with sufficient intensity to evaporated the conductive mater ⁇ ial.
  • a test circuit coupled to the device monitors specific frequency-related characteristics and provides a corresponding output to a control system. The control system dictates the operation of a deflection system that
  • OMPI s V ⁇ p0 v_ * directs the electromagnetic energy provided by the laser means and a laser power control device that regulates the intensity of that energy.
  • Figure 1 depicts a typical quartz crystal filter including the quartz blank, frequency plating, and conductive electrodes.
  • Figure 2 depicts a representative SAW (Surface Acoustic Wave) filter including a number of interdigi- tated conductive fingers, some of which have been severed so as to achieve frequency trimming.
  • SAW Surface Acoustic Wave
  • Figure 3 illustrates an apparatus for effecting frequency trimming of an encapsualted piezoelectric component, for example, a quartz crystal resonator.
  • a quartz resonator including a quartz blank, con ⁇ ductive electrodes and a glass cover, especially amenable to laser trimming is illustrated in Figure 4.
  • OMPI in accordance with this invention, there is illus ⁇ trated in Figure 3 an apparatus for providing a frequency trimming of an encapulated piezoelectric component, be it a quartz crystal resonator, surface acoustic wave filter or similar device.
  • the device to be trimmed, 1, is in ⁇ serted in a test circuit 2 in such a manner that it is directed toward an optical beam 3 generated by Q-switched Nd-YAG laser 4.
  • the laser is a pulsed Nd-YAG type capa ⁇ ble of delivering a focused beam that will produce sufficient heat to evaporate metal from the electrodes of, for example, a quartz resonator.
  • the laser beam is appropriately directed by an X-Y deflection system 5 equipped with the necessary optical devices including, by way of illustration, a pair of optical mirrors 6.
  • the direction of the beam is controlled by a test system 7 that delivers control signals to the deflection system and to the laser power control 8.
  • the test system, power control and x-y deflection system operate to control the intensity and direction of the laserbeam so as to simul- taneously scan the surface of the device to be trimmed and to modulate the trimming rate as the resonant fre ⁇ quency (or some other specified characteristic frequency) approaches its final value.
  • a quartz resonator especially amenable to trimming is illustrated in Figure 4.
  • the resonator includes a quartz blank 41, electrodes 42 and a glass cover 43.
  • a salient feature of the resonator is the glass cover 43.
  • the cover is transparent to the optical energy generated by the laser so that the laserbeam is allowed to impinge on the electrodes of the resonator and thereby cause the evaporation of sufficient electrode mass to achieve trim ⁇ ming.
  • Such a quartz resonator may be fabricated according to the following technique.
  • the quartz crystal is conductively bonded to lead-in wires, that is to say, one electrode is electrically and physically connected to one of the lead-in wires and the other electrode is electri ⁇ cally and physically connected to the other lead-in wire.
  • the conductive bond may be made, for example, by electri- cally conductive bonding material, for example, silver- filled epoxy. Or it may be made by soldering, welding and the like.
  • the quartz crystal is then inserted into an open-ended glass tube of suitable diameter and length. The extremities of the lead-in wires protrude outside the glass tube and are secured in a suitable external holder to properly position the quartz crystal within the glass tube.
  • the end of the glass tube is then heated to its softening point and pressed together to seal the end by forming a press seal, the lead-in wires being embedded in the press seal.
  • the lead-in wires are of a type readily sealable to glass, for example, Dumet wire for sealing to soft glass.
  • Dumet comprises a nickel-iron core within a copper sheath.
  • the press seal solidifies and rigidly holds the lead-in wires and quartz crystal.
  • a circumferential section of the glass tube near the other end thereof is heated to its softening point and the end is then drawn apart from the main body of the glass tube to form a necked-down portion in the glass tube.
  • the necked-down portion which is of smaller diameter than the glass tube and is suitable as an exhaust tubulation to exhaust, tipoff and seal the glass tube with the quartz crystal therewithin.
  • the exhaust tubulation may be tipped off under vacuum, to maintain a vacuum within the glass tube.
  • an inert gas for example, dry nitrogen, may be introduced into the glass tube prior to tip-off of the exhaust tube.
  • a cooling gas e.g.
  • OMPI nitrogen may be flowed into the glass tube during the sealing steps in order to cool the quartz crystal and prevent it from being heated above the curie point of the quartz material.
  • Figure 4 shows one embodiment of an encapsulated quartz crystal in accordance with this invention.
  • the quartz crystal comprises a flat circular disk about 8mm in diameter by 0.5mm thick.
  • the metallized portion of each surface is about 6mm in diameter.
  • Lead-in wires are made of Dumet, 0.35mm thick, and are fastened to the electrodes.
  • a glass tube is 11mm outside diameter by 20mm long (internal length).
  • a press seal about 9mm wide by about 7mm long and is about 2.5mm thick. After exhausting and filling with nitrogen, the glass tube is sealed at tip-off.
  • the lead-in wires can be embedded in glass bead prior to press sealing in order to bend and hold the wires in the correct position for fast ⁇ ening the crystal.
  • the glass tube be flattened into, say a flat sub- stantially rectangular, as opposed to circular shape, in order to reduce the size of the glass tube or in order to accommodate a rectangular quartz crystal.
  • the open-ended round glass tube would be heated and flattened prior to mounting of the quartz crystal/lead-in wire assembly therein. After embedment of said assembly in a press seal at one end of the flatened glass tube, the other end could also be sealed by a press seal with ⁇ out the need of an exhaust tubulation.
  • nitrogen for example, could be introduced into the interior of the flattened glass tube by means of a small diameter hollow metal needle inserted therein while the glass was heated to its softened point. At the proper time, the needle would be removed and the press seal made immediately, thereby providing the desired nitrogen fill within the glass tube.
  • OMPI ⁇ tfNATlC-$> The technique described above results in a resonator entirely enclosed by glass.
  • the reso ⁇ nator may be enclosed by a standard metal cover which has been provided with a glass window as shown in Figure 5.
  • the window 51 may be comprised of any otherwise suitable material transparent to energy at the laserbeam wave ⁇ length. (In a particular embodiment this wavelength was 1.06 micrometers.)
  • the window may be preferrably disc ⁇ shaped and susceptible to attachment to the metal cover 52 by, for example, glue or a glass-to-metal seal. The diameter of the disc-shaped window should be large enough so that the laserbeam is allowed to impinge on substan ⁇ tially the entire electrode surface.
  • a SAW structure such as the one illustrated in Figure 6 is amenable to the laser trimming technique described herein.
  • the trimming technique and implementing apparatus have been found to offer numerous significant advantages in the area fabrication and trimming of piezoelectric components. To wit: The post-encapsulation trimming of those devices permits less stringent handling procedures resulting in fewer rejected parts. Avoidance of the pre- encapsulation offset trimming technique provides more precise trimming and a closer approach to the desired ultimate frequency characteristics of the device.
  • the post-encapsulation trim- ming technique allows the encapsulated device to be stored for a period of time before the final trimming procedure is performed.
  • This is decidedly an advantage because of the "aging" effect characteristics of such device. That is to say, a large portion of the total frequency shift of the device is found to occur within a relative short period after fabrication.
  • the effects of this "short term" aging can be accordingly circumvented.
  • the total long-term frequency drift i.e., the total drift after a period on the order of one year
  • the total long-term frequency drift can be expeced to be reduced from approximate 10 ppm (parts per million) when trimmed before encapsulation to about 3 ppm when trimmed subsequent encapsulation.
  • the subject invention is useful in the fabrication of frequency selective piezoelectric devices.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

An apparatus for trimming piezoelectric components of the type characterized by a piezoelectric substrate (41) upon which is deposited a conductive material (42). The apparatus includes a housing (52) for the device at least a portion of which (51) is substantially transparent to electromagnetic energy at a predetermined wavelength. A laser (4) provides energy at the predetermined wavelength and with sufficient intensity to evaporate the conductive material. A test circuit coupled (2) to the device monitors specific frequency-related characteristics and provides a corresponding output to a control system (7). The control system (7) dictates the operation of a deflection system that directs the electromagnetic energy provided by the laser means (4) and a laser power control device (8) that regulates the intensity of that energy.

Description

APPARATUS FOR TRIMMING OF PIEZOELECTRIC COMPONENTS
TECHNICAL FIELD
The subject invention relates to the fabrication of piezoelectric components and, more particularly, to the frequency trimming of same.
BACKGROUND OF INVENTION
As is well known, piezoelectric materials, that is materials characterized by an ability to transform elec¬ trical energy to mechanical energy, and vice versa, have widespread application in electronic equipment. To wit: such materials are extensively used, for example, as resonators and filters and as such are required to exhi¬ bit stringent frequency response (accuracy and stability) characteristics. As a result both bulk and surface wave filters and resonators typically demand some degree of "trimming" to compensate for finite tolerances attribut¬ able to material and production variances.
With regard to bulk wave devices, trimming processes have heretofore been largely limited to ad hoc addition or removal of pieozelectric material in order to achieve the specified frequency characteristics. Surface wave devices, on the other hand, have been frequency trimmed by ablation or abscission of conductive coatings pre¬ viously deposited on the surface of peizoelectric mater- ial. For example, quartz crystal resonators are trimmed by the removal or addition of precisely controlled amounts of material from or to one or both of the elec¬ trodes deposited on the major faces of the blank. A typical quartz filter illustrating the quartz blank (11), frequency plating (12), and conductive electrodes (13), is shown in Figure 1. The modification in massloading is accompanied by a frequency change in the resonator and is monitored and continued until the specified performance is achieved. In practice quartz filters are typically comprised of two or more resonators arranged in various configurations. Here too the filters composite frequency response can be trimmed by adjusting the resonant frequency of the component resonators irrespective of whether the resonator are arranged as discrete blanks, stacked arrays or multi-resonator structures deposited on a single wafer.
Historically trimming had been effected by vacuum deposition of controlled amounts of a precious metal onto the electrode or by exposure of the electrodes to a reac- tive atmosphere such as iodine (for silver electrodes). More recently a laserbeam has been used to evaporate material deposited on the pieozelectric material. ' The resonant frequency of the resonator increases as the attendant massloading decreases. A plurality of methods for trimming surface wave components have also been disclosed. Here too lasers have been utilized to cut portions of predeposited conductive structures, thereby disconnecting those structures form the piezoelectric substrate. Figure 2 depicts a representative surface acoustic wave (SAW) filter including a number of interdigitated fingers (21), some of which (22), have been disconnected so as to achieve frequency trimming.
Although generally effective, the above-mentioned trimming techniques suffer from a common disadvantage: each requires the trimming procedure to be performed prior to final encapsulation of the component, the grava¬ men being that the encapsulation process itself will likely have a significant effect on the frequency charac- teristics of the device. Such effects are posited to to have their origin in the thermal or mechanical stres¬ ses induced by moisture, changes in air pressure, and stray capacitance introduced by the encapsulation process. Because such phenomena are effectively inamenable to amelioration once the component has been sealed, it is necessary that they be anticipated and, to the extent predictable, accomodated during the trimming procedure. That is, the resonant frequency of the device is trimmed to a frequency offset by a predetermined amount from the desired frequency with the expectation that the final frequency, after encapulation, will be accurate.
Clearly a trimming scheme allows final trimming to be performed subsequent encapulation represents a welcome advance in the art of fabricating frequency-selective piezoelectric components. As will become evident, such an advance in the art is achieved by the subject inven¬ tion.
DISCLOSURE OF THE INVENTION
The above and other objects, advantages and capabi¬ lities are achieved in one aspect of this invention by an apparatus for trimming piezoelectric components of the type chracterized by a piezoelectric substrate upon which is depositied a conductive material. The apparatus includes a housing for the device at least a portion of which is substantially transparent to electromagnetic energy at a predetermined wavelength. Laser means pro¬ vides energy at the predetermined wavelength and with sufficient intensity to evaporated the conductive mater¬ ial. A test circuit coupled to the device monitors specific frequency-related characteristics and provides a corresponding output to a control system. The control system dictates the operation of a deflection system that
"BU EAIΓ
OMPI s Vπp0 v_* directs the electromagnetic energy provided by the laser means and a laser power control device that regulates the intensity of that energy.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 depicts a typical quartz crystal filter including the quartz blank, frequency plating, and conductive electrodes.
Figure 2 depicts a representative SAW (Surface Acoustic Wave) filter including a number of interdigi- tated conductive fingers, some of which have been severed so as to achieve frequency trimming.
Figure 3 illustrates an apparatus for effecting frequency trimming of an encapsualted piezoelectric component, for example, a quartz crystal resonator. A quartz resonator, including a quartz blank, con¬ ductive electrodes and a glass cover, especially amenable to laser trimming is illustrated in Figure 4.
An alternative configuration in which the resonator is enclosed in a standard metal cover which has been pro- vided a transparent window is shown in Figure 5.
A corresponding SAW configuration is shown in Figure 6.
BEST MODE FOR CARRYING OUT THE INVENTION
For a better understanding of the present invention, together with the objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in conjunction with the above- described drawings.
OMPI In accordance with this invention, there is illus¬ trated in Figure 3 an apparatus for providing a frequency trimming of an encapulated piezoelectric component, be it a quartz crystal resonator, surface acoustic wave filter or similar device. The device to be trimmed, 1, is in¬ serted in a test circuit 2 in such a manner that it is directed toward an optical beam 3 generated by Q-switched Nd-YAG laser 4. The laser is a pulsed Nd-YAG type capa¬ ble of delivering a focused beam that will produce sufficient heat to evaporate metal from the electrodes of, for example, a quartz resonator. The laser beam is appropriately directed by an X-Y deflection system 5 equipped with the necessary optical devices including, by way of illustration, a pair of optical mirrors 6. The direction of the beam is controlled by a test system 7 that delivers control signals to the deflection system and to the laser power control 8. The test system, power control and x-y deflection system operate to control the intensity and direction of the laserbeam so as to simul- taneously scan the surface of the device to be trimmed and to modulate the trimming rate as the resonant fre¬ quency (or some other specified characteristic frequency) approaches its final value.
A quartz resonator especially amenable to trimming is illustrated in Figure 4. The resonator includes a quartz blank 41, electrodes 42 and a glass cover 43. A salient feature of the resonator is the glass cover 43. The cover is transparent to the optical energy generated by the laser so that the laserbeam is allowed to impinge on the electrodes of the resonator and thereby cause the evaporation of sufficient electrode mass to achieve trim¬ ming.
Such a quartz resonator may be fabricated according to the following technique. First, the quartz crystal is conductively bonded to lead-in wires, that is to say, one electrode is electrically and physically connected to one of the lead-in wires and the other electrode is electri¬ cally and physically connected to the other lead-in wire. The conductive bond may be made, for example, by electri- cally conductive bonding material, for example, silver- filled epoxy. Or it may be made by soldering, welding and the like. The quartz crystal is then inserted into an open-ended glass tube of suitable diameter and length. The extremities of the lead-in wires protrude outside the glass tube and are secured in a suitable external holder to properly position the quartz crystal within the glass tube. The end of the glass tube is then heated to its softening point and pressed together to seal the end by forming a press seal, the lead-in wires being embedded in the press seal. For this purpose, the lead-in wires are of a type readily sealable to glass, for example, Dumet wire for sealing to soft glass. Dumet comprises a nickel-iron core within a copper sheath. Upon cooling, the press seal solidifies and rigidly holds the lead-in wires and quartz crystal. Next, a circumferential section of the glass tube near the other end thereof is heated to its softening point and the end is then drawn apart from the main body of the glass tube to form a necked-down portion in the glass tube. Said end is then cut off or otherwise removed, leaving the necked-down portion which is of smaller diameter than the glass tube and is suitable as an exhaust tubulation to exhaust, tipoff and seal the glass tube with the quartz crystal therewithin. After exhausting (by vacuum) the atmosphere within the glass tube, the exhaust tubulation may be tipped off under vacuum, to maintain a vacuum within the glass tube. Or an inert gas, for example, dry nitrogen, may be introduced into the glass tube prior to tip-off of the exhaust tube. If necessary, a cooling gas, e.g.
OMPI nitrogen may be flowed into the glass tube during the sealing steps in order to cool the quartz crystal and prevent it from being heated above the curie point of the quartz material. Figure 4 shows one embodiment of an encapsulated quartz crystal in accordance with this invention. The quartz crystal comprises a flat circular disk about 8mm in diameter by 0.5mm thick. The metallized portion of each surface is about 6mm in diameter. Lead-in wires are made of Dumet, 0.35mm thick, and are fastened to the electrodes. A glass tube is 11mm outside diameter by 20mm long (internal length). A press seal about 9mm wide by about 7mm long and is about 2.5mm thick. After exhausting and filling with nitrogen, the glass tube is sealed at tip-off. If desired, the lead-in wires can be embedded in glass bead prior to press sealing in order to bend and hold the wires in the correct position for fast¬ ening the crystal. In some cases, it may be desirable that the glass tube be flattened into, say a flat sub- stantially rectangular, as opposed to circular shape, in order to reduce the size of the glass tube or in order to accommodate a rectangular quartz crystal. In such a case, the open-ended round glass tube would be heated and flattened prior to mounting of the quartz crystal/lead-in wire assembly therein. After embedment of said assembly in a press seal at one end of the flatened glass tube, the other end could also be sealed by a press seal with¬ out the need of an exhaust tubulation. In such a case, nitrogen, for example, could be introduced into the interior of the flattened glass tube by means of a small diameter hollow metal needle inserted therein while the glass was heated to its softened point. At the proper time, the needle would be removed and the press seal made immediately, thereby providing the desired nitrogen fill within the glass tube.
"βlTREAlr
OMPI ^tfNATlC-$> The technique described above results in a resonator entirely enclosed by glass. As an alternative the reso¬ nator may be enclosed by a standard metal cover which has been provided with a glass window as shown in Figure 5. The window 51 may be comprised of any otherwise suitable material transparent to energy at the laserbeam wave¬ length. (In a particular embodiment this wavelength was 1.06 micrometers.) The window may be preferrably disc¬ shaped and susceptible to attachment to the metal cover 52 by, for example, glue or a glass-to-metal seal. The diameter of the disc-shaped window should be large enough so that the laserbeam is allowed to impinge on substan¬ tially the entire electrode surface. In practice a diameter equal to or somewhat less than that of the elec- trode is sufficient since the extremities of the elec¬ trode surface have been found less sensitive to frequency trimming by evaporation. A SAW structure such as the one illustrated in Figure 6 is amenable to the laser trimming technique described herein. The trimming technique and implementing apparatus have been found to offer numerous significant advantages in the area fabrication and trimming of piezoelectric components. To wit: The post-encapsulation trimming of those devices permits less stringent handling procedures resulting in fewer rejected parts. Avoidance of the pre- encapsulation offset trimming technique provides more precise trimming and a closer approach to the desired ultimate frequency characteristics of the device. And, probably most significantly, the post-encapsulation trim- ming technique allows the encapsulated device to be stored for a period of time before the final trimming procedure is performed. This is decidedly an advantage because of the "aging" effect characteristics of such device. That is to say, a large portion of the total frequency shift of the device is found to occur within a relative short period after fabrication. By postponing the final trimming procedure the effects of this "short term" aging can be accordingly circumvented. As an example the total long-term frequency drift (i.e., the total drift after a period on the order of one year) can be expeced to be reduced from approximate 10 ppm (parts per million) when trimmed before encapsulation to about 3 ppm when trimmed subsequent encapsulation.
Accordingly, while there has been shown and desribed what at present are considered to be the preferred embod¬ iments of the invention, it will be obvious to those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention as defined by the appended claims.
INDUSTRIAL APPLICABILITY
The subject invention is useful in the fabrication of frequency selective piezoelectric devices.
IJUREAU OMPI

Claims

WHAT IS CLAIMED IS:
1. An apparatus for trimming a frequency-selective device chracterized by a piezoelectric substrate upon which is deposited a conductive material, said apparatus comprising:
a housing for enclosing the device, said housing at least partially substantially transparent to electromagnetic energy at a predetermined wavelength,
laser means for providing electromagnetic energy at the predetermined wavelength and with sufficient intensity to cause evaporation of the conductive material,
a test circuit coupled to the device for monitoring specific frequency-related characteristics of the device and for providing an output in response thereto,
deflection means for directing the electromagnetic energy provided by the laser means,
a laser power-control device for controlling the intensity of the electromagnetic energy provided by the laser means, and
a control system having an input coupled to the output of the test circuit, said control system coupled to the deflection means and coupled to the laser power control device for controlling the operation of the deflection means and the laser power control device.
'BU EATT
OMPI
^R™ϊτi 2. An apparatus as defined in Claim 1 wherein the housing comprises a generally disc-shaped window substantially transparent to optical energy.
3. An apparatus as defined in Claim 2 wherein the window is comprised of glass.
4. An apparatus as defined in Claim 3 wherein the window is glued to the remainder of the housing.
5. An apparatus as defined in Claim 3 wherein the remainder of the housing comprises a metal and the window is attached to the housing through a glass-to-metal seal.
6. An apparatus as defined in Claim 1 wherein the housing is comprised of glass.
7. An apparatus as defined in Claim 1 wherein the housing is comprised of quartz.
8. An apparatus as defined in either Claim 1, Claim 2, Claim 6, or Claim 7 wherein at least a portion of the housing is substantially transparent to electromagnetic energy at a wavelength of approximately 1.06 micrometer.
9. An apparatus as defined in Claim 1 wherein the deflection means comprises a pair of optical mirrors.
10. An apparatus as defined in Claim 9 wherein the deflection means is capable of directing electromagnetic energy in two directions.
11. An apparatus as defined in Claim 1 wherein the laser means is a Q-switched Nd-YAG laser.
EP19820902309 1982-06-14 1982-06-14 Apparatus for trimming of piezoelectric components. Withdrawn EP0111482A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1982/000822 WO1984000081A1 (en) 1982-06-14 1982-06-14 Apparatus for trimming of piezoelectric components

Publications (2)

Publication Number Publication Date
EP0111482A1 EP0111482A1 (en) 1984-06-27
EP0111482A4 true EP0111482A4 (en) 1986-12-01

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Country Status (2)

Country Link
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FI78782C (en) * 1986-01-10 1989-09-11 Valmet Oy A method for producing a piezoresistive resistance element with a device applying the method and a sensor produced by the method, in particular a pressure sensor or equivalent.
GB2199985B (en) * 1986-12-22 1991-09-11 Raytheon Co Surface acoustic wave device
CN108548656B (en) * 2018-03-29 2021-08-03 昂纳信息技术（深圳）有限公司 Test device and test system for TO-CAN laser

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US3768157A (en) * 1971-03-31 1973-10-30 Trw Inc Process of manufacture of semiconductor product
US3766616A (en) * 1972-03-22 1973-10-23 Statek Corp Microresonator packaging and tuning
US3840804A (en) * 1973-05-21 1974-10-08 F Sauerland Crystal frequency monitor
US3913195A (en) * 1974-05-28 1975-10-21 William D Beaver Method of making piezoelectric devices
US4021898A (en) * 1976-05-20 1977-05-10 Timex Corporation Method of adjusting the frequency of vibration of piezoelectric resonators
US4154530A (en) * 1977-12-22 1979-05-15 National Semiconductor Corporation Laser beam error correcting process
US4131484A (en) * 1978-02-13 1978-12-26 Western Electric Company, Inc. Frequency adjusting a piezoelectric device by lasering
JP3130373B2 (en) * 1992-06-09 2001-01-31 川研ファインケミカル株式会社 Detergent composition

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Also Published As

Publication number Publication date
WO1984000081A1 (en) 1984-01-05
EP0111482A1 (en) 1984-06-27

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